WO2010001497A1 - Semiconductor die pickup apparatus and semiconductor die pickup method - Google Patents

Semiconductor die pickup apparatus and semiconductor die pickup method Download PDF

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Publication number
WO2010001497A1
WO2010001497A1 PCT/JP2008/064516 JP2008064516W WO2010001497A1 WO 2010001497 A1 WO2010001497 A1 WO 2010001497A1 JP 2008064516 W JP2008064516 W JP 2008064516W WO 2010001497 A1 WO2010001497 A1 WO 2010001497A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor die
lid
holding sheet
stage
contact surface
Prior art date
Application number
PCT/JP2008/064516
Other languages
French (fr)
Japanese (ja)
Inventor
沖人 梅原
真一 佐々木
Original Assignee
株式会社新川
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Filing date
Publication date
Application filed by 株式会社新川 filed Critical 株式会社新川
Publication of WO2010001497A1 publication Critical patent/WO2010001497A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Definitions

  • the present invention relates to a structure of a pickup device for a semiconductor die and a pickup method.
  • the semiconductor die is manufactured by cutting a wafer having a size of 6 inches or 8 inches into a predetermined size. At the time of cutting, an adhesive holding tape is attached to the back surface so that the cut semiconductor dies do not fall apart, and the wafer is cut from the front side with a dicing saw or the like. At this time, the holding tape attached to the back surface is slightly cut, but is not cut and holds each semiconductor die. Each cut semiconductor die is picked up from the holding tape one by one and sent to the next process such as die bonding.
  • this method using the push-up needle has a problem that the semiconductor die is broken by the push-up when the thickness of the semiconductor die is reduced, and it has become difficult to use it for the pickup of a thin semiconductor die in recent years. .
  • Patent Document 1 a semiconductor die to be picked up is placed on a suction hole of a stage having a plurality of suction holes, and the suction hole is held in a vacuum while the semiconductor die is sucked and held on a collet. The sheet is sucked into each suction hole, deformed, the part of the holding sheet corresponding to the suction hole is peeled off from the semiconductor die, and then the stage is moved or rotated to hold the remaining part without being peeled off. There has been proposed a method of peeling a sheet from a semiconductor die (see FIGS. 1 to 4 of Patent Document 1).
  • Patent Document 1 a protrusion having a narrower width than the semiconductor die to be picked up is provided on the surface of the stage, a suction hole is provided in the stage surface around the protrusion, and the semiconductor die is picked up.
  • the semiconductor die to be picked up on the projecting part is placed so as to protrude from the projecting part, and is sucked and held by a collet, and the holding sheet of the part protruding from the projecting part is vacuum-sucked by the suction hole and the semiconductor sheet is held out of the projecting part.
  • Patent Document 1 The method described in Patent Document 1 is a method in which the suction hole is evacuated, the holding tape is sucked into the suction hole, and the holding tape is peeled off from the semiconductor die. Since the surface is covered, air cannot be sucked from the portion around the suction hole after the holding tape just above the suction hole is peeled off. For this reason, the holding sheet directly above the suction hole can be peeled off by suction, but the portion around the suction hole cannot be peeled off by vacuum suction of the suction hole and remains in a state of being adhered to the semiconductor die. (See FIGS. 1 and 2 of Patent Document 1).
  • the stage when the stage is moved to separate the peeled remaining portion of the holding sheet, the smaller the area of the remaining portion, the less the force applied to the semiconductor die, and the damage to the semiconductor die can be suppressed.
  • the suction hole in order to reduce the remaining portion to be peeled off by the suction hole, it is necessary to make the suction hole large in accordance with the size of the semiconductor to be picked up. If the holding sheet is sucked at once by such a large suction hole, a large force may be applied to the semiconductor die when the adhesive force of the holding sheet is large.
  • recent semiconductor dies are thin and low in strength, and this force may cause cracking or deformation.
  • Patent Document 1 Another method described in Patent Document 1 is to evacuate a small suction hole arranged only around the protruding portion to peel off the portion of the semiconductor die holding sheet protruding from the protruding portion, Because the holding sheet of the semiconductor die is peeled off by the tensile force applied to the holding sheet, it is necessary to increase the height of the protruding part in order to reliably peel off the holding sheet. If there is a semiconductor die adjacent in the direction, the protrusion may hit the semiconductor die and damage the semiconductor die, so the height of the protrusion is limited and the holding sheet cannot be peeled off reliably. There was a problem.
  • an object of the present invention is to easily pick up a semiconductor die while suppressing a force applied to the semiconductor die when the holding sheet is peeled off in a semiconductor die pickup apparatus.
  • the semiconductor die pick-up device of the present invention is a semiconductor die pick-up device for picking up a semiconductor die attached to a holding sheet, and is in close contact with the surface of the holding sheet opposite to the surface to which the semiconductor die is attached.
  • a cylindrical stage including a close contact surface, a suction opening provided on the close contact surface and extending in a straight line from the inner periphery side to the outer periphery side of the stage with substantially the same width as the semiconductor die to be picked up, and the width of the suction opening It is provided on the stage so that the tip on the side that closes the suction opening can move forward from the contact surface with approximately the same width, slide along the contact surface to open and close the suction opening, and let the tip of the lid advance from the contact surface
  • the surface that pushes up the holding sheet of the lid is inclined downward from the front end side of the lid toward the rear end side of the lid opening side, and is recessed from the contact surface by the thickness of the lid.
  • the inclination angle of the inclined surface with respect to the contact surface is preferably larger than the inclination angle with respect to the contact surface of the surface opposite to the surface that pushes up the holding sheet of the lid, A step portion extending from the inclined surface to the outer peripheral surface of the stage along the contact surface is provided. It is also preferable that the inclination angle is larger than the inclination angle of the contact surface, and the inclination surface is also preferably a plane substantially perpendicular to the contact surface.
  • a pin is provided that extends in the width direction of the suction opening, and includes a slider that slides in the direction in which the suction opening extends by a slider drive mechanism provided inside the stage and moves forward and backward with respect to the contact surface. It is also preferable that the lid includes an arm projecting from the tip to the side of closing the suction opening and is rotatably attached to the slider pin via the arm.
  • the semiconductor die pick-up method of the present invention is a semiconductor die pick-up method for picking up a semiconductor die attached to a holding sheet, wherein the semiconductor die of the holding sheet to which the semiconductor die to be picked up is attached is attached.
  • a cylindrical stage including a contact surface that is in close contact with the surface opposite to the surface on which it is located, and a linear surface extending from the inner periphery side of the stage toward the outer periphery side with the same width as the semiconductor die to be picked up, provided on the contact surface
  • the suction opening and the width of the suction opening are substantially the same width, provided on the stage so that the tip of the suction opening closing side can be advanced from the contact surface, slide along the contact surface to open and close the suction opening, When the front end of the lid is advanced from the contact surface, the surface that pushes up the holding sheet of the lid is inclined downward from the front end side of the lid toward the rear end side of the lid opening side.
  • a semiconductor die pick-up device comprising a collet for adsorbing the die is prepared, one end of the semiconductor die to be picked up is aligned with the tip of the closed lid, and the width direction position of the lid and the width direction position of the semiconductor die are Alignment process, the tip of the lid is advanced from the contact surface, the holding sheet and the semiconductor die are pushed up, and the surface on the opposite side of the lid from which the holding sheet is pushed up is inclined with the bottom surface of the slide groove Slide the lid from one end to the other end of the semiconductor die to be picked up while making contact with the edge with the surface to open the suction openings sequentially, and pick up the open suction opening from one end of the semiconductor die to the other end.
  • the holding sheet is sequentially sucked toward and picked up from the semiconductor die to be picked up sequentially, and the semiconductor die is sequentially adsorbed from one end side to the other end side on the collet waiting immediately above the semiconductor die to be picked up, A pickup step of picking up a semiconductor die.
  • the present invention provides an effect that a semiconductor die can be easily picked up while suppressing a force applied to the semiconductor die when the holding sheet is peeled off in the semiconductor die pick-up device.
  • an adhesive holding sheet 12 is attached to the back surface of the wafer 11, and the holding sheet 12 is attached to a metal ring 13.
  • the wafer 11 is handled in such a state that it is attached to the metal ring 13 via the holding sheet 12 in this way.
  • the wafer 11 is cut by a dicing saw or the like from the surface side into a semiconductor die 15 in the cutting process.
  • a notch gap 14 formed during dicing is formed between the semiconductor dies 15. The depth of the cut gap 14 reaches from the semiconductor die 15 to a part of the holding sheet 12, but the holding sheet 12 is not cut and each semiconductor die 15 is held by the holding sheet 12.
  • the wafer holder 10 includes an annular expand ring 16 having a flange portion and a ring presser 17 for fixing the ring 13 on the flange of the expand ring 16.
  • the ring retainer 17 is driven in a direction to advance and retract toward the flange of the expand ring 16 by a ring retainer drive unit (not shown).
  • the inner diameter of the expand ring 16 is larger than the diameter of the wafer on which the semiconductor die 15 is arranged, the expand ring 16 has a predetermined thickness, and the flange is outside the expand ring 16 and is separated from the holding sheet 12.
  • the wafer holder 10 is configured to be movable in a direction along the surface of the holding sheet 12 by a wafer holder horizontal direction drive unit (not shown).
  • the holding sheet 12 to which the semiconductor die 15 is attached is in a substantially planar state before being set on the expanding ring 16.
  • FIG. 4 is a diagram showing a configuration of the semiconductor die pick-up apparatus 100, and FIG. 4 shows a state in which the semiconductor die 15 attached to the holding sheet 12 is set in the semiconductor die pick-up apparatus 100.
  • the ring presser 17 is lowered on the ring 13, and the ring 13 is sandwiched between the flanges of the expand ring 16. Since there is a step between the upper surface where the holding sheet 12 of the expand ring 16 contacts and the flange surface, when the ring 13 is pressed against the flange surface, the holding sheet 12 is the same as the step between the upper surface of the expand ring 16 and the flange surface.
  • the expansion ring 16 is stretched along the curved surface.
  • the holding sheet 12 fixed on the expand ring 16 is subjected to a pulling force from the center of the holding sheet toward the periphery.
  • a gap between the semiconductor dies 15 attached on the holding sheet 12 is widened.
  • the wafer holder 10 is attached with a wafer holder horizontal direction driving unit 72 that moves the wafer holder 10 along a surface along the holding sheet 12.
  • the wafer holder horizontal direction driving unit 72 may be, for example, a unit that drives the wafer holder 10 in the horizontal direction by a motor and a gear provided inside, or along a guide by a driving source such as a motor provided outside.
  • the wafer holder 10 may be moved in the XY direction.
  • a collet 18 for attracting and moving the semiconductor die 15 is provided on the wafer holder 10.
  • the collet 18 includes suction holes 19 for sucking the semiconductor die 15 on the suction surface, and each suction hole 19 is connected to a vacuum device 71.
  • a stage 20 is provided below the wafer holder 10, and the stage 20 is driven in a vertical direction that is an advancing / retreating direction with respect to the holding sheet 12 by a stage vertical direction driving mechanism 73.
  • the stage vertical direction drive mechanism 73 may be, for example, a mechanism that drives the stage 20 in the vertical direction by a motor and a gear provided inside, or is vertically moved along a guide by a drive source such as a motor provided outside.
  • the stage 20 may be moved in the direction.
  • the stage 20 has a cylindrical casing 21 having a close contact surface 22 in close contact with the holding sheet 12 on the upper surface thereof, and a base portion 24 provided on the opposite side of the close contact surface 22 of the casing 21. And a drive unit 25 that is attached to the base unit 24 and drives a slider drive mechanism 300 attached to the inside of the housing 21.
  • the base portion 24 of the stage 20 is attached to a stage fixing portion (not shown).
  • the suction opening 41 is provided in the contact surface 22, is substantially the same width as the semiconductor die 15 to be picked up shown in FIG. 4, and is longer than the semiconductor die 15, from the inner peripheral side of the stage 20 toward the outer peripheral side. It extends in a straight line.
  • a lid 23 that slides along the direction in which the suction opening 41 extends and opens and closes the suction opening 41 is attached to the suction opening 41.
  • the side of the lid 23 that closes the suction opening 41 along the sliding direction is the front end 23a, and the end on the side where the lid 23 opens is the rear end 23c.
  • the side surface 23b of the lid 23 and the side surface 41b of the suction opening 41 constitute a slide surface. If the suction opening 41 has substantially the same width as the semiconductor die 15 to be picked up on the contact surface 22, a step is provided inside, and a slit communicating with the stage 20 is provided in the step portion. May be.
  • the tip 23a of the lid 23 is a curved surface that is convex toward the side of closing the suction opening 41, and the end surface 41 a of the suction opening against which the tip 23 a of the lid 23 is pressed has a curved surface along the curved surface of the tip 23 a of the lid 23.
  • the curved surface may be a cylindrical surface, a combination of cylindrical surfaces having a plurality of radii, or a curved surface having another shape.
  • a longitudinal groove 364 that extends in the direction and sucks the holding sheet 12 is provided.
  • the vertical groove 364 is configured by a fan-shaped cylindrical surface of approximately 270 degrees connected to the suction opening 41, and the tangent line 500 that contacts the cylindrical surface of each vertical groove 364 at both corners of the suction opening 41 is the cylindrical surface of the end surface 41a. It protrudes from the end face 41a in the direction in which the lid 23 is closed to a position that becomes a tangent.
  • a vertical groove 364 having a fan-shaped cylindrical surface of approximately 270 degrees communicates the contact surface 22 and the inside of the housing 21.
  • 7B when the one end 15a of the semiconductor die 15 is aligned with the end face 41a of the suction opening 41 or the tip 23a of the lid 23, a part of the semiconductor die 15 is part of the tip of the lid 23.
  • the fan-shaped hatched portion that protrudes from 23 a and is approximately 90 degrees is located above the vertical groove 364.
  • the surface on the holding sheet 12 side becomes substantially flush with the contact surface 22.
  • a chamfered portion 23 e is provided around the surface of the lid 23, and when the lid 23 closes the suction opening 41, a small V-shaped groove is formed between the contact surface 22 and the lid 23.
  • the width of the suction opening 41, the width of the lid 23, and the width of the semiconductor die 15 are substantially the same, and the side surfaces 41b of the suction opening 41 and the side surfaces 23b of the lid 23 slide. It touches.
  • the stage 20 is recessed from the contact surface 22 by the thickness of the lid 23, and is substantially the same width as the lid 23 from the end of the suction opening 41 on the side where the lid 23 opens to the outer peripheral side of the stage 20.
  • An extending slide groove 22a and an inclined surface 22b following the bottom surface 22a 'of the slide groove 22a are provided.
  • the side surface 22h of the slide groove 22a is the same surface as the side surface 41b of the suction opening 41, and the side surface 23b of the lid 23 and the side surface 22h of the slide groove 22a constitute a slide surface.
  • the bottom surface 22 a ′ of the slide groove 22 a is substantially parallel to the contact surface 22 and does not cover the cylindrical surface of the outer periphery of the stage 20, and is more than the position of the rear end 23 c of the lid 23 when the lid 23 closes the suction opening 41. It extends to the end 22c located at the stage inner peripheral side.
  • the end 22c is linear, and the rear end 23c of the lid 23 projects slightly toward the outer periphery of the stage 20 from the end 22c of the slide groove 22a with the lid 23 closed.
  • the inclined surface 22b is inclined downward from the end 22c of the sliding groove 22a in the direction opposite to the contact surface 22. Side surfaces 22j that are flush with the side surface 22h of the sliding groove 22a extend on both sides of the inclined surface 22b.
  • the side surface 22j and the side surface 23b of the lid 23 constitute a slide surface.
  • a line of intersection between the inclined surface 22b and the bottom surface 22a 'of the slide groove 22a forms a linear ridge line edge 22d extending in a direction perpendicular to the slide direction of the lid 23.
  • the rear end 23c of the lid 23 protrudes to the outer peripheral side of the stage 20 from the end 22c of the slide groove 22a and the edge 22d in a state where the lid 23 closes the suction opening 41.
  • the lower surface 23g which is the surface opposite to the surface to be pushed up, is supported by the edge 22d.
  • a slider drive mechanism 300 for sliding a slider 332 to which a lid 23 is rotatably attached is provided inside the stage 20.
  • the slider drive mechanism 300 is slidably attached to the first link 326 driven in the forward and backward direction with respect to the contact surface 22 by the drive unit 25 attached to the base portion 24 of the stage 20 and the housing 21 of the stage 20.
  • a piston 370 that moves forward and backward with respect to the contact surface 22; a stopper 321a that is provided inside the housing 21 and that engages with a flange 371 of the piston 370 to limit the movement of the piston 370 in the forward / backward direction; A spring 373 that connects one link 326 and the piston 370 in a direction that advances and retreats with respect to the contact surface 22; a guide rail 331 that is attached to the piston 370 and extends substantially parallel to the contact surface 22 and extends in the direction of the suction opening 41; A slider 332 slidably attached to the guide rail 331 and a piston 370 can be freely rotated by a pin 328.
  • a cylindrical pin 330 extending in the width direction of the suction opening 41 is attached to the slider 332, and an inverted U-shape provided on an arm 23 f that protrudes from the tip 23 a of the lid 23 toward the closing side of the suction opening 41.
  • the mold notch is rotatably engaged.
  • casing 21 is connected to the vacuum apparatus 71, and is comprised so that an inside can be made into a vacuum.
  • the pin 327 provided at one end enters the engagement groove 326a of the first link 326, and the engagement groove 329a provided at the other end sandwiches the pin 330a of the slider 332, whereby the first link 326 and the first link 326 are engaged with the first link 326.
  • a link 326 is connected.
  • a motor 381 for operating the slider drive mechanism 300 is attached inside the drive unit 25, and a cam that contacts a roller 326 c provided at the tip of the shaft 326 b of the first link 326 on the rotating shaft of the motor 381. 383 is attached.
  • the slider drive mechanism 300 changes the operation of the first link 326 that moves in the forward and backward direction toward the contact surface 22 to the operation in the direction in which the slider 332 is moved in parallel with the contact surface 22 by the L-shaped second link 329. Since it is converted, the structure can be made compact, and the mechanism can be stored inside the cylindrical casing 21.
  • a semiconductor die pick-up device 100 includes a control unit 70 which is a computer including a CPU and the like, and includes a driving unit 25, a vacuum device 71, a collet 18, a wafer holder horizontal driving unit 72, a stage.
  • the vertical drive mechanism 73 is connected to each other, and the drive unit 25, vacuum device 71, collet 18 and wafer holder horizontal drive unit 72, and stage vertical drive mechanism 73 are configured to be driven by commands output from the control unit 70.
  • a one-dot chain line indicates a signal line that connects the control unit 70, the drive unit 25, the vacuum device 71, the collet 18, the wafer holder horizontal direction drive unit 72, and the stage vertical direction drive mechanism 73.
  • FIGS. 1 to 8 The portions described with reference to FIGS. 1 to 8 are denoted by the same reference numerals, and description thereof is omitted.
  • the control unit 70 starts the alignment process between the lid 23 and the semiconductor die 15 with the lid 23 closed. Since the lid 23 is in a position where the suction opening 41 is closed, the tip 23a of the lid 23 is in contact with the end surface 41a of the suction opening 41, and the lower surface of the rear end 23c of the lid 23 is the surface of the slide groove 22a. And is supported by the slide groove 22a. Further, the surface of the lid 23 and the contact surface 22 are substantially the same surface.
  • the controller 70 moves the wafer holder 10 horizontally above the standby position of the stage 20 by the wafer holder horizontal direction driving unit 72 shown in FIG.
  • the controller 70 once stops the horizontal movement of the wafer holder 10, and the stage 20 is brought into close contact with the stage vertical drive mechanism 73.
  • the stage 20 is raised until the surface 22 and the surface of the lid 23 are in close contact with the lower surface of the holding sheet 12.
  • the control unit 70 stops raising the stage 20.
  • the control unit 70 again aligns the one end 15a of the semiconductor die 15 to be picked up with the tip 23a of the lid 23 in the closed state by the wafer holder horizontal direction driving unit 72, and the position in the width direction of the lid 23 and the position of the semiconductor die 15
  • the width direction position is adjusted and adjusted so that the side surface of the semiconductor die 15 matches the side surface 23 b of the lid 23. Since the width of the lid 23 is substantially the same as that of the semiconductor die 15 to be picked up, the position of each side surface of the semiconductor die 15 and each side surface 23b of the lid 23 when the one side surface 23b is aligned with the side surface of the semiconductor die 15. Can be combined.
  • the holding sheet 12 receives a tensile force by the expanding ring 16 of the wafer holder 10.
  • FIG. 9B is a plan view of the contact surface 22 of the stage 20 and the surface of the lid 23.
  • the holding sheet 12 and the semiconductor die 15 placed thereon are indicated by a one-dot chain line so that the positional relationship can be understood.
  • the lid 23 is shown slightly larger than the semiconductor die 15 in order to distinguish between the semiconductor die 15 and the lid 23 having substantially the same width.
  • FIGS. 10B and 12B As shown in FIG. 9 (b), when the positions of the lid 23 and the semiconductor die 15 are aligned, the approximately 90-degree fan-shaped hatched portion of the semiconductor die 15 is located on the vertical groove 364.
  • the control unit 70 ends the alignment process. Then, the control unit 70 moves to the position immediately above the semiconductor die 15 from which the collet 18 is to be picked up, and holds the collet 18 at a height with a slight gap. When the movement of the collet 18 is finished, the control unit 70 starts sucking air from the suction hole 19 by the vacuum device 71, and puts the collet 18 in a suction standby state of the semiconductor die 15.
  • the control unit 70 starts the holding sheet peeling process.
  • the control unit 70 evacuates the inside of the casing 21 of the stage 20 using the vacuum device 71.
  • the vertical groove 364 communicating with the inside of the housing 21 shown in FIG. 10B is also evacuated, and the holding sheet 12 is attracted to the contact surface 22.
  • the holding sheet 12 is pulled downward by the vacuum, but in this state, the holding sheet 12 is not yet peeled from the semiconductor die 15.
  • the V-shaped groove between the chamfered portion 23e provided on the surface of the lid 23 shown in FIG. 8 and the suction opening 41 air flows from the outer peripheral side of the stage 20 toward the vertical groove 364 that becomes a vacuum. Flowing.
  • the pressure in the V-shaped groove is lower than the atmospheric pressure, but the holding sheet 12 is not peeled off at this negative pressure.
  • the cam 383 attached to the shaft of the motor 381 is rotated.
  • the cam 383 has an elliptical shape, and the cam surface is in contact with the roller 326c attached to the tip of the shaft 326b of the first link 326.
  • the cam surface of the cam 383 becomes the roller 326c. Is pushed up toward the contact surface 22.
  • the shaft 326 b rises and the entire first link 326 rises toward the contact surface 22.
  • the tip 23 a of the lid 23 advances upward from the contact surface 22, the tip 23 a of the lid 23 pushes up the holding sheet 12 and one end 15 a of the semiconductor die 15. Then, since the tip 23 a receives a downward force from the holding sheet 12, the lid 23 rotates clockwise about the pin 330.
  • the lower surface 23g which is the surface opposite to the surface that pushes up the holding sheet 12 of the lid 23, is supported by an edge 22d between the slide groove 22a and the inclined surface 22b, and the surface of the rear end 23c on the holding sheet 12 side is in close contact. Since the surface is substantially flush with the surface 22, the surface of the lid 23 that pushes up the holding sheet 12 is inclined downward from the front end 23a side of the lid 23 toward the rear end 23c side.
  • the inclination angle is an angle ⁇ with respect to the contact surface 22.
  • the inclined surface 22b is inclined with respect to the contact surface 22 by an angle ⁇ larger than the angle ⁇ . For this reason, the inclined surface 22b does not hinder the movement of the rear end 23c of the lid 23, and the lower surface 23g of the lid 23 is always in line contact with the edge 22d.
  • the lid 23 pushes up the semiconductor die 15 and the holding sheet 12 to be picked up.
  • the holding sheets 12 at both corners of the semiconductor die 15 located on the vertical grooves 364 that have become vacuum are sucked and fixed to the contact surface 22.
  • the holding sheet 12 attached to the semiconductor die 15 to be picked up is pulled obliquely downward toward the contact surface 22, and the diagonal downward pulling force causes the holding sheet 12 to be placed on the vertical groove 364.
  • the holding sheet 12 begins to peel from both corners of the semiconductor die 15 positioned, and the approximately 90-degree fan-shaped holding sheet 12 positioned on the longitudinal groove 364 is peeled off.
  • the holding sheet 12 of the substantially triangular portion of the semiconductor die 15 that protrudes from the tip 23 a of the lid 23 to the contact surface 22 is pulled obliquely downward toward the contact surface 22.
  • the semiconductor die 15 is peeled from both sides in the width direction toward the center in the width direction.
  • the peeling line 53 is formed at a position slightly closer to the sliding direction of the lid 23 than the one end 15 a of the semiconductor die 15.
  • the portion of the semiconductor die 15 from which the holding sheet 12 is peeled loses the force drawn toward the contact surface 22 by the holding sheet 12.
  • the pressure on the surface of the semiconductor die 15 on the collet 18 side is reduced by approaching the adsorption surface of the collet 18 by the upward movement of the tip 23a of the lid 23.
  • the pressure of the surface of the semiconductor die 15 on the holding sheet 12 side becomes higher than the pressure on the collet 18 side, and the portion of the semiconductor die 15 peeled off from the holding sheet 12 is adsorbed by the collet 18.
  • a portion of the semiconductor die 15 on the rear end 23c side of the lid 23 from the peeling line 53 where the holding sheet 12 has not yet been peeled is left with a slight gap between the semiconductor die 15 and the collet 18. Since the pressure difference between the holding sheet 12 side and the collet 18 side is not so large and there is a pulling force by the holding sheet 12, it is not yet adsorbed by the collet 18. For this reason, the semiconductor die 15 undergoes minute bending deformation between a portion adsorbed by the collet 18 and a portion not adsorbed by the collet 18.
  • the peeling line 53 is a line extending from the side surface in the width direction of the semiconductor die 15 to the side surface along the tip 23 a of the lid 23, and in the portion along the side surface 23 b of the lid 23.
  • the peeling line 53 does not extend.
  • each side surface 23b of the lid 23 is in contact with each side surface 41b of the suction opening 41. It has become a state.
  • the lower surface of the rear end 23c of the lid 23 is in contact with the surface of the slide groove 22a.
  • the holding sheet 12 peeled off from the semiconductor die 15 is covered on the vertical groove 364. For this reason, since almost no air flows from the outside of the housing 21 toward the inside of the housing 21, the inside of the housing 21 is kept in a vacuum.
  • the spring 373 of the slider drive mechanism 300 has such a stiffness that it hardly bends when the tip 23 a of the lid 23 is pushed up from the contact surface 22, the tip 23 a of the lid 23 has a predetermined advance height from the contact surface 22. Even if pushed up, the distance between the piston 370 and the first link 326 hardly changes. For this reason, the lid 23 only protrudes from the contact surface 22 by the rising of the first link 326 and does not slide.
  • the pin 328 of the piston 370 does not rise with respect to the contact surface 22, and only the pin 327 of the second link 329 entering the engagement groove 326 a of the first link 326 rises in the direction of the contact surface 22. Then, the second link 329 starts to rotate around the pin 328. By this rotation operation, the engaging groove 329a at the other end of the second link 329 moves toward the outer periphery of the stage 20, and the slider 332 and the pin of the slider 332 to which the pin 330a in the engaging groove 329a is fixed.
  • the lid 23 that is rotatably engaged with the 330 via the arm 23 f starts to slide toward the outer peripheral side of the stage 20.
  • the tip 23a of the lid 23 is separated from the end face 41a of the suction opening 41, and the suction opening 41 is opened to have an opening having substantially the same width as the semiconductor die 15 to be picked up.
  • An opening 42 is formed. Since the inside of the housing 21 of the stage 20 is in a vacuum state by the vacuum device 71, the opening opening 42 sucks the holding sheet 12 therein. Then, the holding sheet 12 is drawn into the opening portion 42 as the lid 23 slides, and is peeled off from the semiconductor die 15.
  • the center in the width direction of the lid 23 from the adhesion surface 22 is a ridge line that rises in a mountain shape.
  • each side surface 23 b side of the lid 23 is a line inclined toward the sliding direction from the center portion. For this reason, the holding sheet 12 on each side of the semiconductor die 15 is peeled off before the holding sheet 12 at the center portion in the width direction of the semiconductor die 15.
  • the peeling line 53 is inclined with respect to the ends 15a and 15b of the semiconductor die 15 or with respect to the sliding direction in the plane along the contact surface 22, the portion adsorbed by the collet 18 and the collet The stress generated by a minute bending deformation between the portion not adsorbed by 18 is relieved, and damage to the semiconductor die 15 can be effectively suppressed.
  • the opening portion 42 increases toward the outer peripheral side of the stage 20, and the peeling line 53 sequentially moves in parallel to the outer peripheral side of the stage 20.
  • the holding sheet 12 is sequentially peeled from the one end 15 a to the other end 15 b of the semiconductor die 15 along the peeling line 53, and is sequentially sucked into the opening opening 42.
  • the lower surface 23g opposite to the surface pushing up the holding sheet 12 of the lid 23 slides in contact with the edge 22d.
  • the tangent line of the lower surface 23g of 23 is a seal line that separates the outside of the casing 21 at atmospheric pressure from the inside of the casing 21 in a vacuum state.
  • the side surface 23b of the lid 23, the side surface 22j of the slide groove 22a, and the side surfaces 22h on both sides of the lid 23 and the inclined surface 22b constitute a slide surface.
  • the opening portion 42 is covered by the peeled holding sheet 12, but the holding sheet 12 is sucked into the opening portion 42, and the tip 23 a of the lid 23 faces the portion where the holding sheet 12 is not peeled off. Therefore, the suction of the holding sheet 12 by the opening 42 is not stopped, and the entire holding sheet 12 is sequentially sucked from the one end 15a of the semiconductor die 15 to the other end 15b by the opening 42. It can be peeled off and the remaining part of the peeling can be prevented.
  • the semiconductor die 15 is entirely adsorbed by the collet 18 and picked up by the collet 18.
  • the cam 383 of the slider drive mechanism 300 After the semiconductor die 15 is picked up, when the cam 383 of the slider drive mechanism 300 further rotates according to a command from the control unit 70, the shaft 326b of the first link 326 is lowered due to the rotation of the cam 383.
  • the lid 23 closes the suction opening 41 when the tip 23a is in contact with the end face 41a, sliding in the direction toward the end face 41a of the suction opening 41. Then, the compression force of the spring 373 is released.
  • the cam 383 further rotates and the shaft 326b is lowered, the piston 370, the first link 326, and the second link 329 are both lowered, and the tip 23a of the lid 23 is lowered to substantially the same position as the surface of the contact surface 22. To return to the initial position.
  • the lid 23 is slid in a state in which the tip 23a of the lid 23 is advanced upward from the contact surface 22, and substantially the same width as that of the semiconductor die 15 appearing immediately below the semiconductor die 15.
  • the holding sheet 12 is sequentially pulled into the opening portion 42 of the suction opening 41 to sequentially peel off the holding sheet 12, and the semiconductor die 15 is sequentially placed on the collet 18 waiting immediately above the semiconductor die 15. Since the adsorption is performed, the semiconductor die 15 can be easily picked up while suppressing the force applied to the semiconductor die 15 when the holding sheet 12 is peeled off.
  • the tip 23a of the lid 23 is advanced upward from the contact surface 22 in a state where the vertical groove 364 is evacuated, and the semiconductor die 15 is pushed up and picked up by the downward pulling force generated in the holding sheet 12. Since a trigger for peeling is created by peeling off the holding sheets 12 at both corners of the one end 15a of the semiconductor die 15, and then the lid 23 is slid to suck the holding sheet 12 into the opening 42, There is an effect that the holding sheet 12 can be peeled off more easily.
  • the lid 23 is slid from the one end 15a side to the other end 15b side of the semiconductor die 15, and the holding sheet 12 is sequentially sucked into the opening opening 42 to peel off the holding sheet 12. Even if the opening portion 42 is covered by the holding sheet 12 sucked into the opening portion 42, the lid 23 slides toward the portion where the holding sheet 12 is not peeled, so that the entire holding sheet 12 is sequentially opened. The opening 42 can be sucked and peeled off, and the entire holding sheet 12 can be easily peeled off.
  • the tip 23 a of the lid 23 is a curved surface
  • the peeling line 53 is inclined with respect to the ends 15 a and 15 b of the semiconductor die 15 or with respect to the sliding direction within the plane along the contact surface 22.
  • the part that advances upward from the contact surface 22 is a part of the vicinity of the tip 23a of the lid 23, and the rear end 23c of the lid 23 does not advance upward from the contact surface 22, so that the lid 23 is slid.
  • the rear end 23c of the lid 23 does not collide with the adjacent semiconductor die 15, and the adjacent semiconductor die 15 is not damaged by the sliding of the lid 23. Therefore, even when there are adjacent semiconductor dies 15 around The semiconductor die 15 can be picked up.
  • the stage 20 includes only a vertical movement in the advancing and retreating direction with respect to the holding sheet 12 by the stage vertical driving mechanism 73, and a moving mechanism with respect to the horizontal direction that is along the holding sheet 12. Therefore, there is no backlash of the mechanism in the horizontal direction, and the position stability in the direction along the holding sheet 12 is good. Further, since the alignment of the semiconductor die 15 to be picked up and the lid 23 in the direction along the surface of the holding sheet 12 is performed by the wafer holder horizontal direction driving unit 72, the horizontal position of the stage 20 is adjusted during the horizontal alignment. Is stable, and it is possible to reduce the occurrence of misalignment during alignment between the lid 23 of the stage 20 and the semiconductor die 15 attached to the holding sheet 12.
  • FIGS. 1 to 13 Parts similar to those of the embodiment described with reference to FIGS. 1 to 13 are denoted by the same reference numerals and description thereof is omitted.
  • the stage 20 is recessed from the contact surface 22 by the thickness of the lid 23, from the end of the suction opening 41 on the side where the lid 23 opens with substantially the same width as the lid 23 toward the outer peripheral side of the stage 20.
  • the bottom surface 22a 'of the slide groove 22a a flat surface 22e substantially perpendicular to the contact surface 22 and a step portion 22f are provided.
  • the side surface 22h of the slide groove 22a is the same surface as the side surface 41b of the suction opening 41, and the side surface 23b of the lid 23 and the side surface 22h of the slide groove 22a constitute a slide surface.
  • the bottom surface 22a ′ of the slide groove 22a is substantially parallel to the contact surface 22 and does not cover the cylindrical surface on the outer periphery of the stage 20, and from the position of the rear end 23c of the lid 23 with the lid 23 closing the suction opening 41. Also extends to the end 22c at the position on the inner periphery side of the stage.
  • the end 22c is linear, and the rear end 23c of the lid 23 protrudes slightly to the outer peripheral side of the stage 20 from the end 22c of the slide groove 22a with the lid 23 closed.
  • the flat surface 22e extends vertically from the end 22c of the slide groove 22a in the direction opposite to the contact surface 22 and downward in the longitudinal direction of the housing 21.
  • An intersection line between the flat surface 22e and the bottom surface 22a 'of the slide groove 22a forms an edge 22d of a linear ridge line extending in a direction perpendicular to the sliding direction of the lid 23.
  • the flat surface 22e continues to a step 22f extending from the flat surface 22e to the outer peripheral surface of the housing 21 substantially in parallel with the contact surface 22. Since the step 22 f extends to the outer peripheral surface of the cylindrical casing 21, the outer peripheral end 22 g is an arc along the cylinder of the casing 21.
  • Side surfaces 22j that are flush with the side surface 22h of the slide groove 22a extend on both sides of the step 22f.
  • the side surface 22j and the side surface 23b of the lid 23 constitute a slide surface.
  • the rear end 23c of the lid 23 protrudes to the outer peripheral side of the stage 20 from the end 22c of the slide groove 22a and the edge 22d in a state where the lid 23 closes the suction opening 41.
  • the lower surface 23g which is the surface opposite to the surface to be pushed up, is supported by the edge 22d.
  • the angle of the surface including the edge 22d and the outer peripheral side end 22g of the step portion 22f with respect to the contact surface 22 is an angle ⁇ , and the contact surface of the lower surface 23g of the lid 23 when the lid 23 slides.
  • the inclination angle with respect to 22 is ⁇ . Since the angle ⁇ is always larger than the angle ⁇ with respect to the contact surface 22 of the lower surface 23g of the lid 23 even when the lid 23 is slid, the outer peripheral side end 22g of the step 22f does not interfere with the rear end 23c of the lid 23. While the lid 23 is sliding, the lower surface 23g of the lid 23 is always in line contact with the edge 22d.
  • the lower surface 23g of the lid 23 opposite to the surface pushing up the holding sheet 12 slides in contact with the edge 22d, so the tangent between the edge 22d and the lower surface 23g of the lid 23 Is a seal line that separates the outside of the casing 21 at atmospheric pressure from the inside of the casing 21 in a vacuum state.
  • the side surface 23b of the lid 23, the side surface 22j of the slide groove 22a, and the side surfaces 22h of the lid 23 and both sides of the step portion 22f constitute a slide surface.
  • the step portion 22f has been described as extending from the flat surface 22e substantially perpendicular to the contact surface 22 toward the outer peripheral side of the stage 20, but as shown in FIG.
  • an inclined surface 22 b is provided following the bottom surface 22 a ′ of the sliding groove 22 a, and the stepped portion 22 f may extend from the inclined surface 22 b toward the outer peripheral side of the stage 20.
  • the angle of the inclined surface 22b with respect to the contact surface 22 is larger than the angle ⁇ with respect to the contact surface 22 of the surface including the edge 22d and the outer peripheral end 22g of the step portion 22f.

Abstract

A semiconductor die pickup apparatus is provided with a stage (20) including an adhering surface (22) to be adhered to a holding sheet (12); a suction opening (41) arranged on the adhering surface (22); a cover (23) which slides along the adhering surface (22) and opens/closes the suction opening (41); and a collet (18) for sucking a semiconductor die (15). At the time of picking up the semiconductor die (15), a leading end (23a) of the cover (23) is advanced from the adhering surface (22), and the cover (23) is slid while pressing up the holding sheet (12) and the semiconductor die (15) to successively open the suction hole (41). The holding sheet (12) is successively sucked by the opened suction opening (41) to successively pull and remove the holding sheet (12) from the semiconductor die (15), and at the same time, a collet (18) waiting directly above the semiconductor (15) is made to successively suck the semiconductor dies (15) to pickup the semiconductor dies (15). Thus, the semiconductor die pickup device easily picks up the semiconductor die while suppressing a force applied to the semiconductor die at the time of pulling and removing the holding sheet.

Description

半導体ダイのピックアップ装置及びピックアップ方法Semiconductor die pickup apparatus and pickup method
　本発明は、半導体ダイのピックアップ装置の構造及びピックアップ方法に関する。 The present invention relates to a structure of a pickup device for a semiconductor die and a pickup method.
　半導体ダイは、６インチや８インチの大きさのウェーハを所定の大きさに切断して製造される。切断の際には切断した半導体ダイがバラバラにならないように、裏面に粘着性の保持テープを貼り付け、表面側からダイシングソーなどによってウェーハを切断する。この際、裏面に貼り付けられた保持テープは若干切り込まれるが切断されないで各半導体ダイを保持した状態となっている。そして切断された各半導体ダイは一つずつ保持テープからピックアップされてダイボンディング等の次の工程に送られる。 The semiconductor die is manufactured by cutting a wafer having a size of 6 inches or 8 inches into a predetermined size. At the time of cutting, an adhesive holding tape is attached to the back surface so that the cut semiconductor dies do not fall apart, and the wafer is cut from the front side with a dicing saw or the like. At this time, the holding tape attached to the back surface is slightly cut, but is not cut and holds each semiconductor die. Each cut semiconductor die is picked up from the holding tape one by one and sent to the next process such as die bonding.
　従来、粘着性の保持テープから半導体ダイをピックアップする方法としては、突き上げ針による方法が多く用いられている(例えば、特許文献１の図１５参照)。これは、コレットで半導体ダイを吸引した状態で、周囲に向かって引っ張り力が掛けられている保持シートの下側から突き上げ針によって半導体ダイの中央を突き上げ、保持シートに掛かっている引張り力によって半導体ダイから粘着性の保持シートを引き剥がし、コレットで半導体ダイをピックアップする方法である。 Conventionally, as a method of picking up a semiconductor die from an adhesive holding tape, a method using a push-up needle is often used (see, for example, FIG. 15 of Patent Document 1). This is because the semiconductor die is sucked by the collet and the center of the semiconductor die is pushed up from the lower side of the holding sheet on which the tensile force is applied toward the periphery by the push-up needle, and the semiconductor is pulled by the tensile force applied to the holding sheet. In this method, the adhesive holding sheet is peeled off from the die and the semiconductor die is picked up by a collet.
　しかし、この突き上げ針による方法は半導体ダイの厚さが薄くなってくると突き上げによって半導体ダイが割れてしまうという問題があり、近年の薄型半導体ダイのピックアップには用いることが困難となってきている。 However, this method using the push-up needle has a problem that the semiconductor die is broken by the push-up when the thickness of the semiconductor die is reduced, and it has become difficult to use it for the pickup of a thin semiconductor die in recent years. .
　そこで、突き上げ針を用いずに半導体ダイを粘着性の保持シートから分離、ピックアップする方法が提案されている。たとえば、特許文献１には、複数の吸引孔を備えるステージの吸引孔の上にピックアップしようとする半導体ダイを載せ、コレットにその半導体ダイを吸着保持させた状態で、吸引孔を真空にして保持シートを各吸引孔の中に吸い込んで変形させ、吸引孔に対応する部分の保持シートを半導体ダイから引き剥がした後、ステージを水平に移動または回転させることにより引き剥がされずに残った部分の保持シートを半導体ダイから引き剥がす方法が提案されている(特許文献１の図１から図４参照)。 Therefore, a method for separating and picking up a semiconductor die from an adhesive holding sheet without using a push-up needle has been proposed. For example, in Patent Document 1, a semiconductor die to be picked up is placed on a suction hole of a stage having a plurality of suction holes, and the suction hole is held in a vacuum while the semiconductor die is sucked and held on a collet. The sheet is sucked into each suction hole, deformed, the part of the holding sheet corresponding to the suction hole is peeled off from the semiconductor die, and then the stage is moved or rotated to hold the remaining part without being peeled off. There has been proposed a method of peeling a sheet from a semiconductor die (see FIGS. 1 to 4 of Patent Document 1).
　また、特許文献１には、ステージの表面にピックアップしようとする半導体ダイよりも幅の狭い突出部を設け、突出部の周辺のステージ表面には吸引孔を設け、半導体ダイをピックアップする際には、突出部の上にピックアップしようとする半導体ダイを突出部からはみ出すように載せてコレットによって吸着保持し、吸引孔で保持シートを下方に真空吸引して突出部分からはみ出した部分の保持シートを半導体ダイより引き剥がし、その後、半導体ダイをコレットで吸着したまま突出部をステージ表面に対して水平に移動させて半導体ダイの残りの部分の保持シートを引き剥がす他の方法が提案されている(特許文献１の図９から図１０参照)。 Further, in Patent Document 1, a protrusion having a narrower width than the semiconductor die to be picked up is provided on the surface of the stage, a suction hole is provided in the stage surface around the protrusion, and the semiconductor die is picked up. The semiconductor die to be picked up on the projecting part is placed so as to protrude from the projecting part, and is sucked and held by a collet, and the holding sheet of the part protruding from the projecting part is vacuum-sucked by the suction hole and the semiconductor sheet is held out of the projecting part. Another method has been proposed in which the semiconductor die is peeled off from the die, and then the protrusion is moved horizontally with respect to the stage surface while the semiconductor die is attracted by the collet to peel off the remaining sheet of the semiconductor die (patent) (See FIGS. 9 to 10 of Document 1).
特許第３２０９７３６号明細書Japanese Patent No. 3209736
　特許文献１に記載された方法は、吸引孔を真空にして保持テープを吸引孔に吸い込み、保持テープを半導体ダイから引き剥がす方法であるが、保持テープは半導体ダイから引き剥がされると吸引孔の表面を覆ってしまうため、吸引孔の真上にある保持テープを引き剥がした後は吸引孔の周囲の部分から空気を吸い込むことができなくなる。このため、吸引孔の真上にある保持シートは吸引によって引き剥がすことができるが、吸引孔の周囲の部分は吸引孔の真空吸引によって引き剥がすことができず、半導体ダイと接着した状態が残ってしまう(特許文献１の図１、図２参照)。一方、ステージを移動させて、この引き剥がし残り部分の保持シートの分離を行う場合には、残り部分の面積が少ないほうが半導体ダイに加わる力が少なくなり半導体ダイの損傷を抑制することができる。しかし、吸引孔による引き剥がし残り部分を少なくしようとすると、吸引孔をピックアップする半導体の大きさにあわせた大きなものとすることが必要となる。この様に大きな吸引孔によって保持シートを一度に吸引すると保持シートの接着力が大きい場合には半導体ダイに大きな力がかかる場合がある。特に近年の半導体ダイは薄く強度が低いため、この力によって割れや変形が生じる場合がある。このように、特許文献に記載された方法は、大きな吸引孔を用いると吸引の際に半導体ダイに大きな力が加わってしまい、小さな吸引孔を用いるとステージの移動の際に半導体ダイに大きな力がかかってしまうので、保持シートの引き剥がしの際に半導体ダイにかかる力を抑制できず、半導体ダイの損傷を招く場合があるという問題があった。 The method described in Patent Document 1 is a method in which the suction hole is evacuated, the holding tape is sucked into the suction hole, and the holding tape is peeled off from the semiconductor die. Since the surface is covered, air cannot be sucked from the portion around the suction hole after the holding tape just above the suction hole is peeled off. For this reason, the holding sheet directly above the suction hole can be peeled off by suction, but the portion around the suction hole cannot be peeled off by vacuum suction of the suction hole and remains in a state of being adhered to the semiconductor die. (See FIGS. 1 and 2 of Patent Document 1). On the other hand, when the stage is moved to separate the peeled remaining portion of the holding sheet, the smaller the area of the remaining portion, the less the force applied to the semiconductor die, and the damage to the semiconductor die can be suppressed. However, in order to reduce the remaining portion to be peeled off by the suction hole, it is necessary to make the suction hole large in accordance with the size of the semiconductor to be picked up. If the holding sheet is sucked at once by such a large suction hole, a large force may be applied to the semiconductor die when the adhesive force of the holding sheet is large. In particular, recent semiconductor dies are thin and low in strength, and this force may cause cracking or deformation. As described above, in the method described in the patent document, if a large suction hole is used, a large force is applied to the semiconductor die during suction, and if a small suction hole is used, a large force is applied to the semiconductor die during the stage movement. Therefore, there is a problem that the force applied to the semiconductor die when the holding sheet is peeled off cannot be suppressed, and the semiconductor die may be damaged.
　また、特許文献１に記載された他の方法は、突出部の周辺にのみ配置された小さな吸引孔を真空にすることによって突出部からはみ出た部分の半導体ダイの保持シートを引き剥がし、残りの部分の半導体ダイの保持シートの引き剥がしを保持シートにかかっている引張り力によって行うため、確実に保持シートの引き剥がしを行うためには突出部高さを高くする必要があり、突出部の移動方向に隣接する半導体ダイがある場合にはその半導体ダイに突出部が当たって半導体ダイを損傷させる場合があるので、突出部の高さが制限され、保持シートを確実に引き剥がすことができないという問題があった。 Another method described in Patent Document 1 is to evacuate a small suction hole arranged only around the protruding portion to peel off the portion of the semiconductor die holding sheet protruding from the protruding portion, Because the holding sheet of the semiconductor die is peeled off by the tensile force applied to the holding sheet, it is necessary to increase the height of the protruding part in order to reliably peel off the holding sheet. If there is a semiconductor die adjacent in the direction, the protrusion may hit the semiconductor die and damage the semiconductor die, so the height of the protrusion is limited and the holding sheet cannot be peeled off reliably. There was a problem.
　そこで、本発明は、半導体ダイのピックアップ装置において、保持シートの引き剥がしの際に半導体ダイに加わる力を抑制しつつ半導体ダイを容易にピックアップすることを目的とする。 Therefore, an object of the present invention is to easily pick up a semiconductor die while suppressing a force applied to the semiconductor die when the holding sheet is peeled off in a semiconductor die pickup apparatus.
　本発明の半導体ダイのピックアップ装置は、保持シートに貼り付けられた半導体ダイをピックアップする半導体ダイのピックアップ装置であって、保持シートの半導体ダイが貼り付けられている面と反対側の面に密着する密着面を含む円筒形のステージと、密着面に設けられ、ピックアップする半導体ダイと略同一幅でステージの内周側から外周側に向かって直線状に延びる吸引開口と、吸引開口の幅と略同一幅で、吸引開口を閉じる側の先端が密着面から進出自在となるようにステージに設けられ、密着面に沿ってスライドして吸引開口を開閉し、蓋の先端を密着面から進出させた際に、蓋の保持シートを押し上げる面が蓋の先端側から蓋が開く側の後端側に向かって下向きに傾斜する蓋と、密着面から蓋の厚さだけ凹み、蓋と略同一幅で、蓋が開く側の吸引開口の端から、ステージ外周の円筒面にかからない位置で蓋が吸引開口を閉じた状態での蓋の後端の位置よりもステージ内周側の位置まで、ステージ外周面に向かって延びるスライド用溝と、ステージ外周側端のスライド用溝の底面から密着面と反対側に向かって延びる傾斜面と、半導体ダイを吸着するコレットと、を備え、半導体ダイをピックアップする際に、蓋の先端を密着面から進出させ、保持シートと半導体ダイとを押し上げると共に、蓋の保持シートを押し上げる面と反対側の面をスライド用溝の底面と傾斜面とのエッジに接触させながら蓋をスライドさせて吸引開口を順次開き、開いた吸引開口に保持シートを順次吸引させてピックアップする半導体ダイから保持シートを順次引き剥がすと共にピックアップする半導体ダイの直上で待機しているコレットに半導体ダイを順次吸着させること、を特徴とする。 The semiconductor die pick-up device of the present invention is a semiconductor die pick-up device for picking up a semiconductor die attached to a holding sheet, and is in close contact with the surface of the holding sheet opposite to the surface to which the semiconductor die is attached. A cylindrical stage including a close contact surface, a suction opening provided on the close contact surface and extending in a straight line from the inner periphery side to the outer periphery side of the stage with substantially the same width as the semiconductor die to be picked up, and the width of the suction opening It is provided on the stage so that the tip on the side that closes the suction opening can move forward from the contact surface with approximately the same width, slide along the contact surface to open and close the suction opening, and let the tip of the lid advance from the contact surface When the cover is pressed, the surface that pushes up the holding sheet of the lid is inclined downward from the front end side of the lid toward the rear end side of the lid opening side, and is recessed from the contact surface by the thickness of the lid. The outer peripheral surface of the stage from the end of the suction opening on the opening side of the lid to the position on the inner peripheral side of the stage rather than the position of the rear end of the lid in a state where the lid closes the suction opening at a position that does not cover the cylindrical surface of the outer periphery of the stage When picking up a semiconductor die, a slide groove extending toward the surface, an inclined surface extending from the bottom surface of the slide groove on the outer periphery side of the stage toward the opposite side of the contact surface, and a collet that adsorbs the semiconductor die In addition, the front end of the lid is advanced from the contact surface, and the holding sheet and the semiconductor die are pushed up, and the surface opposite to the side of the lid that pushes up the holding sheet is brought into contact with the edge of the bottom surface of the slide groove and the inclined surface. Slide the lid to open the suction openings one after the other, pull the holding sheets sequentially from the semiconductor die to be picked up by sequentially sucking the holding sheets into the opened suction openings and pick up. Be sequentially adsorb semiconductor die collet waiting immediately above the semiconductor die to be, characterized by.
　本発明の半導体ダイのピックアップ装置において、傾斜面の密着面に対する傾斜角度は、蓋の保持シートを押し上げる面と反対側の面の密着面に対する傾斜角度よりも大きいこと、としても好適であるし、傾斜面から密着面に沿ってステージ外周面まで延びる段部を備え、エッジと段部のステージ外周側端とを含む面の密着面に対する角度は、蓋の保持シートを押し上げる面と反対側の面の密着面に対する傾斜角度よりも大きいこと、としても好適であるし、傾斜面は、密着面に対して略直角な平面としても好適である。 In the semiconductor die pick-up device of the present invention, the inclination angle of the inclined surface with respect to the contact surface is preferably larger than the inclination angle with respect to the contact surface of the surface opposite to the surface that pushes up the holding sheet of the lid, A step portion extending from the inclined surface to the outer peripheral surface of the stage along the contact surface is provided. It is also preferable that the inclination angle is larger than the inclination angle of the contact surface, and the inclination surface is also preferably a plane substantially perpendicular to the contact surface.
　本発明の半導体ダイのピックアップ装置において、吸引開口の幅方向に延びるピンが取り付けられ、ステージ内部に設けられるスライダ駆動機構によって吸引開口の延びる方向にスライドするとともに密着面に対して進退するスライダを備え、蓋は、先端から吸引開口を閉じる側に張り出したアームを備え、アームを介してスライダのピンに回転自在に取り付けられていること、としても好適である。 In the semiconductor die pick-up device of the present invention, a pin is provided that extends in the width direction of the suction opening, and includes a slider that slides in the direction in which the suction opening extends by a slider drive mechanism provided inside the stage and moves forward and backward with respect to the contact surface. It is also preferable that the lid includes an arm projecting from the tip to the side of closing the suction opening and is rotatably attached to the slider pin via the arm.
　本発明の半導体ダイのピックアップ方法は、保持シートに貼り付けられた半導体ダイをピックアップする半導体ダイのピックアップ方法であって、ピックアップする半導体ダイが貼り付けられた保持シートの半導体ダイが貼り付けられている面と反対側の面に密着する密着面を含む円筒形のステージと、密着面に設けられ、ピックアップする半導体ダイと略同一幅でステージの内周側から外周側に向かって直線状に延びる吸引開口と、吸引開口の幅と略同一幅で、吸引開口を閉じる側の先端が密着面から進出自在となるようにステージに設けられ、密着面に沿ってスライドして吸引開口を開閉し、蓋の先端を密着面から進出させた際に、蓋の保持シートを押し上げる面が蓋の先端側から蓋が開く側の後端側に向かって下向きに傾斜する蓋と、密着面から蓋の厚さだけ凹み、蓋と略同一幅で、蓋が開く側の吸引開口の端から、ステージ外周の円筒面にかからない位置で蓋が吸引開口を閉じた状態での蓋の後端の位置よりもステージ内周側の位置まで、ステージ外周面に向かって延びるスライド用溝と、ステージ外周側端のスライド用溝の底面から密着面と反対側に向かって延びる傾斜面と、半導体ダイを吸着するコレットと、を備える半導体ダイのピックアップ装置を用意し、閉じている状態の蓋の先端にピックアップする半導体ダイの一端を合わせ、蓋の幅方向位置と半導体ダイの幅方向位置とを合わせる位置合わせ工程と、蓋の先端を密着面から進出させ、保持シートと半導体ダイとを押し上げると共に、蓋の保持シートを押し上げる面と反対側の面をスライド用溝の底面と傾斜面とのエッジに接触させながらピックアップする半導体ダイの一端側から他端側に向かって蓋をスライドさせて吸引開口を順次開き、開いた吸引開口にピックアップする半導体ダイの一端側から他端側に向かって保持シートを順次吸引させてピックアップする半導体ダイから保持シートを順次引き剥がすと共にピックアップする半導体ダイの直上で待機しているコレットに半導体ダイを一端側から他端側に向かって順次吸着させ、半導体ダイをピックアップするピックアップ工程と、を有することを特徴とする。 The semiconductor die pick-up method of the present invention is a semiconductor die pick-up method for picking up a semiconductor die attached to a holding sheet, wherein the semiconductor die of the holding sheet to which the semiconductor die to be picked up is attached is attached. A cylindrical stage including a contact surface that is in close contact with the surface opposite to the surface on which it is located, and a linear surface extending from the inner periphery side of the stage toward the outer periphery side with the same width as the semiconductor die to be picked up, provided on the contact surface The suction opening and the width of the suction opening are substantially the same width, provided on the stage so that the tip of the suction opening closing side can be advanced from the contact surface, slide along the contact surface to open and close the suction opening, When the front end of the lid is advanced from the contact surface, the surface that pushes up the holding sheet of the lid is inclined downward from the front end side of the lid toward the rear end side of the lid opening side. After the lid with the lid closed with the suction opening at a position that is recessed from the contact surface by the thickness of the lid, is approximately the same width as the lid, and does not cover the cylindrical surface on the outer periphery of the stage from the end of the suction opening on the side where the lid opens. A slide groove extending toward the outer peripheral surface of the stage from the end position to a position on the inner peripheral side of the stage, an inclined surface extending from the bottom surface of the slide groove on the outer peripheral side of the stage toward the side opposite to the contact surface, and a semiconductor A semiconductor die pick-up device comprising a collet for adsorbing the die is prepared, one end of the semiconductor die to be picked up is aligned with the tip of the closed lid, and the width direction position of the lid and the width direction position of the semiconductor die are Alignment process, the tip of the lid is advanced from the contact surface, the holding sheet and the semiconductor die are pushed up, and the surface on the opposite side of the lid from which the holding sheet is pushed up is inclined with the bottom surface of the slide groove Slide the lid from one end to the other end of the semiconductor die to be picked up while making contact with the edge with the surface to open the suction openings sequentially, and pick up the open suction opening from one end of the semiconductor die to the other end. The holding sheet is sequentially sucked toward and picked up from the semiconductor die to be picked up sequentially, and the semiconductor die is sequentially adsorbed from one end side to the other end side on the collet waiting immediately above the semiconductor die to be picked up, A pickup step of picking up a semiconductor die.
　本発明は、半導体ダイのピックアップ装置において、保持シートの引き剥がしの際に半導体ダイに加わる力を抑制しつつ半導体ダイを容易にピックアップすることができるという効果を奏する。 The present invention provides an effect that a semiconductor die can be easily picked up while suppressing a force applied to the semiconductor die when the holding sheet is peeled off in the semiconductor die pick-up device.
保持シートに貼り付けられたウェーハを示す説明図である。It is explanatory drawing which shows the wafer affixed on the holding sheet. 保持シートに貼り付けられた半導体ダイを示す説明図である。It is explanatory drawing which shows the semiconductor die affixed on the holding sheet. ウェーハホルダの構成を示す説明図である。It is explanatory drawing which shows the structure of a wafer holder. 本発明の実施形態における半導体ダイのピックアップ装置の構成を示す説明図である。It is explanatory drawing which shows the structure of the pick-up apparatus of the semiconductor die in embodiment of this invention. 本発明の実施形態における半導体ダイのピックアップ装置のステージを示す斜視図である。It is a perspective view which shows the stage of the pick-up apparatus of the semiconductor die in embodiment of this invention. 本発明の実施形態における半導体ダイのピックアップ装置のステージの吸引開口が開いた状態を示す平面図である。It is a top view which shows the state which the suction opening of the stage of the pick-up apparatus of the semiconductor die in embodiment of this invention opened. 本発明の実施形態における半導体ダイのピックアップ装置のステージの吸引開口が閉じた状態と位置合わせされた半導体ダイの位置関係を示す平面図である。It is a top view which shows the positional relationship of the semiconductor die aligned with the state which the suction opening of the stage of the pick-up apparatus of the semiconductor die in the embodiment of this invention closed. 本発明の実施形態における半導体ダイのピックアップ装置のステージの幅方向の断面図である。It is sectional drawing of the width direction of the stage of the pick-up apparatus of the semiconductor die in embodiment of this invention. 本発明の実施形態における半導体ダイのピックアップ装置のスライダ駆動機構が動作を開始する前の状態を示す説明図である。It is explanatory drawing which shows the state before the slider drive mechanism of the pick-up apparatus of the semiconductor die in embodiment of this invention starts operation | movement. 本発明の実施形態における半導体ダイのピックアップ装置の蓋の先端が密着面から進出した状態を示す説明図である。It is explanatory drawing which shows the state which the front-end | tip of the lid | cover of the pick-up apparatus of the semiconductor die in embodiment of this invention advanced from the contact | adherence surface. 本発明の実施形態における半導体ダイのピックアップ装置の蓋の先端が密着面から進出した状態の蓋と半導体ダイと保持シートとコレットを示す説明図である。It is explanatory drawing which shows the lid | cover, semiconductor die, holding sheet | seat, and collet of the state which the front-end | tip of the lid | cover of the semiconductor die pick-up apparatus in embodiment of this invention advanced from the contact surface. 本発明の実施形態における半導体ダイのピックアップ装置の蓋がスライドしている状態を示す説明図である。It is explanatory drawing which shows the state which the cover of the pick-up apparatus of the semiconductor die in the embodiment of this invention is sliding. 本発明の実施形態における半導体ダイのピックアップ装置の蓋がスライドしている状態の蓋と半導体ダイと保持シートとコレットを示す説明図である。It is explanatory drawing which shows the lid | cover, semiconductor die, holding sheet | seat, and collet of the state which the cover of the pick-up apparatus of the semiconductor die in embodiment of this invention is sliding. 本発明の他の実施形態における半導体ダイのピックアップ装置のステージを示す斜視図である。It is a perspective view which shows the stage of the pick-up apparatus of the semiconductor die in other embodiment of this invention. 本発明の他の実施形態における半導体ダイのピックアップ装置の蓋の先端が密着面から進出した状態を示す説明図である。It is explanatory drawing which shows the state which the front-end | tip of the lid | cover of the pick-up apparatus of the semiconductor die in other embodiment of this invention advanced from the contact | adherence surface. 本発明の他の実施形態における半導体ダイのピックアップ装置の蓋の先端が密着面から進出した状態を示す説明図である。It is explanatory drawing which shows the state which the front-end | tip of the lid | cover of the pick-up apparatus of the semiconductor die in other embodiment of this invention advanced from the contact | adherence surface.
符号の説明Explanation of symbols
　１０　ウェーハホルダ、１１　ウェーハ、１２　保持シート、１３　リング、１４　切り込み隙間、１５　半導体ダイ、１５ａ　一端、１５ｂ　他端、１６　エキスパンドリング、１７　リング押さえ、１８　コレット、１９　吸着孔、２０　ステージ、２１　筐体、２２　密着面、２２ａ　スライド用溝、２２ａ’　底面、２２ｂ　傾斜面、２２ｃ　端部、２２ｄ　エッジ、２２ｅ　平面、２２ｆ　段部、２２ｇ　外周側端、２２ｈ，２２ｊ　側面、２３　蓋、２３ａ　先端、２３ｂ　側面、２３ｃ　後端、２３ｅ　面取り部分、２３ｆ　アーム、２３ｇ　下面、２４　基体部、２５　駆動部、４１　吸引開口、４１ａ　端面、４１ｂ　側面、４２　開口開き部、５３　剥離線、７０　制御部、７１　真空装置、７２　ウェーハホルダ水平方向駆動部、７３　ステージ上下方向駆動機構、１００　半導体ダイのピックアップ装置、３００　スライダ駆動機構、３２１ａ　ストッパ、３２６　第１リンク、３２６ａ，３２９ａ　係合溝、３２６ｂ　シャフト、３２６ｃ　ローラ、３２７，３２８，３３０，３３０ａ　ピン、３２９　第２リンク、３３１　ガイドレール、３３２　スライダ、３６４　縦溝、３７０　ピストン、３７１　フランジ、３７３　ばね、３８１　モータ、３８３　カム、５００　接線、α，β，γ　角度。 10 wafer holder, 11 wafer, 12 holding sheet, 13 ring, 14 notch gap, 15 semiconductor die, 15a one end, 15b other end, 16 expanding ring, 17 ring presser, 18 collet, 19 suction hole, 20 stage, 21 housing 22 contact surface, 22a slide groove, 22a 'bottom surface, 22b inclined surface, 22c edge, 22d edge, 22e flat surface, 22f step, 22g outer peripheral side end, 22h, 22j side surface, 23 lid, 23a front end, 23b side surface , 23c rear end, 23e chamfered part, 23f arm, 23g lower surface, 24 base part, 25 drive part, 41 suction opening, 41a end face, 41b side face, 42 opening side part, 53 peeling line, 70 control part, 71 vacuum device, 72 Wafer holder water Direction drive unit, 73 stage vertical drive mechanism, 100 semiconductor die pickup device, 300 slider drive mechanism, 321a stopper, 326 first link, 326a, 329a engagement groove, 326b shaft, 326c roller, 327, 328, 330, 330a pin, 329 second link, 331 guide rail, 332 slider, 364 vertical groove, 370 piston, 371 flange, 373 spring, 381 motor, 383 cam, 500 tangent, α, β, γ angles.
　以下、本発明の好適な実施形態について図面を参照しながら説明する。本発明の半導体ダイのピックアップ装置について説明する前にウェーハとウェーハホルダについて説明する。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Before describing the semiconductor die pick-up apparatus of the present invention, the wafer and the wafer holder will be described.
　図１に示すように、ウェーハ１１は裏面に粘着性の保持シート１２が貼り付けられており、保持シート１２は金属製のリング１３に取付けられている。ウェーハ１１はこのように保持シート１２を介して金属製のリング１３に取付けられた状態でハンドリングされる。そして、図２に示すように、ウェーハ１１は切断工程で表面側からダイシングソーなどによって切断されて各半導体ダイ１５となる。各半導体ダイ１５の間にはダイシングの際に出来た切り込み隙間１４が出来る。切り込み隙間１４の深さは半導体ダイ１５から保持シート１２の一部にまで達しているが、保持シート１２は切断されておらず、各半導体ダイ１５は保持シート１２によって保持されている。 As shown in FIG. 1, an adhesive holding sheet 12 is attached to the back surface of the wafer 11, and the holding sheet 12 is attached to a metal ring 13. The wafer 11 is handled in such a state that it is attached to the metal ring 13 via the holding sheet 12 in this way. As shown in FIG. 2, the wafer 11 is cut by a dicing saw or the like from the surface side into a semiconductor die 15 in the cutting process. A notch gap 14 formed during dicing is formed between the semiconductor dies 15. The depth of the cut gap 14 reaches from the semiconductor die 15 to a part of the holding sheet 12, but the holding sheet 12 is not cut and each semiconductor die 15 is held by the holding sheet 12.
　このように、保持シート１２とリング１３とが取付けられた半導体ダイ１５は図３に示すように、ウェーハホルダ１０に取付けられる。ウェーハホルダ１０は、フランジ部を持つ円環状のエキスパンドリング１６とエキスパンドリング１６のフランジの上にリング１３を固定するリング押さえ１７とを備えている。リング押さえ１７は図示しないリング押さえ駆動部によってエキスパンドリング１６のフランジに向かって進退する方向に駆動される。エキスパンドリング１６の内径は半導体ダイ１５が配置されているウェーハの径よりも大きく、エキスパンドリング１６は所定の厚さを備えており、フランジはエキスパンドリング１６の外側にあって、保持シート１２から離れた方向の端面側に外側に突出するように取付けられている。また、エキスパンドリング１６の保持シート１２側の外周は保持シート１２をエキスパンドリング１６に取付ける際に、保持シート１２をスムーズに引き伸ばすことができるように曲面構成となっている。また、ウェーハホルダ１０は図示しないウェーハホルダ水平方向駆動部によって保持シート１２の面に沿った方向に移動することができるように構成されている。 As described above, the semiconductor die 15 to which the holding sheet 12 and the ring 13 are attached is attached to the wafer holder 10 as shown in FIG. The wafer holder 10 includes an annular expand ring 16 having a flange portion and a ring presser 17 for fixing the ring 13 on the flange of the expand ring 16. The ring retainer 17 is driven in a direction to advance and retract toward the flange of the expand ring 16 by a ring retainer drive unit (not shown). The inner diameter of the expand ring 16 is larger than the diameter of the wafer on which the semiconductor die 15 is arranged, the expand ring 16 has a predetermined thickness, and the flange is outside the expand ring 16 and is separated from the holding sheet 12. It is attached so as to protrude outward on the end face side in the direction. Further, the outer periphery of the expanding ring 16 on the holding sheet 12 side has a curved surface configuration so that the holding sheet 12 can be smoothly stretched when the holding sheet 12 is attached to the expanding ring 16. Further, the wafer holder 10 is configured to be movable in a direction along the surface of the holding sheet 12 by a wafer holder horizontal direction drive unit (not shown).
　図３（ｂ）に示すように、半導体ダイ１５が貼り付けられた保持シート１２はエキスパンドリング１６にセットされる前は略平面状態となっている。 As shown in FIG. 3B, the holding sheet 12 to which the semiconductor die 15 is attached is in a substantially planar state before being set on the expanding ring 16.
　図４は半導体ダイのピックアップ装置１００の構成を示す図であり、また図４は半導体ダイのピックアップ装置１００に保持シート１２に貼り付けられた半導体ダイ１５をセットした状態を示している。この状態では、リング１３の上にリング押さえ１７が降下し、リング１３をエキスパンドリング１６のフランジとの間に挟み込んでいる。エキスパンドリング１６の保持シート１２の当たる上面とフランジ面との間には段差があるので、リング１３がフランジ面に押し付けられると、保持シート１２はエキスパンドリング１６の上面とフランジ面との段差分だけエキスパンドリング１６上部の曲面に沿って引き伸ばされる。このため、エキスパンドリング１６の上に固定された保持シート１２には保持シートの中心から周囲に向かう引っ張り力が働いている。また、この引っ張り力によって保持シート１２が延びるので、保持シート１２の上に貼り付けられた各半導体ダイ１５間の隙間が広がっている。 FIG. 4 is a diagram showing a configuration of the semiconductor die pick-up apparatus 100, and FIG. 4 shows a state in which the semiconductor die 15 attached to the holding sheet 12 is set in the semiconductor die pick-up apparatus 100. In this state, the ring presser 17 is lowered on the ring 13, and the ring 13 is sandwiched between the flanges of the expand ring 16. Since there is a step between the upper surface where the holding sheet 12 of the expand ring 16 contacts and the flange surface, when the ring 13 is pressed against the flange surface, the holding sheet 12 is the same as the step between the upper surface of the expand ring 16 and the flange surface. The expansion ring 16 is stretched along the curved surface. For this reason, the holding sheet 12 fixed on the expand ring 16 is subjected to a pulling force from the center of the holding sheet toward the periphery. In addition, since the holding sheet 12 is extended by the pulling force, a gap between the semiconductor dies 15 attached on the holding sheet 12 is widened.
　ウェーハホルダ１０には保持シート１２に沿った面でウェーハホルダ１０を移動させるウェーハホルダ水平方向駆動部７２が取付けられている。ウェーハホルダ水平方向駆動部７２は、例えば、内部に設けたモータとギヤによってウェーハホルダ１０を水平方向に駆動するものであってもよいし、外部に設けられたモータなどの駆動源によってガイドに沿ってＸＹ方向にウェーハホルダ１０を移動させるようなものであってもよい。また、ウェーハホルダ１０の上部には半導体ダイ１５を吸着移動させるコレット１８が設けられている。コレット１８は吸着面に半導体ダイ１５を吸着するための吸着孔１９を備え、各吸着孔１９は真空装置７１に接続されている。また、ウェーハホルダ１０の下側にはステージ２０が設けられ、ステージ２０はステージ上下方向駆動機構７３によって保持シート１２に対して進退方向である上下方向に駆動される。ステージ上下方向駆動機構７３は、例えば、内部に設けたモータとギヤによってステージ２０を上下方向に駆動するものであってもよいし、外部に設けられたモータなどの駆動源によってガイドに沿って上下方向にステージ２０を移動させるようなものであってもよい。 The wafer holder 10 is attached with a wafer holder horizontal direction driving unit 72 that moves the wafer holder 10 along a surface along the holding sheet 12. The wafer holder horizontal direction driving unit 72 may be, for example, a unit that drives the wafer holder 10 in the horizontal direction by a motor and a gear provided inside, or along a guide by a driving source such as a motor provided outside. The wafer holder 10 may be moved in the XY direction. In addition, a collet 18 for attracting and moving the semiconductor die 15 is provided on the wafer holder 10. The collet 18 includes suction holes 19 for sucking the semiconductor die 15 on the suction surface, and each suction hole 19 is connected to a vacuum device 71. In addition, a stage 20 is provided below the wafer holder 10, and the stage 20 is driven in a vertical direction that is an advancing / retreating direction with respect to the holding sheet 12 by a stage vertical direction driving mechanism 73. The stage vertical direction drive mechanism 73 may be, for example, a mechanism that drives the stage 20 in the vertical direction by a motor and a gear provided inside, or is vertically moved along a guide by a drive source such as a motor provided outside. The stage 20 may be moved in the direction.
　図５に示すように、ステージ２０はその上面に保持シート１２に密着する密着面２２を備えた円筒形の筐体２１と、筐体２１の密着面２２と反対側に設けられた基体部２４と、基体部２４に取付けられ、筐体２１の内部に取付けられたスライダ駆動機構３００を駆動する駆動部２５とを備えている。ステージ２０の基体部２４は図示しないステージ固定部に取付けられている。吸引開口４１は、密着面２２に設けられ、図４に示したピックアップする半導体ダイ１５と略同一幅でその長さが半導体ダイ１５よりも長く、ステージ２０の内周側から外周側に向かって直線状に延びている。吸引開口４１には、吸引開口４１の幅と略同一幅で、吸引開口４１の延びる方向に沿ってスライドして吸引開口４１を開閉する蓋２３が取り付けられている。蓋２３はスライド方向に沿って吸引開口４１を閉じる側が先端２３ａで、蓋２３が開く側の端が後端２３ｃである。蓋２３の側面２３ｂと吸引開口４１の側面４１ｂとはスライド面を構成している。吸引開口４１は密着面２２においてピックアップしようとする半導体ダイ１５と略同一の幅となっていれば、内部に段差を設け、その段差部分にステージ２０に連通するスリットを設けるように構成してあってもよい。 As shown in FIG. 5, the stage 20 has a cylindrical casing 21 having a close contact surface 22 in close contact with the holding sheet 12 on the upper surface thereof, and a base portion 24 provided on the opposite side of the close contact surface 22 of the casing 21. And a drive unit 25 that is attached to the base unit 24 and drives a slider drive mechanism 300 attached to the inside of the housing 21. The base portion 24 of the stage 20 is attached to a stage fixing portion (not shown). The suction opening 41 is provided in the contact surface 22, is substantially the same width as the semiconductor die 15 to be picked up shown in FIG. 4, and is longer than the semiconductor die 15, from the inner peripheral side of the stage 20 toward the outer peripheral side. It extends in a straight line. A lid 23 that slides along the direction in which the suction opening 41 extends and opens and closes the suction opening 41 is attached to the suction opening 41. The side of the lid 23 that closes the suction opening 41 along the sliding direction is the front end 23a, and the end on the side where the lid 23 opens is the rear end 23c. The side surface 23b of the lid 23 and the side surface 41b of the suction opening 41 constitute a slide surface. If the suction opening 41 has substantially the same width as the semiconductor die 15 to be picked up on the contact surface 22, a step is provided inside, and a slit communicating with the stage 20 is provided in the step portion. May be.
　図６、図７に示すように、蓋２３の先端２３ａは吸引開口４１を閉じる際には吸引開口４１のステージ内周側にある端面４１ａに押し当てられる。蓋２３の先端２３ａは、吸引開口４１を閉じる側に向かって凸の曲面であり、蓋２３の先端２３ａが押し当てられる吸引開口の端面４１ａは、蓋２３の先端２３ａの曲面に沿った曲面を備えている。曲面は円筒面でもよいし、複数の半径の円筒面を組み合わせたものでもよいし、他の形状の曲面で構成されていてもよい。 6 and 7, when the suction opening 41 is closed, the tip 23a of the lid 23 is pressed against the end surface 41a on the stage inner peripheral side of the suction opening 41. The tip 23 a of the lid 23 is a curved surface that is convex toward the side of closing the suction opening 41, and the end surface 41 a of the suction opening against which the tip 23 a of the lid 23 is pressed has a curved surface along the curved surface of the tip 23 a of the lid 23. I have. The curved surface may be a cylindrical surface, a combination of cylindrical surfaces having a plurality of radii, or a curved surface having another shape.
　また、蓋２３の先端２３ａが接する側の吸引開口４１の両角部には、吸引開口４１の側面４１ｂから吸引開口４１の幅方向に向かって突出し、密着面２２からステージ２０の内面に向かって上下方向に延びて保持シート１２を吸引する縦溝３６４を有している。縦溝３６４は、吸引開口４１とつながった略２７０度の扇型の円筒面によって構成され、吸引開口４１の両角部において、各縦溝３６４の円筒面に接する接線５００が端面４１ａの円筒面の接線となる位置まで蓋２３が閉となる方向に向かって端面４１ａよりも突出している。 Further, the corners of the suction opening 41 on the side where the tip 23 a of the lid 23 contacts are projected from the side surface 41 b of the suction opening 41 toward the width direction of the suction opening 41, and vertically moved from the contact surface 22 toward the inner surface of the stage 20. A longitudinal groove 364 that extends in the direction and sucks the holding sheet 12 is provided. The vertical groove 364 is configured by a fan-shaped cylindrical surface of approximately 270 degrees connected to the suction opening 41, and the tangent line 500 that contacts the cylindrical surface of each vertical groove 364 at both corners of the suction opening 41 is the cylindrical surface of the end surface 41a. It protrudes from the end face 41a in the direction in which the lid 23 is closed to a position that becomes a tangent.
　図７（ａ）に示すように、蓋２３が閉じた場合には、蓋２３の先端２３ａは端面４１ａに接するので、蓋２３が閉じた状態では、蓋２３、吸引開口４１の両角部には、略２７０度の扇型の円筒面を持つ縦溝３６４が密着面２２と筐体２１の内部とを連通する。また、図７（ｂ）に示すように、半導体ダイ１５の一端１５ａを吸引開口４１の端面４１ａあるいは蓋２３の先端２３ａに合わせた場合には、半導体ダイ１５の一部は、蓋２３の先端２３ａからはみ出し、略９０度の扇形の斜線部分は縦溝３６４の上に位置する。 As shown in FIG. 7A, when the lid 23 is closed, the tip 23a of the lid 23 contacts the end surface 41a. Therefore, when the lid 23 is closed, both corners of the lid 23 and the suction opening 41 are provided. A vertical groove 364 having a fan-shaped cylindrical surface of approximately 270 degrees communicates the contact surface 22 and the inside of the housing 21. 7B, when the one end 15a of the semiconductor die 15 is aligned with the end face 41a of the suction opening 41 or the tip 23a of the lid 23, a part of the semiconductor die 15 is part of the tip of the lid 23. The fan-shaped hatched portion that protrudes from 23 a and is approximately 90 degrees is located above the vertical groove 364.
　図８に示すように、蓋２３は吸引開口４１を閉じた際には保持シート１２側にある表面が密着面２２と略同一面となる。蓋２３の表面の周囲には面取り部分２３ｅが設けられており、蓋２３が吸引開口４１を閉じた際には、密着面２２と蓋２３との間には小さなＶ字形の溝が形成される。また、先に説明したように、吸引開口４１の幅と蓋２３の幅と半導体ダイ１５の幅はそれぞれ略同一で、吸引開口４１の各側面４１ｂと蓋２３の各側面２３ｂはスライドするように接している。 As shown in FIG. 8, when the lid 23 closes the suction opening 41, the surface on the holding sheet 12 side becomes substantially flush with the contact surface 22. A chamfered portion 23 e is provided around the surface of the lid 23, and when the lid 23 closes the suction opening 41, a small V-shaped groove is formed between the contact surface 22 and the lid 23. . Further, as described above, the width of the suction opening 41, the width of the lid 23, and the width of the semiconductor die 15 are substantially the same, and the side surfaces 41b of the suction opening 41 and the side surfaces 23b of the lid 23 slide. It touches.
　図５に示すように、ステージ２０は、密着面２２から蓋２３の厚さだけ凹み、蓋２３と略同一幅で蓋２３が開く側の吸引開口４１の端からステージ２０の外周側に向かって延びるスライド用溝２２ａと、スライド用溝２２ａの底面２２ａ’に続く傾斜面２２ｂとを備えている。スライド用溝２２ａの側面２２ｈは吸引開口４１の側面４１ｂと同一の面となっており、蓋２３の側面２３ｂとスライド用溝２２ａの側面２２ｈとはスライド面を構成している。スライド用溝２２ａの底面２２ａ’は密着面２２に略平行に、ステージ２０外周の円筒面にかからない位置で、蓋２３が吸引開口４１を閉じた状態での蓋２３の後端２３ｃの位置よりもステージ内周側の位置にある端部２２ｃまで延びている。端部２２ｃは直線状で、蓋２３の後端２３ｃは蓋２３が閉じた状態でスライド用溝２２ａの端部２２ｃよりも若干ステージ２０外周側に突出している。傾斜面２２ｂは、スライド用溝２２ａの端部２２ｃから密着面２２と反対の方向の下側に向かって傾斜している。傾斜面２２ｂの両側にはスライド用溝２２ａの側面２２ｈと同一面となっている側面２２ｊが延びている。側面２２ｊと蓋２３の側面２３ｂとはスライド面を構成している。傾斜面２２ｂとスライド用溝２２ａの底面２２ａ’との交線は蓋２３のスライド方向と直角方向に延びる直線状の稜線のエッジ２２ｄを形成している。蓋２３の後端２３ｃは蓋２３が吸引開口４１を閉じた状態でスライド用溝２２ａの端部２２ｃ、及びエッジ２２ｄよりもステージ２０の外周側に突出しているので、蓋２３の保持シート１２を押し上げる面と反対側の面である下面２３ｇはエッジ２２ｄで支持される。 As shown in FIG. 5, the stage 20 is recessed from the contact surface 22 by the thickness of the lid 23, and is substantially the same width as the lid 23 from the end of the suction opening 41 on the side where the lid 23 opens to the outer peripheral side of the stage 20. An extending slide groove 22a and an inclined surface 22b following the bottom surface 22a 'of the slide groove 22a are provided. The side surface 22h of the slide groove 22a is the same surface as the side surface 41b of the suction opening 41, and the side surface 23b of the lid 23 and the side surface 22h of the slide groove 22a constitute a slide surface. The bottom surface 22 a ′ of the slide groove 22 a is substantially parallel to the contact surface 22 and does not cover the cylindrical surface of the outer periphery of the stage 20, and is more than the position of the rear end 23 c of the lid 23 when the lid 23 closes the suction opening 41. It extends to the end 22c located at the stage inner peripheral side. The end 22c is linear, and the rear end 23c of the lid 23 projects slightly toward the outer periphery of the stage 20 from the end 22c of the slide groove 22a with the lid 23 closed. The inclined surface 22b is inclined downward from the end 22c of the sliding groove 22a in the direction opposite to the contact surface 22. Side surfaces 22j that are flush with the side surface 22h of the sliding groove 22a extend on both sides of the inclined surface 22b. The side surface 22j and the side surface 23b of the lid 23 constitute a slide surface. A line of intersection between the inclined surface 22b and the bottom surface 22a 'of the slide groove 22a forms a linear ridge line edge 22d extending in a direction perpendicular to the slide direction of the lid 23. The rear end 23c of the lid 23 protrudes to the outer peripheral side of the stage 20 from the end 22c of the slide groove 22a and the edge 22d in a state where the lid 23 closes the suction opening 41. The lower surface 23g, which is the surface opposite to the surface to be pushed up, is supported by the edge 22d.
　図４に示すように、本実施形態の半導体ダイのピックアップ装置１００は、蓋２３が回転自在に取り付けられたスライダ３３２をスライドさせるスライダ駆動機構３００がステージ２０の内部に設けられている。スライダ駆動機構３００はステージ２０の基体部２４に取付けられた駆動部２５によって密着面２２に対して進退方向に駆動される第１リンク３２６と、ステージ２０の筐体２１に滑動自在に取付けられ、密着面２２に対して進退するピストン３７０と、筐体２１の内部に設けられ、ピストン３７０のフランジ３７１に係合してピストン３７０の密着面２２に対する進退方向の動作を制限するストッパ３２１ａと、第１リンク３２６とピストン３７０とを密着面２２に対して進退する方向に接続するばね３７３と、ピストン３７０に取付けられ、密着面２２に略平行で吸引開口４１の延びる方向に延びるガイドレール３３１と、ガイドレール３３１に滑動自在に取付けられたスライダ３３２と、ピストン３７０にピン３２８によって回転自在に取付けられ、スライダ３３２と第１リンク３２６とを接続し、ピストン３７０がストッパ３２１ａに当接すると、第１リンク３２６の密着面２２に対する進退方向の動作をスライダ３３２のガイドレール３３１に沿った方向の動作に変換する第２リンク３２９と、によって構成されている。スライダ３３２には吸引開口４１の幅方向に延びる円筒形状のピン３３０が取り付けられ、ピン３３０には、蓋２３の先端２３ａから吸引開口４１を閉じる側に張り出したアーム２３ｆに設けられた逆Ｕ字型の切り欠きが回転自在に係合している。また、筐体２１は真空装置７１に接続され、内部を真空にすることができるよう構成されている。 As shown in FIG. 4, in the semiconductor die pick-up device 100 of this embodiment, a slider drive mechanism 300 for sliding a slider 332 to which a lid 23 is rotatably attached is provided inside the stage 20. The slider drive mechanism 300 is slidably attached to the first link 326 driven in the forward and backward direction with respect to the contact surface 22 by the drive unit 25 attached to the base portion 24 of the stage 20 and the housing 21 of the stage 20. A piston 370 that moves forward and backward with respect to the contact surface 22; a stopper 321a that is provided inside the housing 21 and that engages with a flange 371 of the piston 370 to limit the movement of the piston 370 in the forward / backward direction; A spring 373 that connects one link 326 and the piston 370 in a direction that advances and retreats with respect to the contact surface 22; a guide rail 331 that is attached to the piston 370 and extends substantially parallel to the contact surface 22 and extends in the direction of the suction opening 41; A slider 332 slidably attached to the guide rail 331 and a piston 370 can be freely rotated by a pin 328. When the slider 332 and the first link 326 are connected and the piston 370 contacts the stopper 321a, the movement of the first link 326 in the advancing / retreating direction with respect to the contact surface 22 is performed in the direction along the guide rail 331 of the slider 332. And a second link 329 for converting the operation. A cylindrical pin 330 extending in the width direction of the suction opening 41 is attached to the slider 332, and an inverted U-shape provided on an arm 23 f that protrudes from the tip 23 a of the lid 23 toward the closing side of the suction opening 41. The mold notch is rotatably engaged. Moreover, the housing | casing 21 is connected to the vacuum apparatus 71, and is comprised so that an inside can be made into a vacuum.
　第２リンク３２９は一端に設けられたピン３２７が第１リンク３２６の係合溝３２６ａに入り、他端に設けられた係合溝３２９ａがスライダ３３２のピン３３０ａを挟み込むことによってスライダ３３２と第１リンク３２６とを接続している。駆動部２５の内部には、スライダ駆動機構３００を動作させるためのモータ３８１が取付けられており、モータ３８１の回転軸には第１リンク３２６のシャフト３２６ｂの先端に設けられたローラ３２６ｃに接するカム３８３が取付けられている。 In the second link 329, the pin 327 provided at one end enters the engagement groove 326a of the first link 326, and the engagement groove 329a provided at the other end sandwiches the pin 330a of the slider 332, whereby the first link 326 and the first link 326 are engaged with the first link 326. A link 326 is connected. A motor 381 for operating the slider drive mechanism 300 is attached inside the drive unit 25, and a cam that contacts a roller 326 c provided at the tip of the shaft 326 b of the first link 326 on the rotating shaft of the motor 381. 383 is attached.
　このように、スライダ駆動機構３００は密着面２２に向かって進退方向に動作する第１リンク３２６の動作をＬ字形の第２リンク３２９によってスライダ３３２を密着面２２に平行に移動させる方向の動作に変換しているため、コンパクトな構成とすることができ、円筒形状の筐体２１の内部にその機構を収納することができるようになっている。 As described above, the slider drive mechanism 300 changes the operation of the first link 326 that moves in the forward and backward direction toward the contact surface 22 to the operation in the direction in which the slider 332 is moved in parallel with the contact surface 22 by the L-shaped second link 329. Since it is converted, the structure can be made compact, and the mechanism can be stored inside the cylindrical casing 21.
　図４に示すように、半導体ダイのピックアップ装置１００は、ＣＰＵなどを内部に含むコンピュータである制御部７０を備え、駆動部２５、真空装置７１、コレット１８及びウェーハホルダ水平方向駆動部７２、ステージ上下方向駆動機構７３がそれぞれ接続され、駆動部２５、真空装置７１、コレット１８及びウェーハホルダ水平方向駆動部７２、ステージ上下方向駆動機構７３は制御部７０から出力される指令によって駆動されるよう構成されている。なお、図４において１点鎖線は制御部７０と駆動部２５、真空装置７１、コレット１８及びウェーハホルダ水平方向駆動部７２、ステージ上下方向駆動機構７３を接続する信号線を示している。 As shown in FIG. 4, a semiconductor die pick-up device 100 includes a control unit 70 which is a computer including a CPU and the like, and includes a driving unit 25, a vacuum device 71, a collet 18, a wafer holder horizontal driving unit 72, a stage. The vertical drive mechanism 73 is connected to each other, and the drive unit 25, vacuum device 71, collet 18 and wafer holder horizontal drive unit 72, and stage vertical drive mechanism 73 are configured to be driven by commands output from the control unit 70. Has been. In FIG. 4, a one-dot chain line indicates a signal line that connects the control unit 70, the drive unit 25, the vacuum device 71, the collet 18, the wafer holder horizontal direction drive unit 72, and the stage vertical direction drive mechanism 73.
　次に、図９から図１２を参照しながら半導体ダイのピックアップ装置１００によって、保持シート１２から半導体ダイ１５をピックアップする動作について説明する。図１から図８を参照して説明した部分については同様の符号を付して説明は省略する。 Next, the operation of picking up the semiconductor die 15 from the holding sheet 12 by the semiconductor die pickup device 100 will be described with reference to FIGS. The portions described with reference to FIGS. 1 to 8 are denoted by the same reference numerals, and description thereof is omitted.
　図９（ａ）に示すように、制御部７０は蓋２３が閉じた状態で蓋２３と半導体ダイ１５との位置合わせ工程を開始する。蓋２３は吸引開口４１を閉じた位置にあるので、蓋２３の先端２３ａは吸引開口４１の端面４１ａに接した位置となっており、蓋２３の後端２３ｃの下面はスライド用溝２２ａの表面に載って、スライド用溝２２ａによって支持されている。また、蓋２３の表面と密着面２２とは略同一面となっている。制御部７０は、図４に示したウェーハホルダ水平方向駆動部７２によってウェーハホルダ１０をステージ２０の待機位置の上まで水平方向に移動させる。そして、制御部７０は、ウェーハホルダ１０がステージ２０の待機位置の上の所定の位置まで移動したら、ウェーハホルダ１０の水平方向の移動を一端停止し、ステージ上下方向駆動機構７３によってステージ２０の密着面２２と蓋２３の表面が保持シート１２の下面に密着するまでステージ２０を上昇させる。ステージ２０の密着面２２と蓋２３の表面が保持シート１２の下面に密着したら、制御部７０はステージ２０の上昇を停止する。そして、制御部７０は、再度ウェーハホルダ水平方向駆動部７２によって、閉じている状態の蓋２３の先端２３ａにピックアップする半導体ダイ１５の一端１５ａを合わせ、蓋２３の幅方向位置と半導体ダイ１５の幅方向位置とを合わせ、半導体ダイ１５の側面が蓋２３の側面２３ｂに合うように調整する。蓋２３の幅はピックアップしようとする半導体ダイ１５と略同一幅であるので、一方の側面２３ｂを半導体ダイ１５の側面にあわせると、半導体ダイ１５の各側面と蓋２３の各側面２３ｂとの位置合わせを行うことができる。この時、保持シート１２はウェーハホルダ１０のエキスパンドリング１６によって引っ張り力を受けている。 As shown in FIG. 9A, the control unit 70 starts the alignment process between the lid 23 and the semiconductor die 15 with the lid 23 closed. Since the lid 23 is in a position where the suction opening 41 is closed, the tip 23a of the lid 23 is in contact with the end surface 41a of the suction opening 41, and the lower surface of the rear end 23c of the lid 23 is the surface of the slide groove 22a. And is supported by the slide groove 22a. Further, the surface of the lid 23 and the contact surface 22 are substantially the same surface. The controller 70 moves the wafer holder 10 horizontally above the standby position of the stage 20 by the wafer holder horizontal direction driving unit 72 shown in FIG. Then, when the wafer holder 10 moves to a predetermined position above the standby position of the stage 20, the controller 70 once stops the horizontal movement of the wafer holder 10, and the stage 20 is brought into close contact with the stage vertical drive mechanism 73. The stage 20 is raised until the surface 22 and the surface of the lid 23 are in close contact with the lower surface of the holding sheet 12. When the contact surface 22 of the stage 20 and the surface of the lid 23 are in close contact with the lower surface of the holding sheet 12, the control unit 70 stops raising the stage 20. Then, the control unit 70 again aligns the one end 15a of the semiconductor die 15 to be picked up with the tip 23a of the lid 23 in the closed state by the wafer holder horizontal direction driving unit 72, and the position in the width direction of the lid 23 and the position of the semiconductor die 15 The width direction position is adjusted and adjusted so that the side surface of the semiconductor die 15 matches the side surface 23 b of the lid 23. Since the width of the lid 23 is substantially the same as that of the semiconductor die 15 to be picked up, the position of each side surface of the semiconductor die 15 and each side surface 23b of the lid 23 when the one side surface 23b is aligned with the side surface of the semiconductor die 15. Can be combined. At this time, the holding sheet 12 receives a tensile force by the expanding ring 16 of the wafer holder 10.
　図９（ｂ）はステージ２０の密着面２２と蓋２３の表面の平面図であり、その上に載っている保持シート１２と半導体ダイ１５を１点鎖線で表示してその位置関係がわかるようにした図で、図９（ｂ）では略同一幅の半導体ダイ１５と蓋２３とを区別するために蓋２３を半導体ダイ１５よりも若干大きく図示している。図１０（ｂ）、図１２(ｂ)も同様である。図９（ｂ）に示すように、蓋２３と半導体ダイ１５との位置が合わせられると、半導体ダイ１５の略９０度の扇形の斜線部分は縦溝３６４の上に位置する。 FIG. 9B is a plan view of the contact surface 22 of the stage 20 and the surface of the lid 23. The holding sheet 12 and the semiconductor die 15 placed thereon are indicated by a one-dot chain line so that the positional relationship can be understood. In FIG. 9B, the lid 23 is shown slightly larger than the semiconductor die 15 in order to distinguish between the semiconductor die 15 and the lid 23 having substantially the same width. The same applies to FIGS. 10B and 12B. As shown in FIG. 9 (b), when the positions of the lid 23 and the semiconductor die 15 are aligned, the approximately 90-degree fan-shaped hatched portion of the semiconductor die 15 is located on the vertical groove 364.
　ステージ２０の保持シート１２の下面への進出、密着と半導体ダイ１５の位置合わせとが終わると、制御部７０は位置合わせ工程を終了する。そして、制御部７０は、コレット１８をピックアップしようとする半導体ダイ１５の直上に移動し、半導体ダイ１５と若干の隙間を開けた高さに保持する。制御部７０はコレット１８の移動が終わると真空装置７１によって吸着孔１９から空気の吸引を開始し、コレット１８を半導体ダイ１５の吸着待機状態とする。 When the advancement and adhesion of the stage 20 to the lower surface of the holding sheet 12 and the alignment of the semiconductor die 15 are completed, the control unit 70 ends the alignment process. Then, the control unit 70 moves to the position immediately above the semiconductor die 15 from which the collet 18 is to be picked up, and holds the collet 18 at a height with a slight gap. When the movement of the collet 18 is finished, the control unit 70 starts sucking air from the suction hole 19 by the vacuum device 71, and puts the collet 18 in a suction standby state of the semiconductor die 15.
　図１０から図１３に示すように、制御部７０は保持シート引き剥がし工程を開始する。制御部７０は真空装置７１によってステージ２０の筐体２１の内部を真空とする。筐体２１の内部の圧力を真空にすると、図１０（ｂ）に示す筐体２１の内部と連通している縦溝３６４も真空となり、保持シート１２を密着面２２に吸着する。この際、保持シート１２は、真空によって下向きに引かれるがこの状態ではまだ保持シート１２は半導体ダイ１５から剥離していない。また、図８に示した蓋２３の表面に設けられた面取り部分２３ｅと吸引開口４１との間のＶ字形の溝には、ステージ２０の外周側から真空となる縦溝３６４に向かって空気が流れている。このＶ字形の溝の圧力は大気圧よりは低い圧力であるが、この負圧では保持シート１２は剥がれていない。 10 to 13, the control unit 70 starts the holding sheet peeling process. The control unit 70 evacuates the inside of the casing 21 of the stage 20 using the vacuum device 71. When the pressure inside the housing 21 is evacuated, the vertical groove 364 communicating with the inside of the housing 21 shown in FIG. 10B is also evacuated, and the holding sheet 12 is attracted to the contact surface 22. At this time, the holding sheet 12 is pulled downward by the vacuum, but in this state, the holding sheet 12 is not yet peeled from the semiconductor die 15. Further, in the V-shaped groove between the chamfered portion 23e provided on the surface of the lid 23 shown in FIG. 8 and the suction opening 41, air flows from the outer peripheral side of the stage 20 toward the vertical groove 364 that becomes a vacuum. Flowing. The pressure in the V-shaped groove is lower than the atmospheric pressure, but the holding sheet 12 is not peeled off at this negative pressure.
　図１０（ａ）に示すように、制御部７０の指令によってスライダ駆動機構３００の駆動部２５のモータ３８１が回転すると、モータ３８１の軸に取付けられているカム３８３が回転する。カム３８３は楕円形状で、カム面が第１リンク３２６のシャフト３２６ｂの先端に取付けられたローラ３２６ｃに接しており、図１０(ａ)の矢印の方向に回転するとカム３８３のカム面はローラ３２６ｃを密着面２２の方向に向かって押し上げる。この動作によってシャフト３２６ｂが上昇し、第１リンク３２６全体が密着面２２に向かって上昇する。第１リンク３２６全体が上昇すると、密着面２２の側にばね３７３によって接続されているピストン３７０は第１リンク３２６によって押し上げられて、ピストン３７０の全体が密着面２２に向かって上昇する。ピストン３７０の全体が密着面２２に向かって上昇すると、密着面２２の側に取付けられているガイドレール３３１もピストン３７０とともに密着面２２に向かって上昇する。ガイドレール３３１が上昇すると、ガイドレール３３１の上面に沿ってスライドするよう取付けられているスライダ３３２も密着面２２に向かって上昇する。そして、スライダ３３２にアーム２３ｆを介して回転自在に係合されている蓋２３の先端２３ａは、スライダ３３２の上昇と共に密着面２２から上方に向かって進出する。 As shown in FIG. 10A, when the motor 381 of the drive unit 25 of the slider drive mechanism 300 is rotated by a command from the control unit 70, the cam 383 attached to the shaft of the motor 381 is rotated. The cam 383 has an elliptical shape, and the cam surface is in contact with the roller 326c attached to the tip of the shaft 326b of the first link 326. When the cam 383 rotates in the direction of the arrow in FIG. 10A, the cam surface of the cam 383 becomes the roller 326c. Is pushed up toward the contact surface 22. By this operation, the shaft 326 b rises and the entire first link 326 rises toward the contact surface 22. When the entire first link 326 rises, the piston 370 connected to the contact surface 22 side by the spring 373 is pushed up by the first link 326, and the entire piston 370 rises toward the contact surface 22. When the entire piston 370 rises toward the contact surface 22, the guide rail 331 attached to the contact surface 22 side also moves up toward the contact surface 22 together with the piston 370. When the guide rail 331 rises, the slider 332 attached so as to slide along the upper surface of the guide rail 331 also rises toward the contact surface 22. The tip 23a of the lid 23 that is rotatably engaged with the slider 332 via the arm 23f advances upward from the contact surface 22 as the slider 332 rises.
　蓋２３の先端２３ａが密着面２２から上方に向かって進出すると蓋２３の先端２３ａは、保持シート１２と半導体ダイ１５の一端１５ａを押し上げる。すると、先端２３ａは保持シート１２から下向きの力を受けるので、蓋２３はピン３３０を中心に時計方向に回転する。蓋２３の保持シート１２を押し上げる面と反対側の面である下面２３ｇは、スライド用溝２２ａと傾斜面２２ｂとの間のエッジ２２ｄで支持され、後端２３ｃの保持シート１２側の面は密着面２２と略同一面になっているので、蓋２３の保持シート１２を押し上げている表面は蓋２３の先端２３ａ側から後端２３ｃ側に向かって下向きに傾斜する。傾斜角度は、密着面２２に対して角度αである。一方、傾斜面２２ｂは密着面２２に対して角度αよりも大きい角度βだけ傾斜している。このため、傾斜面２２ｂは蓋２３の後端２３ｃの移動を妨げることが無く、蓋２３の下面２３ｇは常にエッジ２２ｄと線接触する。 When the tip 23 a of the lid 23 advances upward from the contact surface 22, the tip 23 a of the lid 23 pushes up the holding sheet 12 and one end 15 a of the semiconductor die 15. Then, since the tip 23 a receives a downward force from the holding sheet 12, the lid 23 rotates clockwise about the pin 330. The lower surface 23g, which is the surface opposite to the surface that pushes up the holding sheet 12 of the lid 23, is supported by an edge 22d between the slide groove 22a and the inclined surface 22b, and the surface of the rear end 23c on the holding sheet 12 side is in close contact. Since the surface is substantially flush with the surface 22, the surface of the lid 23 that pushes up the holding sheet 12 is inclined downward from the front end 23a side of the lid 23 toward the rear end 23c side. The inclination angle is an angle α with respect to the contact surface 22. On the other hand, the inclined surface 22b is inclined with respect to the contact surface 22 by an angle β larger than the angle α. For this reason, the inclined surface 22b does not hinder the movement of the rear end 23c of the lid 23, and the lower surface 23g of the lid 23 is always in line contact with the edge 22d.
　蓋２３の先端２３ａが上昇するにつれて、蓋２３はピックアップしようとする半導体ダイ１５と保持シート１２とを上に押し上げる。一方、真空となった縦溝３６４の上に位置している半導体ダイ１５の両角の部分の保持シート１２は密着面２２に吸引固定されている。このため、蓋２３の上昇によって、ピックアップしようとする半導体ダイ１５に張りつけられている保持シート１２は密着面２２に向かって斜め下向きに引っ張られ、この斜め下向きの引っ張り力によって縦溝３６４の上に位置している半導体ダイ１５の両角の部分から保持シート１２が剥がれ始め、縦溝３６４の上に位置している略９０度の扇形部分の保持シート１２が剥がれる。そして、蓋２３の先端２３ａが上昇するにつれて蓋２３の先端２３ａよりも密着面２２にはみ出している半導体ダイ１５の略三角形状の部分の保持シート１２が密着面２２に向かって斜め下向きに引っ張られ、半導体ダイ１５の幅方向の両側から幅方向の中心に向かって剥がれていく。 As the tip 23a of the lid 23 rises, the lid 23 pushes up the semiconductor die 15 and the holding sheet 12 to be picked up. On the other hand, the holding sheets 12 at both corners of the semiconductor die 15 located on the vertical grooves 364 that have become vacuum are sucked and fixed to the contact surface 22. For this reason, when the lid 23 is raised, the holding sheet 12 attached to the semiconductor die 15 to be picked up is pulled obliquely downward toward the contact surface 22, and the diagonal downward pulling force causes the holding sheet 12 to be placed on the vertical groove 364. The holding sheet 12 begins to peel from both corners of the semiconductor die 15 positioned, and the approximately 90-degree fan-shaped holding sheet 12 positioned on the longitudinal groove 364 is peeled off. Then, as the tip 23 a of the lid 23 rises, the holding sheet 12 of the substantially triangular portion of the semiconductor die 15 that protrudes from the tip 23 a of the lid 23 to the contact surface 22 is pulled obliquely downward toward the contact surface 22. The semiconductor die 15 is peeled from both sides in the width direction toward the center in the width direction.
　そして、制御部７０の指令によって更にスライダ駆動機構３００のモータ３８１が回転し、モータ３８１と共に回転するカム３８３によって更に第１リンク３２６とピストン３７０とが密着面２２の方向に向かって上昇すると、ピストン３７０の外面に張り出したフランジ３７１の端面が筐体２１に設けられたストッパ３２１ａにぶつかる。するとピストン３７０はストッパ３２１ａによって密着面２２に対してそれ以上進出できなくなり、蓋２３の先端２３ａの密着面２２からの進出が所定の位置で停止する。先端２３ａが所定の位置まで上昇すると、先端２３ａの曲面に沿って保持シート１２の剥離線５３が形成される。 When the motor 381 of the slider drive mechanism 300 further rotates according to the command from the control unit 70, and the first link 326 and the piston 370 further rise in the direction of the contact surface 22 by the cam 383 that rotates together with the motor 381, the piston The end surface of the flange 371 projecting to the outer surface of 370 hits the stopper 321 a provided on the housing 21. Then, the piston 370 can no longer advance with respect to the contact surface 22 by the stopper 321a, and the advancement of the tip 23a of the lid 23 from the contact surface 22 stops at a predetermined position. When the tip 23a rises to a predetermined position, a peeling line 53 of the holding sheet 12 is formed along the curved surface of the tip 23a.
　図１１に示すように、蓋２３の先端２３ａが上昇するにつれて蓋２３が回転するので、蓋２３の先端２３ａは半導体ダイ１５の一端１５ａよりも蓋２３のスライド方向に向かってわずかに移動する。このため、剥離線５３は半導体ダイ１５の一端１５ａよりもわずかに蓋２３のスライド方向に寄った位置に形成される。 As shown in FIG. 11, since the lid 23 rotates as the tip 23a of the lid 23 rises, the tip 23a of the lid 23 moves slightly toward the sliding direction of the lid 23 from one end 15a of the semiconductor die 15. For this reason, the peeling line 53 is formed at a position slightly closer to the sliding direction of the lid 23 than the one end 15 a of the semiconductor die 15.
　図１１に示すように、半導体ダイ１５の保持シート１２が剥がれた部分は、保持シート１２によって密着面２２に向かって引かれる力がなくなる。また、保持シート１２が剥がれた一端１５ａから剥離線５３までの部分の半導体ダイ１５と保持シート１２との間には空気が入り込み、この部分の半導体ダイ１５の保持シート１２側の面の圧力は大気圧となる。一方、半導体ダイ１５のコレット１８側の面は、蓋２３の先端２３ａの上方への進出によってコレット１８の吸着面に接近することにより圧力が低下する。このため、半導体ダイ１５の保持シート１２側の面の圧力がコレット１８側の圧力よりも高くなり、保持シート１２から剥がれた半導体ダイ１５の部分はコレット１８に吸着される。半導体ダイ１５の剥離線５３から蓋２３の後端２３ｃ側にあってまだ保持シート１２が剥がれていない部分は、半導体ダイ１５とコレット１８との間に若干の隙間が残っており、半導体ダイ１５の保持シート１２側とコレット１８側との圧力差があまり大きくなっていないことと、保持シート１２による引き下げ力があることにより、まだコレット１８に吸着されていない。このため、半導体ダイ１５は、コレット１８に吸着された部分とコレット１８に吸着されていない部分との間で微小な曲げ変形を生じている。 As shown in FIG. 11, the portion of the semiconductor die 15 from which the holding sheet 12 is peeled loses the force drawn toward the contact surface 22 by the holding sheet 12. In addition, air enters between the portion of the semiconductor die 15 from the one end 15a where the holding sheet 12 is peeled off to the peeling line 53 and the holding sheet 12, and the pressure on the surface of the semiconductor die 15 on the holding sheet 12 side of this portion is It becomes atmospheric pressure. On the other hand, the pressure on the surface of the semiconductor die 15 on the collet 18 side is reduced by approaching the adsorption surface of the collet 18 by the upward movement of the tip 23a of the lid 23. For this reason, the pressure of the surface of the semiconductor die 15 on the holding sheet 12 side becomes higher than the pressure on the collet 18 side, and the portion of the semiconductor die 15 peeled off from the holding sheet 12 is adsorbed by the collet 18. A portion of the semiconductor die 15 on the rear end 23c side of the lid 23 from the peeling line 53 where the holding sheet 12 has not yet been peeled is left with a slight gap between the semiconductor die 15 and the collet 18. Since the pressure difference between the holding sheet 12 side and the collet 18 side is not so large and there is a pulling force by the holding sheet 12, it is not yet adsorbed by the collet 18. For this reason, the semiconductor die 15 undergoes minute bending deformation between a portion adsorbed by the collet 18 and a portion not adsorbed by the collet 18.
　図１０（ａ）に示すように、蓋２３の先端２３ａが密着面２２から上方に進出し、保持シート１２を押し上げている側の表面が傾斜すると、剥離線５３よりも蓋２３の後端２３ｃ側にある蓋２３の表面と保持シート１２との間には隙間が生じ、剥離線５３よりも蓋２３の後端２３ｃ側にある蓋２３の表面の圧力は略大気圧となる。また、蓋２３の面取り部分２３ｅの表面の圧力は蓋２３の表面の圧力と同様の大気圧となるため、先端２３ａに隣接する一部を除いて面取り部分２３ｅの保持シート１２は半導体ダイ１５から剥がれていない。したがって、剥離線５３は図１０（ｂ）に示すように、蓋２３の先端２３ａに沿って半導体ダイ１５の幅方向の側面から側面にかけて延びる線であり、蓋２３の側面２３ｂに沿った部分には剥離線５３は延びていない。 As shown in FIG. 10A, when the front end 23 a of the lid 23 advances upward from the contact surface 22 and the surface on the side where the holding sheet 12 is pushed up is inclined, the rear end 23 c of the lid 23 with respect to the peeling line 53. A gap is generated between the surface of the lid 23 on the side and the holding sheet 12, and the pressure on the surface of the lid 23 on the rear end 23 c side of the lid 23 with respect to the peeling line 53 is substantially atmospheric pressure. Further, since the pressure on the surface of the chamfered portion 23e of the lid 23 is the same atmospheric pressure as the pressure on the surface of the lid 23, the holding sheet 12 of the chamfered portion 23e is removed from the semiconductor die 15 except for a portion adjacent to the tip 23a. Not peeled off. Therefore, as shown in FIG. 10B, the peeling line 53 is a line extending from the side surface in the width direction of the semiconductor die 15 to the side surface along the tip 23 a of the lid 23, and in the portion along the side surface 23 b of the lid 23. The peeling line 53 does not extend.
　図１０（ａ）に示すように、蓋２３の厚さは、先端２３ａの密着面２２からの所定の進出高さよりも厚いので、蓋２３の各側面２３ｂは吸引開口４１の各側面４１ｂと接した状態となっている。また、蓋２３の後端２３ｃの下面は、スライド用溝２２ａの表面に接している。そして、縦溝３６４の上には半導体ダイ１５から剥がれた保持シート１２が覆いかぶさっている。このため、筐体２１の外部から筐体２１の内部に向かってほとんど空気が流れこまないため筐体２１の内部は真空に保持されている。 As shown in FIG. 10A, since the thickness of the lid 23 is thicker than a predetermined advance height from the contact surface 22 of the tip 23a, each side surface 23b of the lid 23 is in contact with each side surface 41b of the suction opening 41. It has become a state. The lower surface of the rear end 23c of the lid 23 is in contact with the surface of the slide groove 22a. The holding sheet 12 peeled off from the semiconductor die 15 is covered on the vertical groove 364. For this reason, since almost no air flows from the outside of the housing 21 toward the inside of the housing 21, the inside of the housing 21 is kept in a vacuum.
　また、スライダ駆動機構３００のばね３７３は蓋２３の先端２３ａを密着面２２から押し上げる程度ではほとんど撓まない程度のこわさを持っているので、蓋２３の先端２３ａが密着面２２から所定の進出高さまで押し上げられてもピストン３７０と第１リンク３２６との間の距離はほとんど変化しない。このため、第１リンク３２６の上昇によって蓋２３は密着面２２から突出するのみで、スライドはしていない。 Further, since the spring 373 of the slider drive mechanism 300 has such a stiffness that it hardly bends when the tip 23 a of the lid 23 is pushed up from the contact surface 22, the tip 23 a of the lid 23 has a predetermined advance height from the contact surface 22. Even if pushed up, the distance between the piston 370 and the first link 326 hardly changes. For this reason, the lid 23 only protrudes from the contact surface 22 by the rising of the first link 326 and does not slide.
　図１２（ａ）に示すように、制御部７０の指令によって更にスライダ駆動機構３００のカム３８３が回転し、第１リンク３２６が密着面２２に向かって押し上げられると、密着面２２に向かって移動できないピストン３７０と第１リンク３２６との間のばね３７３がモータ３８１とカム３８３によって密着面２２に対して進退する方向に圧縮され始める。ばね３７３が圧縮されると、ピストン３７０は密着面２２に対して進出せず、第１リンク３２６だけが密着面２２に対して進出することとなる。このため、ピストン３７０のピン３２８は密着面２２に対して上昇せず、第１リンク３２６の係合溝３２６ａに入っている第２リンク３２９のピン３２７だけが密着面２２の方向に上昇する。すると第２リンク３２９はピン３２８を中心に回転を始める。この回転動作によって第２リンク３２９の他端の係合溝３２９ａがステージ２０の外周側に向かって移動し、係合溝３２９ａに入っているピン３３０ａが固定されているスライダ３３２とスライダ３３２のピン３３０にアーム２３ｆを介して回転自在に係合されている蓋２３がステージ２０の外周側に向かってスライドを始める。 As shown in FIG. 12A, when the cam 383 of the slider drive mechanism 300 is further rotated by a command from the control unit 70 and the first link 326 is pushed up toward the contact surface 22, it moves toward the contact surface 22. The spring 373 between the impossible piston 370 and the first link 326 starts to be compressed by the motor 381 and the cam 383 in the direction of moving back and forth with respect to the contact surface 22. When the spring 373 is compressed, the piston 370 does not advance with respect to the contact surface 22, and only the first link 326 extends with respect to the contact surface 22. For this reason, the pin 328 of the piston 370 does not rise with respect to the contact surface 22, and only the pin 327 of the second link 329 entering the engagement groove 326 a of the first link 326 rises in the direction of the contact surface 22. Then, the second link 329 starts to rotate around the pin 328. By this rotation operation, the engaging groove 329a at the other end of the second link 329 moves toward the outer periphery of the stage 20, and the slider 332 and the pin of the slider 332 to which the pin 330a in the engaging groove 329a is fixed. The lid 23 that is rotatably engaged with the 330 via the arm 23 f starts to slide toward the outer peripheral side of the stage 20.
　図１２（ａ）、図１３に示すように、蓋２３がスライドを始めると、蓋２３の保持シート１２を押し上げている表面と反対側の下面２３ｇは、エッジ２２ｄに接してエッジ２２ｄに支持されながらスライドするので、蓋２３の傾斜角度は蓋２３がスライドするにつれて次第に大きくなってくる。しかし、蓋２３がスライドした状態でも傾斜面２２ｂと密着面２２とのなす角度βは、蓋２３と密着面２２とのなす角度αよりも大きいので、蓋２３の下面２３ｇは傾斜面２２ｂと干渉しない。そして、蓋２３がスライドしている間、蓋２３の下面２３ｇは常にエッジ２２ｄに接した状態となっている。 As shown in FIGS. 12A and 13, when the lid 23 starts to slide, the lower surface 23g of the lid 23 opposite to the surface pushing up the holding sheet 12 is in contact with the edge 22d and supported by the edge 22d. Therefore, the inclination angle of the lid 23 gradually increases as the lid 23 slides. However, since the angle β formed between the inclined surface 22b and the contact surface 22 is larger than the angle α formed between the cover 23 and the contact surface 22 even when the cover 23 is slid, the lower surface 23g of the cover 23 interferes with the inclined surface 22b. do not do. While the lid 23 is sliding, the lower surface 23g of the lid 23 is always in contact with the edge 22d.
　図１２（ｂ）に示すように、蓋２３がスライドすると、蓋２３の先端２３ａが吸引開口４１の端面４１ａから離れ、吸引開口４１が開いてピックアップしようとする半導体ダイ１５と略同一幅の開口開き部４２ができる。ステージ２０の筐体２１の内部は真空装置７１によって真空状態となっていることから、開口開き部４２はその中に保持シート１２を吸引する。そして、蓋２３のスライドに伴って開口開き部４２の中に保持シート１２が引き込まれて半導体ダイ１５から引き剥がされる。半導体ダイ１５と保持シート１２との間の剥離線５３は蓋２３の先端２３ａの曲面に沿った形状となるので、密着面２２から蓋２３の幅方向の中央が山形に盛り上がった稜線で、密着面２２に沿った面内では蓋２３の各側面２３ｂの側は中央部分よりもスライド方向に向かって傾斜した線となっている。このため、半導体ダイ１５の各側面側の保持シート１２は半導体ダイ１５の幅方向の中央部分の保持シート１２よりも先に剥がれることとなる。このように、剥離線５３が密着面２２に沿った面内では半導体ダイ１５の各端１５ａ，１５ｂに対してあるいはスライド方向に対して傾斜しているので、コレット１８に吸着された部分とコレット１８に吸着されていない部分との間の微小な曲げ変形によって発生する応力が緩和され、半導体ダイ１５の損傷を効果的に抑制することができる。 As shown in FIG. 12B, when the lid 23 is slid, the tip 23a of the lid 23 is separated from the end face 41a of the suction opening 41, and the suction opening 41 is opened to have an opening having substantially the same width as the semiconductor die 15 to be picked up. An opening 42 is formed. Since the inside of the housing 21 of the stage 20 is in a vacuum state by the vacuum device 71, the opening opening 42 sucks the holding sheet 12 therein. Then, the holding sheet 12 is drawn into the opening portion 42 as the lid 23 slides, and is peeled off from the semiconductor die 15. Since the peeling line 53 between the semiconductor die 15 and the holding sheet 12 has a shape along the curved surface of the tip 23a of the lid 23, the center in the width direction of the lid 23 from the adhesion surface 22 is a ridge line that rises in a mountain shape. Within the surface along the surface 22, each side surface 23 b side of the lid 23 is a line inclined toward the sliding direction from the center portion. For this reason, the holding sheet 12 on each side of the semiconductor die 15 is peeled off before the holding sheet 12 at the center portion in the width direction of the semiconductor die 15. Thus, since the peeling line 53 is inclined with respect to the ends 15a and 15b of the semiconductor die 15 or with respect to the sliding direction in the plane along the contact surface 22, the portion adsorbed by the collet 18 and the collet The stress generated by a minute bending deformation between the portion not adsorbed by 18 is relieved, and damage to the semiconductor die 15 can be effectively suppressed.
　蓋２３のスライドにつれて開口開き部４２はステージ２０の外周側に向かって大きくなり、剥離線５３も順次ステージ２０の外周側に平行移動する。保持シート１２は剥離線５３に沿って半導体ダイ１５の一端１５ａから他端１５ｂに向かって順次剥がれ、開口開き部４２に順次吸引される。 As the lid 23 slides, the opening portion 42 increases toward the outer peripheral side of the stage 20, and the peeling line 53 sequentially moves in parallel to the outer peripheral side of the stage 20. The holding sheet 12 is sequentially peeled from the one end 15 a to the other end 15 b of the semiconductor die 15 along the peeling line 53, and is sequentially sucked into the opening opening 42.
　図１３に示すように、蓋２３がスライドして剥離線５３が半導体ダイ１５の一端１５ａから他端１５ｂに向かって移動すると、図１１を参照して説明したのと同様に、保持シート１２が剥がれた一端１５ａから剥離線５３までの部分の半導体ダイ１５と保持シート１２との間には空気が入り込み、この部分の半導体ダイ１５の保持シート１２側の面の圧力は大気圧となる。一方、半導体ダイ１５のコレット１８側の面は、コレット１８の吸着面に接近することにより圧力が低下するので、保持シート１２が剥がれた一端１５ａから剥離線５３の手前までの半導体ダイ１５の部分はコレット１８に吸着される。そして、蓋２３のスライドによって剥離線５３が半導体ダイ１５の一端１５ａから他端１５ｂに向かって移動するにつれて、半導体ダイ１５は一端１５ａから他端１５ｂに向かって順次コレット１８に吸着されていく。 As shown in FIG. 13, when the lid 23 slides and the peeling line 53 moves from one end 15 a of the semiconductor die 15 toward the other end 15 b, the holding sheet 12 is moved as described with reference to FIG. 11. Air enters between the part of the semiconductor die 15 and the holding sheet 12 from the peeled end 15a to the peeling line 53, and the pressure on the surface of the semiconductor die 15 on the side of the holding sheet 12 becomes atmospheric pressure. On the other hand, since the pressure of the surface of the semiconductor die 15 on the collet 18 side approaches the adsorption surface of the collet 18, the portion of the semiconductor die 15 from one end 15 a where the holding sheet 12 is peeled to the front of the peeling line 53. Is adsorbed by the collet 18. Then, as the peeling line 53 moves from one end 15a to the other end 15b of the semiconductor die 15 by the slide of the lid 23, the semiconductor die 15 is sequentially attracted to the collet 18 from the one end 15a to the other end 15b.
　図１２（ａ）、図１３に示すように、蓋２３がスライドすると、蓋２３の保持シート１２を押し上げている表面と反対側の下面２３ｇがエッジ２２ｄに接してスライドするので、エッジ２２ｄと蓋２３の下面２３ｇの接線は大気圧の筐体２１の外部と真空状態の筐体２１の内部とを仕切るシール線となる。また、図５に示すように蓋２３の側面２３ｂとスライド用溝２２ａの側面２２ｊ及び蓋２３と傾斜面２２ｂの両側の側面２２ｈはそれぞれスライド面を構成している。このため、蓋２３の下面２３ｇとスライド用溝２２ａの底面２２ａ’との隙間および蓋２３の側面２３ｂと各側面２２ｈ，２２ｊとの隙間から空気が筐体２１の内部に入り込むことを抑制できるので、蓋２３をスライドさせている間、筐体２１の内部の真空を良好に保持でき、保持シート１２を効果的に吸引開口４１の中に真空吸引することができる。また、蓋２３がスライドすると蓋２３の後端２３ｃは密着面２２から下方に移動していくので、蓋２３をスライドさせた際に蓋２３の後端２３ｃが隣接する半導体ダイ１５にぶつかることが無く、蓋２３のスライドによって隣接する半導体ダイ１５を損傷させることが無いので、周囲に隣接した半導体ダイ１５がある場合でも容易に半導体ダイ１５をピックアップすることができる。 As shown in FIG. 12A and FIG. 13, when the lid 23 slides, the lower surface 23g opposite to the surface pushing up the holding sheet 12 of the lid 23 slides in contact with the edge 22d. The tangent line of the lower surface 23g of 23 is a seal line that separates the outside of the casing 21 at atmospheric pressure from the inside of the casing 21 in a vacuum state. Further, as shown in FIG. 5, the side surface 23b of the lid 23, the side surface 22j of the slide groove 22a, and the side surfaces 22h on both sides of the lid 23 and the inclined surface 22b constitute a slide surface. For this reason, air can be prevented from entering the inside of the casing 21 from the gap between the lower surface 23g of the lid 23 and the bottom surface 22a ′ of the sliding groove 22a and the gap between the side surface 23b of the lid 23 and the side surfaces 22h and 22j. While the lid 23 is being slid, the vacuum inside the casing 21 can be held well, and the holding sheet 12 can be effectively vacuumed into the suction opening 41. Further, when the lid 23 slides, the rear end 23c of the lid 23 moves downward from the contact surface 22, so that the rear end 23c of the lid 23 may hit the adjacent semiconductor die 15 when the lid 23 is slid. In addition, since the adjacent semiconductor die 15 is not damaged by the slide of the lid 23, the semiconductor die 15 can be easily picked up even when there are adjacent semiconductor dies 15.
　また、引き剥がされた保持シート１２によって開口開き部４２が覆われるが、保持シート１２を開口開き部４２の中に吸引して、蓋２３の先端２３ａが保持シート１２の剥がれていない部分に向かってスライドしているので、開口開き部４２による保持シート１２の吸引が停止することが無く、保持シート１２の全体を半導体ダイ１５の一端１５ａから他端１５ｂに向かって順次開口開き部４２に吸引して引き剥がしていくことができ、引き剥がし残り部分ができないようにすることができる。 Further, the opening portion 42 is covered by the peeled holding sheet 12, but the holding sheet 12 is sucked into the opening portion 42, and the tip 23 a of the lid 23 faces the portion where the holding sheet 12 is not peeled off. Therefore, the suction of the holding sheet 12 by the opening 42 is not stopped, and the entire holding sheet 12 is sequentially sucked from the one end 15a of the semiconductor die 15 to the other end 15b by the opening 42. It can be peeled off and the remaining part of the peeling can be prevented.
　半導体ダイ１５に貼り付けられている保持シート１２が全て剥がれると半導体ダイ１５は全面的にコレット１８に吸着され、コレット１８によってピックアップされる。 When the holding sheet 12 attached to the semiconductor die 15 is completely peeled off, the semiconductor die 15 is entirely adsorbed by the collet 18 and picked up by the collet 18.
　半導体ダイ１５をピックアップした後、制御部７０の指令によって更にスライダ駆動機構３００のカム３８３が回転すると、今度はカム３８３の回転によって第１リンク３２６のシャフト３２６ｂが降下し、それにつれて蓋２３は先端２３ａが吸引開口４１の端面４１ａに向かう方向にスライドし、先端２３ａが端面４１ａに接すると蓋２３は吸引開口４１を閉じる。すると、ばね３７３の圧縮力が開放される。そして、更にカム３８３が回転し、シャフト３２６ｂが降下すると、ピストン３７０及び第１リンク３２６、第２リンク３２９は共に降下し、蓋２３の先端２３ａが密着面２２の表面と略同一位置まで降下して初期位置に戻る。 After the semiconductor die 15 is picked up, when the cam 383 of the slider drive mechanism 300 further rotates according to a command from the control unit 70, the shaft 326b of the first link 326 is lowered due to the rotation of the cam 383. The lid 23 closes the suction opening 41 when the tip 23a is in contact with the end face 41a, sliding in the direction toward the end face 41a of the suction opening 41. Then, the compression force of the spring 373 is released. When the cam 383 further rotates and the shaft 326b is lowered, the piston 370, the first link 326, and the second link 329 are both lowered, and the tip 23a of the lid 23 is lowered to substantially the same position as the surface of the contact surface 22. To return to the initial position.
　以上述べたように、本実施形態は、蓋２３の先端２３ａを密着面２２から上方に進出させた状態で蓋２３をスライドさせ、半導体ダイ１５の直下に現出する半導体ダイ１５と略同一幅の吸引開口４１の開口開き部４２の中に保持シート１２を順次吸引させることによって順次保持シート１２の引き剥がしを行うと共に、半導体ダイ１５を順次半導体ダイ１５の直上で待機しているコレット１８に吸着させていくので、保持シート１２の引き剥がしの際に半導体ダイ１５に加わる力を抑制しつつ半導体ダイ１５を容易にピックアップすることができるという効果を奏する。また、本実施形態では、縦溝３６４を真空にした状態で蓋２３の先端２３ａを密着面２２から上方に進出させて半導体ダイ１５を押し上げ、保持シート１２に発生する下向きの引っ張り力によってピックアップしようとする半導体ダイ１５の一端１５ａの両角の保持シート１２を引きはがすことによって引き剥がしのきっかけをつくり、その後、蓋２３をスライドさせて保持シート１２を開口開き部４２に吸引していくことから、より容易に保持シート１２を引き剥がすことができるという効果を奏する。 As described above, in the present embodiment, the lid 23 is slid in a state in which the tip 23a of the lid 23 is advanced upward from the contact surface 22, and substantially the same width as that of the semiconductor die 15 appearing immediately below the semiconductor die 15. The holding sheet 12 is sequentially pulled into the opening portion 42 of the suction opening 41 to sequentially peel off the holding sheet 12, and the semiconductor die 15 is sequentially placed on the collet 18 waiting immediately above the semiconductor die 15. Since the adsorption is performed, the semiconductor die 15 can be easily picked up while suppressing the force applied to the semiconductor die 15 when the holding sheet 12 is peeled off. Further, in this embodiment, the tip 23a of the lid 23 is advanced upward from the contact surface 22 in a state where the vertical groove 364 is evacuated, and the semiconductor die 15 is pushed up and picked up by the downward pulling force generated in the holding sheet 12. Since a trigger for peeling is created by peeling off the holding sheets 12 at both corners of the one end 15a of the semiconductor die 15, and then the lid 23 is slid to suck the holding sheet 12 into the opening 42, There is an effect that the holding sheet 12 can be peeled off more easily.
　本実施形態では、半導体ダイ１５の一端１５ａ側から他端１５ｂ側に向けて蓋２３をスライドさせて開口開き部４２に順次保持シート１２を吸引させて保持シート１２の引き剥がしを行うので、開口開き部４２の中に吸引した保持シート１２によって開口開き部４２が覆われても、蓋２３が保持シート１２の剥がれていない部分に向かってスライドしているので、保持シート１２の全体を順次開口開き部４２に吸引して引き剥がしていくことができ、容易に保持シート１２全部の引き剥がしを行うことができるという効果を奏する。また、蓋２３の下面２３ｇがエッジ２２ｄと線状に接してスライドするので、筐体２１の外部から筐体２１の内部への空気の侵入を効果的に抑制でき、筐体２１内部の真空を良好に維持できるので、保持シート１２を効果的に開口開き部４２の中に吸引して引き剥がすことができるという効果を奏する。 In the present embodiment, the lid 23 is slid from the one end 15a side to the other end 15b side of the semiconductor die 15, and the holding sheet 12 is sequentially sucked into the opening opening 42 to peel off the holding sheet 12. Even if the opening portion 42 is covered by the holding sheet 12 sucked into the opening portion 42, the lid 23 slides toward the portion where the holding sheet 12 is not peeled, so that the entire holding sheet 12 is sequentially opened. The opening 42 can be sucked and peeled off, and the entire holding sheet 12 can be easily peeled off. In addition, since the lower surface 23g of the lid 23 slides linearly in contact with the edge 22d, the intrusion of air from the outside of the housing 21 to the inside of the housing 21 can be effectively suppressed, and the vacuum inside the housing 21 is reduced. Since it can maintain favorably, there exists an effect that the holding sheet 12 can be effectively sucked into the opening portion 42 and peeled off.
　本実施形態は、蓋２３の先端２３ａが曲面で、剥離線５３が密着面２２に沿った面内では半導体ダイ１５の各端１５ａ，１５ｂに対してあるいはスライド方向に対して傾斜しているので、コレット１８に吸着された部分とコレット１８に吸着されていない部分との間の微小な曲げ変形によって発生する応力が緩和され、半導体ダイ１５の損傷を効果的に抑制することができる。 In the present embodiment, the tip 23 a of the lid 23 is a curved surface, and the peeling line 53 is inclined with respect to the ends 15 a and 15 b of the semiconductor die 15 or with respect to the sliding direction within the plane along the contact surface 22. The stress generated by minute bending deformation between the portion adsorbed by the collet 18 and the portion not adsorbed by the collet 18 is relieved, and damage to the semiconductor die 15 can be effectively suppressed.
　本実施形態では、密着面２２から上方に進出するのは蓋２３の先端２３ａの近傍の一部で蓋２３の後端２３ｃは密着面２２から上方に進出しないので、蓋２３をスライドさせた際に蓋２３の後端２３ｃが隣接する半導体ダイ１５にぶつかることが無く、蓋２３のスライドによって隣接する半導体ダイ１５を損傷させることが無いので、周囲に隣接した半導体ダイ１５がある場合でも容易に半導体ダイ１５をピックアップすることができるという効果を奏する。 In the present embodiment, the part that advances upward from the contact surface 22 is a part of the vicinity of the tip 23a of the lid 23, and the rear end 23c of the lid 23 does not advance upward from the contact surface 22, so that the lid 23 is slid. The rear end 23c of the lid 23 does not collide with the adjacent semiconductor die 15, and the adjacent semiconductor die 15 is not damaged by the sliding of the lid 23. Therefore, even when there are adjacent semiconductor dies 15 around The semiconductor die 15 can be picked up.
　また、本実施形態では、ステージ２０は、ステージ上下方向駆動機構７３によって保持シート１２に対して進退方向に上下動のみを行い、保持シート１２に沿った方向である水平方向に対する移動機構を備えていないので水平方向に対する機構のバックラッシュなどが無く、保持シート１２に沿った方向に対する位置の安定性がよい。そして、ピックアップする半導体ダイ１５と蓋２３との保持シート１２の面に沿った方向の位置合わせはウェーハホルダ水平方向駆動部７２によって行うため、水平方向の位置合わせの際にステージ２０の水平方向位置が安定し、ステージ２０の蓋２３と保持シート１２に貼りつけられている半導体ダイ１５との位置合わせの際の位置ずれの発生を低減することができるという効果を奏する。 In the present embodiment, the stage 20 includes only a vertical movement in the advancing and retreating direction with respect to the holding sheet 12 by the stage vertical driving mechanism 73, and a moving mechanism with respect to the horizontal direction that is along the holding sheet 12. Therefore, there is no backlash of the mechanism in the horizontal direction, and the position stability in the direction along the holding sheet 12 is good. Further, since the alignment of the semiconductor die 15 to be picked up and the lid 23 in the direction along the surface of the holding sheet 12 is performed by the wafer holder horizontal direction driving unit 72, the horizontal position of the stage 20 is adjusted during the horizontal alignment. Is stable, and it is possible to reduce the occurrence of misalignment during alignment between the lid 23 of the stage 20 and the semiconductor die 15 attached to the holding sheet 12.
　本発明の他の実施形態について図１４、図１５を参照しながら説明する。図１から図１３を参照して説明した実施形態と同様の部分には同様の符号を付して説明は省略する。 Another embodiment of the present invention will be described with reference to FIGS. Parts similar to those of the embodiment described with reference to FIGS. 1 to 13 are denoted by the same reference numerals and description thereof is omitted.
　図１４に示すように、ステージ２０は、密着面２２から蓋２３の厚さだけ凹み、蓋２３と略同一幅で蓋２３が開く側の吸引開口４１の端からステージ２０の外周側に向かって延びるスライド用溝２２ａと、スライド用溝２２ａの底面２２ａ’に続き、密着面２２と略直角な平面２２ｅと、段部２２ｆとを備えている。スライド用溝２２ａの側面２２ｈは吸引開口４１の側面４１ｂと同一の面となっており、蓋２３の側面２３ｂとスライド用溝２２ａの側面２２ｈとはスライド面を構成している。スライド用溝２２ａの底面２２ａ’は密着面２２に略平行に、ステージ２０の外周の円筒面にかからない位置で、蓋２３が吸引開口４１を閉じた状態での蓋２３の後端２３ｃの位置よりもステージ内周側の位置にある端部２２ｃまで延びている。端部２２ｃは直線状で、蓋２３の後端２３ｃは蓋２３が閉じた状態でスライド用溝２２ａの端部２２ｃよりも若干ステージ２０の外周側に突出している。平面２２ｅはスライド用溝２２ａの端部２２ｃから密着面２２と反対の方向に下側に向かって筐体２１の長手方向に垂直に延びている。平面２２ｅとスライド用溝２２ａの底面２２ａ’との交線は蓋２３のスライド方向と直角方向に延びる直線状の稜線のエッジ２２ｄを形成している。平面２２ｅは、平面２２ｅから密着面２２と略平行に筐体２１の外周面まで延びる段部２２ｆに続いている。段部２２ｆは円筒形の筐体２１の外周面まで延びているので、その外周側端２２ｇは筐体２１の円筒に沿った円弧となっている。段部２２ｆの両側にはスライド用溝２２ａの側面２２ｈと同一面となっている側面２２ｊが延びている。側面２２ｊと蓋２３の側面２３ｂとはスライド面を構成している。蓋２３の後端２３ｃは蓋２３が吸引開口４１を閉じた状態でスライド用溝２２ａの端部２２ｃ、及びエッジ２２ｄよりもステージ２０の外周側に突出しているので、蓋２３の保持シート１２を押し上げる面と反対側の面である下面２３ｇはエッジ２２ｄで支持される。 As shown in FIG. 14, the stage 20 is recessed from the contact surface 22 by the thickness of the lid 23, from the end of the suction opening 41 on the side where the lid 23 opens with substantially the same width as the lid 23 toward the outer peripheral side of the stage 20. Following the extending slide groove 22a, the bottom surface 22a 'of the slide groove 22a, a flat surface 22e substantially perpendicular to the contact surface 22 and a step portion 22f are provided. The side surface 22h of the slide groove 22a is the same surface as the side surface 41b of the suction opening 41, and the side surface 23b of the lid 23 and the side surface 22h of the slide groove 22a constitute a slide surface. The bottom surface 22a ′ of the slide groove 22a is substantially parallel to the contact surface 22 and does not cover the cylindrical surface on the outer periphery of the stage 20, and from the position of the rear end 23c of the lid 23 with the lid 23 closing the suction opening 41. Also extends to the end 22c at the position on the inner periphery side of the stage. The end 22c is linear, and the rear end 23c of the lid 23 protrudes slightly to the outer peripheral side of the stage 20 from the end 22c of the slide groove 22a with the lid 23 closed. The flat surface 22e extends vertically from the end 22c of the slide groove 22a in the direction opposite to the contact surface 22 and downward in the longitudinal direction of the housing 21. An intersection line between the flat surface 22e and the bottom surface 22a 'of the slide groove 22a forms an edge 22d of a linear ridge line extending in a direction perpendicular to the sliding direction of the lid 23. The flat surface 22e continues to a step 22f extending from the flat surface 22e to the outer peripheral surface of the housing 21 substantially in parallel with the contact surface 22. Since the step 22 f extends to the outer peripheral surface of the cylindrical casing 21, the outer peripheral end 22 g is an arc along the cylinder of the casing 21. Side surfaces 22j that are flush with the side surface 22h of the slide groove 22a extend on both sides of the step 22f. The side surface 22j and the side surface 23b of the lid 23 constitute a slide surface. The rear end 23c of the lid 23 protrudes to the outer peripheral side of the stage 20 from the end 22c of the slide groove 22a and the edge 22d in a state where the lid 23 closes the suction opening 41. The lower surface 23g, which is the surface opposite to the surface to be pushed up, is supported by the edge 22d.
　図１５に示すように、エッジ２２ｄと段部２２ｆの外周側端２２ｇとを含む面の密着面２２に対する角度は、角度γであり、蓋２３がスライドする際の蓋２３の下面２３ｇの密着面２２に対する傾斜角度はαである。角度γは、蓋２３がスライドした状態でも常に蓋２３の下面２３ｇの密着面２２に対する角度αよりも大きい角度γなので、段部２２ｆの外周側端２２ｇは蓋２３の後端２３ｃと干渉しない。そして、蓋２３がスライドしている間、蓋２３の下面２３ｇは常にエッジ２２ｄと線接触した状態となっている。 As shown in FIG. 15, the angle of the surface including the edge 22d and the outer peripheral side end 22g of the step portion 22f with respect to the contact surface 22 is an angle γ, and the contact surface of the lower surface 23g of the lid 23 when the lid 23 slides. The inclination angle with respect to 22 is α. Since the angle γ is always larger than the angle α with respect to the contact surface 22 of the lower surface 23g of the lid 23 even when the lid 23 is slid, the outer peripheral side end 22g of the step 22f does not interfere with the rear end 23c of the lid 23. While the lid 23 is sliding, the lower surface 23g of the lid 23 is always in line contact with the edge 22d.
　図１５に示すように、蓋２３がスライドすると、蓋２３の保持シート１２を押し上げている表面と反対側の下面２３ｇがエッジ２２ｄに接してスライドするので、エッジ２２ｄと蓋２３の下面２３ｇの接線は大気圧の筐体２１の外部と真空状態の筐体２１の内部とを仕切るシール線となる。また、図１４に示すように蓋２３の側面２３ｂとスライド用溝２２ａの側面２２ｊ及び蓋２３と段部２２ｆの両側の側面２２ｈはそれぞれスライド面を構成している。このため、蓋２３の下面２３ｇとスライド用溝２２ａの底面２２ａ’との隙間および蓋２３の側面２３ｂと各側面２２ｈ，２２ｊとの隙間から空気が筐体２１の内部に入り込むことを抑制できるので、蓋２３をスライドさせている間、筐体２１の内部の真空を良好に保持でき、保持シート１２を効果的に吸引開口４１の中に真空吸引することができるという効果を奏する。また、蓋２３がスライドすると蓋２３の後端２３ｃは密着面２２から下方に移動していくので、蓋２３をスライドさせた際に蓋２３の後端２３ｃが隣接する半導体ダイ１５にぶつかることが無く、蓋２３のスライドによって隣接する半導体ダイ１５を損傷させることが無く、周囲に隣接した半導体ダイ１５がある場合でも容易に半導体ダイ１５をピックアップすることができるという効果を奏する。 As shown in FIG. 15, when the lid 23 slides, the lower surface 23g of the lid 23 opposite to the surface pushing up the holding sheet 12 slides in contact with the edge 22d, so the tangent between the edge 22d and the lower surface 23g of the lid 23 Is a seal line that separates the outside of the casing 21 at atmospheric pressure from the inside of the casing 21 in a vacuum state. Further, as shown in FIG. 14, the side surface 23b of the lid 23, the side surface 22j of the slide groove 22a, and the side surfaces 22h of the lid 23 and both sides of the step portion 22f constitute a slide surface. For this reason, air can be prevented from entering the inside of the casing 21 from the gap between the lower surface 23g of the lid 23 and the bottom surface 22a ′ of the sliding groove 22a and the gap between the side surface 23b of the lid 23 and the side surfaces 22h and 22j. While the lid 23 is being slid, the vacuum inside the casing 21 can be maintained well, and the holding sheet 12 can be effectively sucked into the suction opening 41. Further, when the lid 23 slides, the rear end 23c of the lid 23 moves downward from the contact surface 22, so that the rear end 23c of the lid 23 may hit the adjacent semiconductor die 15 when the lid 23 is slid. In addition, the adjacent semiconductor die 15 is not damaged by the slide of the lid 23, and the semiconductor die 15 can be easily picked up even when the adjacent semiconductor die 15 is present.
　以上説明した本実施形態では、段部２２ｆは密着面２２と略直角の平面２２ｅからステージ２０の外周側に向かって延びることとして説明したが、図１６に示すように、先に図１から図１３を参照して説明した実施形態の様にスライド用溝２２ａの底面２２ａ’に続いて傾斜面２２ｂを設け、段部２２ｆは傾斜面２２ｂからステージ２０の外周側に向かって延びることとしても良い。この場合、傾斜面２２ｂの密着面２２に対する角度は、エッジ２２ｄと段部２２ｆの外周側端２２ｇとを含む面の密着面２２に対する角度γよりも大きな角度となっている。 In the present embodiment described above, the step portion 22f has been described as extending from the flat surface 22e substantially perpendicular to the contact surface 22 toward the outer peripheral side of the stage 20, but as shown in FIG. As in the embodiment described with reference to FIG. 13, an inclined surface 22 b is provided following the bottom surface 22 a ′ of the sliding groove 22 a, and the stepped portion 22 f may extend from the inclined surface 22 b toward the outer peripheral side of the stage 20. . In this case, the angle of the inclined surface 22b with respect to the contact surface 22 is larger than the angle γ with respect to the contact surface 22 of the surface including the edge 22d and the outer peripheral end 22g of the step portion 22f.

Claims (6)

  1. 　保持シートに貼り付けられた半導体ダイをピックアップする半導体ダイのピックアップ装置であって、
    　保持シートの半導体ダイが貼り付けられている面と反対側の面に密着する密着面を含む円筒形のステージと、
    　密着面に設けられ、ピックアップする半導体ダイと略同一幅でステージの内周側から外周側に向かって直線状に延びる吸引開口と、
    　吸引開口の幅と略同一幅で、吸引開口を閉じる側の先端が密着面から進出自在となるようにステージに設けられ、密着面に沿ってスライドして吸引開口を開閉し、蓋の先端を密着面から進出させた際に、蓋の保持シートを押し上げる面が蓋の先端側から蓋が開く側の後端側に向かって下向きに傾斜する蓋と、
    　密着面から蓋の厚さだけ凹み、蓋と略同一幅で、蓋が開く側の吸引開口の端から、ステージ外周の円筒面にかからない位置で蓋が吸引開口を閉じた状態での蓋の後端の位置よりもステージ内周側の位置まで、ステージ外周面に向かって延びるスライド用溝と、
    　ステージ外周側端のスライド用溝の底面から密着面と反対側に向かって延びる傾斜面と、
    　半導体ダイを吸着するコレットと、を備え、
    　半導体ダイをピックアップする際に、蓋の先端を密着面から進出させ、保持シートと半導体ダイとを押し上げると共に、蓋の保持シートを押し上げる面と反対側の面をスライド用溝の底面と傾斜面とのエッジに接触させながら蓋をスライドさせて吸引開口を順次開き、開いた吸引開口に保持シートを順次吸引させてピックアップする半導体ダイから保持シートを順次引き剥がすと共にピックアップする半導体ダイの直上で待機しているコレットに半導体ダイを順次吸着させること、
    　を特徴とする半導体ダイのピックアップ装置。     A semiconductor die pick-up device for picking up a semiconductor die attached to a holding sheet,
    A cylindrical stage including a close contact surface that is in close contact with the surface opposite to the surface on which the semiconductor die of the holding sheet is attached;
    A suction opening provided on the contact surface and extending in a straight line from the inner peripheral side of the stage to the outer peripheral side with substantially the same width as the semiconductor die to be picked up;
    It is provided on the stage so that the tip on the side that closes the suction opening can be advanced from the contact surface, and the slide opening is opened and closed by opening and closing the suction opening. A lid in which the surface that pushes up the holding sheet of the lid is inclined downward from the front end side of the lid toward the rear end side of the lid opening side when advanced from the contact surface;
    After the lid with the lid closed with the suction opening at a position that is recessed from the contact surface by the thickness of the lid, is approximately the same width as the lid, and does not cover the cylindrical surface on the outer periphery of the stage from the end of the suction opening on the side where the lid opens. A slide groove extending toward the outer peripheral surface of the stage from the end position to a position on the inner peripheral side of the stage;
    An inclined surface extending from the bottom surface of the slide groove on the outer periphery side of the stage toward the side opposite to the contact surface;
    A collet for adsorbing a semiconductor die,
    When picking up the semiconductor die, the front end of the lid is advanced from the contact surface, and the holding sheet and the semiconductor die are pushed up, and the surface on the opposite side of the lid from which the holding sheet is pushed up is the bottom surface and the inclined surface of the slide groove. Slide the lid while making contact with the edge of the opening to open the suction openings one after another. The holding sheets are sequentially sucked into the opened suction openings, and the holding sheets are sequentially peeled off from the semiconductor die to be picked up, and a standby is performed immediately above the semiconductor die to be picked up. Adsorbing semiconductor dies one after another to the collet
    A semiconductor die pick-up device.
  2. 　請求項１に記載の半導体ダイのピックアップ装置であって、
    　傾斜面の密着面に対する傾斜角度は、蓋の保持シートを押し上げる面と反対側の面の密着面に対する傾斜角度よりも大きいこと、
    　を特徴とする半導体ダイのピックアップ装置。     A semiconductor die pick-up device according to claim 1,
    The inclination angle of the inclined surface with respect to the contact surface is larger than the inclination angle with respect to the contact surface of the surface opposite to the surface that pushes up the holding sheet of the lid,
    A semiconductor die pick-up device.
  3. 　請求項１に記載の半導体ダイのピックアップ装置であって、
    　傾斜面から密着面に沿ってステージ外周面まで延びる段部を備え、
    　エッジと段部のステージ外周側端とを含む面の密着面に対する角度は、蓋の保持シートを押し上げる面と反対側の面の密着面に対する傾斜角度よりも大きいこと、
    　を特徴とする半導体ダイのピックアップ装置。     A semiconductor die pick-up device according to claim 1,
    A step portion extending from the inclined surface to the outer peripheral surface of the stage along the contact surface,
    The angle with respect to the contact surface of the surface including the edge and the stage outer peripheral side end of the step portion is larger than the inclination angle with respect to the contact surface of the surface opposite to the surface that pushes up the holding sheet of the lid,
    A semiconductor die pick-up device.
  4. 　請求項３に記載の半導体ダイのピックアップ装置であって、
    　傾斜面は、密着面に対して略直角な平面であること、
    　を特徴とする半導体ダイのピックアップ装置。     A semiconductor die pick-up device according to claim 3,
    The inclined surface is a plane substantially perpendicular to the contact surface,
    A semiconductor die pick-up device.
  5. 　請求項１に記載の半導体ダイのピックアップ装置であって、
    　吸引開口の幅方向に延びるピンが取り付けられ、ステージ内部に設けられるスライダ駆動機構によって吸引開口の延びる方向にスライドするとともに密着面に対して進退するスライダを備え、
    　蓋は、先端から吸引開口を閉じる側に張り出したアームを備え、アームを介してスライダのピンに回転自在に取り付けられていること、
    　を特徴とする半導体ダイのピックアップ装置。     A semiconductor die pick-up device according to claim 1,
    A pin that extends in the width direction of the suction opening is attached, and includes a slider that slides in the direction in which the suction opening extends by a slider drive mechanism provided inside the stage and moves forward and backward with respect to the contact surface,
    The lid is provided with an arm protruding from the tip to the side of closing the suction opening, and is attached to the slider pin via the arm,
    A semiconductor die pick-up device.
  6. 　保持シートに貼り付けられた半導体ダイをピックアップする半導体ダイのピックアップ方法であって、
    　ピックアップする半導体ダイが貼り付けられた保持シートの半導体ダイが貼り付けられている面と反対側の面に密着する密着面を含む円筒形のステージと、密着面に設けられ、ピックアップする半導体ダイと略同一幅でステージの内周側から外周側に向かって直線状に延びる吸引開口と、吸引開口の幅と略同一幅で、吸引開口を閉じる側の先端が密着面から進出自在となるようにステージに設けられ、密着面に沿ってスライドして吸引開口を開閉し、蓋の先端を密着面から進出させた際に、蓋の保持シートを押し上げる面が蓋の先端側から蓋が開く側の後端側に向かって下向きに傾斜する蓋と、密着面から蓋の厚さだけ凹み、蓋と略同一幅で、蓋が開く側の吸引開口の端から、ステージ外周の円筒面にかからない位置で蓋が吸引開口を閉じた状態での蓋の後端の位置よりもステージ内周側の位置まで、ステージ外周面に向かって延びるスライド用溝と、ステージ外周側端のスライド用溝の底面から密着面と反対側に向かって延びる傾斜面と、半導体ダイを吸着するコレットと、を備える半導体ダイのピックアップ装置を用意し、
    　閉じている状態の蓋の先端にピックアップする半導体ダイの一端を合わせ、蓋の幅方向位置と半導体ダイの幅方向位置とを合わせる位置合わせ工程と、
    　蓋の先端を密着面から進出させ、保持シートと半導体ダイとを押し上げると共に、蓋の保持シートを押し上げる面と反対側の面をスライド用溝の底面と傾斜面とのエッジに接触させながらピックアップする半導体ダイの一端側から他端側に向かって蓋をスライドさせて吸引開口を順次開き、開いた吸引開口にピックアップする半導体ダイの一端側から他端側に向かって保持シートを順次吸引させてピックアップする半導体ダイから保持シートを順次引き剥がすと共にピックアップする半導体ダイの直上で待機しているコレットに半導体ダイを一端側から他端側に向かって順次吸着させ、半導体ダイをピックアップするピックアップ工程と、
    　を有することを特徴とする半導体ダイのピックアップ方法。     A method for picking up a semiconductor die for picking up a semiconductor die attached to a holding sheet,
    A cylindrical stage including a contact surface that is in close contact with the surface opposite to the surface on which the semiconductor die is attached to the holding sheet to which the semiconductor die to be picked up is attached, and the semiconductor die that is provided on the contact surface and picks up A suction opening that extends in a straight line from the inner circumference side to the outer circumference side of the stage with substantially the same width, and a width that is substantially the same width as the suction opening so that the tip on the side that closes the suction opening can be advanced from the contact surface. The stage that is provided on the stage, slides along the close contact surface, opens and closes the suction opening, and when the front end of the lid is advanced from the close contact surface, the surface that pushes up the cover holding sheet is the side that opens from the front end side of the lid A lid that is inclined downward toward the rear end side, is recessed from the contact surface by the thickness of the lid, is approximately the same width as the lid, and does not cover the cylindrical surface on the outer periphery of the stage from the end of the suction opening on the side where the lid opens. The lid closed the suction opening In this state, the slide groove extending toward the outer peripheral surface of the stage from the position of the rear end of the lid to the position on the inner peripheral side of the stage, and from the bottom surface of the slide groove on the outer peripheral side of the stage toward the side opposite to the contact surface A semiconductor die pick-up device comprising an inclined surface that extends and a collet that adsorbs the semiconductor die is prepared.
    Aligning one end of the semiconductor die to be picked up at the tip of the lid in the closed state, and aligning the width direction position of the lid with the width direction position of the semiconductor die,
    The tip of the lid is advanced from the contact surface, and the holding sheet and the semiconductor die are pushed up, and the pickup is picked up while the surface on the opposite side of the lid pushing the holding sheet is in contact with the edge of the bottom surface of the slide groove and the inclined surface. The lid is slid from one end side to the other end side of the semiconductor die to sequentially open the suction openings, and the holding sheets are sequentially sucked from the one end side of the semiconductor die to the other end side to be picked up to the open suction opening. A pick-up step of sequentially picking up the semiconductor die by sequentially adsorbing the semiconductor die from one end side to the other end side to a collet waiting immediately above the semiconductor die to be picked up, while sequentially peeling the holding sheet from the semiconductor die to be picked up;
    A method for picking up a semiconductor die, comprising:
PCT/JP2008/064516 2008-06-30 2008-08-13 Semiconductor die pickup apparatus and semiconductor die pickup method WO2010001497A1 (en)

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JP2008169897A JP4215818B1 (en) 2008-06-30 2008-06-30 Semiconductor die pickup apparatus and pickup method

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TW201001614A (en) 2010-01-01
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JP2010010519A (en) 2010-01-14

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