WO2009113769A3 - 와이어 결속방식의 리드프레임 및 이를 사용한 led 파워램프 - Google Patents

와이어 결속방식의 리드프레임 및 이를 사용한 led 파워램프 Download PDF

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Publication number
WO2009113769A3
WO2009113769A3 PCT/KR2009/000553 KR2009000553W WO2009113769A3 WO 2009113769 A3 WO2009113769 A3 WO 2009113769A3 KR 2009000553 W KR2009000553 W KR 2009000553W WO 2009113769 A3 WO2009113769 A3 WO 2009113769A3
Authority
WO
WIPO (PCT)
Prior art keywords
wire
lead frame
same
binding method
led power
Prior art date
Application number
PCT/KR2009/000553
Other languages
English (en)
French (fr)
Other versions
WO2009113769A2 (ko
Inventor
김남규
Original Assignee
Kim Nam-Gyu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kim Nam-Gyu filed Critical Kim Nam-Gyu
Priority to US12/922,160 priority Critical patent/US20110006704A1/en
Priority to JP2010514655A priority patent/JP4538098B1/ja
Priority to CN2009801170613A priority patent/CN102027285A/zh
Publication of WO2009113769A2 publication Critical patent/WO2009113769A2/ko
Publication of WO2009113769A3 publication Critical patent/WO2009113769A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

본 발명은 종래의 LED 램프에서 LED를 실장하기 위해 인쇄회로기판이 사용되는 문제를 해결하기 위한 것으로, 반도체 칩이 실장되는 본체부(10)와; 상기 본체부(10) 일측으로부터 연장 설치되고, 와이어가 접속된 상태로 관통되도록 끝단부에 소정 직경의 와이어홀(21)이 형성된 입력부(20)와; 상기 본체부(10) 타측으로부터 연장 설치되고, 와이어가 접속된 상태로 관통되도록 끝단부에 소정 직경의 와이어홀(21)이 형성된 출력부(30)를 포함하여 구성되는 것을 특징으로 하는 와이어 결속방식의 리드프레임과 이를 사용한 LED 파워램프를 제공한다.
PCT/KR2009/000553 2008-03-12 2009-02-05 와이어 결속방식의 리드프레임 및 이를 사용한 led 파워램프 WO2009113769A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/922,160 US20110006704A1 (en) 2008-03-12 2009-02-05 Lead frame by wire binding method and led power lamp using same
JP2010514655A JP4538098B1 (ja) 2008-03-12 2009-02-05 ワイヤ結束方式のリードフレーム及びこれを使用したｌｅｄパワーランプ
CN2009801170613A CN102027285A (zh) 2008-03-12 2009-02-05 采用导线束合方法的引线框及使用该引线框的led电源灯

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0022990 2008-03-12
KR1020080022990A KR100892424B1 (ko) 2008-03-12 2008-03-12 와이어 결속방식의 리드프레임 및 이를 사용한 ｌｅｄ파워램프

Publications (2)

Publication Number Publication Date
WO2009113769A2 WO2009113769A2 (ko) 2009-09-17
WO2009113769A3 true WO2009113769A3 (ko) 2009-11-05

Family

ID=40757457

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/000553 WO2009113769A2 (ko) 2008-03-12 2009-02-05 와이어 결속방식의 리드프레임 및 이를 사용한 led 파워램프

Country Status (5)

Country Link
US (1) US20110006704A1 (ko)
JP (1) JP4538098B1 (ko)
KR (1) KR100892424B1 (ko)
CN (1) CN102027285A (ko)
WO (1) WO2009113769A2 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101767455B1 (ko) 2011-03-04 2017-08-14 삼성디스플레이 주식회사 발광다이오드 모듈, 이를 갖는 백라이트 어셈블리 및 표시장치
CN105246235A (zh) * 2015-11-25 2016-01-13 宁波皓升半导体照明有限公司 便于接线的led灯具

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010463A (en) * 1990-04-30 1991-04-23 Ross David L Electrified bulletin board with illuminable push-pin
US5268828A (en) * 1991-04-19 1993-12-07 Takiron Co., Ltd. Illuminant display device
KR20050119744A (ko) * 2004-06-17 2005-12-22 삼성전기주식회사 탈착 가능한 차량용 발광 다이오드 및 그 모듈
KR20070113173A (ko) * 2007-10-15 2007-11-28 주식회사 유양정보통신 다면 입체방사 발광장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036939Y2 (ko) * 1985-04-02 1991-02-21
US5404282A (en) * 1993-09-17 1995-04-04 Hewlett-Packard Company Multiple light emitting diode module
US6972528B2 (en) * 2003-11-21 2005-12-06 Chiliang Shao Structure for LED lighting chain
GB0517316D0 (en) * 2005-08-24 2005-10-05 Graham Morton A lamp
KR20070103173A (ko) * 2006-04-18 2007-10-23 영진약품공업주식회사 코엔자임 ｑ10을 포함하는 피부보호 조성물

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010463A (en) * 1990-04-30 1991-04-23 Ross David L Electrified bulletin board with illuminable push-pin
US5268828A (en) * 1991-04-19 1993-12-07 Takiron Co., Ltd. Illuminant display device
KR20050119744A (ko) * 2004-06-17 2005-12-22 삼성전기주식회사 탈착 가능한 차량용 발광 다이오드 및 그 모듈
KR20070113173A (ko) * 2007-10-15 2007-11-28 주식회사 유양정보통신 다면 입체방사 발광장치

Also Published As

Publication number Publication date
US20110006704A1 (en) 2011-01-13
KR100892424B1 (ko) 2009-04-10
JP4538098B1 (ja) 2010-09-08
WO2009113769A2 (ko) 2009-09-17
JP2010531068A (ja) 2010-09-16
CN102027285A (zh) 2011-04-20

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