WO2009155907A3 - Wärmeabfuhr für ein konversionselement und entsprechendes leuchtmittel - Google Patents

Wärmeabfuhr für ein konversionselement und entsprechendes leuchtmittel Download PDF

Info

Publication number
WO2009155907A3
WO2009155907A3 PCT/DE2009/000883 DE2009000883W WO2009155907A3 WO 2009155907 A3 WO2009155907 A3 WO 2009155907A3 DE 2009000883 W DE2009000883 W DE 2009000883W WO 2009155907 A3 WO2009155907 A3 WO 2009155907A3
Authority
WO
WIPO (PCT)
Prior art keywords
conversion element
heat
conversion
heat dissipation
lighting device
Prior art date
Application number
PCT/DE2009/000883
Other languages
English (en)
French (fr)
Other versions
WO2009155907A2 (de
Inventor
Frank Baumann
Kirstin Petersen
Sönke TAUTZ
Alfred Lell
Uwe Strauss
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2009155907A2 publication Critical patent/WO2009155907A2/de
Publication of WO2009155907A3 publication Critical patent/WO2009155907A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

In mindestens einer Ausführungsform des Konversionselements (1) ist dieses mit einem lichtdurchlässigen Matrixmaterial (2) gestaltet, in dem Wärmeleitpartikel (4) und mindestens ein Konversionsmittel (3) eingebettet sind, wobei das Konversionsmittel (3) dazu ausgestaltet ist, Licht einer Wellenlänge zumindest zum Teil in Licht einer anderen Wellenlänge umzuwandeln. Durch das Konversionsmittel (3) und/oder die Wärmeleitpartikel (4) sind Wärmeleitpfade P im Konversionselement (1) gebildet. Über solche, durch Wärmeleitpartikel (4) und Konversionsmittel (3) gebildete Wärmeleitpfade (P) kann Wärme aus dem Konversionselement (1) effizient abgeführt werden. Hierdurch erhöht sich die Konversionseffizienz des Konversionselements.
PCT/DE2009/000883 2008-06-25 2009-06-25 Konversionselement und leuchtmittel WO2009155907A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008030253.8A DE102008030253B4 (de) 2008-06-25 2008-06-25 Konversionselement und Leuchtmittel
DE102008030253.8 2008-06-25

Publications (2)

Publication Number Publication Date
WO2009155907A2 WO2009155907A2 (de) 2009-12-30
WO2009155907A3 true WO2009155907A3 (de) 2010-03-18

Family

ID=41210474

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/000883 WO2009155907A2 (de) 2008-06-25 2009-06-25 Konversionselement und leuchtmittel

Country Status (2)

Country Link
DE (1) DE102008030253B4 (de)
WO (1) WO2009155907A2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8203161B2 (en) * 2009-11-23 2012-06-19 Koninklijke Philips Electronics N.V. Wavelength converted semiconductor light emitting device
DE102010034915A1 (de) * 2010-08-20 2012-02-23 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Streukörper
DE102010034913B4 (de) 2010-08-20 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlung emittierendes Bauelement und Verfahren zur Herstellung des Strahlung emittierenden Bauelements
DE102010061848B4 (de) * 2010-11-24 2022-11-03 Lumitech Patentverwertung Gmbh LED-Modul mit vorgefertigtem Element
DE102011009369A1 (de) * 2011-01-25 2012-07-26 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
DE102011017633A1 (de) * 2011-04-27 2012-10-31 Osram Ag Verfahren zum Bilden einer Leuchtstoffanordnung und dazugehörige Leuchtstoffanordnung
DE102011100710A1 (de) 2011-05-06 2012-11-08 Osram Opto Semiconductors Gmbh Konversionselement für Leuchtdioden und Herstellungsverfahren
DE102012101663B4 (de) 2012-02-29 2019-12-24 Osram Opto Semiconductors Gmbh Konversionselement, Leuchtmittel und Verfahren zur Herstellung eines Konversionselements
DE102012005658B4 (de) * 2012-03-22 2013-10-24 Schott Ag Weißlichterzeugung
DE102012108828A1 (de) * 2012-09-19 2014-03-20 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, optisches Element und deren Herstellungsverfahren
DE102013103416A1 (de) * 2013-04-05 2014-10-23 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierende Baugruppe und Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe
KR102071463B1 (ko) 2013-04-08 2020-01-30 루미리즈 홀딩 비.브이. 형광체 변환 층에 높은 열 전도도 입자를 갖는 led 및 그 제조 방법
DE102016119739A1 (de) * 2016-10-17 2018-04-19 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102021130998A1 (de) * 2021-11-25 2023-05-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische leuchtvorrichtung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150818A1 (en) * 1999-05-17 2004-08-05 Armstrong Robert L. Optical devices and methods employing nanoparticles, microcavities, and semicontinuous metal films
US6867542B1 (en) * 2000-03-29 2005-03-15 General Electric Company Floating chip photonic device and method of manufacture
EP1605028A1 (de) * 2003-03-13 2005-12-14 Nichia Corporation Lichtemittierender film, lumineszierende vorrichtung, verfahren zur herstellung eines lichtemittierenden films und verfahren zur herstellung einer lumineszierenden vorrichtung
WO2006041178A2 (en) * 2004-10-13 2006-04-20 Matsushita Electric Industrial Co., Ltd. Luminescent light source, method for manufacturing the same, and light-emitting apparatus
US7196354B1 (en) * 2005-09-29 2007-03-27 Luminus Devices, Inc. Wavelength-converting light-emitting devices
WO2007073393A2 (en) * 2005-02-16 2007-06-28 Georgia Tech Research Corporation Composite materials having low filler percolation thresholds and methods of controlling filler interconnectivity
US20070194709A1 (en) * 2003-01-10 2007-08-23 Toyoda Gosei Co., Ltd. Light emitting device
US20080054280A1 (en) * 2006-09-06 2008-03-06 Gelcore Llc Light emitting packages and methods of making same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140185A (ja) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd 発光装置
JP4931628B2 (ja) * 2006-03-09 2012-05-16 セイコーインスツル株式会社 照明装置及びこれを備える表示装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150818A1 (en) * 1999-05-17 2004-08-05 Armstrong Robert L. Optical devices and methods employing nanoparticles, microcavities, and semicontinuous metal films
US6867542B1 (en) * 2000-03-29 2005-03-15 General Electric Company Floating chip photonic device and method of manufacture
US20070194709A1 (en) * 2003-01-10 2007-08-23 Toyoda Gosei Co., Ltd. Light emitting device
EP1605028A1 (de) * 2003-03-13 2005-12-14 Nichia Corporation Lichtemittierender film, lumineszierende vorrichtung, verfahren zur herstellung eines lichtemittierenden films und verfahren zur herstellung einer lumineszierenden vorrichtung
WO2006041178A2 (en) * 2004-10-13 2006-04-20 Matsushita Electric Industrial Co., Ltd. Luminescent light source, method for manufacturing the same, and light-emitting apparatus
WO2007073393A2 (en) * 2005-02-16 2007-06-28 Georgia Tech Research Corporation Composite materials having low filler percolation thresholds and methods of controlling filler interconnectivity
US7196354B1 (en) * 2005-09-29 2007-03-27 Luminus Devices, Inc. Wavelength-converting light-emitting devices
US20080054280A1 (en) * 2006-09-06 2008-03-06 Gelcore Llc Light emitting packages and methods of making same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SELLA C ET AL: "R.F.-sputtered luminescent rare earth and yttrium oxysulphide films", THIN SOLID FILMS, ELSEVIER-SEQUOIA S.A. LAUSANNE, CH, vol. 90, no. 2, 16 April 1982 (1982-04-16), pages 181 - 185, XP025731221, ISSN: 0040-6090, [retrieved on 19820416] *

Also Published As

Publication number Publication date
WO2009155907A2 (de) 2009-12-30
DE102008030253A1 (de) 2009-12-31
DE102008030253B4 (de) 2020-02-20

Similar Documents

Publication Publication Date Title
WO2009155907A3 (de) Wärmeabfuhr für ein konversionselement und entsprechendes leuchtmittel
EP1932188A4 (de) Led mit lichtdurchlässigem kühlkörper
WO2011109086A3 (en) Solid state lamp with thermal spreading elements and light directing optics
EP1969647A4 (de) Leuchtdiode (led) mit hohem wirkungsgrad
EP2012370A4 (de) Verfahren zum herstellen eines halbleiter-leuchtelements, halbleiter-leuchtelement und mit dem halbleiter-leuchtelement ausgestattete lampe
EP1898464A4 (de) Kühlkörper für ein leistungsmodul
DE602007005054D1 (de) Hochleistungs-LED-Lampe mit verstärkter Wärmeableitung
BRPI0820090A2 (pt) Lâmpada de diodo emissor de luz, e, método e sistema de administração de potência de lâmpada de diodo emissor de luz
EP1949463A4 (de) Leuchtdiode (led) mit hohem lichtextraktions-wirkungsgrad
DK1880459T3 (da) Effektstyresystem til vindmøllepark
WO2008011723A3 (en) Illumination module with similar heat and light propagation directions
WO2010051985A8 (de) Led-leuchte
EP1905102A4 (de) Leuchtbauelement für wechselstrombetrieb
EP2191198A4 (de) Led-leuchte mit kühlkörperoptik
ZA200609298B (en) High efficiency thermal engine
HK1130564A1 (en) Semiconductor module for power generation or light emission
GB0513958D0 (en) Optoelectronic assembly with heat sink
ITNA20080011A1 (it) Lampada a led di potenza per lanterne semaforiche.
TW200745522A (en) Light sensor with integrated temperature sensor functionality
GB0712090D0 (en) Solar rechargeable light emitting diode lights
GB2449595B (en) Group III nitride semiconductor light emitting device and method for producing the same
HK1155314A1 (en) Led light output linearization led
GB2439745B (en) Street light with heat dissipating device
WO2012041480A3 (en) Lighting system
WO2012064900A3 (en) Light modules connectable using heat pipes

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09768831

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 09768831

Country of ref document: EP

Kind code of ref document: A2