WO2009129534A2

WO2009129534A2 - Scintillation detector and method of making

Info

Publication number: WO2009129534A2
Application number: PCT/US2009/041122
Authority: WO
Inventors: Peter R. Menge; Brian Bacon
Original assignee: Saint-Gobain Ceramics & Plastics, Inc.
Priority date: 2008-04-18
Filing date: 2009-04-20
Publication date: 2009-10-22
Also published as: CN101990644A; US20090261253A1; CN101990644B; WO2009129534A3; US7820974B2

Abstract

A method of assembling a detector includes conditioning a rare-earth halide scintillator crystal in a sealed container, wherein the conditioning process includes heating the scintillator crystal, reducing the pressure within the sealed container for an evacuation period while heating, and flowing a purging gas through the sealed container for a flowing duration while heating. The method further includes assembling a detector comprising the scintillator crystal in an assembly environment comprising an inert gas.

Description

SCINTILLATION DETECTOR AND METHOD OF MAKING

TECHNICAL FIELD

The present disclosure is directed to scintillators, particularly ruggedized scintillation detectors for industrial applications,

BACKGROUND ART

Scintillation detectors have been employed in various industrial applications, such as the oil and gas industry for well logging Typically, such detectors have scintillator crystals made of an activated sodium iodide material that is effective for detecting gamma rays Generally, the scintillator crystals are enclosed in tubes or casings, which include a window permitting radiation induced scintillation light to pass out of the crystal package for measurement by a light-sensing device such as a photomultiplier tube The photomultiplier lube converts the light photons emitted from the crystal into electrical pulses that arc shaped and digitized by associated electronics that may be registered as counts and transmitting to analyzing equipment In terms of well logging applications, the ability to detect gamma rays makes it possible to analyze rock strata as gamma lays arc emitted from naturally occurring radioisotopes, typically of shales that surround hydrocarbon reservoirs

Desired properties of scintillation detectors include high resolution, high brightness, and robust design to withstand mechanical and thermal loads, while providing a high quality hermetic seal to isolate the sensitive internals of the detector from harsh operating environments In this latter aspect, a common practice in the utilization of scintillation detectors is to take measurements while drilling (MWD) For MWD applications, the detector should be ruggedized, that is, it should have a high shock resistance and be capable of withstanding high temperatures, while maintaining performance specifications for a reasonable lifetime

Improved scintillation properties such as resolution and brightness have been achieved by the migration from conventional crystals such as alkali halides (e g , sodium iodide), bismuth germinate (BGO), and gadolinium ortho-silicate (GSO) crystals, to rare-earth halides. However, successful integration of such materials has been found to pose numerous engineering challenges, including the development of suitable packaging and packaging techniques.

As such, there continues to be a need for improved scintillation detectors, particularly ruggedized scintillation detectors incorporating state of the art scintillator materials that can withstand the rigors of industrial applications DISCLOSURE OF INVENTION

According to a first aspect, a method of assembling a detector is disclosed that includes conditioning of a raic-caith halide scintillator crystal in a sealed container, such that the conditioning process includes the steps of healing the scintillator crystal, reducing the pressure within the scaled container for an evacuation period while heating, and flowing a purging gas through the sealed container for a flowing duration The method further includes assembling a detector comprising the scintillator crystal in an assembly environment comprising an inert gas According to one embodiment, the rare-earth halide scintillator crystal can include one of activated LaBr₃, LaCl₃, LuI₃. GdI₃. and GdBr₃.

In reference to particulars of the heating process, in one embodiment, heating includes heating at rate of at least about 0 5°C/min. and in another embodiment at a rate of not greater than about 10°C/min. In accordance with othei embodiments, the healing process further includes heating to a temperature of not less than about 100°C

With respect to the step of flowing a purging gas, in one embodiment, the purging gas is flowed while heating. The purging gas can be selected from the group of materials consisting of a halogen- containing gas, an inert gas. and a noble gas. In particular, the purging gas can include argon or CF₄ During the flowing process, the purging gas can be flowed at a rate of at least about 10 liters/min In one embodiment, the flowing duration is at least about 5 minutes

In accordance with one embodiment, during the process ofreducing the ptcssure, the pressure is not greater than about 1E-1 Ton or less. Moreover, the evacuation period can be at least about 2 minutes, or in some embodiments can be longer, such as at least about 5 minutes, or 10 minutes

In accordance with another embodiment of the first aspect, the steps ofreducing the pressure and flowing the purging gas while heating can be repeated, such as for example, at least two times, or even al least through three cycles

Additionally, in other embodiments, the process further includes holding the scintillator crystal in a holding atmosphere having the puiging gas and at a holding temperature before assembling During such a process, the holding atmosphere can have an absolute pressure of at least about 1 IO kPa Moreover, in one instance, the process further includes holding the scintillator crystal in the holding atmosphere for at least about I hour.

In other embodiments, the process further includes cleaning the scintillator crystal prior to conditioning. For example, cleaning can include removing material from an exterior surface of the scintillator crystal, such as at least about 0.25 mm of material from exposed exterior surfaces of the scintillator crystal In another embodiment, cleaning can also include polishing a surface of the scintillator crystal prior to conditioning. In one instance the polishing is completed using an abrasive, such as a ceramic powder material The cleaning process can further include cleaning detector components prior to assembling In accordance with one embodiment, cleaning of the detector components (not including the scintillator crystal) includes rinsing the detector components using an organic-based solvent, such as for example, alcohols, ketones, and acetates Additionally, in other examples, cleaning the detector components also includes healing the components to a volatilization temperature of at least about 175°C for not less than about 12 hours

In another embodiment, the assembly environment can include an inert gas, such as argon In particular, the assembly environment can include an oxygen content of not greater than 10 ppm of oxygen and not greater than 15 ppm of water vapor According to a second aspect, a scintillation detector is disclosed that includes a rare-earth halide scintillator crystal in a sealed casing, the scintillation detector having a relative light output LO(r) - ((LO₁₀₀)/(LO₀))X 100%, of not less than about 75% wherein LO₁₀₀ is the detected light output of the detector after about 100 hours of exposure at 150°C and LO₀ is the original delected light output at room temperature prior to exposure at !50°C. In other instances, the relative light output is greater, such as not less than about 80%, not less than about 85%, not less than about 90%, or even not less than about 92% after 100 hours of exposure at 150°C In one particular embodiment, the relative light output LO(r) is within a range between about 99% and about 92%, after 150 houis of exposure at 150°C

In one embodiment, the detector includes a shock absorbing member substantially surrounding the scintillator ciysial In one embodiment, the shock absorbing member comprises silicone having a total mass loss (TML) of less than about 1 0% according to ASTM E595. In another embodiment, the shock-absorbing member has a Shore A hardness within a range ol between about 40 and about 70

The detector can further include a reflector disposed between the scintillator crystal and the shock absorbing member and substantially surrounding the scintillator crystal In one particular example, the reflector is a fluorinaled polymer. Additionally, the detector can further include a sleeve substantially suπounding the shock absorbing member Moreover, the detector can be coupled to the a photomultipliei tube, via a light pipe disposed between the detector and the photomultiplicr tube. The coupling can be aided by using biasing members

In accordance with a third aspect, a scintillation detector is disclosed that includes a rare-earth hatide scintillator crystal in a sealed casing, the sealed casing comprising an atmosphere having an oxygen content of not greater than about 10 ppm and a water vapor content not greater than about 15 ppm Additionally, the scintillation delectoi has a relative light output LO(r) = ((LO₁₀₀)/(LO₀))X 100%, of not less than about 92% wherein LO₁₀₀ is the detected light output of the detector after about 100 hours of exposure at 150°C and LO₀ is the original detected light output at room temperature prior to exposure at 150°C In accordance with another aspect a scintillation detector includes a rare-earth halide scintillator crystal in a scaled casing, and has an energy resolution degtadalion factor ΔER = ((ER₁₀₀- ER₀)/(ERa))X 100%. of not greater than about 25% wherein ERioo is the energy resolution of the detector after about 100 hours of exposure at 150°C and ER₀ is the original energy resolution at room temperature prior to exposure at 150°C In particular instances, the ER(r) is not greater than about 20%. 15%. or even not greater than about 10% when measured at room temperature after 100 hours of exposure at 150°C

In accordance with another aspect, a scintillation detector includes a rare-earth halide scintillator crystal in a sealed casing, and has an absolute energy resolution of not greater than about 35 keV (5.3%) at 662 keV after exposing the detector to temperatures of not less than 150°C for not less than about 100 houts In particular embodiments, the absolute energy resolution can be less, such as not greater than about 30 keV. 25 keV.22 keV.20 keV, and particularly within a range between about 16 keV and about 20 keV at 662 keV.

BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure may be better understood, and its numerous features and advantages made apparent to those skilled in the art by referencing the accompanying drawings

FlG 1 includes an illustration of a detector according to one embodiment

FlG 2 includes a cross-sectional illustration of a scintillation detector according to one embodiment.

FIG.3 includes a flow chart illustrating a method of forming a detector in accordance with one embodiment.

FlG. 4 includes a plot illustrating the percentage of original light output as a function hours of operation at 150°C for three scintillation detectors, two of which, are in accordance with embodiments herein

FlG 5 includes a plot illustrating a percent change of energy resolution as a function hours of operation at 150°C for three scintillation detectors, two of which, are in accordance with embodiments herein.

The use of the same reference symbols in different drawings indicates similar or identical items

DESCRIPTION OF THE PREFERRED EMBODIMENT(S) Numerous innovative teachings of the present application will be described with particular reference to exemplary embodiments. However, it should be understood that this class of embodiments provides only a few examples of the many advantageous uses of lhe innovative teachings herein In general, statements made in (he specification of the present application do not necessarily limit any of the various claimed articles, systems or methods Moreover, some statements may apply to some inventive features but not to others.

A scintillation detector is disclosed that is suitable for use in extreme environments In particular, according to embodiments disclosed heicin. the detector is designed and assembled to provide notably desirable performance under challenging conditions, including MWD applications.

Rcfciring to the figures, FIG 1 illustrates a radiation detector 100 according to one embodiment. As illustrated, the radiation detector includes a photosensor 101, light pipe 103. and a scintillator housing 105. As mentioned above, the scintillator housing 105 can include a scintillator crystal 107 disposed within and substantially suπounded by a reflector 109 and a shock absorbing member 111 The scintillator crystal 107. reflector 109, and the shock absorbing member 111 are housed within a casing 113 which includes a window 115 at one end of the casing 113

In further reference to FIG. 1, the photosensor 101 can be a device capable of spectral detection and resolution, such as a photomultiplier tube or other detection device The photons emitted by the scintillator crystal 107 arc transmitted through the window 115 of the scintillator housing 105, through the light pipe 103. to the photosensor 101 As is understood in the art, the photosensor 101 provides a count of the photons detected, which provides data on the radiation detected by the scintillator crystal. The photosensor 101 can be housed within a tube or housing made of a material capable of withstanding and protecting the electronics of the photosensor 101, such as a metal, metal alloy or the like Various materials can be provided with the photosensor 101, such as within the housing, to stabilize the device during use and ensure good optical coupling between the light pipe 103 and the scintillator housing 105

As illustrated, the light pipe 103 is disposed between the photosensor 101 and the scintillator housing 105 The light pipe 103 can facilitate optical coupling between the photosensor 101 and the scintillator housing 105. According to one embodiment, the light pipe 103 can be coupled to the scintillator housing 105 and the photosensor 101 using biasing members 117 that provide a spring resiliency Such biasing members 117 can facilitate absorption of shocks to the detector 100 which can reduce false readings and counts during use of the device As will be appreciated, the biasing members can be used in conjunction with other known coupling methods such as the use of an optical gel or bonding agent.

In further reference to the scintillation detector, FIG. 2 provides an illustration of a scintillation detector 210, according to one embodiment The scintillation detector 210 includes a scintillator crystal 214 disposed within a housing 212 According to one embodiment, the scintillator crystal 214 can be an activated halidc crystal, desirably a high performance rare-earth halide. Examples of rare- earth halides include activated rare-earth bromides, chlorides and iodides, including activated L aBr_3; LaCl₃, LuI₃, GdI₃, GdBr₃. Particulai activaling species include cerium, praseodymium, europium, and ncodymium Particular scintillator compositions include cerium activated lanthanum bromide (LaBr₃:Ce). cerium activated lanthanum chloride (LaCI₃ :Ce) Other materials include cerium activated gadolinium iodide (Gdl₃:Ce). cerium activated iutclium iodide (L ul₃:Ce). and in some cases cerium bromide (CcBr₃) and cerium chloride (CeCl₃) In accordance with one particulai embodiment, the scintillator crystal 214 is activated lanthanum bromide

The scintillator crystal 214 can have various shapes, such as a rectangular shape, or a cylindrical surface 216 as illustrated including flat end faces 218 and 220 It will be appreciated that the surface finish of the scintillator crystal 214 can be sanded, polished, ground, etc., as desired

In further reference to FIG 2, the housing 212 can include a casing 222 that can be cylindrical or tubular to effectively fit the selected geometry of the scintillator crystal 214. The casing 222 can be closed at its rear end by a back cap 224 and at its front end by an optical window 226 The optical window 226 can include a material that is transmissive to scintillation light given off by the scintillator crystal 214 According to one embodiment, the optical window 226 is made of sapphire The casing 222 and back cap 224 can be made of a non-lransmissive material, such as a metal, metal alloy, or the like As such, in one embodiment the casing 222 and the back cap are made of stainless steel or aluminum The back cap 224 can be coupled to the casing 222 using a sealant, mechanical fasteners, or by a vacuum type peripheral weld. According to a particular embodiment, the casing 222 can have a recess in the casing wall to form a welding flange 230, which facilitates fitting the back cap 224 Additionally, the back cap 224 can include an opening to its outer side such that annular grooves 234 and 236 are spaced slightly inwardly from the circumferential edge Welding is performed at the outer ends of the welding flange 230 and the reduced thickness of a connecting portion 238 of welding flange 230 reduces welding heat, conducting heat away from the welding flanges to permit formation of a desired weld

The scintillation detector 210 further includes a biasing member 240, a backing plate 242, a cushion pad 244, and an end reflector 246. The biasing member 240, can include a spring, as illustrated, or other suitable resilient biasing members The biasing member 240 functions lo axially load the crystal and bias it towards the optical window 226 According to one embodiment, the biasing member 240 can be a stack of wave springs disposed crest-lo-crest as shown Other suitable biasing members can include but are not limited to, coil springs, resilient pads, pneumatic devices or even devices incorporating a semi-compiessible liquid or gei As such, suitable materials for the biasing member 240 can include a metal, a metal alloy, polymers, or the like

The backing plate 242 disperses the force of the biasing member 240 across the area of the cushion pad 244 for substantially uniform application of pressure and axial loading of the rear face 218 of the scintillator crystal 214. Alternatively, the backing plate and biasing member may be integrated into a single structure, such as in the case of an elastomeric polymer member, which may have a rigid reinforcement layer The cushion pad 244 can typically be made of a resilient material such as a polymer, particularly an elastomer, such as. a silicone rubber. The thickness of the cushion pad 244 can vary within a range of about 1 5 mm to about 8 mm for most crystals

Additionally, the cushion pad 244 can be adjacent to the end reflector 246 The end reflector 246 can include a suitable reflecting material such as a powder, like aluminum oxide (alumina) powder, or a reflective tape or foil such as. a white porous unsintered PTFE material . A porous reflective material facilitates the escape of air or gas from between the reflector film and crystal face and can avoid pockets of trapped air or gas which could prevent the end reflector 246 from being pushed by the cushion pad 244 flat against the rear end face 218 of the scintillator crystal 214 which can have a negative impact on reflectivity at the reflector-crystal interface. The reflector material may be about 025 mm thick According to particular embodiment, the reflecting material is a film that can be wrapped at least once around the crystal and possibly two or more times as desired. Alternatively, the end reflector 246 can be a metal foil disk, which conforms to the surface of the crystal end face 218 and provides suitable reflectance toward the optica) window 226

in accordance with a particular embodiment, the end reflector 246 is a preformed sheet containing a fluorinaled polymer In one embodiment, the fluorinated polymer can include a fluorine substituted olefin polymer comprising at least one monomer selected from the group consisting of vinylidene fluoride, vinylfluoride, tetrafluoroethylene, hexafluoropropylene, trifluoroethylene. chlorotrifluoroethylele, ethylcne-chlorolrifluoroethylene, and mixtures of such fluoropolymers. In one particular embodiment, the end reflector 246 is made essentially of a fluorinated polymet In another more particular embodiment, the end reflector 246 is made essentially of polytelrafluoroethylene (PTFE)

As indicated above, the biasing member 240 exerts a force on the scintillator crystal 214, to urge the scintillator crystal 214 towards the optical window 226 thereby maintaining suitable optical coupling between the scintillation crystal 214 and the optical window 226 An optional layer 252 (or interface pad) can be provided between the scintillator crystal 214 and the optical window 226 to facilitate effective optical coupling According to one embodiment, layer 252 can include a transparent polymer material, such as a transparent silicone elastomer. The thickness of the interface pad 252 can be within a range of about 1 5 mm to about 8 mm for most crystals.

In further reference to FIG. 2, as illustrated, the optical window 226 can be retained in the casing 222 by an annular lip 258 at the front end of the casing 222. The annular lip 258 can protrude radially inwardly from the casing wall 228 and can define an opening having a diameter less than the diameter of the optical window 226. Additionally, the annular lip 258 can have an inner beveled surface 260 and the optical window 226 can include a corresponding beveled, circumferential edge surface 262 that engages the inner beveled surface 260 The mating beveled surfaces can be hermetically sealed by a high temperature solder such as 95/5 or 90/10 lead/tin solder The solder also aids in restiaining the optical window 226 against axial push-out, in addition to providing a high temperature seal The optical window 226 can be axially trapped between the annular lip 258 and the scintillator crystal 214 such that it can be radially constrained by the casing wall 222 Optionally. Io permit welting of the optica! window 226 by the solder, the sealing edge surfaces of the optical window 226 can include a meialized coating such as platinum

According to the illusliated embodiment of FIG 2, the inner beveled surface 260 can foi wardly terminate at a cylindrical surface 266 and rear war dly at a cylindrical surface 268. The cylindrical surface 268 closely surrounds a poition of the optical window 226 and extends axially inwardly to a cylindrical surface 270. which extends axially to the flange 230 at the opposite end of the casing 222 The interface of the optical window 226 is aligned with the annular shoulder formed between the cylindrical surfaces 268 and 270

According to another embodiment, the scintillator crystal 214 can be substantially surrounded by a reflector 274 The reflector 274 can incorporate materials as described above in accordance with the end reflector 246. such as a potous material including a powder, foil, metal coating, or polymer coating. According to one embodiment, the reflector 247 is a layer of aluminum oxide (alumina) powder In another embodiment, the reflector 247 is a self-adhering while porous PTFE material As noted above, air or gas that might otherwise be trapped between the end reflector 246 and the scintillator crystal 214 can escape through the porous reflector 274

In accordance with a particular embodiment, the reflector 274 is a preformed sheet containing a fluor iπaled polymer In one embodiment, the fluorinated polymer can include a fluorine substituted olefin polymer comprising at least one monomer selected from the group consisting of vinylidene fluoride, vinylfluoride, tetrafluoroethylene, hexafluoropropylene, Irifiuoroethylene. chlorotrifluoToethylele. ethylene-chlototrifluoroethylene, and mixtures of such fluoropolymeis. In one particulai embodiment, the reflector 274 is made essentially of a fluorinated polymer In another more particular embodiment, the reflector 274 is made essentially of polytelrafluoroethylene (PTFE)

In addition to the reflector 274 surrounding the scintillator crystal 214, a shock absorbing member 276, can substantially surround the scintillator crystal 214. The shock absorbing member 276 can surround and exert a radial force on the reflector 274 and the scintillator crystal 214 As shown, the shock absorbing member 276 can be cylindrical to accompany the selected shape of the scintillator crystal 214 The shock absorbing member 276 can be made of a rcsilicntty compressible material and according to one embodiment, is a polymer, such as an elastomer Additionally, the surface contour of the shock absorbing member 276 can vary along the length to provide a frictionally engaging surface lhereby enhancing the stabilization of the scintillator crystal 214 within the casing 222. For example, the shock absorbing member 276 can have a uniform inner surface 277 and an outer surface 278, or optionally, can have ribs extending axially or circumfcrenlially on the inner surface 277, the outer surface 278, or both Still, the shock absorbing member 276 can have protrusions, dimples, or other shaped irregularities on the inner surface 277. the outer surface 278. or both surfaces to friclionafly engage the scintillator crystal 214 and the casing 222 The shock absorbing member is discussed in more detail below

As also illustrated, the scintillation detector 210 can include a ring 290 that extends from the fiont end of the shock absorbing member 276 to the optical window 226. The ring 290 facilitates stabilization and alignment of the circular interface pad 252 during assembly of the scintillation detector 210 The i ing 290 has an axially inner end portion 292 substantially surrounding the scintillator ciystal 214 and an axially outer end portion 294 substantially surrounding the interface pad 252 The inteisection of the interior surfaces of the axially inner end portion 292 and the axially outer end portion 294 can include a shoulder 296. which facilitates positioning of the ring 290 on the scintillator crystal 214 duting assembly. The ring 290 can be made of resilient material, such as a polymer, generally an elastomer, and according to one embodiment, can include silicone. Additional material, such as alumina powder can be added to enhance the reflection of the ring 290 The ring 290 and the shock absorbing member may alternatively be integrated together as a continuous integral component

In further reference to the components of the scintillation detector 210 as illustrated in FIG 2. a sleeve 298 extends longitudinally fiom the optical window 226 to approximately the back cap 224. The sleeve 298 can substantially surround the shock absorbing member 276 and scintillator crystal 214 and in a compressed state (when fitted within the casing 222) provides a radially compressive force to the shock absotbing member 276 and scintillator crystal 214 According to one embodiment, insertion of the sleeve 298 into the casing 222 requires compression of the sleeve thereby providing a iadially compressive force on the crystal 214. Suitable materials for the sleeve 98 include resilient materials, such as a metal, metal alloy, a polymer, carbon or the like Additionally, the sleeve 298 can include a material that has a lower coefficient of friction with the material of the casing 222 than does the material of the shock absorbing member 276 with the materia! of the casing 222.

In accordance with the foregoing, stability of the shock-absorbing member and cushion pad at elevated temperatures is desirable According to embodiments herein, the materia! has less than 1 0% total mass loss (TML) and less than 0.1% collected volatile condensable material (CVCM) according to ASTM E595 (subject to a temperature of 125°C, in a pressure of less than 7x10° Pa for twenty four hours) According to a particular embodiment, the material of the shock absorbing member has a total mass loss of not greater than about 050% when subject to the ASTM E595 standardized test Still, the total mass loss of the material can be less, such as not greater than about 040%, or even not greater than about 0.30% Additionally, suitable materials for the shock absorbing member can have a low level of total mass loss and when subject to temperatures above and beyond those required by ASTM E595 Accordingly, the material of the shock absorbing member can have a total mass loss of not greater than about 1.0% when subject to a temperature of not less than about 150°C, or about 175°C, or even in some cases about 200°C, under a pressure of less than 7x10° Pa for twenty four hours Use of silicone, such as L SR (liquid silicone rubber), in combination with the particularly low volatility characteristics represents a particular combination

In another embodiment, the material of the shock absorbing member and cushion pad can include a material having a filler The filler typically includes a colloidal ceramic powder, such as alumina or silica, which in some situations facilitates the formation of a thixolropic matetial for working purposes Additionally, in one embodiment, the cushion pad has a Shore A hardness within a range of between about 40 and about 70, such as within a range of between about 40 and about 60 Generally, such as materia! can also be a bakelcss material, in accordance with such a bakeless material described above Referring to FIG 3. a flowchart is illustrated including a method of forming a scintillation detector As illustrated in FIG 3. the process is initiated at step 301 by cleaning a scintillator crystal Generally, the process of cleaning a scintillatoi crystal includes removing material from an exterior surface of the scintillator crystal, such as by mechanical abrasion, facilitating removal of films and residue from the crystal surface For such cleaning operations, a dry, inorganic material is generally suitable, such as a ceramic or metal to abrade the surface of the scintillator crystal and remove a layer of material In particular, use of organic matei ials during cleaning is avoided to reduce the potential of contamination, including avoiding contact with gloves containing organic materials such as natural rubbei, butyl rubber, latex, neoprene. nitrile. or vinyl In some instances, gloves used during a cleaning process can have a stainless steel mesh covering as the contact surface for handle the crystal.

In accordance with a particular embodiment, cleaning of the scintillator crystal includes removing at least about 025 mm of material from all exposed exterior surfaces of the scintillator crystal. More particularly, a greater amount of material may be removed, such as at least about 05 mm. or even at least about 1 mm of material The amount of material removed may be limited, such as not greater than about 5 mm of material Aftei removing a layer of material from the surface of the scintillator crystal, the cleaning process can further include polishing one or more surfaces of the scintillator crystal. As such, the face of the scintillator crystal configured to be adjacent to the light pipe and in the direct optical path is typically polished Polishing can be completed using a dry powdered ceramic material, such as fine grained alumina

After cleaning the scintillator crystal, the process can continue at step 303 by cleaning the detector components In accordance with one embodiment, the process of cleaning the detector components includes rinsing the components with an organic-based solvent Suitable organic-based solvents can include water (e g , deionized water), alcohol, ketones, and acetates. In a more particular embodiment, the cleaning process can include multiple rinses with one or more organic-based solvents. For example, rinsing the detector components initially with a deionized water rinse, followed by a ! insing the same detector components with methanol, and subsequently i insing the same detector components with acetone

After suitably t insing the detector components, the process of cleaning can further include subjecting the thermally stable detector components, such as glass and metal components, to a heating procedure Heating the detector components may facilitate volatilization of residual otganics and othci contaminants In accordance with one embodiment, the heating process includes heating the dctcctoi components to a volatilization temperature of at least about 175°C. Othei embodiments may utilize higher temperatures, such as for example, at least about 190°C, 200°C. or even at least about 225°C Generally the volatilization temperature is not greater than about 300°C After i eachtng the volatilization temperature, the detector components are typically held at the volatilization temperature for not less than about 12 hours, such as not less than about 15 hours, or even not less than about 18 hours flic duration of holding the components at the volatilization temperature may be limited, such as not greater than about 30 hours.

After cleaning the detector components, assembling of the scintillation detector continues by conditioning the scintillator crystal The conditioning process 304 illustrated in FIG 3 includes steps 305.306, 307.308, 309, and 310 (305-310), and generally includes a combination of procedures aiding the removal of contaminates from the surface of the crystal while preparing it for operation at elevated temperatures, which is particularly suitable for forming a scintillation detector capable of improved lifetime and performance in industrial applications

As illustrated in FIG 3, the conditioning process is initiated at step 305 by placing the scintillator crystal in a sealed container and exposing it to a reduced pressure atmosphere Generally, the reduced pressure atmosphere has a pressure substantially less than standard atmospheric piessure, such as on the order of not greater than about lE-1 Ton, not greater than about 1E-2 Torr, such as not greater than about lE-3 Torr, or even not greater than about lE-5 Torr The reduced pressure atmosphere may be within a range between about I E-3 Torr and about I E-6 Torr

Exposure of the scintillator crystal to the reduced pressure atmosphere can lost for a duration of not less than about 15 minutes, such as not less than about 30 minutes, or not less than about 1 hour The duration of the reduced pressure treatment can be limited such as not greater than about 3 hours.

After sufficiently exposing the scintillator crystal to a reduced pressure atmosphere, the conditioning process can continue at step 306 by heating the scintillator crystal Heating in combination with other processes facilitates volatilizing certain species from the scintillator crystal As such, the conditioning process may be carried out in an oven or other vessel having atmospheric and temperature control capabilities In accordance with one embodiment, the sealed container is heated at a rate of at least about 0.5°C/min. such as at least about 1°C/min, at least about 2°C/min, or even at least about 5°C/min The heating rate can be limited, such that in certain instances it is not greater than 10°C/min, and more particularly within a range between about l°C/min and about 6°C/min During the heating process, the scaled containci can be heated to a tempeiatuic of not less than about 100°C According to other embodiments, the sealed container is heated to a temperature of not less than about 125°C, such as not less than about 150°C. or even not less than about 175°C Typically, the sealed container is heated to a tempciaturc within a range between about 100°C and about 300°C After initiating the healing process at step 306, the conditioning process can continue at step

307 by i educing the pressure within the sealed container for an evacuation period while heating the scintillator crystal Reducing the pressure within the scaled container is suitable to purge the ambient atmosphere from within the sealed container, facilitating the removal of certain species, such as oxygen, water vapoi and any contaminates from the surface of the crystal from the atmosphere As such, in one embodiment, the process of reducing the pressure within the sealed container is conducted while heating

Reducing the pressure can include reducing the pressure within the scaled container to a pressure of not greater than about 1 E-I Torr. In other embodiments, the pressure can be less, such as not giealer than about 1 E-3 Ton. or even not greater than about 1 E-5 Ton, Typically the pressuie is within a range of about 1 E-3 Toir to about 1 E-6 Torr .

Low pressure treatment at step 307 can last at least about 2 minutes, such as at least about 5 minutes, at least about 10 minutes, or even at least about 15 minutes Low pressure tieatmcnt can extend foi a period within a range between about 15 minutes and about 25 minutes

After the step 307, the process of conditioning the scintillator crystal can continue at step 308 by flowing a purging gas through the sealed container for a flowing duration In accordance with one particular embodiment, the flowing process is completed while the sealed container and the scintillator crystal ate being heated. Generally, the purging gas is a halogen-containing gas, inert gas. or a noble gas In accordance with a particular embodiment, argon is the purging gas In accordance with another particular embodiment, the purging gas includes a halide gas, such as a fluorine-containing or chlorinc- containing species, for example CF₄. The flow of certain halogen gases through the sealed container may facilitate reaction and removal of certain contaminate species from the seaied container .

During the process of flowing a purging gas through the scaled container, the gases generally flow at a substantial rate to facilitate sufficient purging of the atmosphere of the sealed container. In one embodiment, the gas is flowed into the sealed container of not less than about 10 liters/min Other embodiments use greater rates, for example in one embodiment, the rate is at least about 20 liters/min In accordance with a particular embodiment, the purging gas is flowed into the sealed container at a rate within a range between about 40 liters/min and about 80 liters/min

The process of flowing a purging gas into the sealed container lasts for a flowing duration that is generally about 5 minutes. Still, greater durations may be used, for example in one embodiment, the flowing duration is at least about 10 minutes, or at least about 15 minutes Typically, the (lowing duration lasts for at least about I S minutes and is not greater than about 30 minutes

After completing the process of flowing a purging gas through the sealed container at step 308, certain procedures within the conditioning process may be repeated As illustrated in FlG 3. at step 309, a repeat or cycling process may be initiated by reluming to step 307, and repeating steps 307 and 308 In accordance with one embodiment, steps 307 and 308 can be repeated at least once such that the conditioning process includes reducing the pressure, flowing a putging gas, reducing the pressure, and once again flowing a purging gas In accordance with another embodiment, the conditioning process can include at least thice cycles of repeating steps 307 and 308 The type of purging gases can be changed for each cycle of flowing a gas through the sealed container, for example, during a fir st flowing process a halogen-containing gas may be used, while in a subsequent flowing process an inert gas can be flowed through the sealed container

As illustrated in FlG 3 the conditioning process can be finalized by holding the scintillator crystal in a holding atmosphere at step 310 after sufficiently cycling through steps 307 and 308 During a holding procedure, the scintillator crystal is maintained in a holding atmosphere having a pressure greater than standard atmospheric pressure to avoid the creation of a negative pressuie within the sealed container during cooling, which may allow the reentry of the ambient atmosphere into the sealed container . As such, in one embodiment the holding atmosphere has an absolute pressure of at least about 110 kPa In other embodiments, the absolute pressure may be greatci. for example at least about 117 kPa or at least about 131 kPa Typically, the holding atmosphere has an absolute pressure within a range between about 110 kPa and about 152 IcPa

Duiing the holding process the scintillator crystal is held at the elevated temperature, such as not less than about 120°C, not less than about 150°C, or even not less than about 175°C The scintillator crystal can be held in the holding atmosphere for a duration of at least about 1 hour, for example, at least about 2 hours, at least about 4 hours, or even at least about 8 hours. In one particular embodiment, the scintillator crystal is held in the holding atmosphere for a least about 12 hours The duration can be limited such as not greater than about 24 hours

Upon finishing the holding process at step 310, the conditioning process is completed and the sealed container may be cooled and brought to ambient temperature in preparation for moving the scintillator crystal to a sealed wot kbox as illustrated at step 311 Moving of the scintillator crystal from the sealed container to the sealed workbox can be conducted such that the conditioned state of the scintillator crystal is maintained by substantially maintaining the environment around the scintillator crystal As such, in one embodiment, the scintillator crystal is placed in a secondary container within the sealed container during the conditioning process, such that upon moving the scintillator crystal, the secondary container can be scaled, maintaining the conditioned state of the scintillator crystal Alternatively, the scaled container can be attached directly to the sealed workfaox. obviating the need for a secondary container

Geneially. the sealed workbox is capable of having a scaled atmosphere and being accessible by an operator such that the scintillation detector may be assembled lliciein In accordance with one embodiment, the sealed wot kbox includes an assembly atmosphere, which is a controlled atmosphere suitable for assembling the scintillation detector therein As such, the assembly atmosphere generally contains and inert gas or noble gas In accordance with a particular embodiment, lhe assembly atmosphere comprises argon, such that the entire atmosphere consists essentially ol argon

Additionally, the assembly atmosphere has a low level of contaminants, particularly low levels of oxygen and water vapor As such, in accordance with one embodiment, during assembly of the scintillation detector, the workbox has an oxygen content of not greater than about 10 ppm. In certain other embodiments, the oxygen content is less, such as not greater than about 5 ppm. not greater than about 3 ppm, or even not greater than about I ppm The assembly atmosphere can have an oxygen content within a range between about 001 ppm and about 5 ppm

The sealed workbox also has a water vapor content generally not greater than about 15 ppm.

For example, in one embodiment, the assembly atmosphere has a water vapor content that is not greater than about 10 ppm. such as not greater than about 5 ppm, or even not greater than about I ppm According to one certain embodiment, the sealed workbox has a water vapor content within a range between about 0.01 ppm and about 5 ppm Such water vapor contents translate to a dew point of at least about -60°C and more typically around -80°C

In embodiments where the sealed container and scaled workbox are not connected, the assembly atmosphere can be obtained by purging the workbox. Such a purging process may include flowing an inert gas through the scaled workbox, and reducing pressure within the sealed workbox. Moi cover, the use of gettering materials, such as a desiccant in the case of water vapor, and copper oxide in the case of oxygen, may be used to obtain a particularly dry and oxygen-depleted environment.

After moving the scintillator crystal to the scaled workbox at step 311, (he process continues at step 313 by assembling the detector in the sealed workbox Assembly of the detector can include forming a detector as illustrated in FIG .2, including for example, the scinlillatoi crystal, leflector, shock absoibing member, interface pad, sleeve, springs, the casing, and other components described herein After assembling the components, the detector can be permanently scaled In accordance with one embodiment, the sealing process includes a welding or brazing operation

According to embodiments herein, the completed scintillation detector was found to have notable performance attributes. Embodiments utilizing rare earth haiide crystals were found not only to have strong scintillation properties at low temperature applications, but have exceptional performance even after exposure to elevated temperatures for extended duialions Such performance is quantified in terms of relative light output LO(r), whetein LO(ι) = (L0₁₀₀/LO₀) X 100%). wherein LO₁₀₀ is the delected light output of the detector of about 100 hours of exposure at 150°C, and LO₀ is the original detected light output at room temperature prior to exposure at 150°C Embodiments have been measured to have a relative light output LO(r) of not less than about 75%. such as not less than about 80%, 85%.90%, or even not less than about 92% For clarity, the general designation ''L 0," is used herein to define the detected light output of the scintillation detector after a time of operation "t" Il will be appreciated that the delected light output fora lime of operation "t " of the detector is generally described herein in relative terms, as a iatio or percentage of the original detected light output of the detector at time zero, or L O₀ Unless otherwise specified herein, light output values are measured at room temperature, and are generated from application of 662 kcV gamma rays issuing from a cesium isotope, Cs-137 LO₀ is measured at room temperature prior to exposure at elevated temperatures and LO, where t>0 is measured after cooling the detector from an elevated temperature to room temperature Referring to FlG.4. a plot is illustrated showing a percentage of original light output of three scintillation detectors as a function of hours at 150°C. plots 401 and 403 represent scintillation detectors in accordance with embodiments herein, while plot 405 represents a conventional scintillation detector The scintillation detectors represented by plots 401 and 403 were formed according to the process illustrated in FIG 3, including a conditioning process of placing the LaBr₃:Ce scintillator crystal in an sealed container, heating the scintillator crystal to 150°C at rC/min while reducing the pressure to 1E-5 Torr and subsequently flowing argon through the chamber at a rate of 50 liicrs/min for 15 minutes The reducing pressure and flowing argon steps were repeated twice, while the sealed container was heating and upon reaching 150°C the chamber was filled with argon to 131 kPa and held for 12 hours After the conditioning, the sealed container was cooled and the scintillator crystal was passed to a sealed wotkbox having less than 1 ppm oxygen and less than 0.5 ppm water vapor, assembled into the detector and welded closed

The scintillation detector of plot 405 was formed according to a conventional process similar to that disclosed in U S 4,764,677 and included a LaBr₃:Ce scintillator crystal for direct comparison with the embodiments described above However, the scintillation detector of plot 405 did not undergo a conditioning process, and was instead assembled in a dry air atmosphere and subsequently placed in a vacuum oven, which was pumped down to a pressure of roughly 50 mToπ and heated to 150°C and held al this temperature and pressure for 12 hours. The scintillation detector was then removed from the vacuum oven and passed to an argon filled welding box having an oxygen content of approximately 500 ppm and a water vapor content of approximately 21 ppm, and welded closed

As clearly illustrated in FlG 4, the scintillation detector formed to according to the conventional process demonstrates poor performance after only a 30 hours of exposure to the elevated temperatures In contrast, the scintillation detectors of plots 401 and 403 demonstrate notable perfoimance. wilh relative light output LO(r) not less than about 92% indeed, the scintillation detectors of plots 401 and 403 demonstrate a relative light output LO(i) of not less than about 94%. wilh very little decrease in performance for durations exceeding 100 hours Notably, it was discovered that if the assembly and sealing environment were lightly controlled, to have less than about 1 ppm oxygen and less than 05 water vapor, the relative light output L O(r) results for LaBrj:Ce-based detectors were formed to be inferior to the embodiments depicted in plots 40! and 403. Staled another way, identical detectors that were nol subjected to the conditioning, having optimized assembly and sealing environments, were measurably inferior to the embodiments noted above, with such samples having a relative light output value LO{t) of at best 91% after 100 hours of operation at 150°C In addition to the improved light output performance noted above, the scintillation detectors described herein have supeiior energy resolution, especially after exposuie to elevated temperatures fbi extended durations. The sensitivity of a detector can be quantified by the energy resolution, or the ability of the detector to accurately identify the energy of ceitain radiation, Typically, the resolution is quantified by determining full width half maximum (FWHM) values from a spectral curve (typically a Gaussian-shaped curve) for radiation striking the detector at a given energy. The smaller the FWHM value for a given spectral curve, the greater the energy resolution and accuracy of measurements Exposure of a scintillation detector to elevated temperatures causes a decrease in the resolution that is detectable by an increase in the FWHM capabilities of the detector. The absolute energy resolution can be defined by the actual FWl IM values, and the change in energy resolution is measured in terms of an energy resolution degradation factor (ΔER) that measures the percent change in the FWHM values after a certain duration at high temperatures

In accordance with embodiments herein, the scintillation detectors have supeiior absolute energy resolution after extended durations at elevated temperatures. As such, in one embodiment, the scintillation detector can have an absolute energy resolution of not greater than about 35 keV (53%) at 662 keV after exposure to temperatures of not less than 150°C for not less than about 100 hours Other such embodiments can have a lower absolute energy resolution, such as not greater than about 30 keV (45%), 25 keV (3 8%). or even 20 keV (3.0%) after exposure to temperatures of not less than 150°C for not less than about 100 hours In one particular embodiment, the scintillation detector has an absolute energy resolution within a range between about 16 keV and about 20 keV. Moreover, the scintillation detectors herein can have the same absolute energy resolution values noted above after longer durations, such as not less than about 125 hours, about 150 hours, or even about 170 hours of exposure to temperatures of not less than about 150°C

In accordance with embodiments herein, the energy resolution degradation factor is described by the equation ΔER = ((ERιoo-ERo)/(ER₀))X 100%. wherein ER₁₀₀ is the energy resolution of the detector after about 100 hours of exposure at 150°C and ER₀ is the original energy resolution at room temperature prior to exposure at 150°C. As such, the detectors herein demonstrate an ΔER not greater than about 25%, 20%.15%, or even not greater than about 10%, when measured at room temperature after 100 hours of exposure at 150°C . Like the performance characteristics detailed previously, the general designation "ER," is used herein to define the energy resolution of the scintillation detector after a time of operation "t" It will be appreciated that the energy resolution for a time of operation "I" of the detector is generally described herein in relative terms, as a iatio or percentage of the original energy resolution of the detector at lime zero, or IrR₀ The light output values are measured at room temperature, and are generated from application of 662 keV gamma rays issuing from a cesium isotope. Cs- 137 ER₀ is measured at room temperature prior to exposure at elevated temperatures and ER, where t>0 is measured after cooling the detector from an elevated temper ature to room temperature

Table I below illustrates FWHM values for scintillation detectors previously described in accordance with FIG 4 Notably. Samples 1 and 2 detailed in Table 1 correspond to those scintillation detectors 401 and 403 previously described in FIG 4 and formed according to embodiments herein The Comparative Sample, is the conventionally formed detector 405 formed and assembled according to the guidelines described above in FlG 4 The comparative sample demonstrates a rapid increase in the FWHM values, such that only after 24 hours of exposure to 150°C the FWHM values are twice as great and thus the resolution capabilities of the detector are half of what they were originally In contrast, the scintillation detectors of Samples 1 and 2 demonstrate significantly less change, bareiy a 1 % change in some cases, alter being subject to temperatures of 150°C for durations extending up to and beyond 100 hours

Table 1

In fact, the discrepancy in performance is better illustrated in FiG 5, which plots the percent change of energy resolution (i e.. ΔER ) for the detectors after particular durations of exposure to 150°C As illustrated in FIG.5, Samples 1 and 2 correspond to the plots 501 and 503, respectively, and demonstrate a percent change in energy resolution significantly less than that of the conventional detector sample of plot 505. The scintillation detector formed according to the conventional process demonstrates poor performance after only a 12 hours of exposure to the elevated temperatures. The scintillation detectors of plots 501 and 503 demonstrate little change in the energy resolution after the first 24 hours at 150°C and particularly an overall degradation factor that is less than 10% for extended durations As such, it was discovered if assembly procedures and designs were used as described herein, the energy resolution degradation factor of rare-earth halide-based detectors were superior to conventional processes and designs According Io the embodiments described herein, scintillation detectors are piovided that have pei formance characteristics superior to the state of the art. !t has been previously recognized that assembly of scintillation detectors in substantially dry environments having an inert atmosphere is suitable for traditional scintillator crystal materials, such as alkali halides See for example U.S. Patent 4.764,677 However, it was discovered that such processes proved unsuitable for forming scintillation detectors incorporating rare-earth halide crystals, as it was found that such crystals were found to be more reactive and/o; are not as easily prepared for packaging than the traditional materials In particular, upon observation of performance degradation as a function of time at elevated temperatures, studies were conducted to understand the root cause of the degradation . The studies revealed contamination issues that appeared to be particularly unique to tare-earth halide crystals.

For example, methods of fabricating scintillation detectors include a conditioning process as described in detail above, which may include repetitive cycling of var ious sub-steps Certain embodiments additionally include cleaning processes for the crystal and the detector components, use of low volatility components within the dclectoi. and assembly procedures previously unrecognized in the art

The above-disclosed subject matter is to be considered illustrative, and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments, which fall within the true scope of the present invention. Thus, to the maximum extent allowed by law. the scope of the present invention is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description

The Abstract of the Disclosure is provided to comply with 37 C F R. § 1 72(b) and is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description of the Drawings, various features may be grouped together or described in a single embodiment for the purpose of streamlining the disclosure . This disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than arc expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter may be directed to less than all features of any of the disclosed embodiments. Thus, the following claims are incorporated into the Detailed Description of the Drawings, with each claim standing on its own as defining separately claimed subject matter

Claims

CLAIMS:

I A method of assembling a detector comprising: conditioning a tarc-catth halide scintillator crystal in a sealed container, the conditioning process comprising: healing the scintillator crystal: reducing the pressure within the sealed container for an evacuation period while heating: and flowing a purging gas through the scaled container for a flowing duration; and assembling a detector comprising the scintillator crystal in an assembly environment comprising an inert gas

2. The method of claim 1, wherein the scintillator crystal is a material selected from the group consisting of activated lanthanum bromide and activated lanthanum chloride

3 The method of any of claims 1 or 2, wherein heating comprises heating at rate of at least about 0.5°C/min

4 The method of claim 3. wherein heating comprises heating at rale of not greater than about 10°C/min

5. The method of any of claims 1.2. or 3. wherein heating includes heating to a temperature of not less than about 100°C.

6 The method of any of claims 1.2.3. or 5, wherein flowing the purging gas is conducted while heating.

7 The method of any of claims 1.2, 3, 5. or 6, wherein the purging gas is selected from the group of materials consisting of a halogen-containing gas, an inert gas, and a noble gas

8 The method of claim 7, wherein the purging gas is argon

9. The method of claim 7, wherein the purging gas is CF₄.

10. The method of claim 7, wherein flowing is conducted by flowing the purging gas at a rate of at least about 10 liters/min

11 The method of any of claims 1, 2, 3, 5, 6, or 7, wherein the flowing duration is at least about 5 min

12 The method of any of claims 1, 2, 3, 5, 6, or 11. wherein ieducing die ptessute includes reducing the pressure to not greater than about lE-1 Torr

13 The method of any of claims 1, 2, 3, 5, 6, 7, 11, or 12, wherein the evacuation period is at least about 2 min

14 The method of any of claims 1, 2, 3, 5, 6, 7, 11, 12, or 13, further comprising repealing the steps of reducing the pressure and flowing the purging gas while heating after completing flowing the purging gas

15 The method of claim 14. further comprising completing at least three cycles of reducing the pressure and flowing the purging gas while heating

16 The method of any of claims 1, 2, 3, 5, 6, 7, 11, 12, 13. or 14. further comprising holding the scintillator crystal in a holding atmosphere comprising the purging gas at a holding temperature after flowing the purging gas and before assembling

17 The method of claim 16. wherein the holding atmosphere comprises an absolute pressure of at least about 110 kPa

18 The method of claim 16. further comprising holding the scintillator crystal in the holding atmosphere for at least about 1 hour

19. The method of any of claims 1.2, 3, 5.6.7. 11, 12. 13. 14. or 16. wherein conditioning further comprises exposing the scintillator crystal to a reduced pressure atmosphere prior to heating

20 The method of claim 19. wherein the reduced pressure atmosphere has a pressure not greater than about 1E-1 Torr

21 The method of any of claims 1.2.3.5, 6. 7, 11, 12, 13, 14, 16, or 19 further comprising cleaning the scintillator crystal prior to conditioning,

22 The method of claim 21. wherein cleaning comprises removing material from an exterior surface of the scintillator crystal

23 The method of claim 22, wherein removing comprises removing at least about 0.25 mm of material from exposed exterior surfaces of the scintillatoi crystal.

24 The method of any of claims 1.2.3, 5.6, 7, 11, 12. 13, R 16, 19, or 21 further comprising polishing a surface of the scintillator crystal piior to conditioning

25 The method of claim 24. wherein the polishing is completed using a ceramic powder material

26 The method of any of claims 1, 2, 3, 5, 6, 7, 11, 12, 13, 14, 16, 19, 21, or 24, further comprising cleaning detector components prior to assembling

27 The method of claim 26, wherein cleaning comprises rinsing the detector components using an organic-based solvent

28 The method of claim 28, wherein the organic-based solvent is selected from the group of materials consisting of alcohols, ketones, and acetates

29 The method of claim 26, wherein cleaning the detector components further comprises heating the components to a volatilization temperature of at least about 175°C

30 The method of claim 26, further comprising holding the detector components at the volatilization temperatuie for not less than about 12 hours

31 The method of any of claims 1, 2, 3, 5, 6, 7, 11, 12, 13. 14, 16, 19, 21, 24, or 26. wherein the assembly environment comprises argon.

32 The method of any of claims 1, 2, 3, 5, 6, 7, 11, 12, 13, 14, 16, 19, 21, 24, 26, or 31, wherein the assembly environment comprises an oxygen content of not greater than IO ppm of oxygen

33 The method of any of claims 1, 2, 3, 5, 6, 7, 11, 12, 1.3, 14, 16, 19, 21, 24, 26, 31, or 32, wherein the assembly environment comprises a water vapor content of not greater than 15 ppm of water vapor.

34 A scintillation detector comprising: a rare-earth halide scintillator crystal in a scaled casing, the scintillation detector having a relative light output lθ(r) = ((LO₁₀₀)/{L0₀))X 100%. of not less than about 75% wherein LO₁₀₀ is the detected light output of the detector after about 100 hours of exposure at 150°C and LO₀ is the original detected light output at room temperature prioi to exposure at !5O°C

35 The scintillation detector of claim 34. wherein LO(r) is not less than about 80%, wherein LO₁₀₀ is the detected light output of the detector at room temperature after 100 hours of exposure at 150°C-

36 The scintillation delectoi of any one of claims 34 or 35, wherein LO(r) is not less than about 85%. wherein LO₁₅₀ is the detected light output of the detector at room temperature after 100 hours of exposure at 150°C

37 The scintillation detector of claim 36, wherein L O(r) is not less than about 92%, wherein LO₁₅₀ is the detected light output of the detector at room temperature after 100 hours of exposure at 150°C

38. The scintillation detector of claim 36. wherein LO(r) is within a range between about 99% and about 92%, wherein LO₁₅₀ is the detected light output of the detector at room temperature after 150 hours of exposure at I50°C .

39 The scintillation detector of any one of claims 34.35, or 36, the scintillator crystal is a material selected from the group consisting of activated lanthanum bromide and activated lanthanum chloride

40 The scintillation detector of any one of claims 34, 35, 36, or 39 further comprising a shock absorbing member substantially surrounding the scintillator crystal.

41 The scintillation detector of any one of claims 34, 35, 36, 39, or 40, futrher comprising a controlled atmosphere within the sealed casing different than the ambient atmosphere having an oxygen content not greater than about 10 ppm

42 The scintillation detector of claim 41 , wherein the controlled atmosphere comprises a water vapor content not greater than about 15 ppm

43 The scintillation detector of claim 40, wherein the shock absorbing member comprises silicone having a total mass loss (TML) of less than about 1.0% according to ASTM E595

44 The scintillation detector of claim 40, wherein the shock-absorbing member has a Shore A hardness within a iange of between about 40 and about 70.

45 The scintillation detector of any one of claims 34, 35,36, 39, 40, ot 41, further comprising a reflector disposed between the scintillator crystal and the shock absorbing member and substantially surrounding the scintillator crystal

46 The scintillation detector of claim 45, wherein the reflector comprises a fluorinalcd polymer

47 The scintillation detector of any one of claims 34, 35, 36, 39, 40, 41. or 45. further comprising a sleeve substantially surrounding the shock absorbing member.

48. The scintillation detector ol any one of claims 34.35.36.39, 40.41 , 45. or 47, further comprising a pholomultiplier tube coupled to the scintillation detector

49 The scintillation detector of claim 48, further comprising a light pipe disposed between the scintillation detector and the photomuitipliei tube

50 The scintillation detector of claim 49, wherein the light pipe is coupled to the photomultiplier tube and the scintillation detector using biasing members

51. A scintillation detector comprising: a rare-earth halide scintillator crystal in a sealed casing, the scintillation detector having an energy resolution degradation factor ΔER = ((ER₁₀₀-ERo)/(ER₀))X 100%, of not greater than about 25% wherein ER₁₀₀ is the energy resolution of the detector after about 100 hours of exposure at 150°C and ER₀ is the original energy resolution at room temperature prior to exposure at 150°C

52 The scintillation detector of claim 51, wherein ΔER is not greater than about 15% after 100 houis of exposure at 150°C

53 The scintillation detector of claim 52, wherein ΔER is not greater than about 10% after 100 hours of exposure at 150°C

54 A scintillation detector comprising: a rare-earth halide scintillator crystal in a sealed casing, the scintillation detector having an absolute energy resolution of not greater than about 35 keV at 662 keV after exposing the detector to temperatures of not less than 150°C for not less than about 100 hours.

55 The scintillation detector of claim 54, wherein the absolute energy resolution is not greater than about 30 keV at 662 keV.

56. The scintillation detector of claim 55, wherein the absolute energy resolution is not greater than about 25 keV at 662 keV

57 The scintillation detector of claim 56. wherein the absolute energy resolution is within a range between about 16 keV and about 20 keV at 662 keV.