WO2009156993A3 - Method for non-contact materials deposition - Google Patents

Method for non-contact materials deposition Download PDF

Info

Publication number
WO2009156993A3
WO2009156993A3 PCT/IL2009/000628 IL2009000628W WO2009156993A3 WO 2009156993 A3 WO2009156993 A3 WO 2009156993A3 IL 2009000628 W IL2009000628 W IL 2009000628W WO 2009156993 A3 WO2009156993 A3 WO 2009156993A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact materials
materials deposition
layers
section area
height
Prior art date
Application number
PCT/IL2009/000628
Other languages
French (fr)
Other versions
WO2009156993A2 (en
Inventor
Hanan Gothait
Michael Dovrat
Ofir Baharav
Axel Benichou
Original Assignee
Xjet Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xjet Ltd. filed Critical Xjet Ltd.
Priority to JP2011515730A priority Critical patent/JP2011525716A/en
Priority to EP09769799A priority patent/EP2305012B1/en
Priority to US13/001,273 priority patent/US8343869B2/en
Priority to CN2009801241695A priority patent/CN102113422A/en
Publication of WO2009156993A2 publication Critical patent/WO2009156993A2/en
Publication of WO2009156993A3 publication Critical patent/WO2009156993A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/145—Arrangement thereof
    • B41J2/155—Arrangement thereof for line printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Treatment Of Fiber Materials (AREA)

Abstract

Embodiments of the invention are directed to a method of printing lines. The method may include depositing material on a substrate from a plurality of nozzles to form a multi-layered line of a desired cross section area or a desired height by dispensing the material in at least two layers in a single scan. Each layer may be printed by different nozzles and the number of layers in the line is determined based on the desired cross section area or height.
PCT/IL2009/000628 2008-06-24 2009-06-24 Method and system for non-contact materials deposition WO2009156993A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011515730A JP2011525716A (en) 2008-06-24 2009-06-24 Method and system for non-contact material deposition
EP09769799A EP2305012B1 (en) 2008-06-24 2009-06-24 Method and system for non-contact materials deposition
US13/001,273 US8343869B2 (en) 2008-06-24 2009-06-24 Method for non-contact materials deposition
CN2009801241695A CN102113422A (en) 2008-06-24 2009-06-24 Method and system for non-contact materials deposition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US7514708P 2008-06-24 2008-06-24
US61/075,147 2008-06-24
US11865308P 2008-11-30 2008-11-30
US61/118,653 2008-11-30

Publications (2)

Publication Number Publication Date
WO2009156993A2 WO2009156993A2 (en) 2009-12-30
WO2009156993A3 true WO2009156993A3 (en) 2010-04-01

Family

ID=41173297

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2009/000628 WO2009156993A2 (en) 2008-06-24 2009-06-24 Method and system for non-contact materials deposition

Country Status (7)

Country Link
US (1) US8343869B2 (en)
EP (1) EP2305012B1 (en)
JP (1) JP2011525716A (en)
KR (1) KR20110036815A (en)
CN (1) CN102113422A (en)
TW (1) TW201016474A (en)
WO (1) WO2009156993A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100066779A1 (en) 2006-11-28 2010-03-18 Hanan Gothait Method and system for nozzle compensation in non-contact material deposition
TW201029850A (en) 2008-11-30 2010-08-16 Xjet Ltd Method and system for applying materials on a substrate
US9340016B2 (en) 2009-05-18 2016-05-17 Xjet Ltd Method and device for printing on heated substrates
WO2011138729A2 (en) 2010-05-02 2011-11-10 Xjet Ltd. Printing system with self-purge, sediment prevention and fumes removal arrangements
CN103097141A (en) 2010-07-22 2013-05-08 迅捷有限公司 Printing head nozzle evaluation
KR101722294B1 (en) 2010-10-18 2017-04-11 엑스제트 엘티디. Inkjet head storage and cleaning
EP2856510A4 (en) * 2012-05-28 2016-03-23 Xjet Ltd Solar cell electrically conductive structure and method
US9533497B2 (en) * 2012-07-02 2017-01-03 Xerox Corporation Systems and methods for printing raised markings on documents
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
KR20230169406A (en) 2012-12-27 2023-12-15 카티바, 인크. Techniques for print ink volume control to deposit fluids within precise tolerances
EP3058037B1 (en) 2013-10-17 2020-07-22 Xjet Ltd. Tungsten-carbide/cobalt ink composition for 3d inkjet printing
KR102007618B1 (en) 2013-12-12 2019-10-21 카티바, 인크. Ink-based layer fabrication using halftoning to control thickness
CN106457299B (en) * 2014-03-19 2020-01-03 实用光有限公司 Printing high aspect ratio patterns
JPWO2017221652A1 (en) * 2016-06-21 2018-11-01 株式会社デンソー ELECTRIC VEHICLE COMPONENT, METHOD FOR PRODUCING ELECTRIC EQUIPMENT FOR VEHICLE, CONDUCTIVE CIRCUIT FORMING DEVICE
WO2023278312A1 (en) * 2021-07-02 2023-01-05 Sion Power Corporation Systems and methods for roll-to-roll deposition of electrochemical cell components and other articles

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003318133A (en) * 2002-04-22 2003-11-07 Seiko Epson Corp Forming method for film pattern, film pattern forming device, conductive film wiring method, mount structure of semiconductor chip, semiconductor apparatus, light emission device, electronic optical apparatus, electronic apparatus, and non-contact card medium
US20050037614A1 (en) * 2003-08-15 2005-02-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing wiring and method for manufacturing semiconductor device
US20060045962A1 (en) * 2004-08-25 2006-03-02 Hirotsuna Miura Method of manufacturing multi-layered wiring board, electronic device, and electronic apparatus
EP1737284A2 (en) * 2005-06-22 2006-12-27 Canon Kabushiki Kaisha Circuit pattern forming method, circuit pattern forming device and printed circuit board
US20070030326A1 (en) * 2003-01-16 2007-02-08 Silverbrook Research Pty Ltd Printer system for developing a three-dimensional structure
JP2008073647A (en) * 2006-09-22 2008-04-03 Fujifilm Corp Liquid discharge apparatus and method of forming resist pattern

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010035129A1 (en) * 2000-03-08 2001-11-01 Mohan Chandra Metal grid lines on solar cells using plasma spraying techniques
JP4039035B2 (en) * 2001-10-31 2008-01-30 セイコーエプソン株式会社 Line pattern forming method, line pattern, electro-optical device, electronic device, non-contact card medium
JP2004342716A (en) * 2003-05-14 2004-12-02 Konica Minolta Holdings Inc Method and apparatus for forming bump
JP4619060B2 (en) * 2003-08-15 2011-01-26 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP2006035184A (en) * 2004-07-30 2006-02-09 Seiko Epson Corp Method and apparatus for applying droplet, electrooptical device, and electronic equipment
JP2006073561A (en) * 2004-08-31 2006-03-16 Seiko Epson Corp Circuit board
JP2006108506A (en) * 2004-10-07 2006-04-20 Seiko Epson Corp Film pattern forming method and substrate manufacturing method
JP4507893B2 (en) * 2005-01-21 2010-07-21 リコープリンティングシステムズ株式会社 Wiring board
EP2064000B1 (en) * 2006-09-22 2018-01-17 Alpha Assembly Solutions Inc. Solvent systems for metals and inks

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003318133A (en) * 2002-04-22 2003-11-07 Seiko Epson Corp Forming method for film pattern, film pattern forming device, conductive film wiring method, mount structure of semiconductor chip, semiconductor apparatus, light emission device, electronic optical apparatus, electronic apparatus, and non-contact card medium
US20070030326A1 (en) * 2003-01-16 2007-02-08 Silverbrook Research Pty Ltd Printer system for developing a three-dimensional structure
US20050037614A1 (en) * 2003-08-15 2005-02-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing wiring and method for manufacturing semiconductor device
US20060045962A1 (en) * 2004-08-25 2006-03-02 Hirotsuna Miura Method of manufacturing multi-layered wiring board, electronic device, and electronic apparatus
EP1737284A2 (en) * 2005-06-22 2006-12-27 Canon Kabushiki Kaisha Circuit pattern forming method, circuit pattern forming device and printed circuit board
JP2008073647A (en) * 2006-09-22 2008-04-03 Fujifilm Corp Liquid discharge apparatus and method of forming resist pattern
US20080158278A1 (en) * 2006-09-22 2008-07-03 Fujifilm Corporation Liquid ejection apparatus and resist pattern forming method

Also Published As

Publication number Publication date
US20110151665A1 (en) 2011-06-23
EP2305012B1 (en) 2012-12-05
WO2009156993A2 (en) 2009-12-30
KR20110036815A (en) 2011-04-11
CN102113422A (en) 2011-06-29
JP2011525716A (en) 2011-09-22
US8343869B2 (en) 2013-01-01
EP2305012A2 (en) 2011-04-06
TW201016474A (en) 2010-05-01

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