WO2009114372A3 - Thermal interconnect and integrated interface systems, methods of production and uses thereof - Google Patents
Thermal interconnect and integrated interface systems, methods of production and uses thereof Download PDFInfo
- Publication number
- WO2009114372A3 WO2009114372A3 PCT/US2009/036113 US2009036113W WO2009114372A3 WO 2009114372 A3 WO2009114372 A3 WO 2009114372A3 US 2009036113 W US2009036113 W US 2009036113W WO 2009114372 A3 WO2009114372 A3 WO 2009114372A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat spreader
- layer
- coupling
- spreader component
- thermally conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
Abstract
Heat spreader assemblies are disclosed that include a heat spreader component, at least one coupling layer, and at least one thermally conductive layer, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. In some instances, heat spreader assemblies include an aluminum-based heat spreader component, at least one coupling layer, wherein the coupling layer comprises zinc, a zinc-based material, tin, a tin-based material or a combination thereof, and at least one thermally conductive layer comprising nickel, wherein the heat spreader component is coupled to the at least one thermally conductive layer through the at least one coupling layer. Methods of forming heat spreader assemblies are also disclosed that include providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; providing at least one coupling material, wherein the coupling material is directly deposited onto the bottom surface of the heat spreader component; and depositing, applying or coating at least one thermally conductive coating, film or layer on at least part of the bottom surface of the heat spreader component. In several embodiments, heat spreader component comprises a native oxide layer, an oxide barrier layer or a combination thereof that is removed before application of the at least one coupling material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/666,004 US20100319898A1 (en) | 2008-03-13 | 2009-03-05 | Thermal interconnect and integrated interface systems, methods of production and uses thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3639708P | 2008-03-13 | 2008-03-13 | |
US61/036,397 | 2008-03-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009114372A2 WO2009114372A2 (en) | 2009-09-17 |
WO2009114372A3 true WO2009114372A3 (en) | 2009-12-03 |
Family
ID=41065764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/036113 WO2009114372A2 (en) | 2008-03-13 | 2009-03-05 | Thermal interconnect and integrated interface systems, methods of production and uses thereof |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100319898A1 (en) |
TW (1) | TW200949185A (en) |
WO (1) | WO2009114372A2 (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100038066A1 (en) * | 2008-08-14 | 2010-02-18 | Tai-Her Yang | Thermal conducting principle and device for prestressed clamping type multi-layered structure |
US20100129648A1 (en) * | 2008-11-26 | 2010-05-27 | Jun Xu | Electronic packaging and heat sink bonding enhancements, methods of production and uses thereof |
EP2597041A1 (en) * | 2011-11-22 | 2013-05-29 | Active Space Technologies GmbH | Thermal strap |
US9390998B2 (en) * | 2012-02-17 | 2016-07-12 | Invensas Corporation | Heat spreading substrate |
DE102012104593B4 (en) * | 2012-05-29 | 2016-02-25 | Sma Solar Technology Ag | Semiconductor device |
US9190341B2 (en) | 2012-06-05 | 2015-11-17 | Texas Instruments Incorporated | Lidded integrated circuit package |
EP2754524B1 (en) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line |
EP2781296B1 (en) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Device and method for cutting out contours from flat substrates using a laser |
DE202013103599U1 (en) * | 2013-08-09 | 2014-11-13 | Trafomodern Transformatorengesellschaft M.B.H. | Electrical component |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
TWI730945B (en) | 2014-07-08 | 2021-06-21 | 美商康寧公司 | Methods and apparatuses for laser processing materials |
TWI659793B (en) | 2014-07-14 | 2019-05-21 | 美商康寧公司 | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
US10695872B2 (en) * | 2015-03-11 | 2020-06-30 | Lockheed Martin Corporation | Heat spreaders fabricated from metal nanoparticles |
EP3274306B1 (en) | 2015-03-24 | 2021-04-14 | Corning Incorporated | Laser cutting and processing of display glass compositions |
EP3319911B1 (en) | 2015-07-10 | 2023-04-19 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
KR102078294B1 (en) | 2016-09-30 | 2020-02-17 | 코닝 인코포레이티드 | Apparatus and method for laser machining transparent workpieces using non-axisymmetric beam spots |
EP3848333A1 (en) | 2016-10-24 | 2021-07-14 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
DE102018115509A1 (en) * | 2018-06-27 | 2020-01-02 | Infineon Technologies Ag | Heat dissipation device, semiconductor packaging system and method of manufacturing the same |
US11791237B2 (en) | 2018-06-27 | 2023-10-17 | Intel Corporation | Microelectronic assemblies including a thermal interface material |
US11682605B2 (en) | 2019-05-28 | 2023-06-20 | Intel Corporation | Integrated circuit packages with asymmetric adhesion material regions |
US11469154B2 (en) * | 2021-01-17 | 2022-10-11 | Amulaire Thermal Technology, Inc. | IGBT module with heat dissipation structure having specific layer thickness ratio |
WO2024081005A1 (en) * | 2022-10-12 | 2024-04-18 | Lunar Energy, Inc. | Gantry for thermal management |
US11849536B1 (en) | 2022-10-12 | 2023-12-19 | Lunar Energy, Inc. | Gantry for thermal management |
US11997812B2 (en) | 2022-10-12 | 2024-05-28 | Lunar Energy, Inc. | Cover for sealing a power module |
US11889662B1 (en) | 2022-10-12 | 2024-01-30 | Lunar Energy, Inc. | Thermal interface sandwich |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060040112A1 (en) * | 2002-07-15 | 2006-02-23 | Nancy Dean | Thermal interconnect and interface systems, methods of production and uses thereof |
US20060237838A1 (en) * | 2003-02-19 | 2006-10-26 | Mark Fery | Thermal interconnect systems methods of production and uses thereof |
-
2009
- 2009-03-05 WO PCT/US2009/036113 patent/WO2009114372A2/en active Application Filing
- 2009-03-05 US US12/666,004 patent/US20100319898A1/en not_active Abandoned
- 2009-03-12 TW TW098108094A patent/TW200949185A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060040112A1 (en) * | 2002-07-15 | 2006-02-23 | Nancy Dean | Thermal interconnect and interface systems, methods of production and uses thereof |
US20060237838A1 (en) * | 2003-02-19 | 2006-10-26 | Mark Fery | Thermal interconnect systems methods of production and uses thereof |
Also Published As
Publication number | Publication date |
---|---|
TW200949185A (en) | 2009-12-01 |
WO2009114372A2 (en) | 2009-09-17 |
US20100319898A1 (en) | 2010-12-23 |
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