WO2010010666A1 - Circuit structure, joint box, and method for manufacturing circuit structure - Google Patents

Circuit structure, joint box, and method for manufacturing circuit structure Download PDF

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Publication number
WO2010010666A1
WO2010010666A1 PCT/JP2009/003273 JP2009003273W WO2010010666A1 WO 2010010666 A1 WO2010010666 A1 WO 2010010666A1 JP 2009003273 W JP2009003273 W JP 2009003273W WO 2010010666 A1 WO2010010666 A1 WO 2010010666A1
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WO
WIPO (PCT)
Prior art keywords
pin
insulating plate
circuit
hole
conductive foil
Prior art date
Application number
PCT/JP2009/003273
Other languages
French (fr)
Japanese (ja)
Inventor
長谷川佳克
川田昌史
▲高▼橋圭介
Original Assignee
三菱電線工業株式会社
三菱マテリアル株式会社
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Publication date
Application filed by 三菱電線工業株式会社, 三菱マテリアル株式会社 filed Critical 三菱電線工業株式会社
Publication of WO2010010666A1 publication Critical patent/WO2010010666A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the present invention relates to a circuit structure, a joint box, and a method for manufacturing the circuit structure.
  • Patent Document 1 A technique for forming a circuit structure by laminating a plurality of circuit boards as described above is disclosed in, for example, Patent Document 1.
  • FIG. 13 is a plan view of a conventional circuit structure 100.
  • the circuit structure 100 is configured by stacking a plurality of circuit boards 111 each including an insulating plate 101 and a circuit pattern 110 made of a conductive foil 102 formed on the insulating plate 101.
  • the insulating plate 101 is formed with a plurality of holes 107 that are respectively penetrated in the thickness direction and are common to the stacked insulating plates 101.
  • alignment holes 103 for laminating the circuit boards 111 are formed at the four corners of the insulating plate 101.
  • an opening 104 having the same area as the hole 107 is formed at a position corresponding to the hole 107 of the insulating plate 101. Through holes (not shown) for conducting a plurality of stacked circuit boards 111 are inserted into some or all of the holes 107 and the openings 104.
  • a plurality of receiving terminals 105 are formed in order to conduct with another circuit board 111 having different circuit patterns 110.
  • the receiving terminal 105 is provided from the edge of the circuit pattern 110 to the hole 107 of the insulating plate 101 where the circuit pattern 110 is not formed, and the opening 106 is located at a position corresponding to the hole 107. Is formed.
  • the terminals provided in the signal system connector for example, have a pitch interval of about 2 mm, and a group of terminals composed of 12 terminals are arranged in 7 stages, and are configured in a narrow pitch and multistage arrangement. In order to deal with such connector terminals, it is required to increase the density of components placed on each circuit board of the circuit structure and to narrow the pitch of holes for conducting each circuit board. .
  • a plurality of receiving terminals 105 are provided from the edge of the circuit pattern 110 to the insulating plate 101, so that the density of the components to be placed and the hole portions are increased. Is a hindrance to narrowing the pitch.
  • the present invention has been made in view of such various points, and the object of the present invention is to cope with a connector having terminals with a narrow pitch and a multi-stage arrangement, and has good manufacturing efficiency and manufacturing cost. And a manufacturing method of a circuit structure, a joint box, and a circuit structure.
  • the circuit structure according to the present invention includes an insulating plate in which a plurality of holes penetrating in the thickness direction are formed, and a position corresponding to at least one hole of the insulating plate while being formed on the insulating plate. And a circuit board comprising a conductive foil provided with an opening having a smaller area than the hole, and one or a plurality of circuit boards stacked such that a plurality of holes of the insulating plate correspond to each other
  • the holes of the insulating plate are inserted into the plurality of holes of the insulating plate of the circuit board and the openings of the conductive foil provided at positions corresponding to at least one of the plurality of holes. Folding the conductive foil in the direction of the inner wall of the circuit board and contacting the bent conductive foil to electrically connect the circuit board, and through pins that respectively connect predetermined areas of the circuit pattern of the circuit board And said that there were pictures.
  • the opening having a smaller area than the hole is provided at a position corresponding to at least one hole of the insulating plate of the conductive foil of the circuit pattern, and the through pin is inserted into the opening.
  • the conductive foil is bent in the direction of the inner wall of the hole of the insulating plate.
  • the through pins come into contact with the bent conductive foil, thereby being electrically connected to the circuit board and conducting the circuit pattern of one or a plurality of circuit boards between predetermined regions. For this reason, in order to make the circuit pattern of the circuit board conductive, a receiving terminal that hinders the density of the components to be mounted and the narrow pitch of the holes from the edge of the circuit pattern to the insulating plate is provided. It is not necessary.
  • the opening of the receiving terminal and the hole of the insulating plate are aligned with each other with high precision, and the diameter of the through pin corresponds to the diameter of the opening of the receiving terminal.
  • the through pin is inserted into the opening of the conductive foil and the conductive foil is bent, the size of the opening of the receiving terminal is large. Even if there is a slight error, etc., the through pin can be inserted and conducted without any problem. For this reason, the manufacturing efficiency and manufacturing cost of the circuit structure are improved.
  • the opening of the conductive foil may have a notch.
  • the opening portion of the conductive foil includes the cutout portion, the conductive foil can be easily bent when the through pin is inserted.
  • the circuit structure according to the present invention includes an inner wall of the hole and a through pin so that the folded conductive foil fills a gap between the inner wall of the hole of the insulating plate and the through pin inserted into the hole. It may be inserted between.
  • the bent conductive foil is interposed between the inner wall of the hole and the through pin so as to fill a gap between the inner wall of the hole of the insulating plate and the through pin inserted into the hole. Since it is fitted, the contact area between the through pin and the conductive foil becomes larger, and both can be electrically connected more favorably. In addition, since there is no gap between the inner wall of the hole portion of the insulating plate and the through pin, the through pin can be held more stably, and the quality of the circuit structure becomes better.
  • the cross section of the through pin may be formed in a polygonal shape.
  • the conductive foil can be bent more easily when the through pin is inserted.
  • the pitch interval of the through pins inserted into the plurality of holes of the insulating plate may be 1.5 to 2.2 mm.
  • the terminal arrangement of the connectors connected to the circuit structure is narrow. Even if it is a thing, it can electrically connect favorably.
  • the joint box according to the present invention is formed on the insulating plate in which a plurality of holes penetrating in the thickness direction are formed, and at a position corresponding to at least one hole of the insulating plate.
  • a circuit board comprising a conductive pattern provided with a conductive foil provided with an opening having an area smaller than that of the hole, and one or a plurality of the circuit boards are stacked so that the plurality of holes of the insulating plate correspond to each other.
  • the conductive foil is bent in the direction of the inner wall, and is electrically connected to the circuit board by contacting the bent conductive foil, thereby electrically connecting predetermined regions of the circuit pattern of the circuit board to each other.
  • a circuit structure having pins and a box body provided so as to cover the circuit structure, the box body being provided on the signal input / output side with the outside of the circuit structure, and the through pin protruding to the outside
  • An insulating upper box penetrating in such a manner and an insulating lower box provided on the side opposite to the signal input / output side of the circuit structure are provided.
  • the lower box may fix the tip of the through pin.
  • the lower box fixes the tip of the through pin so that the through pin and the conductive foil are electrically connected (the portion where the through pin is inserted and the conductive foil is bent and brought into contact) and the through pin.
  • the part where the through pin is fixed against the external force applied is different. For this reason, generation
  • the lower box has a plurality of insertion holes having an area smaller than the cross-sectional area of the through pin, and the end of the through pin is fixed by press-fitting the end of the through pin into the insertion hole. It may be.
  • a plurality of insertion holes having an area smaller than the cross-sectional area of the through pin are formed in the lower box, and the end of the through pin is fixed by press-fitting the end of the through pin into the insertion hole. Therefore, the through pin can be fixed more easily and stably.
  • the upper box has a through pin penetrated in the thickness direction, and a plurality of through holes having an area smaller than the cross-sectional area of the through pin are formed, and the through pin is press-fitted into the through hole. May be clamped and fixed.
  • the through box penetrates the upper box in the thickness direction in the upper box, and a plurality of through holes having an area smaller than the cross-sectional area of the through pin are formed.
  • the through pin is inserted. Since the pin is clamped and fixed, the through pin can be fixed more easily and stably.
  • the method for manufacturing a circuit structure according to the present invention includes an insulating plate in which a plurality of holes penetrating in the thickness direction are formed, an insulating plate formed on the insulating plate, and at least one hole of the insulating plate.
  • a circuit board comprising a conductive pattern having an opening having a smaller area than the hole at a corresponding position is prepared, or a plurality of holes are provided in the insulating plate by preparing a plurality of circuit boards.
  • the conductive foil is bent in the direction of the inner wall of the hole portion of the insulating plate by inserting the through pin into the portion, and electrically connected to the circuit board by contacting the bent conductive foil.
  • a circuit structure, a joint box, and a method for manufacturing a circuit structure that can be applied to a connector having terminals with a narrow pitch and a multi-stage arrangement, and that have good manufacturing efficiency and manufacturing cost. Can be provided.
  • FIG. 1 is a schematic view of a joint box provided with a circuit structure.
  • FIG. 2 is an exploded view of the joint box of FIG.
  • FIG. 3A is a plan view of an opening provided with four notches formed at positions symmetrical with respect to the center.
  • FIG. 3B is a plan view of an opening provided with two notches formed at positions symmetrical with respect to the center.
  • FIG.3 (c) is a top view of the opening part provided with six notches formed in the symmetrical position with respect to the center.
  • FIG. 3D is a plan view of an opening formed in a perfect circle shape.
  • FIG. 3E is a plan view of an opening formed in an elliptical shape.
  • FIG. 3F is a plan view of the opening formed in a triangular shape.
  • FIG. 3G is a plan view of the opening formed in a square shape.
  • FIG. 3 (h) is a plan view of an opening formed so that two thin slits intersect.
  • FIG. 4 is a cross-sectional view of the through pin.
  • Fig.5 (a) is a cross-sectional view of an opening part and a hole part when the front-end
  • FIG. 5B is a longitudinal sectional view of the opening and the hole when the tip of the through pin is inserted.
  • FIG. 6A is a cross-sectional view of the opening and the hole when the tip of the through pin is inserted and penetrated.
  • FIG. 6B is a longitudinal sectional view of the opening and the hole when the tip of the through pin is inserted and penetrated.
  • FIG. 6A is a cross-sectional view of the opening and the hole when the tip of the through pin is inserted and penetrated.
  • FIG. 6B is a longitudinal sectional view of the opening and
  • FIG. 7 is a cross-sectional view of a circuit board in which a plurality of sheets in which circuit patterns are conducted in each region in each circuit board are stacked by through pins.
  • FIG. 8 is a cross-sectional view of one circuit board in which a circuit pattern is conducted in each region in the circuit board by through pins.
  • FIG. 9 is a cross-sectional view of a circuit board in which a plurality of sheets in which circuit patterns are conducted between circuit boards are stacked by through pins.
  • FIG. 10 is a longitudinal cross-sectional view of an opening and a hole where a gap is formed between the conductive foil that is bent by inserting and penetrating the tip of the through pin and is in contact with the through pin, and the inner wall of the hole.
  • FIG. 11 is a cross-sectional view of a box body that covers the circuit structure from above and below. 12 (a) to 12 (f) are explanatory diagrams of the manufacturing process of the through pin.
  • FIG. 13 is a plan view of
  • FIG. 1 is a schematic view of a joint box 11 including a circuit structure 10.
  • FIG. 2 is an exploded view of the joint box 11 of FIG.
  • the joint box 11 includes a circuit structure 10 and a box body 12 provided so as to cover the circuit structure 10.
  • the circuit structure 10 is provided with four circuit boards 13 stacked.
  • the number of circuit boards 13 of the circuit structure 10 is not limited to four, and any number of circuit boards 13 may be provided. Further, it may be constituted by a single circuit board 13.
  • the circuit board 13 includes an insulating plate 15 formed so that holes 14 penetrating in the thickness direction are arranged in predetermined rows and columns.
  • the insulating plate 15 is made of, for example, a resin material.
  • the circuit board 13 includes a circuit pattern 18 formed on the insulating plate 15 and made of a conductive foil 17 provided with a plurality of openings 16a.
  • the conductive foil 17 of the circuit pattern 18 is made of a metal foil using copper or the like, for example.
  • the opening 16 a of the conductive foil 17 constituting the circuit pattern 18 is provided at a position corresponding to at least one hole 14 of the insulating plate 15.
  • the opening 16 a is for inserting a later-described through pin 19, and has an area smaller than that of the hole 14 of the insulating plate 15.
  • the opening 16a includes four notches 20 formed at positions symmetrical with respect to the center thereof.
  • the shape of the opening 16a is not limited to this.
  • the opening 16a includes two notches 21 formed at positions symmetrical with respect to the center thereof. There may be.
  • the opening part 16a may be provided with the six notch parts 22 formed in the symmetrical position with respect to the center, as shown to the opening part 16c of FIG.3 (c).
  • the number of the notch parts of the opening part 16a is not restricted to these.
  • the opening 16a may be formed in a perfect circular shape as shown in the opening 16d in FIG. 3D or an elliptical shape as shown in the opening 16e in FIG.
  • the opening 16a may be formed in a triangular shape as shown in the opening 16f in FIG. 3 (f) or a quadrangular shape as shown in the opening 16g in FIG. 3 (g).
  • the opening part 16a may be formed in polygonal shapes other than these.
  • the opening 16a may be formed so that two thin slits 23 intersect as shown in the opening 16h in FIG.
  • a non-contact opening 16 ′ a that does not contact the through pin 19 is also formed.
  • the non-contact opening 16 ′ a is formed with a cross-sectional area larger than the cross-sectional area of the through pin 19.
  • a plurality of such circuit boards 13 are provided to overlap each other so that the plurality of hole portions 14 of the insulating plate 15 correspond to each other to constitute the circuit structure 10.
  • the circuit structure 10 includes a plurality of holes 14 of the insulating plate 15 of the circuit board 13 provided in a plurality of layers, and an opening 16 a of the conductive foil 17 provided at a position corresponding to the holes 14. And through-pins 19 that are electrically connected to the circuit board 13 and electrically connect predetermined regions of the circuit pattern 18 of the circuit board 13 to each other.
  • FIG. 4 is a cross-sectional view of the through pin 19.
  • the through pin 19 is formed in a rectangular shape having a cross section of 0.5 mm square, for example, by bending a part of a conductive metal plate such as a copper plate punched into an elongated rectangular shape along the long side direction.
  • the tip of the through pin 19 is pressed into a pointed quadrangular pyramid surface.
  • the cross-sectional shape of the through pin 19 is not limited to this, and may be formed in other polygonal shapes, for example.
  • the through pins 19 are provided at a position corresponding to the plurality of holes 14 of the insulating plate 15 of the circuit board 13 provided in a stacked manner and the holes 14.
  • the conductive foil 17 When inserted into the opening 16 a of the provided conductive foil 17, it hits the conductive foil 17 of the circuit pattern 18 protruding into the hole 14 of the insulating plate 15.
  • the through pin 19 When the through pin 19 is inserted as it is, the conductive foil 17 is bent toward the inner wall of the hole 14 of the insulating plate 15.
  • the bent conductive foil 17 is inserted into the inner wall of the hole portion 14 of the insulating plate 15 and the through pin 19 inserted into the hole portion 14.
  • the through pin 19 is electrically connected to the conductive foil 17 as shown in FIG. 6B, thereby realizing conduction between predetermined regions of the circuit pattern 18 of the circuit board 13. ing.
  • the joint box 11 includes regions A, B, and C, and has a structure in which connectors are respectively fitted in the three regions.
  • FIG. 7 shows a circuit structure formed by laminating a plurality of circuit boards 13.
  • through pins 19a to 19i are inserted into a plurality of stacked circuit boards 13, and the regions A, B, and C are made conductive.
  • the through pins 19 a and 19 b are inserted into the circuit board 13 provided in the region A.
  • the through pins 19c, 19d, and 19e are inserted into the circuit board 13 provided in the region B.
  • the through pins 19f, 19g, 19h, 19i are inserted into the circuit board 13 provided in the region C.
  • the through pins 19b and 19c are electrically connected to the circuit pattern 18 provided over the regions A and B in the uppermost circuit board 13, whereby the circuit pattern 18 is connected to the regions A and B. Conducted with.
  • a connector (not shown) connected to the through pin 19b in the region A and another connector (not shown) connected to the through pin 19c in the region B are electrically connected to each other.
  • the through pins 19e and 19f are electrically connected to the circuit pattern 18 provided over the areas B and C in the circuit board 13 in the middle stage, whereby the circuit pattern 18 is divided between the areas B and C. Conducted.
  • the connector (not shown) connected to the through pin 19e in the region B and the other connector (not shown) connected to the through pin 19f in the region C are electrically connected to each other.
  • the through pins 19g and 19h are electrically connected to the circuit pattern 18 provided in the region C in the uppermost circuit board 13, thereby causing the circuit pattern 18 to conduct between predetermined portions in the region C. Yes.
  • the through pins 19a and 19i are electrically connected to the circuit pattern 18 provided over the regions A and C in the lowermost circuit board 13, whereby the circuit pattern 18 is connected to the regions A and C. Conducted with.
  • a connector (not shown) connected to the through pin 19a in the area A and another connector (not shown) connected to the through pin 19i in the area C are electrically connected to each other.
  • FIG. 8 shows a circuit structure composed of a single circuit board 13.
  • the through pin 19j is inserted into the circuit board 13 provided in the region A.
  • the through pin 19k is inserted into the circuit board 13 provided in the region B.
  • the through pins 19l and 19m are inserted into the circuit board 13 provided in the region C.
  • the through pins 19j and 19k are electrically connected to the circuit pattern 18 provided over the regions A and B in the circuit board 13, thereby making the circuit pattern 18 conductive between the region A and the region B. ing.
  • a connector (not shown) connected to the through pin 19j in the region A and another connector (not shown) connected to the through pin 19k in the region B are electrically connected to each other.
  • the through pins 19l and 19m are electrically connected to the circuit pattern 18 provided in the region C in the circuit board 13, and thereby the circuit pattern 18 is electrically connected to each other in the region C.
  • FIG. 9 shows a circuit structure formed by laminating a plurality of circuit boards 13.
  • the through pins 19n, 19o, and 19p are inserted so as to penetrate through the plurality of laminated circuit boards 13, respectively.
  • the through pins 19n and 19o are electrically connected to a circuit pattern 18 provided on the uppermost circuit board 13, thereby causing the circuit pattern 18 of the uppermost circuit board 13 to conduct between predetermined portions. Yes.
  • the through pin 19o is electrically connected to the circuit pattern 18 on the uppermost circuit board 13 and the circuit pattern 18 on the middle circuit board 13, whereby the uppermost circuit pattern 18 and the middle circuit are connected.
  • the pattern 18 is made conductive.
  • the through pin 19p is electrically connected to the circuit pattern 18 of the uppermost circuit board 13 and the circuit pattern 18 of the lowermost circuit board 13, whereby the uppermost circuit pattern 18 and the lowermost circuit board are connected.
  • the pattern 18 is made conductive. According to such a configuration, a plurality of circuit boards 13 can be assembled and conducted three-dimensionally, which is particularly advantageous in terms of high integration. Furthermore, the through pins 19 can electrically connect one circuit board 13 having a predetermined circuit pattern and another circuit board 13 having a different circuit pattern 18.
  • the joint box 11 includes three regions (regions A, B, and C) into which the connector is fitted.
  • the number of the regions is not limited, and may be less than three. There may be many.
  • the through pin 19 is also inserted into the non-contact opening 16′a, but the conductive foil 17 does not protrude into the hole 14 of the insulating plate 15 in the non-contact opening 16′a.
  • the through pin 19 and the conductive foil 17 of the circuit pattern 18 are not in contact with each other, but are inserted into the opening 16a formed at a corresponding position in the conductive foil 17 of the circuit board 13 in another layer, and the conductive foil 17 is bent. Are in contact and electrically connected.
  • the conductive foil 17 bent by the through pin 19 inserted into the opening 16a of the conductive foil 17 of the circuit pattern 18 is fitted between the inner wall of the hole 14 and the through pin 19 without a gap.
  • the present invention is not limited thereto, and as shown in FIG. 10, a gap may be formed between the conductive foil 17 that is bent and contacts the through pin 19 and the inner wall of the hole portion 14.
  • the plurality of through pins 19 inserted into the plurality of holes 14 of the insulating plate 15 can be arranged in a narrow pitch and 2 to 15 rows ⁇ 2 to 16 columns.
  • the circuit structure 10 according to the present embodiment can correspond to a signal system connector having a terminal structure with a narrow pitch and a multistage arrangement.
  • the box body 12 is provided so as to cover the circuit structure 10 and includes an upper box 30 and a lower box 31 each made of an insulating material such as a resin.
  • FIG. 11 sectional drawing of the box body 12 which covers the circuit structure 10 from the upper side and the lower side is shown.
  • the upper box 30 is provided on the signal input / output side of the circuit structure 10, and the lower box 31 is provided on the side opposite to the signal input / output side of the circuit structure 10.
  • a plurality of through holes 32 and insertion holes 33 each having an area smaller than the cross-sectional area of the through pin 19 are formed at positions corresponding to the hole portions 14 of the circuit board 13.
  • the through pin 19 is inserted into the through hole 32 and the insertion hole 33.
  • the through pin 19 is inserted from the upper box 30 and passes through the through-hole 32 of the upper box 30 so that one end protrudes to the outside.
  • the other tip of the through pin 19 is press-fitted and fixed in the insertion hole 33 of the lower box 31.
  • the through pin 19 is also press-fitted into the through hole 32 of the upper box 30, and the through pin 19 is sandwiched and fixed by the through hole 32.
  • the circuit structure 10 includes the insulating plate 15 formed so that the holes 14 penetrating in the thickness direction are arranged in predetermined rows and columns, and the insulating plate, respectively.
  • a plurality of circuit boards 13 each having a circuit pattern 18 formed of a conductive foil 17 formed on the board 15 and provided with a plurality of openings 16a so as to correspond to the holes 14 are laminated.
  • the regions are electrically connected by a through pin 19.
  • the circuit structure 10 has a three-dimensional circuit structure and is compactly formed.
  • FIG. 12A is explanatory views of the manufacturing process of the through pin 19.
  • a copper plate 40 having a thickness of, for example, 0.2 mm is prepared, and is rolled to a thickness of 0.16 mm, for example, as shown in FIG. Crush.
  • FIG. 12 (c) both side portions 41 along the long side direction of the copper plate 40 are raised to form a base portion 42 therebetween, and as shown in FIG. The part 41 is bent inward and is further folded on the base part 42 as shown in FIG.
  • the folded both side portions 41 are raised together with the base portion 42, the both side portions 41 are brought into close contact with each other, and mechanically compressed from all sides, and 0.5 mm shown in FIG. A cross-sectional shape on all sides.
  • the through pin 19 may have a shape in which the base portion 42 is slightly swollen downward as shown in FIG.
  • the through pin 19 may be manufactured by cutting a wire having a circular or polygonal cross section into a predetermined length.
  • a copper alloy such as brass is applied, and the outer periphery is preferably Sn-plated.
  • the circuit board 13 is produced.
  • a copper conductive foil 17 having a thickness of 50 to 200 ⁇ m is cut into a short shape with a short side length of 100 to 200 mm and a long side length of 100 to 300 mm.
  • a plurality of conductive foils 17 having the same dimensions are formed, and two of the conductive foils 17 are stacked one above the other.
  • the upper conductive foil 17 is an upper conductive foil
  • the lower conductive foil 17 is a lower conductive foil.
  • a punching machine having a plurality of punching blades (big blades) is prepared, and an upper conductive foil and a lower conductive foil superimposed on each other are arranged at predetermined positions on the pedestal. Further, the punching machine or the punching blade is adjusted so that the punching blade penetrates the upper conductive foil and is slightly cut (half cut) without penetrating the lower conductive foil. Then, the upper conductive foil is punched with a punching blade using the lower conductive foil as an underlay material. The punching blade passes through the upper conductive foil and stops to the extent that it is inserted slightly without penetrating the lower conductive foil. That is, an upper conductive foil punched into a predetermined shape and a lower conductive foil in which a half-cut cut line portion having cuts in the contour portion of the predetermined shape are formed.
  • the intermediate conductor has a circuit pattern 18, a discarding member that borders the outer peripheral edge thereof, and a connecting portion that connects the circuit pattern 18 and the discarding member. That is, when two strip-shaped conductive foils 17 are stacked and the conductive foil 17 (upper conductive foil) disposed on the upper side is punched out, it is punched into a shape having a circuit pattern 18, a discard member, and a connecting portion. Unplug. At this time, the circuit pattern 18 has the plurality of openings 16a described above.
  • the next intermediate conductor is formed.
  • the lower conductive foil that was the underlaying material of the upper conductive foil is used as a new upper conductive foil, and another conductive foil 17 is used as an underlaying material so as to overlap each other.
  • the new upper conductive foil is punched with a punching blade using another conductive foil 17 as an underlay to form the next intermediate conductor. That is, the lower conductive foil is disposed on the upper side to form a new upper conductive foil, and the next conductive foil 17 is disposed on the lower side to form a new lower conductive foil.
  • a plurality of resin-made insulating plates 15 are prepared, and holes 14 and the like are formed at predetermined positions using a punching machine.
  • the insulating plate 15 having predetermined holes is formed in the mold by injection molding.
  • a thermosetting resin is used, and when forming by injection molding, a thermoplastic resin is used. Specifically, polypropylene or the like can be used. It is preferable to produce the insulating plate 15 by injection molding in that cutting waste does not occur and the material can be used effectively.
  • circuit patterns 18 formed as described above are aligned and bonded on the insulating plate 15 so that the predetermined holes 14 and the predetermined openings 16a correspond to each other.
  • the circuit board 13 is formed.
  • the circuit pattern 18 and the insulating plate 15 may be directly bonded using an adhesive, or may be bonded after the circuit pattern 18 is once transferred like a seal.
  • circuit boards 13 are overlapped with each other corresponding to the respective hole portions 14, and the upper and lower sides thereof are covered with the upper box 30 and the lower box 31 (box body 12), respectively.
  • the through hole 32 of the upper box 30 and the insertion hole 33 of the lower box 31 are provided so as to respectively correspond to the plurality of hole portions 14 of the circuit board 13.
  • the openings 16 a of the circuit pattern 18 of the circuit board 13 in which the through pins 19 arranged in 7 rows ⁇ 12 columns with a pitch interval of 1.5 to 2.2 mm are stacked from the through holes 32 of the upper box 30, are insulated.
  • Each is inserted into the hole 14 of the adhesive plate 15.
  • the through pin 19 further advances against the conductive foil 17 of the circuit pattern 18 protruding into the hole 14 of the insulating plate 15, and passes through the conductive foil 17 through the insulating plate.
  • the 15 holes 14 are bent in the direction of the inner wall. 6A and 6B, the bent conductive foil 17 fills the gap between the inner wall of the hole 14 of the insulating plate 15 and the through pin 19 inserted into the hole 14. Thus, it fits between the inner wall of the hole 14 and the through pin 19.
  • the tip of the inserted through pin 19 is press-fitted into the insertion hole 33 of the lower box 31 and fixed. At this time, the through pin 19 is also press-fitted into the through hole 32 of the upper box 30 and is fixed by being sandwiched by the through hole 32.
  • the joint box 11 including the circuit structure 10 is completed through the above steps.
  • the circuit structure 10 is provided with an opening 16a having an area smaller than that of the hole 14 at a position corresponding to at least one hole 14 of the insulating plate 15 of the conductive foil 17 of the circuit pattern 18.
  • the through pin 19 is inserted into the opening 16a, and the conductive foil 17 is bent toward the inner wall of the hole 14 of the insulating plate 15.
  • the through pins 19 are in contact with the bent conductive foil 17 to be electrically connected to the circuit board 13 and to conduct predetermined regions of the circuit pattern 18 of the circuit board 13 respectively.
  • the density of components to be placed and the narrow pitch of the holes 14 are hindered from the edge of the circuit pattern 18 to the insulating plate 15. It is not necessary to provide a receiving terminal. Therefore, it is possible to cope with a connector having terminals with a narrow pitch and a multistage arrangement. Moreover, it is not necessary to provide a receiving terminal forming step separately.
  • the opening of the receiving terminal and the hole of the insulating plate are aligned with each other with high precision, and the diameter of the through pin corresponds to the diameter of the opening of the receiving terminal.
  • the through pin 19 is inserted into the opening 16a of the conductive foil 17, and the conductive foil 17 is bent. Even if there is a slight error in the size of the portion, the through pin can be inserted and conducted without any problem. For this reason, the manufacturing efficiency and manufacturing cost of the circuit structure are improved.
  • the through pin 19 has a length that penetrates all the circuit boards 13, so that a circuit board structure can be produced by stacking a plurality of circuit boards 13. It is possible to assemble without worrying about the order of 13 layers. That is, when the same insulating plate 15 is laminated, it is not necessary to mark or pattern the circuit board 19 or to give a feature to the shape in order to prevent undesired lamination, and the manufacturing efficiency is good. It becomes.
  • the present invention is useful for a circuit structure, a joint box, and a method for manufacturing a circuit structure.

Abstract

A circuit structure (10) is provided with a through pin (19) which is inserted into each of plural holes (14) of an insulating plate (15) of a circuit board (13) and an opening (16) of conductive foil (17) provided at a position corresponding to at least one of the plural holes, bends the conductive foil toward the inner wall of the hole of the insulating plate, and comes into contact with the bent conductive foil to thereby electrically connect with the circuit board and bring predetermined regions of a circuit pattern (18) of the circuit substrate into conduction.

Description

回路構造体、ジョイントボックス、及び、回路構造体の製造方法Circuit structure, joint box, and method of manufacturing circuit structure
　本発明は、回路構造体、ジョイントボックス、及び、回路構造体の製造方法に関する。 The present invention relates to a circuit structure, a joint box, and a method for manufacturing the circuit structure.
　従来、回路基板上に実装する部品数が増大し、回路結線等が複雑になると、基板両面では回路配線等を収容することが困難となることから、回路基板を複数枚積層させることで対応している。このように、回路基板を複数枚積層させて回路構造体を形成する技術が、例えば、特許文献１等に開示されている。 Conventionally, if the number of components to be mounted on a circuit board increases and circuit connection becomes complicated, it becomes difficult to accommodate circuit wiring on both sides of the board. ing. A technique for forming a circuit structure by laminating a plurality of circuit boards as described above is disclosed in, for example, Patent Document 1.
　図１３は、従来の回路構造体１００の平面図である。回路構造体１００は、絶縁性プレート１０１と、絶縁性プレート１０１上に形成された導電箔１０２からなる回路パターン１１０とを備えた回路基板１１１が複数枚重ねて構成されている。絶縁性プレート１０１には、厚さ方向にそれぞれ貫通する、積層された絶縁性プレート１０１に共通の複数の孔部１０７が形成されている。また、絶縁性プレート１０１の四隅には、回路基板１１１を積層する際の位置合わせ孔１０３が形成されている。回路パターン１１０には、絶縁性プレート１０１の孔部１０７に対応する位置に、孔部１０７と同面積の開口部１０４が形成されている。これらの孔部１０７及び開口部１０４の一部又は全部には、それぞれ積層された複数枚の回路基板１１１を導通させるスルーピン（不図示）が差し込まれている。 FIG. 13 is a plan view of a conventional circuit structure 100. The circuit structure 100 is configured by stacking a plurality of circuit boards 111 each including an insulating plate 101 and a circuit pattern 110 made of a conductive foil 102 formed on the insulating plate 101. The insulating plate 101 is formed with a plurality of holes 107 that are respectively penetrated in the thickness direction and are common to the stacked insulating plates 101. In addition, alignment holes 103 for laminating the circuit boards 111 are formed at the four corners of the insulating plate 101. In the circuit pattern 110, an opening 104 having the same area as the hole 107 is formed at a position corresponding to the hole 107 of the insulating plate 101. Through holes (not shown) for conducting a plurality of stacked circuit boards 111 are inserted into some or all of the holes 107 and the openings 104.
　また、異なる回路パターン１１０を備える他の回路基板１１１と導通させるため、受端子１０５が複数形成されている。受端子１０５は、回路パターン１１０の縁部上から、回路パターン１１０が形成されていない絶縁性プレート１０１の孔部１０７上に亘って設けられており、孔部１０７に対応する位置に開口部１０６が形成されている。 Also, a plurality of receiving terminals 105 are formed in order to conduct with another circuit board 111 having different circuit patterns 110. The receiving terminal 105 is provided from the edge of the circuit pattern 110 to the hole 107 of the insulating plate 101 where the circuit pattern 110 is not formed, and the opening 106 is located at a position corresponding to the hole 107. Is formed.
再公表特許ＷＯ２００５／０９６６８３号Republished patent WO2005 / 096683
　近年、特に信号系のコネクタに設けられる端子は、例えばピッチ間隔が２ｍｍ程度で、１２本ずつで構成された端子群が７段に配列されており、狭ピッチ且つ多段配列に構成されている。このようなコネクタの端子に対応するためには、回路構造体の各回路基板に載置する部品の高密度化や、各回路基板を導通させるための孔部の狭ピッチ化等が要求される。 In recent years, the terminals provided in the signal system connector, for example, have a pitch interval of about 2 mm, and a group of terminals composed of 12 terminals are arranged in 7 stages, and are configured in a narrow pitch and multistage arrangement. In order to deal with such connector terminals, it is required to increase the density of components placed on each circuit board of the circuit structure and to narrow the pitch of holes for conducting each circuit board. .
　しかしながら、上述のように、従来の回路構造体１００では、回路パターン１１０の縁から絶縁性プレート１０１上に亘って受端子１０５が複数設けられており、載置する部品の高密度化や孔部の狭ピッチ化の妨げとなっている。 However, as described above, in the conventional circuit structure 100, a plurality of receiving terminals 105 are provided from the edge of the circuit pattern 110 to the insulating plate 101, so that the density of the components to be placed and the hole portions are increased. Is a hindrance to narrowing the pitch.
　本発明は、斯かる諸点に鑑みてなされたものであり、その目的とするところは、狭ピッチ且つ多段配列の端子を備えるコネクタに対応することが可能で、且つ、製造効率及び製造コストが良好な回路構造体、ジョイントボックス、及び、回路構造体の製造方法を提供することである。 The present invention has been made in view of such various points, and the object of the present invention is to cope with a connector having terminals with a narrow pitch and a multi-stage arrangement, and has good manufacturing efficiency and manufacturing cost. And a manufacturing method of a circuit structure, a joint box, and a circuit structure.
　本発明に係る回路構造体は、厚さ方向に貫通する孔部が複数形成された絶縁性プレートと、絶縁性プレート上に形成されると共に、絶縁性プレートの少なくとも１つの孔部に対応する位置に孔部より面積が小さい開口部が設けられた導電箔から成る回路パターンと、を備えた回路基板が、１枚、又は、絶縁性プレートの複数の孔部を互いに対応させるように複数枚重ねて設けられ、回路基板の絶縁性プレートの複数の孔部、及び、複数の孔部の少なくとも１つに対応する位置に設けられた導電箔の開口部に差し込まれて、絶縁性プレートの孔部の内壁方向へ導電箔を折り曲げると共に、折り曲げられた導電箔に接触することにより、回路基板と電気的に接続し、回路基板の回路パターンの所定の領域同士をそれぞれ導通させるスルーピンを備えたことを特徴とする。 The circuit structure according to the present invention includes an insulating plate in which a plurality of holes penetrating in the thickness direction are formed, and a position corresponding to at least one hole of the insulating plate while being formed on the insulating plate. And a circuit board comprising a conductive foil provided with an opening having a smaller area than the hole, and one or a plurality of circuit boards stacked such that a plurality of holes of the insulating plate correspond to each other The holes of the insulating plate are inserted into the plurality of holes of the insulating plate of the circuit board and the openings of the conductive foil provided at positions corresponding to at least one of the plurality of holes. Folding the conductive foil in the direction of the inner wall of the circuit board and contacting the bent conductive foil to electrically connect the circuit board, and through pins that respectively connect predetermined areas of the circuit pattern of the circuit board And said that there were pictures.
　このような構成によれば、回路パターンの導電箔の絶縁性プレートの少なくとも１つの孔部に対応する位置に、孔部より面積が小さい開口部を設けており、この開口部にスルーピンを差し込んで、絶縁性プレートの孔部の内壁方向へ導電箔を折り曲げている。そして、スルーピンが、この折り曲げられた導電箔に接触することにより、回路基板と電気的に接続し、一枚、又は、複数枚の回路基板の回路パターンを所定領域同士で導通させる。このため、回路基板の回路パターンを導通させるために、回路パターンの縁から絶縁性プレート上に亘って、載置する部品の高密度化や孔部の狭ピッチ化の妨げとなる受端子を設けなくてよい。従って、狭ピッチ且つ多段配列の端子を備えるコネクタに対応することができる。また、受端子の形成工程を別に設ける必要が無くなる。さらに、従来はスルーピンを差し込む際に、受端子の開口部と絶縁性プレートの孔部とを精度良く位置合わせしてそれぞれ設けると共に、スルーピンの径と受端子の開口部等の径とが対応するように精度良く形成しなければならないのに対し、本発明の構成によれば、スルーピンを導電箔の開口部に差し込み、導電箔を折り曲げる構成となっているため、受端子の開口部の大きさ等について少々の誤差があっても問題無くスルーピンを差し込んで導通させることができる。このため、回路構造体の製造効率及び製造コストが良好となる。 According to such a configuration, the opening having a smaller area than the hole is provided at a position corresponding to at least one hole of the insulating plate of the conductive foil of the circuit pattern, and the through pin is inserted into the opening. The conductive foil is bent in the direction of the inner wall of the hole of the insulating plate. The through pins come into contact with the bent conductive foil, thereby being electrically connected to the circuit board and conducting the circuit pattern of one or a plurality of circuit boards between predetermined regions. For this reason, in order to make the circuit pattern of the circuit board conductive, a receiving terminal that hinders the density of the components to be mounted and the narrow pitch of the holes from the edge of the circuit pattern to the insulating plate is provided. It is not necessary. Therefore, it is possible to cope with a connector having terminals with a narrow pitch and a multistage arrangement. Moreover, it is not necessary to provide a receiving terminal forming step separately. Further, conventionally, when inserting the through pin, the opening of the receiving terminal and the hole of the insulating plate are aligned with each other with high precision, and the diameter of the through pin corresponds to the diameter of the opening of the receiving terminal. However, according to the configuration of the present invention, since the through pin is inserted into the opening of the conductive foil and the conductive foil is bent, the size of the opening of the receiving terminal is large. Even if there is a slight error, etc., the through pin can be inserted and conducted without any problem. For this reason, the manufacturing efficiency and manufacturing cost of the circuit structure are improved.
　また、本発明に係る回路構造体は、導電箔の開口部が切欠部を備えていてもよい。 Also, in the circuit structure according to the present invention, the opening of the conductive foil may have a notch.
　このような構成によれば、導電箔の開口部が切欠部を備えているため、スルーピンの差し込み時に、導電箔を容易に折り曲げることができる。 According to such a configuration, since the opening portion of the conductive foil includes the cutout portion, the conductive foil can be easily bent when the through pin is inserted.
　さらに、本発明に係る回路構造体は、折り曲げられた導電箔が、絶縁性プレートの孔部の内壁と、孔部に差し込まれたスルーピンとの隙間を埋めるように、孔部の内壁とスルーピンとの間に嵌め込まれていてもよい。 Furthermore, the circuit structure according to the present invention includes an inner wall of the hole and a through pin so that the folded conductive foil fills a gap between the inner wall of the hole of the insulating plate and the through pin inserted into the hole. It may be inserted between.
　このような構成によれば、折り曲げられた導電箔が、絶縁性プレートの孔部の内壁と、孔部に差し込まれたスルーピンとの隙間を埋めるように、孔部の内壁とスルーピンとの間に嵌め込まれているため、スルーピンと導電箔との接触面積がより大きくなり、両者をより良好に電気的に接続させることができる。また、絶縁性プレートの孔部の内壁とスルーピンとの間に隙間が無くなるため、スルーピンをより安定的に保持することができ、回路構造体の品質がより良好となる。 According to such a configuration, the bent conductive foil is interposed between the inner wall of the hole and the through pin so as to fill a gap between the inner wall of the hole of the insulating plate and the through pin inserted into the hole. Since it is fitted, the contact area between the through pin and the conductive foil becomes larger, and both can be electrically connected more favorably. In addition, since there is no gap between the inner wall of the hole portion of the insulating plate and the through pin, the through pin can be held more stably, and the quality of the circuit structure becomes better.
　また、本発明に係る回路構造体は、スルーピンの断面が多角形状に形成されていてもよい。 In the circuit structure according to the present invention, the cross section of the through pin may be formed in a polygonal shape.
　このような構成によれば、スルーピンの断面が多角形状に形成されているため、スルーピンの差し込み時に、導電箔をより容易に折り曲げることができる。 According to such a configuration, since the cross section of the through pin is formed in a polygonal shape, the conductive foil can be bent more easily when the through pin is inserted.
　さらに、本発明に係る回路構造体は、絶縁性プレートの複数の孔部に差し込まれたスルーピンのピッチ間隔が１．５～２．２ｍｍであってもよい。 Furthermore, in the circuit structure according to the present invention, the pitch interval of the through pins inserted into the plurality of holes of the insulating plate may be 1.5 to 2.2 mm.
　このような構成によれば、絶縁性プレートの複数の孔部に差し込まれたスルーピンのピッチ間隔が１．５～２．２ｍｍであるため、回路構造体に接続されるコネクタの端子配列が狭ピッチのものであっても、良好に電気的に接続させることができる。 According to such a configuration, since the pitch interval of the through pins inserted into the plurality of holes of the insulating plate is 1.5 to 2.2 mm, the terminal arrangement of the connectors connected to the circuit structure is narrow. Even if it is a thing, it can electrically connect favorably.
　本発明に係るジョイントボックスは、厚さ方向に貫通する孔部が複数形成された絶縁性プレートと、絶縁性プレート上に形成されると共に、絶縁性プレートの少なくとも１つの孔部に対応する位置に孔部より面積が小さい開口部が設けられた導電箔から成る回路パターンと、を備えた回路基板が、１枚、又は、絶縁性プレートの複数の孔部を互いに対応させるように複数枚重ねて設けられ、回路基板の絶縁性プレートの複数の孔部、及び、複数の孔部の少なくとも１つに対応する位置に設けられた導電箔の開口部に差し込まれて、絶縁性プレートの孔部の内壁方向へ導電箔を折り曲げると共に、折り曲げられた導電箔に接触することにより、回路基板と電気的に接続し、回路基板の回路パターンの所定の領域同士をそれぞれ導通させるスルーピンを備えた回路構造体と、回路構造体を覆うように設けられたボックス体と、を備え、ボックス体は、回路構造体の外部との信号入出力側に設けられ、スルーピンが外部に突出するように貫通する絶縁性の上側ボックスと、回路構造体の信号入出力側と反対側に設けられた絶縁性の下側ボックスと、を備えたことを特徴とする。 The joint box according to the present invention is formed on the insulating plate in which a plurality of holes penetrating in the thickness direction are formed, and at a position corresponding to at least one hole of the insulating plate. A circuit board comprising a conductive pattern provided with a conductive foil provided with an opening having an area smaller than that of the hole, and one or a plurality of the circuit boards are stacked so that the plurality of holes of the insulating plate correspond to each other. A plurality of holes of the insulating plate of the circuit board, and inserted into openings of the conductive foil provided at positions corresponding to at least one of the plurality of holes, The conductive foil is bent in the direction of the inner wall, and is electrically connected to the circuit board by contacting the bent conductive foil, thereby electrically connecting predetermined regions of the circuit pattern of the circuit board to each other. A circuit structure having pins and a box body provided so as to cover the circuit structure, the box body being provided on the signal input / output side with the outside of the circuit structure, and the through pin protruding to the outside An insulating upper box penetrating in such a manner and an insulating lower box provided on the side opposite to the signal input / output side of the circuit structure are provided.
　このような構成によれば、上述のように、狭ピッチ且つ多段配列の端子を備えるコネクタに対応することが可能で、且つ、製造効率及び製造コストが良好な回路構造体を備えたジョイントボックスを得ることができる。 According to such a configuration, as described above, a joint box including a circuit structure that can correspond to a connector having terminals with a narrow pitch and a multi-stage arrangement, and that has good manufacturing efficiency and manufacturing cost. Obtainable.
　また、本発明に係るジョイントボックスは、下側ボックスが、スルーピンの先端を固定していてもよい。 In the joint box according to the present invention, the lower box may fix the tip of the through pin.
　このような構成によれば、下側ボックスが、スルーピンの先端を固定するため、スルーピンと導電箔とを導通させる部位（スルーピンを差し込んで導電箔を折り曲げて接触させている部位）と、スルーピンに加わる外力に対抗してスルーピンを固定する部位とが異なる。このため、上記接触部位に外力が加わることによる電気的な接触不良の発生等を良好に抑制することができ、ジョイントボックスの回路構造体の品質がより良好となる。 According to such a configuration, the lower box fixes the tip of the through pin so that the through pin and the conductive foil are electrically connected (the portion where the through pin is inserted and the conductive foil is bent and brought into contact) and the through pin. The part where the through pin is fixed against the external force applied is different. For this reason, generation | occurrence | production of the electrical contact failure by external force being added to the said contact part can be suppressed favorably, and the quality of the circuit structure of a joint box becomes more favorable.
　さらに、本発明に係るジョイントボックスは、下側ボックスが、スルーピンの断面積より小さい面積を有する差込孔が複数形成され、差込孔にスルーピンの先端を圧入することによりスルーピンの先端が固定されていてもよい。 Furthermore, in the joint box according to the present invention, the lower box has a plurality of insertion holes having an area smaller than the cross-sectional area of the through pin, and the end of the through pin is fixed by press-fitting the end of the through pin into the insertion hole. It may be.
　このような構成によれば、下側ボックスにスルーピンの断面積より小さい面積を有する差込孔が複数形成され、この差込孔にスルーピンの先端を圧入することによりスルーピンの先端が固定されているため、スルーピンをより容易に且つ安定的に固定することができる。 According to such a configuration, a plurality of insertion holes having an area smaller than the cross-sectional area of the through pin are formed in the lower box, and the end of the through pin is fixed by press-fitting the end of the through pin into the insertion hole. Therefore, the through pin can be fixed more easily and stably.
　また、本発明に係るジョイントボックスは、上側ボックスが、厚さ方向にスルーピンが貫通すると共に、スルーピンの断面積より小さい面積を有する貫通孔が複数形成され、貫通孔にスルーピンを圧入することによりスルーピンが挟持されて固定されていてもよい。 Further, in the joint box according to the present invention, the upper box has a through pin penetrated in the thickness direction, and a plurality of through holes having an area smaller than the cross-sectional area of the through pin are formed, and the through pin is press-fitted into the through hole. May be clamped and fixed.
　このような構成によれば、上側ボックスに、厚さ方向にスルーピンが貫通すると共に、スルーピンの断面積より小さい面積を有する貫通孔が複数形成され、この貫通孔にスルーピンを圧入することによりスルーピンが挟持されて固定されているため、スルーピンをより容易に且つ安定的に固定することができる。 According to such a configuration, the through box penetrates the upper box in the thickness direction in the upper box, and a plurality of through holes having an area smaller than the cross-sectional area of the through pin are formed. By inserting the through pin into the through hole, the through pin is inserted. Since the pin is clamped and fixed, the through pin can be fixed more easily and stably.
　本発明に係る回路構造体の製造方法は、厚さ方向に貫通する孔部が複数形成された絶縁性プレートと、絶縁性プレート上に形成されると共に、絶縁性プレートの少なくとも１つの孔部に対応する位置に該孔部より面積が小さい開口部が設けられた導電箔から成る回路パターンと、を備えた回路基板を一枚準備する、又は、複数枚準備して絶縁性プレートの複数の孔部を互いに対応させるように重ねて設ける第１の工程と、回路基板の絶縁性プレートの複数の孔部、及び、複数の孔部の少なくとも１つに対応する位置に設けられた導電箔の開口部にスルーピンを差し込むことにより、絶縁性プレートの孔部の内壁方向へ導電箔を折り曲げると共に、折り曲げた導電箔に接触することにより、回路基板と電気的に接続し、回路基板の回路パターンの所定の領域同士をそれぞれ導通させる第２の工程と、を備えたことを特徴とする。 The method for manufacturing a circuit structure according to the present invention includes an insulating plate in which a plurality of holes penetrating in the thickness direction are formed, an insulating plate formed on the insulating plate, and at least one hole of the insulating plate. A circuit board comprising a conductive pattern having an opening having a smaller area than the hole at a corresponding position is prepared, or a plurality of holes are provided in the insulating plate by preparing a plurality of circuit boards. A first step of providing the portions in correspondence with each other, a plurality of holes in the insulating plate of the circuit board, and an opening in the conductive foil provided at a position corresponding to at least one of the plurality of holes The conductive foil is bent in the direction of the inner wall of the hole portion of the insulating plate by inserting the through pin into the portion, and electrically connected to the circuit board by contacting the bent conductive foil. A second step of conducting the respective predetermined regions between the, and further comprising a.
　このような構成によれば、上述のように、狭ピッチ且つ多段配列の端子を備えるコネクタに対応することが可能な回路構造体を、良好な効率及びコストによって製造することができる。 According to such a configuration, as described above, it is possible to manufacture a circuit structure capable of accommodating a connector having terminals with a narrow pitch and a multistage arrangement with good efficiency and cost.
　本発明によれば、狭ピッチ且つ多段配列の端子を備えるコネクタに対応することが可能で、且つ、製造効率及び製造コストが良好な回路構造体、ジョイントボックス、及び、回路構造体の製造方法を提供することができる。 According to the present invention, a circuit structure, a joint box, and a method for manufacturing a circuit structure that can be applied to a connector having terminals with a narrow pitch and a multi-stage arrangement, and that have good manufacturing efficiency and manufacturing cost. Can be provided.
図１は、回路構造体を備えたジョイントボックスの模式図である。FIG. 1 is a schematic view of a joint box provided with a circuit structure. 図２は、図１のジョイントボックスを各構成要素に分解した図である。FIG. 2 is an exploded view of the joint box of FIG. 図３（ａ）は中心に対して対称な位置に形成された４つの切欠部を備えた開口部の平面図である。図３（ｂ）は中心に対して対称な位置に形成された２つの切欠部を備えた開口部の平面図である。図３（ｃ）は中心に対して対称な位置に形成された６つの切欠部を備えた開口部の平面図である。図３（ｄ）は正円形状に形成された開口部の平面図である。図３（ｅ）は楕円形状に形成された開口部の平面図である。図３（ｆ）は三角形状に形成された開口部の平面図である。図３（ｇ）は四角形状に形成された開口部の平面図である。図３（ｈ）は細いスリットが２本交差するように形成された開口部の平面図である。FIG. 3A is a plan view of an opening provided with four notches formed at positions symmetrical with respect to the center. FIG. 3B is a plan view of an opening provided with two notches formed at positions symmetrical with respect to the center. FIG.3 (c) is a top view of the opening part provided with six notches formed in the symmetrical position with respect to the center. FIG. 3D is a plan view of an opening formed in a perfect circle shape. FIG. 3E is a plan view of an opening formed in an elliptical shape. FIG. 3F is a plan view of the opening formed in a triangular shape. FIG. 3G is a plan view of the opening formed in a square shape. FIG. 3 (h) is a plan view of an opening formed so that two thin slits intersect. 図４は、スルーピンの断面図である。FIG. 4 is a cross-sectional view of the through pin. 図５（ａ）はスルーピンの先端を差し込んだときの開口部及び孔部の横断面図である。図５（ｂ）はスルーピンの先端を差し込んだときの開口部及び孔部の縦断面図である。Fig.5 (a) is a cross-sectional view of an opening part and a hole part when the front-end | tip of a through pin is inserted. FIG. 5B is a longitudinal sectional view of the opening and the hole when the tip of the through pin is inserted. 図６（ａ）はスルーピンの先端を差し込んで貫通させたときの開口部及び孔部の横断面図である。図６（ｂ）はスルーピンの先端を差し込んで貫通させたときの開口部及び孔部の縦断面図である。FIG. 6A is a cross-sectional view of the opening and the hole when the tip of the through pin is inserted and penetrated. FIG. 6B is a longitudinal sectional view of the opening and the hole when the tip of the through pin is inserted and penetrated. 図７は、スルーピンによって、各回路基板内の各領域で回路パターンが導通されている複数枚が積層された回路基板の断面図である。FIG. 7 is a cross-sectional view of a circuit board in which a plurality of sheets in which circuit patterns are conducted in each region in each circuit board are stacked by through pins. 図８は、スルーピンによって、回路基板内の各領域で回路パターンが導通されている一枚の回路基板の断面図である。FIG. 8 is a cross-sectional view of one circuit board in which a circuit pattern is conducted in each region in the circuit board by through pins. 図９は、スルーピンによって、回路基板同士で回路パターンが導通されている複数枚が積層された回路基板の断面図である。FIG. 9 is a cross-sectional view of a circuit board in which a plurality of sheets in which circuit patterns are conducted between circuit boards are stacked by through pins. 図１０は、スルーピンの先端を差し込んで貫通させることで折り曲げられてスルーピンに接触する導電箔と、孔部の内壁とに隙間が形成されている開口部及び孔部の縦断面図である。FIG. 10 is a longitudinal cross-sectional view of an opening and a hole where a gap is formed between the conductive foil that is bent by inserting and penetrating the tip of the through pin and is in contact with the through pin, and the inner wall of the hole. 図１１は、上側と下側から回路構造体を覆うボックス体の断面図である。FIG. 11 is a cross-sectional view of a box body that covers the circuit structure from above and below. 図１２（ａ）～図１２（ｆ）は、スルーピンの製造工程の説明図である。12 (a) to 12 (f) are explanatory diagrams of the manufacturing process of the through pin. 図１３は、従来の回路構造体の平面図である。FIG. 13 is a plan view of a conventional circuit structure.
　以下、本発明の実施形態について、図面に基づいて詳細に説明する。尚、本発明は、以下の実施形態に限定されるものではない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.
　（回路構造体１０を備えたジョイントボックス１１の構成）
　図１は、回路構造体１０を備えたジョイントボックス１１の模式図である。図２は、図１のジョイントボックス１１を各構成要素に分解した図である。ジョイントボックス１１は、回路構造体１０と、回路構造体１０を覆うように設けられたボックス体１２とを備えている。 (Configuration of joint box 11 provided with circuit structure 10)
FIG. 1 is a schematic view of a joint box 11 including a circuit structure 10. FIG. 2 is an exploded view of the joint box 11 of FIG. The joint box 11 includes a circuit structure 10 and a box body 12 provided so as to cover the circuit structure 10.
　回路構造体１０は、４枚の回路基板１３が重ねて設けられている。なお、回路構造体１０の回路基板１３は４枚に限られず、回路基板１３を何枚重ねて設けてもよい。また、一枚の回路基板１３で構成されていてもよい。回路基板１３は、厚さ方向に貫通する孔部１４が所定の行及び列に配列するように形成された絶縁性プレート１５を備えている。絶縁性プレート１５は、例えば樹脂材料等で形成されている。また、回路基板１３は、絶縁性プレート１５上に形成され、複数の開口部１６ａが設けられた導電箔１７から成る回路パターン１８を備えている。回路パターン１８の導電箔１７は、例えば銅等を用いた金属箔で構成されている。 The circuit structure 10 is provided with four circuit boards 13 stacked. The number of circuit boards 13 of the circuit structure 10 is not limited to four, and any number of circuit boards 13 may be provided. Further, it may be constituted by a single circuit board 13. The circuit board 13 includes an insulating plate 15 formed so that holes 14 penetrating in the thickness direction are arranged in predetermined rows and columns. The insulating plate 15 is made of, for example, a resin material. The circuit board 13 includes a circuit pattern 18 formed on the insulating plate 15 and made of a conductive foil 17 provided with a plurality of openings 16a. The conductive foil 17 of the circuit pattern 18 is made of a metal foil using copper or the like, for example.
　回路パターン１８を構成する導電箔１７の開口部１６ａは、絶縁性プレート１５の少なくとも１つの孔部１４に対応する位置に設けられている。開口部１６ａは、後述のスルーピン１９を差し込むためのもので、絶縁性プレート１５の孔部１４より面積が小さく形成されている。開口部１６ａは、図３（ａ）に示すように、その中心に対して対称な位置に形成された４つの切欠部２０を備えている。開口部１６ａの形状は、これに限られず、例えば、図３（ｂ）の開口部１６ｂに示すように、その中心に対して対称な位置に形成された２つの切欠部２１を備えたものであってもよい。また、開口部１６ａは、図３（ｃ）の開口部１６ｃに示すように、その中心に対して対称な位置に形成された６つの切欠部２２を備えたものであってもよい。なお、開口部１６ａの切欠部の数はこれらに限られない。また、開口部１６ａは、図３（ｄ）の開口部１６ｄに示すような正円形状、または、図３（ｅ）の開口部１６ｅに示すような楕円形状に形成されていてもよい。さらに、開口部１６ａは、図３（ｆ）の開口部１６ｆに示すような三角形状、または、図３（ｇ）の開口部１６ｇに示すような四角形状に形成されていてもよい。なお、開口部１６ａは、これら以外の多角形状に形成されていてもよい。また、開口部１６ａは、図３（ｈ）の開口部１６ｈに示すように、細いスリット２３が２本交差するように形成されたものであってもよい。 The opening 16 a of the conductive foil 17 constituting the circuit pattern 18 is provided at a position corresponding to at least one hole 14 of the insulating plate 15. The opening 16 a is for inserting a later-described through pin 19, and has an area smaller than that of the hole 14 of the insulating plate 15. As shown in FIG. 3A, the opening 16a includes four notches 20 formed at positions symmetrical with respect to the center thereof. The shape of the opening 16a is not limited to this. For example, as shown in the opening 16b of FIG. 3B, the opening 16a includes two notches 21 formed at positions symmetrical with respect to the center thereof. There may be. Moreover, the opening part 16a may be provided with the six notch parts 22 formed in the symmetrical position with respect to the center, as shown to the opening part 16c of FIG.3 (c). In addition, the number of the notch parts of the opening part 16a is not restricted to these. Further, the opening 16a may be formed in a perfect circular shape as shown in the opening 16d in FIG. 3D or an elliptical shape as shown in the opening 16e in FIG. Furthermore, the opening 16a may be formed in a triangular shape as shown in the opening 16f in FIG. 3 (f) or a quadrangular shape as shown in the opening 16g in FIG. 3 (g). In addition, the opening part 16a may be formed in polygonal shapes other than these. Further, the opening 16a may be formed so that two thin slits 23 intersect as shown in the opening 16h in FIG.
　回路パターン１８を構成する導電箔１７には、差し込まれたスルーピン１９と接触する上述の開口部１６ａの他に、スルーピン１９とは接触しない非接触開口部１６’ａも形成されている。非接触開口部１６’ａは、スルーピン１９の断面積より大きな断面積に形成されている。 In the conductive foil 17 constituting the circuit pattern 18, in addition to the above-described opening 16 a that contacts the inserted through pin 19, a non-contact opening 16 ′ a that does not contact the through pin 19 is also formed. The non-contact opening 16 ′ a is formed with a cross-sectional area larger than the cross-sectional area of the through pin 19.
　このような回路基板１３が、それぞれ絶縁性プレート１５の複数の孔部１４を互いに対応させるように複数枚重ねて設けられて回路構造体１０を構成している。 A plurality of such circuit boards 13 are provided to overlap each other so that the plurality of hole portions 14 of the insulating plate 15 correspond to each other to constitute the circuit structure 10.
　また、回路構造体１０は、複数枚重ねて設けられた回路基板１３の絶縁性プレート１５の複数の孔部１４、及び、孔部１４に対応する位置に設けられた導電箔１７の開口部１６ａに差し込まれて、回路基板１３と電気的に接続し、回路基板１３の回路パターン１８の所定の領域同士をそれぞれ導通させるスルーピン１９を備えている。 In addition, the circuit structure 10 includes a plurality of holes 14 of the insulating plate 15 of the circuit board 13 provided in a plurality of layers, and an opening 16 a of the conductive foil 17 provided at a position corresponding to the holes 14. And through-pins 19 that are electrically connected to the circuit board 13 and electrically connect predetermined regions of the circuit pattern 18 of the circuit board 13 to each other.
　図４は、スルーピン１９の断面図である。スルーピン１９は、細長の矩形状に打ち抜かれた銅板等の導電性金属板の一部分を、長辺方向に沿って折り曲げて、例えば０．５ｍｍ四方の断面矩形状に形成されている。スルーピン１９の先端は、尖った四角錐面状にプレス加工されている。スルーピン１９の断面形状は、これに限らず、例えばその他の多角形状等に形成されていてもよい。 FIG. 4 is a cross-sectional view of the through pin 19. The through pin 19 is formed in a rectangular shape having a cross section of 0.5 mm square, for example, by bending a part of a conductive metal plate such as a copper plate punched into an elongated rectangular shape along the long side direction. The tip of the through pin 19 is pressed into a pointed quadrangular pyramid surface. The cross-sectional shape of the through pin 19 is not limited to this, and may be formed in other polygonal shapes, for example.
　スルーピン１９は、図５（ａ）及び（ｂ）に示すように、複数枚重ねて設けられた回路基板１３の絶縁性プレート１５の複数の孔部１４、及び、孔部１４に対応する位置に設けられた導電箔１７の開口部１６ａに差し込まれると、絶縁性プレート１５の孔部１４に突出する回路パターン１８の導電箔１７に当たる。そのままスルーピン１９が差し込まれると、導電箔１７を絶縁性プレート１５の孔部１４の内壁方向へ折り曲げる。スルーピン１９をさらに差し込むと、図６（ａ）及び（ｂ）に示すように、折り曲げられた導電箔１７が、絶縁性プレート１５の孔部１４の内壁と、孔部１４に差し込まれたスルーピン１９との隙間を埋めるように、孔部１４の内壁とスルーピン１９との間に嵌め込まれる。回路構造体１０内において、スルーピン１９は、図６（ｂ）に示すように導電箔１７と電気的に接続されることにより、回路基板１３の回路パターン１８の所定の領域同士の導通を実現している。 As shown in FIGS. 5A and 5B, the through pins 19 are provided at a position corresponding to the plurality of holes 14 of the insulating plate 15 of the circuit board 13 provided in a stacked manner and the holes 14. When inserted into the opening 16 a of the provided conductive foil 17, it hits the conductive foil 17 of the circuit pattern 18 protruding into the hole 14 of the insulating plate 15. When the through pin 19 is inserted as it is, the conductive foil 17 is bent toward the inner wall of the hole 14 of the insulating plate 15. When the through pin 19 is further inserted, as shown in FIGS. 6A and 6B, the bent conductive foil 17 is inserted into the inner wall of the hole portion 14 of the insulating plate 15 and the through pin 19 inserted into the hole portion 14. Is fitted between the inner wall of the hole 14 and the through pin 19 so as to fill the gap. In the circuit structure 10, the through pin 19 is electrically connected to the conductive foil 17 as shown in FIG. 6B, thereby realizing conduction between predetermined regions of the circuit pattern 18 of the circuit board 13. ing.
　ここで、スルーピン１９による回路パターン１８の導通の種々の形態について、図７～９を用いて説明する。本実施形態に係るジョイントボックス１１は、図１及び２に示すように、領域Ａ、Ｂ，Ｃを備え、当該３つの領域で、それぞれコネクタが嵌合する構造を有している。 Here, various forms of conduction of the circuit pattern 18 by the through pin 19 will be described with reference to FIGS. As shown in FIGS. 1 and 2, the joint box 11 according to this embodiment includes regions A, B, and C, and has a structure in which connectors are respectively fitted in the three regions.
　図７は、複数枚の回路基板１３を積層させて構成された回路構造体を示す。図７に示す構成では、積層された複数枚の回路基板１３にスルーピン１９ａ～１９ｉを差し込んで領域Ａ，Ｂ，Ｃのそれぞれを導通させている。図７において、スルーピン１９ａ，１９ｂは、領域Ａに設けられた回路基板１３に差し込まれている。スルーピン１９ｃ，１９ｄ，１９ｅは、領域Ｂに設けられた回路基板１３に差し込まれている。スルーピン１９ｆ，１９ｇ，１９ｈ，１９ｉは、領域Ｃに設けられた回路基板１３に差し込まれている。 FIG. 7 shows a circuit structure formed by laminating a plurality of circuit boards 13. In the configuration shown in FIG. 7, through pins 19a to 19i are inserted into a plurality of stacked circuit boards 13, and the regions A, B, and C are made conductive. In FIG. 7, the through pins 19 a and 19 b are inserted into the circuit board 13 provided in the region A. The through pins 19c, 19d, and 19e are inserted into the circuit board 13 provided in the region B. The through pins 19f, 19g, 19h, 19i are inserted into the circuit board 13 provided in the region C.
　スルーピン１９ｂと１９ｃとは、最上段の回路基板１３において領域ＡとＢとに亘って設けられた回路パターン１８に電気的に接続されており、これにより、回路パターン１８を領域Ａと領域Ｂとで導通させている。そうして、領域Ａのスルーピン１９ｂに接続されたコネクタ（不図示）と、領域Ｂのスルーピン１９ｃに接続された他のコネクタ（不図示）とが、互いに導通するようになっている。 The through pins 19b and 19c are electrically connected to the circuit pattern 18 provided over the regions A and B in the uppermost circuit board 13, whereby the circuit pattern 18 is connected to the regions A and B. Conducted with. Thus, a connector (not shown) connected to the through pin 19b in the region A and another connector (not shown) connected to the through pin 19c in the region B are electrically connected to each other.
　スルーピン１９ｅと１９ｆとは、中段の回路基板１３において領域ＢとＣとに亘って設けられた回路パターン１８に電気的に接続されており、これにより、回路パターン１８を領域Ｂと領域Ｃとで導通させている。そうして、領域Ｂのスルーピン１９ｅに接続されたコネクタ（不図示）と、領域Ｃのスルーピン１９ｆに接続された他のコネクタ（不図示）とが、互いに導通するようになっている。 The through pins 19e and 19f are electrically connected to the circuit pattern 18 provided over the areas B and C in the circuit board 13 in the middle stage, whereby the circuit pattern 18 is divided between the areas B and C. Conducted. Thus, the connector (not shown) connected to the through pin 19e in the region B and the other connector (not shown) connected to the through pin 19f in the region C are electrically connected to each other.
　スルーピン１９ｇと１９ｈとは、最上段の回路基板１３において領域Ｃに設けられた回路パターン１８に電気的に接続されており、これにより、回路パターン１８を領域Ｃ内の所定部位同士で導通させている。 The through pins 19g and 19h are electrically connected to the circuit pattern 18 provided in the region C in the uppermost circuit board 13, thereby causing the circuit pattern 18 to conduct between predetermined portions in the region C. Yes.
　スルーピン１９ａと１９ｉとは、最下段の回路基板１３において領域ＡとＣとに亘って設けられた回路パターン１８に電気的に接続されており、これにより、回路パターン１８を領域Ａと領域Ｃとで導通させている。そうして、領域Ａのスルーピン１９ａに接続されたコネクタ（不図示）と、領域Ｃのスルーピン１９ｉに接続された他のコネクタ（不図示）とが、互いに導通するようになっている。 The through pins 19a and 19i are electrically connected to the circuit pattern 18 provided over the regions A and C in the lowermost circuit board 13, whereby the circuit pattern 18 is connected to the regions A and C. Conducted with. Thus, a connector (not shown) connected to the through pin 19a in the area A and another connector (not shown) connected to the through pin 19i in the area C are electrically connected to each other.
　図８は、一枚の回路基板１３で構成された回路構造体を示す。図８において、スルーピン１９ｊは、領域Ａに設けられた回路基板１３に差し込まれている。スルーピン１９ｋは、領域Ｂに設けられた回路基板１３に差し込まれている。スルーピン１９ｌ，１９ｍは、領域Ｃに設けられた回路基板１３に差し込まれている。 FIG. 8 shows a circuit structure composed of a single circuit board 13. In FIG. 8, the through pin 19j is inserted into the circuit board 13 provided in the region A. The through pin 19k is inserted into the circuit board 13 provided in the region B. The through pins 19l and 19m are inserted into the circuit board 13 provided in the region C.
　スルーピン１９ｊと１９ｋとは、回路基板１３において領域ＡとＢとに亘って設けられた回路パターン１８に電気的に接続されており、これにより、回路パターン１８を領域Ａと領域Ｂとで導通させている。そうして、領域Ａのスルーピン１９ｊに接続されたコネクタ（不図示）と、領域Ｂのスルーピン１９ｋに接続された他のコネクタ（不図示）とが、互いに導通するようになっている。 The through pins 19j and 19k are electrically connected to the circuit pattern 18 provided over the regions A and B in the circuit board 13, thereby making the circuit pattern 18 conductive between the region A and the region B. ing. Thus, a connector (not shown) connected to the through pin 19j in the region A and another connector (not shown) connected to the through pin 19k in the region B are electrically connected to each other.
　スルーピン１９ｌと１９ｍとは、回路基板１３において領域Ｃに設けられた回路パターン１８に電気的に接続されており、これにより、回路パターン１８を領域Ｃ内の所定部位同士で導通させている。 The through pins 19l and 19m are electrically connected to the circuit pattern 18 provided in the region C in the circuit board 13, and thereby the circuit pattern 18 is electrically connected to each other in the region C.
　図９は、複数枚の回路基板１３を積層させて構成された回路構造体を示す。図９において、スルーピン１９ｎ，１９ｏ，１９ｐは、それぞれ積層された複数枚の回路基板１３を貫通するように差し込まれている。 FIG. 9 shows a circuit structure formed by laminating a plurality of circuit boards 13. In FIG. 9, the through pins 19n, 19o, and 19p are inserted so as to penetrate through the plurality of laminated circuit boards 13, respectively.
　スルーピン１９ｎと１９ｏとは、最上段の回路基板１３に設けられた回路パターン１８に電気的に接続されており、これにより、最上段の回路基板１３の回路パターン１８を所定部位同士で導通させている。 The through pins 19n and 19o are electrically connected to a circuit pattern 18 provided on the uppermost circuit board 13, thereby causing the circuit pattern 18 of the uppermost circuit board 13 to conduct between predetermined portions. Yes.
　また、スルーピン１９ｏは、最上段の回路基板１３の回路パターン１８と、中段の回路基板１３の回路パターン１８とに電気的に接続されており、これにより、最上段の回路パターン１８と中段の回路パターン１８をとを導通させている。 The through pin 19o is electrically connected to the circuit pattern 18 on the uppermost circuit board 13 and the circuit pattern 18 on the middle circuit board 13, whereby the uppermost circuit pattern 18 and the middle circuit are connected. The pattern 18 is made conductive.
　スルーピン１９ｐは、最上段の回路基板１３の回路パターン１８と、最下段の回路基板１３の回路パターン１８とに電気的に接続されており、これにより、最上段の回路パターン１８と最下段の回路パターン１８をとを導通させている。このような構成によれば、３次元的に複数の回路基板１３を組み立てて導通させることができるため、高集積化の点で特に有利である。さらに、スルーピン１９によって、所定の回路パターンを有する１つの回路基板１３と、異なる回路パターン１８を備える他の回路基板１３とを導通させることができる。 The through pin 19p is electrically connected to the circuit pattern 18 of the uppermost circuit board 13 and the circuit pattern 18 of the lowermost circuit board 13, whereby the uppermost circuit pattern 18 and the lowermost circuit board are connected. The pattern 18 is made conductive. According to such a configuration, a plurality of circuit boards 13 can be assembled and conducted three-dimensionally, which is particularly advantageous in terms of high integration. Furthermore, the through pins 19 can electrically connect one circuit board 13 having a predetermined circuit pattern and another circuit board 13 having a different circuit pattern 18.
　なお、本実施形態では、ジョイントボックス１１がコネクタを嵌合させる３つの領域（領域Ａ，Ｂ，Ｃ）を備えているが、当該領域の数は限定されず、３つより少なくてもよいし、多くてもよい。 In the present embodiment, the joint box 11 includes three regions (regions A, B, and C) into which the connector is fitted. However, the number of the regions is not limited, and may be less than three. There may be many.
　また、回路パターン１８において、非接触開口部１６’ａにもスルーピン１９が差し込まれるが、非接触開口部１６’ａには、絶縁性プレート１５の孔部１４に導電箔１７が突出していないため、スルーピン１９とその回路パターン１８の導電箔１７とは接触しないが、他の層における回路基板１３の導電箔１７において対応する位置に形成された開口部１６ａに差し込まれて、導電箔１７を折り曲げて接触し、電気的に接続されている。 Further, in the circuit pattern 18, the through pin 19 is also inserted into the non-contact opening 16′a, but the conductive foil 17 does not protrude into the hole 14 of the insulating plate 15 in the non-contact opening 16′a. The through pin 19 and the conductive foil 17 of the circuit pattern 18 are not in contact with each other, but are inserted into the opening 16a formed at a corresponding position in the conductive foil 17 of the circuit board 13 in another layer, and the conductive foil 17 is bent. Are in contact and electrically connected.
　なお、本実施形態では、回路パターン１８の導電箔１７の開口部１６ａに差し込まれたスルーピン１９によって折り曲げられた導電箔１７が、孔部１４の内壁とスルーピン１９との間に隙間無く嵌め込まれているが、これに限らず、図１０に示すように、折り曲げられてスルーピン１９に接触する導電箔１７と、孔部１４の内壁とに隙間が形成されていてもよい。 In the present embodiment, the conductive foil 17 bent by the through pin 19 inserted into the opening 16a of the conductive foil 17 of the circuit pattern 18 is fitted between the inner wall of the hole 14 and the through pin 19 without a gap. However, the present invention is not limited thereto, and as shown in FIG. 10, a gap may be formed between the conductive foil 17 that is bent and contacts the through pin 19 and the inner wall of the hole portion 14.
　絶縁性プレート１５の複数の孔部１４に差し込まれた複数本のスルーピン１９は、狭ピッチ且つ２～１５行×２～１６列に配列することができ、本実施形態では、図１及び２に示すように、ピッチ間隔が１．５～２．２ｍｍであって、７行×１２列に配列されている。このため、本実施形態に係る回路構造体１０は、特に、狭ピッチ且つ多段配列の端子構造を有する信号系のコネクタに対応することができる。 The plurality of through pins 19 inserted into the plurality of holes 14 of the insulating plate 15 can be arranged in a narrow pitch and 2 to 15 rows × 2 to 16 columns. In the present embodiment, FIGS. As shown in the figure, the pitch interval is 1.5 to 2.2 mm, and they are arranged in 7 rows × 12 columns. For this reason, the circuit structure 10 according to the present embodiment can correspond to a signal system connector having a terminal structure with a narrow pitch and a multistage arrangement.
　ボックス体１２は、回路構造体１０を覆うように設けられ、それぞれ樹脂等の絶縁性材料で構成された上側ボックス３０と下側ボックス３１とを備えている。図１１に、上側と下側から回路構造体１０を覆うボックス体１２の断面図を示す。 The box body 12 is provided so as to cover the circuit structure 10 and includes an upper box 30 and a lower box 31 each made of an insulating material such as a resin. In FIG. 11, sectional drawing of the box body 12 which covers the circuit structure 10 from the upper side and the lower side is shown.
　上側ボックス３０は、回路構造体１０の信号入出力側に設けられ、下側ボックス３１は、回路構造体１０の信号入出力側とは反対側に設けられている。上側ボックス３０及び下側ボックス３１は、回路基板１３の孔部１４に対応する位置に、それぞれスルーピン１９の断面積より小さい面積を有する複数の貫通孔３２及び差込孔３３が形成されており、この貫通孔３２及び差込孔３３にスルーピン１９が差し込まれる。スルーピン１９は、上側ボックス３０の方から差し込まれており、上側ボックス３０の貫通孔３２を貫通して一方の先端が外部に突出している。スルーピン１９の他方の先端は、下側ボックス３１の差込孔３３に圧入固定されている。また、スルーピン１９は、上側ボックス３０の貫通孔３２にも圧入されており、この貫通孔３２でスルーピン１９が挟持されて固定されている。 The upper box 30 is provided on the signal input / output side of the circuit structure 10, and the lower box 31 is provided on the side opposite to the signal input / output side of the circuit structure 10. In the upper box 30 and the lower box 31, a plurality of through holes 32 and insertion holes 33 each having an area smaller than the cross-sectional area of the through pin 19 are formed at positions corresponding to the hole portions 14 of the circuit board 13. The through pin 19 is inserted into the through hole 32 and the insertion hole 33. The through pin 19 is inserted from the upper box 30 and passes through the through-hole 32 of the upper box 30 so that one end protrudes to the outside. The other tip of the through pin 19 is press-fitted and fixed in the insertion hole 33 of the lower box 31. The through pin 19 is also press-fitted into the through hole 32 of the upper box 30, and the through pin 19 is sandwiched and fixed by the through hole 32.
　本実施形態に係る回路構造体１０は、上述のように、厚さ方向に貫通する孔部１４がそれぞれ所定の行及び列に配列するように形成された絶縁性プレート１５、及び、絶縁性プレート１５上に形成され、孔部１４に対応するように複数の開口部１６ａが設けられた導電箔１７から成る回路パターン１８を備える回路基板１３が複数枚積層されており、回路基板１３の所定の領域同士は、スルーピン１９によって導通されている。このような構造によって、回路構造体１０が３次元的な回路構造を有し、コンパクトに形成されている。 As described above, the circuit structure 10 according to the present embodiment includes the insulating plate 15 formed so that the holes 14 penetrating in the thickness direction are arranged in predetermined rows and columns, and the insulating plate, respectively. A plurality of circuit boards 13 each having a circuit pattern 18 formed of a conductive foil 17 formed on the board 15 and provided with a plurality of openings 16a so as to correspond to the holes 14 are laminated. The regions are electrically connected by a through pin 19. With such a structure, the circuit structure 10 has a three-dimensional circuit structure and is compactly formed.
　（回路構造体１０を備えたジョイントボックス１１の製造方法）
　次に、回路構造体１０を備えたジョイントボックス１１の製造方法について説明する。まず、スルーピン１９を作製する。図１２（ａ）～（ｆ）に、スルーピン１９の製造工程の説明図を示す。図１２（ａ）に示すように、まず、例えば厚さが０．２ｍｍで所定幅の銅板４０を準備し、圧延により、図１２（ｂ）に示すように、例えば厚さ０．１６ｍｍに押し潰す。続いて、図１２（ｃ）に示すように、銅板４０の長辺方向に沿った両側部４１を立ち上げて間に基体部４２を形成すると共に、図１２（ｄ）に示すように、両側部４１を内側に曲げ、さらに図１２（ｅ）に示すように、そのまま基体部４２上に折り畳む。次いで、図１２（ｆ）に示すように、折り畳んだ両側部４１を基体部４２と共に立ち上げて、両側部４１同士を密着させ、四方から機械的に圧縮して、図４に示す０．５ｍｍ四方の断面形状とする。なお、スルーピン１９は、図１２（ｆ）に示すように、基体部４２を下方にわずかに膨らました形状のままであってもよい。 (Manufacturing method of the joint box 11 provided with the circuit structure 10)
Next, the manufacturing method of the joint box 11 provided with the circuit structure 10 is demonstrated. First, the through pin 19 is manufactured. 12A to 12F are explanatory views of the manufacturing process of the through pin 19. As shown in FIG. 12A, first, a copper plate 40 having a thickness of, for example, 0.2 mm is prepared, and is rolled to a thickness of 0.16 mm, for example, as shown in FIG. Crush. Subsequently, as shown in FIG. 12 (c), both side portions 41 along the long side direction of the copper plate 40 are raised to form a base portion 42 therebetween, and as shown in FIG. The part 41 is bent inward and is further folded on the base part 42 as shown in FIG. Next, as shown in FIG. 12 (f), the folded both side portions 41 are raised together with the base portion 42, the both side portions 41 are brought into close contact with each other, and mechanically compressed from all sides, and 0.5 mm shown in FIG. A cross-sectional shape on all sides. Note that the through pin 19 may have a shape in which the base portion 42 is slightly swollen downward as shown in FIG.
　このような構成によれば、導電性金属板を折り曲げて、空洞部がなく、且つ、上下方向に幅のある断面四角形の棒状に成形しているので、導電性金属板の板厚が薄い場合でも、導電金属板の厚みと比較して一辺の厚みが十分に大きいスルーピン１９を得ることができ、スルーピン１９が上下方向に湾曲したり、あるいは折損することが少ない。また、横断面が円形状又は多角形状等の線材を所定の長さに切断して、スルーピン１９を作製してもよい。線材としては、黄銅等の銅合金が適用され、外周がＳｎメッキされているものが好ましい。 According to such a configuration, when the conductive metal plate is thin, since the conductive metal plate is bent and formed into a bar having a square section with a width in the vertical direction without a hollow portion, However, it is possible to obtain a through pin 19 having a sufficiently large thickness on one side compared to the thickness of the conductive metal plate, and the through pin 19 is less likely to bend or break in the vertical direction. Alternatively, the through pin 19 may be manufactured by cutting a wire having a circular or polygonal cross section into a predetermined length. As the wire, a copper alloy such as brass is applied, and the outer periphery is preferably Sn-plated.
　次に、回路基板１３を作製する。回路基板１３の作製としては、まず、例えば厚さが５０～２００μｍの銅製の導電箔１７を、短辺の長さを１００～２００ｍｍとし、長辺の長さを１００～３００ｍｍの短形に切断し、複数の同一寸法の導電箔１７を形成し、その内の２枚の導電箔１７を上下に重ね合わせる。この際、上側の導電箔１７を上導電箔とし、下側の導電箔１７を下導電箔とする。 Next, the circuit board 13 is produced. For the production of the circuit board 13, first, for example, a copper conductive foil 17 having a thickness of 50 to 200 μm is cut into a short shape with a short side length of 100 to 200 mm and a long side length of 100 to 300 mm. Then, a plurality of conductive foils 17 having the same dimensions are formed, and two of the conductive foils 17 are stacked one above the other. At this time, the upper conductive foil 17 is an upper conductive foil, and the lower conductive foil 17 is a lower conductive foil.
　次いで、複数の打抜刃（ビグ刃）を有する打抜加工機を準備し、その台座の所定位置に、上下に重ね合わせた上導電箔と下導電箔とを配置する。また、打抜刃が、上導電箔を貫通し、下導電箔には貫通せずに僅かに切り込まれる（ハーフカットされる）ように打抜加工機又は打抜刃を調節する。そして、下導電箔を下敷き材として上導電箔を打抜刃にて打抜く。打抜刃は、上導電箔を貫通し、下導電箔には貫通せずに僅かに挿通される程度で停止する。すなわち、所定の形状に打抜かれた上導電箔と、所定の形状の輪郭部に所々切れ込みが入ったハーフカットの切込線部が形成された下導電箔とを形成する。 Next, a punching machine having a plurality of punching blades (big blades) is prepared, and an upper conductive foil and a lower conductive foil superimposed on each other are arranged at predetermined positions on the pedestal. Further, the punching machine or the punching blade is adjusted so that the punching blade penetrates the upper conductive foil and is slightly cut (half cut) without penetrating the lower conductive foil. Then, the upper conductive foil is punched with a punching blade using the lower conductive foil as an underlay material. The punching blade passes through the upper conductive foil and stops to the extent that it is inserted slightly without penetrating the lower conductive foil. That is, an upper conductive foil punched into a predetermined shape and a lower conductive foil in which a half-cut cut line portion having cuts in the contour portion of the predetermined shape are formed.
　次に、上導電箔の所定の形状とは関係のない部位を取り除き、所定の形状を有する中間導体を形成する。この中間導体は、回路パターン１８と、その外周縁部を縁取るような捨て部材と、回路パターン１８及び捨て部材とを連結する連結部とを有している。すなわち、短冊状の導電箔１７を２枚重ねて、上側に配置される導電箔１７（上導電箔）を打抜く際に、回路パターン１８と、捨て部材と、連結部とを有する形状に打抜く。また、このとき、回路パターン１８には上述した複数の開口部１６ａが形成されている。 Next, a portion unrelated to the predetermined shape of the upper conductive foil is removed, and an intermediate conductor having a predetermined shape is formed. The intermediate conductor has a circuit pattern 18, a discarding member that borders the outer peripheral edge thereof, and a connecting portion that connects the circuit pattern 18 and the discarding member. That is, when two strip-shaped conductive foils 17 are stacked and the conductive foil 17 (upper conductive foil) disposed on the upper side is punched out, it is punched into a shape having a circuit pattern 18, a discard member, and a connecting portion. Unplug. At this time, the circuit pattern 18 has the plurality of openings 16a described above.
　その後、次の中間導体を形成する。具体的には、上導電箔の下敷き材であった下導電箔を、新上導電箔とし、別の導電箔１７を下敷き材として上下に重ね合わせる。そして、新上導電箔を、別の導電箔１７を下敷きとして、打抜刃にて打抜いて次の中間導体を形成する。すなわち、下導電箔を上側に配置して新上導電箔とし、次の導電箔１７を下側に配置して新下導電箔とする。 After that, the next intermediate conductor is formed. Specifically, the lower conductive foil that was the underlaying material of the upper conductive foil is used as a new upper conductive foil, and another conductive foil 17 is used as an underlaying material so as to overlap each other. Then, the new upper conductive foil is punched with a punching blade using another conductive foil 17 as an underlay to form the next intermediate conductor. That is, the lower conductive foil is disposed on the upper side to form a new upper conductive foil, and the next conductive foil 17 is disposed on the lower side to form a new lower conductive foil.
　以上の工程を順次繰返して、バッチ方式で次々と新しい導電箔１７を下敷き材に用いて、その前に下敷き材であった導電箔１７を打抜いていき、回路パターン１８を形成していく。 The above steps are sequentially repeated, and new conductive foils 17 are successively used in the batch method as an underlay material. Before that, the conductive foil 17 that was the underlay material is punched to form a circuit pattern 18.
　次に、複数の樹脂製等の絶縁性プレート１５を準備し、それぞれ打抜加工機を用いて所定の位置に孔部１４等を形成する。または、金型に射出成形で所定の孔を有する絶縁性プレート１５を形成する。打抜加工で成形する場合、熱硬化性樹脂を用い、射出成形で作製する場合は、熱可塑性樹脂を用いる。具体的には、ポリプロピレン等を用いることができる。射出成形で絶縁性プレート１５を作製する方が、切削くずが発生せず、材料を有効活用できる点で好ましい。 Next, a plurality of resin-made insulating plates 15 are prepared, and holes 14 and the like are formed at predetermined positions using a punching machine. Alternatively, the insulating plate 15 having predetermined holes is formed in the mold by injection molding. When forming by punching, a thermosetting resin is used, and when forming by injection molding, a thermoplastic resin is used. Specifically, polypropylene or the like can be used. It is preferable to produce the insulating plate 15 by injection molding in that cutting waste does not occur and the material can be used effectively.
　次いで、絶縁性プレート１５上に、上記のように形成した複数の回路パターン１８を、所定の孔部１４と所定の開口部１６ａとが対応するようにそれぞれ位置合わせして貼り合わせることにより、複数の回路基板１３を形成する。このとき、回路パターン１８と絶縁性プレート１５とは、接着剤を用いて直接貼り合わせてもよいし、一旦回路パターン１８をシールのように転写してから貼り合わせてもよい。 Next, a plurality of circuit patterns 18 formed as described above are aligned and bonded on the insulating plate 15 so that the predetermined holes 14 and the predetermined openings 16a correspond to each other. The circuit board 13 is formed. At this time, the circuit pattern 18 and the insulating plate 15 may be directly bonded using an adhesive, or may be bonded after the circuit pattern 18 is once transferred like a seal.
　続いて、回路基板１３を、それぞれの孔部１４を対応させて４枚重ね合わせ、その上側及び下側をそれぞれ上側ボックス３０及び下側ボックス３１（ボックス体１２）で覆う。このとき、上側ボックス３０の貫通孔３２及び下側ボックス３１の差込孔３３は、それぞれ回路基板１３の複数の孔部１４にそれぞれ対応するように設ける。 Subsequently, four circuit boards 13 are overlapped with each other corresponding to the respective hole portions 14, and the upper and lower sides thereof are covered with the upper box 30 and the lower box 31 (box body 12), respectively. At this time, the through hole 32 of the upper box 30 and the insertion hole 33 of the lower box 31 are provided so as to respectively correspond to the plurality of hole portions 14 of the circuit board 13.
　次いで、ピッチ間隔が１．５～２．２ｍｍで、７行×１２列に配列させたスルーピン１９を、上側ボックス３０の貫通孔３２から積層した回路基板１３の回路パターン１８の開口部１６ａ、絶縁性プレート１５の孔部１４へとそれぞれ差し込んでいく。このとき、スルーピン１９は、図５（ａ）及び（ｂ）に示すように、絶縁性プレート１５の孔部１４に突出する回路パターン１８の導電箔１７に当たってさらに進み、導電箔１７を絶縁性プレート１５の孔部１４の内壁方向へ折り曲げる。そして、図６（ａ）及び（ｂ）に示すように、折り曲げられた導電箔１７が、絶縁性プレート１５の孔部１４の内壁と、孔部１４に差し込まれたスルーピン１９との隙間を埋めるように、孔部１４の内壁とスルーピン１９との間に嵌め込まれる。 Next, the openings 16 a of the circuit pattern 18 of the circuit board 13 in which the through pins 19 arranged in 7 rows × 12 columns with a pitch interval of 1.5 to 2.2 mm are stacked from the through holes 32 of the upper box 30, are insulated. Each is inserted into the hole 14 of the adhesive plate 15. At this time, as shown in FIGS. 5 (a) and 5 (b), the through pin 19 further advances against the conductive foil 17 of the circuit pattern 18 protruding into the hole 14 of the insulating plate 15, and passes through the conductive foil 17 through the insulating plate. The 15 holes 14 are bent in the direction of the inner wall. 6A and 6B, the bent conductive foil 17 fills the gap between the inner wall of the hole 14 of the insulating plate 15 and the through pin 19 inserted into the hole 14. Thus, it fits between the inner wall of the hole 14 and the through pin 19.
　差し込んだスルーピン１９の先端は、下側ボックス３１の差込孔３３に圧入して固定される。また、このとき、スルーピン１９は上側ボックス３０の貫通孔３２にも圧入されており、この貫通孔３２で挟持されることで固定される。 The tip of the inserted through pin 19 is press-fitted into the insertion hole 33 of the lower box 31 and fixed. At this time, the through pin 19 is also press-fitted into the through hole 32 of the upper box 30 and is fixed by being sandwiched by the through hole 32.
　以上の工程により、回路構造体１０を備えたジョイントボックス１１が完成する。 The joint box 11 including the circuit structure 10 is completed through the above steps.
　（作用効果）
　次に、本発明の実施形態の作用効果について説明する。 (Function and effect)
Next, the function and effect of the embodiment of the present invention will be described.
　本発明の実施形態に係る回路構造体１０は、回路パターン１８の導電箔１７の絶縁性プレート１５の少なくとも１つの孔部１４に対応する位置に、孔部１４より面積が小さい開口部１６ａを設けており、この開口部１６ａにスルーピン１９を差し込んで、絶縁性プレート１５の孔部１４の内壁方向へ導電箔１７を折り曲げている。そして、スルーピン１９が、この折り曲げられた導電箔１７に接触することにより、回路基板１３と電気的に接続し、回路基板１３の回路パターン１８の所定の領域をそれぞれ導通させる。 The circuit structure 10 according to the embodiment of the present invention is provided with an opening 16a having an area smaller than that of the hole 14 at a position corresponding to at least one hole 14 of the insulating plate 15 of the conductive foil 17 of the circuit pattern 18. The through pin 19 is inserted into the opening 16a, and the conductive foil 17 is bent toward the inner wall of the hole 14 of the insulating plate 15. The through pins 19 are in contact with the bent conductive foil 17 to be electrically connected to the circuit board 13 and to conduct predetermined regions of the circuit pattern 18 of the circuit board 13 respectively.
　このため、回路基板１３の回路パターン１８を導通させるために、回路パターン１８の縁から絶縁性プレート１５上に亘って、載置する部品の高密度化や孔部１４の狭ピッチ化の妨げとなる受端子を設けなくてよい。従って、狭ピッチ且つ多段配列の端子を備えるコネクタに対応することができる。また、受端子の形成工程を別に設ける必要が無くなる。 Therefore, in order to make the circuit pattern 18 of the circuit board 13 conductive, the density of components to be placed and the narrow pitch of the holes 14 are hindered from the edge of the circuit pattern 18 to the insulating plate 15. It is not necessary to provide a receiving terminal. Therefore, it is possible to cope with a connector having terminals with a narrow pitch and a multistage arrangement. Moreover, it is not necessary to provide a receiving terminal forming step separately.
　さらに、従来はスルーピンを差し込む際に、受端子の開口部と絶縁性プレートの孔部とを精度良く位置合わせしてそれぞれ設けると共に、スルーピンの径と受端子の開口部等の径とが対応するように精度良く形成しなければならないのに対し、本発明の構成によれば、スルーピン１９を導電箔１７の開口部１６ａに差し込み、導電箔１７を折り曲げる構成となっているため、受端子の開口部の大きさ等について少々の誤差があっても問題無くスルーピンを差し込んで導通させることができる。このため、回路構造体の製造効率及び製造コストが良好となる。 Further, conventionally, when inserting the through pin, the opening of the receiving terminal and the hole of the insulating plate are aligned with each other with high precision, and the diameter of the through pin corresponds to the diameter of the opening of the receiving terminal. However, according to the configuration of the present invention, the through pin 19 is inserted into the opening 16a of the conductive foil 17, and the conductive foil 17 is bent. Even if there is a slight error in the size of the portion, the through pin can be inserted and conducted without any problem. For this reason, the manufacturing efficiency and manufacturing cost of the circuit structure are improved.
　また、本発明の実施形態に係るスルーピン１９は、全ての回路基板１３を貫通する長さにすることで、複数枚の回路基板１３を積層させて回路基板構造体を作製しても、回路基板１３の積層順を気にすることなく組み立てることができる。すなわち、同一の絶縁性プレート１５を積層させる場合に、不所望の積層を防止するために、回路基板１９に印や模様を付けたり、形状に特徴を持たせる必要がなくなり、製造効率等が良好となる。 In addition, the through pin 19 according to the embodiment of the present invention has a length that penetrates all the circuit boards 13, so that a circuit board structure can be produced by stacking a plurality of circuit boards 13. It is possible to assemble without worrying about the order of 13 layers. That is, when the same insulating plate 15 is laminated, it is not necessary to mark or pattern the circuit board 19 or to give a feature to the shape in order to prevent undesired lamination, and the manufacturing efficiency is good. It becomes.
　以上説明したように、本発明は、回路構造体、ジョイントボックス、及び、回路構造体の製造方法について有用である。 As described above, the present invention is useful for a circuit structure, a joint box, and a method for manufacturing a circuit structure.
　　　　　１０　　　回路構造体
　　　　　１１　　　ジョイントボックス
　　　　　１２　　　ボックス体
　　　　　１３　　　回路基板
　　　　　１４　　　孔部
　　　　　１５　　　絶縁性プレート
　　　　　１６’　　非接触開口部
　　　　　１６ａ～ｈ　　開口部
　　　　　１７　　　導電箔
　　　　　１８　　　回路パターン
　　　　　１９、１９ａ～ｐ　　　スルーピン
　　　　　２０、２１、２２　　　切欠部
　　　　　２３　　　スリット
　　　　　３０　　　上側ボックス
　　　　　３１　　　下側ボックス
　　　　　３２　　　貫通孔
　　　　　３３　　　差込孔 DESCRIPTION OF SYMBOLS 10 Circuit structure 11 Joint box 12 Box body 13 Circuit board 14 Hole part 15 Insulating plate 16 'Non-contact opening part 16a-h opening part 17 Conductive foil 18 Circuit pattern 19, 19a-p Through pin 20, 21, 22 Notch part 23 Slit 30 Upper box 31 Lower box 32 Through hole 33 Insertion hole

Claims (10)

  1. 　厚さ方向に貫通する孔部が複数形成された絶縁性プレートと、該絶縁性プレート上に形成されると共に、該絶縁性プレートの少なくとも１つの孔部に対応する位置に該孔部より面積が小さい開口部が設けられた導電箔から成る回路パターンと、を備えた回路基板が、１枚、又は、該絶縁性プレートの複数の孔部を互いに対応させるように複数枚重ねて設けられ、
    　上記回路基板の上記絶縁性プレートの複数の孔部、及び、該複数の孔部の少なくとも１つに対応する位置に設けられた上記導電箔の開口部に差し込まれて、該絶縁性プレートの孔部の内壁方向へ該導電箔を折り曲げると共に、折り曲げられた該導電箔に接触することにより、上記回路基板と電気的に接続し、該回路基板の回路パターンの所定の領域同士をそれぞれ導通させるスルーピンを備えた回路構造体。     An insulating plate formed with a plurality of holes penetrating in the thickness direction, and formed on the insulating plate, and having an area larger than the hole at a position corresponding to at least one hole of the insulating plate; A circuit board comprising a conductive pattern provided with a small opening, and a circuit board provided with one or a plurality of layers so as to correspond to a plurality of holes of the insulating plate,
    A plurality of holes of the insulating plate of the circuit board and a hole of the insulating plate inserted into the opening of the conductive foil provided at a position corresponding to at least one of the plurality of holes. Through-pins that bend the conductive foil in the direction of the inner wall of the part, and are electrically connected to the circuit board by contacting the bent conductive foil, thereby electrically connecting predetermined regions of the circuit pattern of the circuit board. A circuit structure comprising:
  2. 　請求項１に記載された回路構造体において、
    　上記導電箔の開口部は、切欠部を備えている回路構造体。     The circuit structure according to claim 1,
    The opening part of the said conductive foil is a circuit structure provided with the notch part.
  3. 　請求項１又は２に記載された回路構造体において、
    　上記折り曲げられた導電箔は、上記絶縁性プレートの孔部の内壁と、該孔部に差し込まれた上記スルーピンとの隙間を埋めるように、該孔部の内壁と該スルーピンとの間に嵌め込まれている回路構造体。     In the circuit structure according to claim 1 or 2,
    The bent conductive foil is fitted between the inner wall of the hole and the through pin so as to fill a gap between the inner wall of the hole of the insulating plate and the through pin inserted into the hole. Circuit structure.
  4. 　請求項１乃至３のいずれか１つに記載された回路構造体において、
    　上記スルーピンは、断面が多角形状に形成されている回路構造体。     The circuit structure according to any one of claims 1 to 3,
    The through pin is a circuit structure having a polygonal cross section.
  5. 　請求項１乃至４のいずれか１つに記載された回路構造体において、
    　上記絶縁性プレートの複数の孔部に差し込まれた上記スルーピンのピッチ間隔が１．５～２．２ｍｍである回路構造体。     The circuit structure according to any one of claims 1 to 4,
    A circuit structure in which a pitch interval between the through pins inserted into a plurality of holes of the insulating plate is 1.5 to 2.2 mm.
  6. 　厚さ方向に貫通する孔部が複数形成された絶縁性プレートと、該絶縁性プレート上に形成されると共に、該絶縁性プレートの少なくとも１つの孔部に対応する位置に該孔部より面積が小さい開口部が設けられた導電箔から成る回路パターンと、を備えた回路基板が、１枚、又は、該絶縁性プレートの複数の孔部を互いに対応させるように複数枚重ねて設けられ、該回路基板の該絶縁性プレートの複数の孔部、及び、該複数の孔部の少なくとも１つに対応する位置に設けられた該導電箔の開口部に差し込まれて、該絶縁性プレートの孔部の内壁方向へ該導電箔を折り曲げると共に、折り曲げられた該導電箔に接触することにより、該回路基板と電気的に接続し、該回路基板の回路パターンの所定の領域同士をそれぞれ導通させるスルーピンを備えた回路構造体と、
    　上記回路構造体を覆うように設けられたボックス体と、
    を備え、
    　上記ボックス体は、上記回路構造体の外部との信号入出力側に設けられ、上記スルーピンが外部に突出するように貫通する絶縁性の上側ボックスと、該回路構造体の該信号入出力側と反対側に設けられた絶縁性の下側ボックスと、を備えたジョイントボックス。     An insulating plate formed with a plurality of holes penetrating in the thickness direction, and formed on the insulating plate, and having an area larger than the hole at a position corresponding to at least one hole of the insulating plate; A circuit board comprising a conductive pattern provided with a small opening, and one or a plurality of stacked circuit boards that correspond to a plurality of holes of the insulating plate. A plurality of holes of the insulating plate of the circuit board and a hole of the insulating plate inserted into an opening of the conductive foil provided at a position corresponding to at least one of the plurality of holes. A through pin that folds the conductive foil in the direction of the inner wall of the circuit board and electrically connects to the circuit board by contacting the bent conductive foil and electrically connects predetermined areas of the circuit pattern of the circuit board. Preparation And the circuit structure was,
    A box body provided to cover the circuit structure;
    With
    The box body is provided on a signal input / output side with respect to the outside of the circuit structure, and an insulating upper box that penetrates so that the through pin protrudes to the outside; and the signal input / output side of the circuit structure; A joint box having an insulating lower box provided on the opposite side.
  7. 　請求項６に記載されたジョイントボックスにおいて、
    　上記下側ボックスは、上記スルーピンの先端を固定しているジョイントボックス。     In the joint box according to claim 6,
    The lower box is a joint box that fixes the tip of the through pin.
  8. 　請求項７に記載されたジョイントボックスにおいて、
    　上記下側ボックスは、上記スルーピンの断面積より小さい面積を有する差込孔が複数形成され、該差込孔に該スルーピンの先端を圧入することにより該スルーピンの先端が固定されるジョイントボックス。     The joint box according to claim 7,
    The lower box is a joint box in which a plurality of insertion holes having an area smaller than the cross-sectional area of the through pin are formed, and the tip of the through pin is fixed by press-fitting the tip of the through pin into the insertion hole.
  9. 　請求項６乃至８のいずれか１つに記載されたジョイントボックスにおいて、
    　上記上側ボックスは、厚さ方向に上記スルーピンが貫通すると共に、該スルーピンの断面積より小さい面積を有する貫通孔が複数形成され、該貫通孔に該スルーピンを圧入することにより該スルーピンが挟持されて固定されるジョイントボックス。     The joint box according to any one of claims 6 to 8,
    In the upper box, the through pin penetrates in the thickness direction, a plurality of through holes having an area smaller than the cross-sectional area of the through pin are formed, and the through pin is sandwiched by press-fitting the through pin into the through hole. Fixed joint box.
  10. 　厚さ方向に貫通する孔部が複数形成された絶縁性プレートと、該絶縁性プレート上に形成されると共に、該絶縁性プレートの少なくとも１つの孔部に対応する位置に該孔部より面積が小さい開口部が設けられた導電箔から成る回路パターンと、を備えた回路基板を一枚準備する、又は、複数枚準備して該絶縁性プレートの複数の孔部を互いに対応させるように重ねて設ける第１の工程と、
    　上記回路基板の上記絶縁性プレートの複数の孔部、及び、該複数の孔部の少なくとも１つに対応する位置に設けられた上記導電箔の開口部にスルーピンを差し込むことにより、該絶縁性プレートの孔部の内壁方向へ該導電箔を折り曲げると共に、折り曲げた該導電箔に上記スルーピンを接触させることによって、該スルーピンを上記回路基板と電気的に接続し、該回路基板の回路パターンの所定の領域同士をそれぞれ導通させるさせる第２の工程と、
    を備えた回路構造体の製造方法。     An insulating plate formed with a plurality of holes penetrating in the thickness direction, and formed on the insulating plate, and having an area larger than the hole at a position corresponding to at least one hole of the insulating plate; Prepare one circuit board with a circuit pattern made of a conductive foil provided with a small opening, or prepare a plurality of circuit boards and overlap each other so that the plurality of holes of the insulating plate correspond to each other Providing a first step;
    By inserting a through pin into a plurality of holes of the insulating plate of the circuit board and an opening of the conductive foil provided at a position corresponding to at least one of the plurality of holes, the insulating plate The conductive foil is bent in the direction of the inner wall of the hole, and the through pin is brought into contact with the bent conductive foil, whereby the through pin is electrically connected to the circuit board, and a predetermined circuit pattern of the circuit board is formed. A second step of electrically connecting the regions;
    A method for manufacturing a circuit structure comprising:
PCT/JP2009/003273 2008-07-23 2009-07-13 Circuit structure, joint box, and method for manufacturing circuit structure WO2010010666A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-189556 2008-07-23
JP2008189556A JP2010027957A (en) 2008-07-23 2008-07-23 Circuit structure, joint box, and method of manufacturing circuit structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089757A (en) * 2010-10-21 2012-05-10 Mitsubishi Cable Ind Ltd Substrate laminate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5381963A (en) * 1976-12-27 1978-07-19 Suwa Seikosha Kk Electric circuit connecting system
JP2000348824A (en) * 1999-04-29 2000-12-15 Berg Technol Inc Header assembly mounted on circuit board
WO2005096683A1 (en) * 2004-03-31 2005-10-13 Mitsubishi Cable Industries, Ltd. Circuit board, its manufacturing method, and joint box using circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5381963A (en) * 1976-12-27 1978-07-19 Suwa Seikosha Kk Electric circuit connecting system
JP2000348824A (en) * 1999-04-29 2000-12-15 Berg Technol Inc Header assembly mounted on circuit board
WO2005096683A1 (en) * 2004-03-31 2005-10-13 Mitsubishi Cable Industries, Ltd. Circuit board, its manufacturing method, and joint box using circuit board

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