WO2009155202A2 - Debris capture and removal for laser micromachining - Google Patents
Debris capture and removal for laser micromachining Download PDFInfo
- Publication number
- WO2009155202A2 WO2009155202A2 PCT/US2009/047062 US2009047062W WO2009155202A2 WO 2009155202 A2 WO2009155202 A2 WO 2009155202A2 US 2009047062 W US2009047062 W US 2009047062W WO 2009155202 A2 WO2009155202 A2 WO 2009155202A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- debris
- barrier
- specimen
- cutting head
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
Definitions
- the system disclosed addresses management of debris generated by laser processing and, more specifically, by laser micromachining of small-scale target specimen features.
- Remaining debris particles are ejected at high velocity (several km/sec) along trajectories perpendicular to the kerf, both axially of (i.e., normal to) the target surface and parallel to the target surface of the target specimen undergoing machining.
- the sizes of these particles range from sub-millimeter to sub-micron, and the particle temperatures are high, typically at least several hundred degrees centigrade.
- the laser system becomes polluted with axial debris and requires daily cleaning and maintenance.
- surface debris may block the laser beam cutting path, reducing ablation efficiency.
- a “sandwich” technique may be used that entails covering both surfaces of the target with a protective layer, drilling through both the protective coverings and the target material, and later peeling off the coverings and surface debris together (Tuan A. Mai, “Toward Debris-free Laser Micromachining,” Industrial Laser Solutions, 23:1 , 2008).
- Another similar technique entails coating a surface with a benign protective layer (e.g., photoresist) that traps debris and can be dissolved after laser processing.
- a benign protective layer e.g., photoresist
- Yet another technique entails cutting in the presence of a water spray or a water film bathing the target surface; however, the presence of liquid tends to result in mist or condensation affecting the laser optics (Sun and Longtin, "Ultrafast Laser Micromachining with a Liquid Film,” Proc. ICALEO, 2001 ).
- Brushes have been used as debris management devices in related industries, such as printed circuit board (PCB) milling that uses end mills to drill macroscopic holes in a plastic PCB backplane to enable routing of the printed circuits.
- PCB printed circuit board
- Some designs incorporate vacuum exhaust, but the systems currently implementing these designs do not fully encompass the cutting area. A considerable amount of material may, therefore, escape from the debris containment system.
- an external vacuum hose may be attached to the back of the circuit board to enable intermittent application of vacuum pressure to remove the board material as it is drilled out.
- a brush may surround the drill bit, or "end mill,” and associated end mill spindle, and a brush housing that supports the brush may be equipped with a vacuum port to exhaust debris generated by drilling the board material.
- An example of such PCB milling equipment is a Final Touch 101 depaneling router system, available from Precision PCB Products of Irvine, CA.
- a method of capturing and removing debris created on a target side of a target specimen undergoing laser micromachining entails providing a barrier that encompasses the immediate volume surrounding a laser cutting head output nozzle to contain the ejected debris and extracting the debris through a vacuum outlet.
- a preferred system implementing this approach to debris management includes a barrier in the form of a flexible fiber brush configured in the shape of a ring and positioned to trap ejected debris within a localized area surrounding a target area where the laser beam is incident on the target specimen.
- the target specimen is preferably made of metal, and the ring brush is made of material that is robust to molten metals.
- the perimeter of the ring brush is positioned to encompass the axis of propagation of the laser beam, and the distance from the propagation axis to the ring brush perimeter is made sufficiently large to allow the molten debris to cool before it encounters the brush.
- An inert gas directed at a high flow rate along the target surface of the metal specimen carries ejected surface debris trapped in the ring brush toward a vacuum outlet.
- the disclosed system contains ejected surface debris and thereby enables automatic capture and disposal of the surface debris and the axial debris produced by the laser micromachining of the target specimen.
- the flexible fiber brush material sustains temperatures of up to at least several hundred degrees and does not impart damage on contact with the target surface.
- Standard laser-based via drilling equipment may be retrofitted with, or re-designed to accommodate, the components necessary to provide the surface gas flow, debris containment, and vacuum exhaust.
- Fig. 1 is a cross-sectional view of a laser cutting head and debris management components that include a ring-shaped flexible fiber brush skirt positioned to capture debris generated by laser micromachining a target specimen.
- Fig. 2 is a fragmentary isometric view of the laser cutting head and debris management components including the flexible fiber ring brush of Fig. 1.
- Fig. 3 is a replica of Fig. 1 but is annotated to indicate flow paths of cutting gas and ejection paths of debris generated by laser micromachining of the target specimen.
- Figs. 1-3 show a laser cutting head 90 of a laser micromachining system.
- Laser cutting head 90 includes laser micromachining-generated debris management (i.e., containment and removal) components 100 associated with a laser focusing lens assembly 102 and a laser cutting head alignment assembly 104 that are adjoined as a unitary structure.
- Lens assembly 102 includes light beam focusing optical components 106 (shown in Figs. 1 and 3 collectively as a single lens component), and cutting head alignment assembly 104 includes at its bottom end a nozzle and purge gas mount 108 to which a laser beam and gas flow output nozzle 110 is affixed.
- a debris removal collar 112 supports cutting head alignment assembly 104 and nozzle and purge gas mount 108.
- Optical components 106 of lens assembly 102 are positioned safely behind a protective debris window 114 set and sealed by an O-ring 116 in a recess 118 in the top end of nozzle and purge gas mount 108, where it is adjoined with cutting head alignment assembly 104.
- a laser beam 120 emitted by a laser source propagates along a beam propagation and cutting head gas flow common axis 122 through lens assembly 102 and output nozzle 110 of cutting head alignment assembly 104.
- Laser beam 120 is focused by lens assembly 102 and directed by cutting head alignment assembly 104 for incidence on a target surface 124 of a target specimen 126 that is secured to a chuck 128.
- Cutting head alignment assembly 104 is configured for lateral positioning of common axis 122 by a three-point adjustment relative to debris removal collar 112.
- a purge gas inlet 130 admits into a conically shaped gas pressure chamber 132 of nozzle and purge gas mount 108 high pressure inert cutting head gas as laser beam 120 propagates through gas pressure chamber 132.
- Laser beam 120 propagates and high pressure cutting head gas flows through output nozzle 110 to, respectively, cut material from target specimen 126 and eject debris material from a kerf formed in the region of material cut from target specimen 126.
- IR infrared
- target specimen 126 of metal material
- suitable target materials include polyvinyl alcohol-coated metal; glass; ceramics; and any number of composite materials, including KEVLAR and carbon fiber.
- Debris ejected from the kerf may be categorized as axial debris 138 and surface debris 140 having trajectories that are substantially perpendicular and substantially parallel, respectively, to target surface 124 of metal specimen 126.
- Two challenges associated with capturing such ejected debris include a wide range of different topographies (i.e, hills, valleys, and canyons) of target surface 124 that can trap surface debris 140 and the high temperature of molten metal debris ejected.
- a change in topography over target surface 124 can be, for example, a five mm stair step presented by a clamp 142 holding target specimen 126 in place against chuck 128.
- a preferred embodiment of debris management components 100 includes a flexible fiber brush skirt 148 in the shape of a ring functioning as a barrier that captures micromachining debris by encompassing as much space as possible within an internal volume 150 surrounding output nozzle 110.
- ring brush 148 is configured as an annulus centered around common axis 122 and having a mean radius 152 at target surface 124. In general, however, ring brush 148 may be configured in the shape of an oval or a straight-sided polygon. Ring brush 148 downwardly depends from and, for ease of replacement, is releasably mounted to a barrier or brush mounting plate 154. [0019] Ring brush 148 appears in cross section in Figs.
- Ring brush 148 which traps ejected surface debris 140 at near molten temperatures, is made of flexible fiber material to ensure it does not scratch or damage components undergoing micromachining. Ring brush 148 is therefore preferably fashioned from a fiber having a very high melting temperature, such as polytetrafluoroethylene (PTFE) "Teflon®" material, which melts at 680 F, or carbon fiber, which melts at 1500 F.
- PTFE polytetrafluoroethylene
- Ring brush 148 has mean radius 152 of a value setting an effective perimeter distance and an internal volume boundary that allow ejected surface debris 140 to cool to a temperature below the melting temperature of ring brush 148 before its bristles trap ejected surface debris 140.
- An alternative ring brush 148 exhibiting longer lifetime is constructed with hybrid bristles in the form of concentric ring members that include an outer ring of PTFE bristles and an inner ring of carbon fiber.
- the outer ring of PTFE bristles has better resilience and memory, but it melts when laser cutting head 90 is in continuous production use.
- the inner ring of carbon fiber does not melt; therefore, the outer PTFE bristles function as a support mechanism for the inner carbon fiber bristles, which protect the PTFE bristles from the molten debris.
- a vacuum outlet port 156 of a fluid passageway 158 formed in debris removal collar 112 is in fluid communication with internal volume 150 to enable continuous evacuation by a remote vacuum pump (not shown) of surface debris 140 generated by the cutting operation of laser beam 110 and contained within internal volume 150 by ring brush 148.
- Fig. 2 is a three-dimensional rendering of laser cutting head 90, as it appears when viewed upwardly from metal specimen 126.
- debris management components 100 include brush mounting plate 154 to which ring brush 148 is mounted and vacuum outlet port 156 fitted into fluid passageway 158 formed in debris removal collar 112.
- Debris management components 100 are retrofitted to a standard laser-based printed circuit board via drilling system, such as a Model 5500 system manufactured by Electro Scientific Industries, Inc., the assignee of this patent application.
- the Model 5500 system is retrofitted with laser heads emitting IR laser beams to cut metal specimen 126.
- Ring brush 148 is shown mounted to brush mounting plate 154 fixed on the bottom surface of nozzle and purge gas mount 108, and vacuum outlet port 156 is shown emerging from debris removal collar 112.
- Ring brush 148 has a perimeter 200, which need not be completely closed but is preferably substantially continuous, with points along perimeter 200 being located sufficiently far away from nozzle 110 to allow ejected particles to cool before making contact with ring brush 148.
- a small gap 206 in ring brush 148 provides to a gas conduit or hose 208 (Figs. 1 and 3) access to purge gas inlet 130.
- Hose 206 and the bristles of ring brush 148 that contact the outer surface of hose 208 extending through gap 206 cooperate to provide a substantially closed barrier in that it prevents escape of surface debris 140 from internal volume 150.
- Fig. 2 also shows, included within laser cutting head 90, components of a vision alignment subsystem 210 to which are mounted several sets of numerous LEDs 215 (only eight of which shown for simplicity) used to illuminate the micromachining operation.
- Fig. 3 is a replica of Fig. 1 but is annotated to indicate, using arrows, paths of cutting head gas flow, exhaust gas flow, and surface gas flow through various cavities within laser cutting head 90.
- a jet of cutting head inert gas 298 introduced into gas inlet 130 is confined within conically shaped gas pressure chamber 132, providing a substantially vertical downwardly directed cutting head gas flow 300 that issues from output nozzle 110.
- Cutting head gas flow 300 issuing from output nozzle 110 includes a portion of gas escaping into internal volume 150 and a portion of gas flowing through the kerf formed in target specimen 126 during micromachining.
- the portion of cutting head gas escaping into internal volume 150 is extracted through fluid passageway 158 and out of outlet port 156 by the remote vacuum pump, thus forming along target surface 124 a generally horizontal surface gas flow 305 that encounters in its path surface debris 140.
- Specifying the rate of surface gas flow 305 to be equal to or greater than the rate of cutting head gas flow 300 directs primarily toward vacuum outlet port 156 the path of ejected surface debris 140 confined within internal volume 150.
- a preferred rate of surface gas flow 305 is about 1.25 times the rate of cutting head gas flow 300 because it facilitates connection of hose 208 of workable diameter to purge gas inlet 130.
- surface gas flow 305 includes a mixture of inert cutting head gas and ambient air from the space within internal volume 150.
- ring brush 148 confines surface gas flow 305 and intensifies the action of negative pressure within internal volume 150, thereby increasing vacuum efficiency.
- encompassing internal volume 150 by ring brush 148 and extracting about 1.25 times the cutting head gas flow 300 enables automatic capture and disposal of the axial debris 138 and ejected surface debris 140 generated by the laser micromachining process.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011514712A JP2011524811A (en) | 2008-06-18 | 2009-06-11 | Method for capturing and removing debris in laser micromachining |
| CN2009801298439A CN102112267A (en) | 2008-06-18 | 2009-06-11 | Debris capture and removal for laser micromachining |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7367208P | 2008-06-18 | 2008-06-18 | |
| US61/073,672 | 2008-06-18 | ||
| US12/326,694 US8207472B2 (en) | 2008-06-18 | 2008-12-02 | Debris capture and removal for laser micromachining |
| US12/326,694 | 2008-12-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2009155202A2 true WO2009155202A2 (en) | 2009-12-23 |
| WO2009155202A3 WO2009155202A3 (en) | 2010-05-06 |
Family
ID=41430166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2009/047062 Ceased WO2009155202A2 (en) | 2008-06-18 | 2009-06-11 | Debris capture and removal for laser micromachining |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8207472B2 (en) |
| JP (1) | JP2011524811A (en) |
| KR (1) | KR20110038627A (en) |
| CN (1) | CN102112267A (en) |
| TW (1) | TW201002461A (en) |
| WO (1) | WO2009155202A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102233482A (en) * | 2010-04-27 | 2011-11-09 | 上海天斡实业有限公司 | Laser cutting process for aluminum foils |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2393628B1 (en) * | 2009-02-03 | 2017-06-21 | Abbott Cardiovascular Systems Inc. | Improved laser cutting system |
| US8536484B2 (en) * | 2011-02-02 | 2013-09-17 | Great Computer Corporation | Laser engravers with a masking mechanism |
| CN103370774B (en) * | 2011-02-21 | 2016-08-24 | 应用材料公司 | Peripheral Laminar Airflow Distribution in Laser Processing Systems |
| US9259802B2 (en) | 2012-07-26 | 2016-02-16 | Electro Scientific Industries, Inc. | Method and apparatus for collecting material produced by processing workpieces |
| CN102790351B (en) * | 2012-08-02 | 2014-10-29 | 山东能源机械集团大族再制造有限公司 | Semiconductor laser |
| US8969760B2 (en) | 2012-09-14 | 2015-03-03 | General Electric Company | System and method for manufacturing an airfoil |
| US8993923B2 (en) | 2012-09-14 | 2015-03-31 | General Electric Company | System and method for manufacturing an airfoil |
| CN105074419B (en) * | 2013-02-14 | 2019-02-01 | 伊雷克托科学工业股份有限公司 | Laser Ablation Unit and Torch System for Composition Analysis Systems |
| US10285255B2 (en) | 2013-02-14 | 2019-05-07 | Elemental Scientific Lasers, Llc | Laser ablation cell and injector system for a compositional analysis system |
| CN103658984B (en) * | 2013-12-04 | 2016-04-13 | 上海交通大学 | Laser weld plasma side draught negative pressure device and laser welding system |
| US9468991B2 (en) | 2014-01-27 | 2016-10-18 | General Electric Company | Method determining hole completion |
| US9676058B2 (en) | 2014-01-27 | 2017-06-13 | General Electric Company | Method and system for detecting drilling progress in laser drilling |
| US9662743B2 (en) | 2014-01-27 | 2017-05-30 | General Electric Company | Method for drilling a hole in an airfoil |
| DE102014203576A1 (en) * | 2014-02-27 | 2015-08-27 | Trumpf Laser- Und Systemtechnik Gmbh | Laser processing head with a crossjet nozzle close to the workpiece |
| WO2016027186A1 (en) * | 2014-08-19 | 2016-02-25 | Koninklijke Philips N.V. | Sapphire collector for reducing mechanical damage during die level laser lift-off |
| CN104439715A (en) * | 2014-11-14 | 2015-03-25 | 镭射谷科技(深圳)有限公司 | Laser cutting device for transparent materials and laser cutting process applied to laser cutting device |
| US9770785B2 (en) | 2014-11-18 | 2017-09-26 | General Electric Company | System and method for forming a cooling hole in an airfoil |
| US11292081B2 (en) | 2015-01-08 | 2022-04-05 | General Electric Company | Method and system for confined laser drilling |
| US10589385B2 (en) | 2015-01-08 | 2020-03-17 | General Electric Company | Method and system for confined laser drilling |
| US9776284B2 (en) | 2015-01-22 | 2017-10-03 | General Electric Company | System and method for cutting a passage in an airfoil |
| US9945253B2 (en) * | 2015-01-29 | 2018-04-17 | Rohr, Inc. | Collecting / removing byproducts of laser ablation |
| US9962792B2 (en) | 2015-02-20 | 2018-05-08 | General Electric Company | Component repair using confined laser drilling |
| CN104759754B (en) * | 2015-04-14 | 2016-09-14 | 大族激光科技产业集团股份有限公司 | A kind of laser process equipment being applied to pipe material |
| US20160303688A1 (en) * | 2015-04-20 | 2016-10-20 | Ford Motor Company | Gas Enclosure and Particle Shield for Laser Welding System |
| JP6807334B2 (en) * | 2015-05-13 | 2021-01-06 | ルミレッズ ホールディング ベーフェー | Sapphire collector to reduce mechanical damage during die-level lift-off |
| JP6516624B2 (en) * | 2015-08-11 | 2019-05-22 | 株式会社ディスコ | Laser processing equipment |
| WO2017034807A1 (en) * | 2015-08-26 | 2017-03-02 | Electro Scientific Industries, Inc. | Laser scan sequencing and direction with respect to gas flow |
| US10672603B2 (en) * | 2015-10-23 | 2020-06-02 | Infineon Technologies Ag | System and method for removing dielectric material |
| US10525554B2 (en) * | 2015-10-30 | 2020-01-07 | Hypertherm, Inc. | Water cooling of laser components |
| DE102015224115B4 (en) * | 2015-12-02 | 2021-04-01 | Avonisys Ag | LASER BEAM PROCESSING DEVICE WITH A COUPLING DEVICE FOR COUPLING A FOCUSED LASER BEAM INTO A JET OF LIQUID |
| DK3756817T3 (en) * | 2016-01-12 | 2023-06-12 | Mestek Machinery Inc | LASER CUTTING TOOL WITH A SURROUNDING PROTECTION DEVICE WITH INTERLOCKING SWITCHES, METHOD OF MOUNTING SUCH LASER CUTTING TOOL |
| US12491577B2 (en) | 2016-01-12 | 2025-12-09 | Mestek Machinery, Inc. | Protection system for laser cutting machine |
| JP6956114B2 (en) * | 2016-05-18 | 2021-10-27 | フランクール, ゲイリーFrancoeur, Gary | Milling and laser drilling system |
| WO2018039248A1 (en) * | 2016-08-23 | 2018-03-01 | Electro Scientific Industries, Inc. | Removal of debris associated with laser drilling of transparent materials |
| TWI613028B (en) * | 2016-09-09 | 2018-02-01 | 財團法人工業技術研究院 | Laser treatment device and laser scrap removal device |
| CA2943319C (en) | 2016-09-28 | 2017-08-01 | Bombardier Transportation Gmbh | Containment device for a laser head and associated manufacturing method |
| DE102017002649B4 (en) * | 2017-03-18 | 2020-12-10 | INPRO Innovationsgesellschaft für fortgeschrittene Produktionssysteme in der Fahrzeugindustrie mbH | Freely guidable device and method for forming a freely guidable device for processing components by means of laser radiation |
| CN107180778A (en) * | 2017-07-17 | 2017-09-19 | 广东工业大学 | A kind of wafer jig for capillary processing |
| ES2703810A1 (en) * | 2017-09-12 | 2019-03-12 | Ford Motor Co | AUTOMATIC SHEET CLEANING SYSTEM FOR THE APPLICATION OF STRONG LASER WELDING (Machine-translation by Google Translate, not legally binding) |
| KR102379215B1 (en) | 2017-10-31 | 2022-03-28 | 삼성디스플레이 주식회사 | Laser apparatus |
| CN108145317B (en) * | 2018-02-11 | 2019-07-30 | 重庆鑫际激光科技有限公司 | Laser engraving machine |
| CN108015439A (en) * | 2018-02-12 | 2018-05-11 | 昆山镭崴光电科技有限公司 | A kind of radium-shine laser drilling machine and boring method flown up to vacuum |
| KR102532733B1 (en) * | 2018-02-14 | 2023-05-16 | 삼성디스플레이 주식회사 | Particle removal apparatus and laser cutting apparatus including the same |
| US11090765B2 (en) * | 2018-09-25 | 2021-08-17 | Saudi Arabian Oil Company | Laser tool for removing scaling |
| JP6852031B2 (en) * | 2018-09-26 | 2021-03-31 | 株式会社東芝 | Welding equipment and nozzle equipment |
| US11724336B2 (en) * | 2019-02-06 | 2023-08-15 | Honeywell Federal Manufacturings Technologies, Llc | Apparatus for a laser welding system |
| DE102019103659B4 (en) * | 2019-02-13 | 2023-11-30 | Bystronic Laser Ag | Gas guide, laser cutting head and laser cutting machine |
| IT201900011103A1 (en) * | 2019-07-08 | 2021-01-08 | Adige Spa | Machine for laser cutting of tubes equipped with an equipment for cleaning the tubes being processed |
| WO2021075534A1 (en) * | 2019-10-18 | 2021-04-22 | 大松精機株式会社 | Laser processing apparatus |
| DE102021122892A1 (en) * | 2021-09-03 | 2023-03-09 | Te Connectivity Germany Gmbh | Semi-finished product provided with a window for laser welding for producing an electrical contact element and method for producing an electrical contact element and electrical contact element |
| CN113828946B (en) * | 2021-11-08 | 2024-08-30 | 耀火智能科技唐山市有限公司 | Fixing system for laser cutting |
| CN115958290A (en) * | 2023-01-20 | 2023-04-14 | 通快(中国)有限公司 | Gas-assisted device for laser welding and laser welding system |
| DE102023110696A1 (en) | 2023-04-26 | 2024-10-31 | Pac Tech - Packaging Technologies Gmbh | bond head and bonding device |
| CN117483975A (en) * | 2023-12-12 | 2024-02-02 | 宏茂微电子(上海)有限公司 | A wafer laser cutting method and device |
| CN118023735B (en) * | 2024-04-15 | 2024-06-28 | 山东凯尔通电气有限公司 | Sampling device for aluminum casting test |
| CN119525774A (en) * | 2025-01-21 | 2025-02-28 | 浙江中剑科技股份有限公司 | A high-precision fiber laser metal cutting device |
| CN120115864A (en) * | 2025-04-23 | 2025-06-10 | 无锡宝德金装备科技有限公司 | A chip protection structure for silicon wafer cutting machine |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5659921A (en) * | 1996-01-22 | 1997-08-26 | Tennant Company | Sweeper with double side skirts for dust control |
| JPH10137970A (en) * | 1996-11-11 | 1998-05-26 | Amada Eng Center:Kk | Thermal machining device and its machining head |
| JP2002160087A (en) | 2000-11-29 | 2002-06-04 | Toppan Forms Co Ltd | Laser processing apparatus and method with smoke exhaust mechanism |
| JP3933398B2 (en) | 2001-01-19 | 2007-06-20 | リコーマイクロエレクトロニクス株式会社 | Beam processing equipment |
| US7038166B2 (en) * | 2003-03-18 | 2006-05-02 | Loma Linda University Medical Center | Containment plenum for laser irradiation and removal of material from a surface of a structure |
| GB2414954B (en) | 2004-06-11 | 2008-02-06 | Exitech Ltd | Process and apparatus for ablation |
| JP2007175721A (en) | 2005-12-27 | 2007-07-12 | Miyachi Technos Corp | Laser drilling method and apparatus |
-
2008
- 2008-12-02 US US12/326,694 patent/US8207472B2/en not_active Expired - Fee Related
-
2009
- 2009-06-11 KR KR1020107028623A patent/KR20110038627A/en not_active Withdrawn
- 2009-06-11 WO PCT/US2009/047062 patent/WO2009155202A2/en not_active Ceased
- 2009-06-11 CN CN2009801298439A patent/CN102112267A/en active Pending
- 2009-06-11 JP JP2011514712A patent/JP2011524811A/en not_active Withdrawn
- 2009-06-15 TW TW098119875A patent/TW201002461A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102233482A (en) * | 2010-04-27 | 2011-11-09 | 上海天斡实业有限公司 | Laser cutting process for aluminum foils |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201002461A (en) | 2010-01-16 |
| CN102112267A (en) | 2011-06-29 |
| US20090314753A1 (en) | 2009-12-24 |
| US8207472B2 (en) | 2012-06-26 |
| KR20110038627A (en) | 2011-04-14 |
| JP2011524811A (en) | 2011-09-08 |
| WO2009155202A3 (en) | 2010-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8207472B2 (en) | Debris capture and removal for laser micromachining | |
| JP6647829B2 (en) | Laser processing equipment | |
| JP5964693B2 (en) | Substance collection method and substance collection apparatus | |
| US8946588B2 (en) | Method and apparatus for improving reliability of a machining process | |
| KR101267760B1 (en) | Laser processing equipment | |
| US9085049B2 (en) | Method and system for manufacturing semiconductor device | |
| CN103212854B (en) | Laser scribe processing method | |
| EP1477265A1 (en) | Laser beam processing machine | |
| EP3330038A1 (en) | Laser cladding system and method | |
| CN103212855B (en) | Containing the laser cutting machine of coaxial water fluidic architecture | |
| EP3330035A1 (en) | Laser cladding system and method | |
| JP7102098B2 (en) | Protective shield for liquid guided laser cutting tools | |
| WO2005120763A3 (en) | Process and apparatus for ablation | |
| JP4555743B2 (en) | Laser processing head | |
| JP2004306106A (en) | Laser beam machining head | |
| CN202506983U (en) | Laser cutting machine with coaxial water-jet structure | |
| JPH11267876A (en) | Laser processing nozzle | |
| JP7668521B2 (en) | Optical equipment protection device and laser processing device | |
| US20190176263A1 (en) | Device for Protecting Laser Optics | |
| CN115846863A (en) | Laser processing head with contamination resistance | |
| JP2011125871A (en) | Laser beam machining apparatus | |
| CN105478416B (en) | The gas curtain protector and means of defence of laser cleaning | |
| JP3268052B2 (en) | Underwater laser processing equipment | |
| JPH11267874A (en) | Laser processing nozzle | |
| US6533376B1 (en) | Conditioning ink jet orifices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 200980129843.9 Country of ref document: CN |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09767512 Country of ref document: EP Kind code of ref document: A2 |
|
| ENP | Entry into the national phase |
Ref document number: 2011514712 Country of ref document: JP Kind code of ref document: A |
|
| ENP | Entry into the national phase |
Ref document number: 20107028623 Country of ref document: KR Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 09767512 Country of ref document: EP Kind code of ref document: A2 |