WO2009104345A1 - Jig for laminate joining apparatus - Google Patents

Jig for laminate joining apparatus Download PDF

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Publication number
WO2009104345A1
WO2009104345A1 PCT/JP2008/073720 JP2008073720W WO2009104345A1 WO 2009104345 A1 WO2009104345 A1 WO 2009104345A1 JP 2008073720 W JP2008073720 W JP 2008073720W WO 2009104345 A1 WO2009104345 A1 WO 2009104345A1
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WO
WIPO (PCT)
Prior art keywords
chuck
substrate
alignment
jig
mark
Prior art date
Application number
PCT/JP2008/073720
Other languages
French (fr)
Japanese (ja)
Inventor
諭 田原
Original Assignee
三菱重工業株式会社
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Filing date
Publication date
Application filed by 三菱重工業株式会社 filed Critical 三菱重工業株式会社
Publication of WO2009104345A1 publication Critical patent/WO2009104345A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames

Definitions

  • the present invention relates to a jig for a laminating / bonding apparatus, and more particularly, to a jig for a laminating / bonding apparatus that is used when a bonded object to be bonded is held by a stacked bonding apparatus that bonds the bonded objects.
  • a lamination joining method for joining two substrates is known.
  • a laminated joining method it is desired to join the two substrates with higher accuracy, and the two opposing surfaces of the two substrates are maintained parallel to each other. It is desirable to bond substrates.
  • a lamination joining method is known in which two substrates are joined by heating. In such a laminated bonding method, thermal strain is generated in the chuck that holds the substrate, and the two surfaces to be bonded of the two substrates may not be maintained parallel to each other. It is desired to bond the two substrates with higher precision while maintaining the parallelness of the two surfaces to be bonded. Furthermore, there is a demand for a jig for a laminated bonding apparatus that makes it easier to place the two substrates on the chuck.
  • Japanese Patent Application Laid-Open No. 2001-118292 discloses a surface in an information processing apparatus capable of detecting variations in probe electrodes used for surface alignment by a simpler means and correcting the variations before or during surface alignment.
  • a combination method is disclosed.
  • the surface alignment method includes a recording medium, a plurality of probe electrodes arranged to face the recording medium, an actuator provided on each of the plurality of probe electrodes, and a support that supports the plurality of probe electrodes.
  • a tilt mechanism for correcting the tilt of the support with respect to the recording medium means for relatively displacing the recording medium and the probe electrode in an in-plane direction parallel to the surface of the recording medium, and an upper surface of the recording medium
  • the information processing apparatus having means for recording / reproducing in the presence of the probe electrode, the surface of the recording medium and the tip of the plurality of probe electrodes with respect to the scanning plane drawn by the tip of the plurality of probe electrodes by the displacement means
  • the surface alignment method for performing surface alignment with a configured surface a signal is detected from a specific probe electrode among the plurality of probe electrodes. Detecting the increase rate of the detection signal for each specific probe electrode using the detection signal, and the specific probe electrode so that the increase rates of the specific probe electrodes are the same. And a step of controlling the tilt mechanism so that the signals detected from the specific probe electrodes are equal to each other.
  • Japanese Laid-Open Patent Publication No. 05-160340 discloses a three-dimensional LSI laminating apparatus in which the positions of elements between layers can be precisely aligned and bonded.
  • the three-dimensional LSI stacking device is a large stroke low-resolution coarse motion with three axes of X, Y, and Z and at least one control axis among the rotations ⁇ X, ⁇ Y, and ⁇ Z around each axis.
  • a fine stroke stage with a small stroke and high resolution having a stage, three axes of X, Y, and Z, and a total of six axes of rotation around each axis, ⁇ X, ⁇ Y, and ⁇ Z, the coarse motion stage, and the fine motion
  • Two wafers that can be aligned in the X and Y directions and positioned and pressed in the Z direction by the stage, a sensor that detects the interval in the Z direction, which is the vertical direction of the two wafers, and a load at the time of wafer bonding.
  • a load cell a position detecting means for detecting a positional deviation in the XY direction which is the in-plane direction of the two wafers, a curing bonding means for curing and bonding the two wafers with an adhesive, and a movement for moving and positioning both means
  • the coarse movement stage and the fine movement stage are controlled in a closed loop based on the positional deviation in the X and Y directions of the two wafers detected by the position detecting means, and the two wafers in the X and Y directions.
  • Adjusting the parallelism of two wafers and performing two wafers by performing closed-loop control on the coarse movement stage and the fine movement stage based on the distance detected by the sensor and the load detected by the load cell. It is characterized by the provision of a control device that performs the pressing.
  • Japanese Unexamined Patent Publication No. 09-148207 discloses a three-dimensional LSI stacking apparatus that can manufacture a high-precision three-dimensional LSI by bonding two wafers with high accuracy without deformation.
  • the quartz glass holding the upper wafer on the lower surface is fixed to the upper part of the main body stage through the housing, while the moving stage holding the lower wafer facing the upper wafer on the upper surface is It is supported so as to be movable and adjustable in three directions orthogonal to the main body stage, and an adhesive is applied to at least one surface of the upper wafer and the lower wafer facing each other, and the moving stage is moved to the upper wafer.
  • the upper wafer and the lower wafer are bonded to each other by irradiating the thermal energy ray transmitted through the quartz glass from above to cure the adhesive.
  • the lower wafer on the moving stage is pressed against the upper wafer. It is characterized in that the transparent deformation resistance member for preventing deformation of the quartz glass is provided on the upper surface of the quartz glass that.
  • An object of the present invention is to provide a jig for a laminating and joining apparatus that makes it easier to place a joining target on a chuck that holds the joining target.
  • a jig for a laminating and bonding apparatus includes a support portion on which a chuck contact surface that contacts a chuck that holds a substrate to be bonded is formed, and an alignment that forms an alignment surface that contacts an edge of the alignment target substrate. And a part.
  • the chuck has a first fitting portion formed on a surface that contacts the chuck contact surface.
  • the 2nd fitting part fitted to a 1st fitting part is formed in a chuck
  • stacking joining apparatuses can be arrange
  • the jig for the laminating apparatus is further arranged by arranging the alignment target substrate so that the edge of the alignment target substrate is in contact with the alignment surface when being arranged at a predetermined position with respect to the chuck. It is possible to more easily arrange the alignment target substrate at the position.
  • the jig for a laminated bonding apparatus further includes a pedestal portion on which a support surface for supporting the alignment target is formed by contacting a part of the surface of the alignment target substrate facing the chuck. .
  • the support portion supports the pedestal portion so as not to contact the chuck.
  • the jig for the laminating and bonding apparatus further includes an alignment portion support portion that supports the alignment portion so as to be movable relative to the support portion.
  • the jig for the laminating and bonding apparatus can retreat the alignment portion when the counter chuck facing the chuck holds the alignment target substrate, and can prevent the alignment portion from obstructing the holding. .
  • the alignment portion support portion is formed of an elastic body having one end joined to the support portion and the other end joined to the alignment portion.
  • the jig for the laminating apparatus preferably retracts the alignment portion by elastically deforming the support portion when the counter chuck facing the chuck holds the alignment target.
  • the jig for the laminating and bonding apparatus further includes a mark aligning portion in which a mark aligning surface is formed that aligns with the mark formed on the edge when the alignment target substrate is arranged at a predetermined position.
  • the alignment target substrate can be more easily disposed at a predetermined position by disposing the alignment target substrate so that the mark is aligned with the mark alignment surface.
  • the alignment target substrate comes into contact with the alignment surface in a state where it is in contact with the chuck.
  • the laminate bonding apparatus jig can more easily arrange the alignment target substrate at a predetermined position on the chuck.
  • the jig for a laminating and bonding apparatus further includes a mark aligning portion on which a mark aligning surface is formed which comes into contact with a mark formed on an edge of the alignment target substrate when the alignment target substrate is disposed at a predetermined position.
  • the alignment bonding target substrate can be more easily arranged at a predetermined position by arranging the alignment target substrate so that the mark contacts the alignment surface.
  • FIG. 1 is a cross-sectional view showing an embodiment of a multilayer bonding apparatus according to the present invention.
  • FIG. 2 is a cross-sectional view showing the alignment apparatus, showing the lower chuck and the upper chuck.
  • FIG. 3 is a perspective view showing an 8-inch substrate lower set jig.
  • FIG. 4 is a cross-sectional view showing an 8-inch substrate lower set jig.
  • FIG. 5 is a perspective view showing an 8-inch substrate upper side setting jig.
  • FIG. 6 is a cross-sectional view showing an 8-inch substrate upper side setting jig.
  • FIG. 7 is a perspective view showing an 8-inch substrate upper side setting jig on which a substrate is set.
  • FIG. 1 is a cross-sectional view showing an embodiment of a multilayer bonding apparatus according to the present invention.
  • FIG. 2 is a cross-sectional view showing the alignment apparatus, showing the lower chuck and the upper chuck.
  • FIG. 3 is
  • FIG. 8 is a perspective view showing a jig for setting the lower side of the 2-inch substrate.
  • FIG. 9 is a perspective view showing a 2-inch substrate upper side setting jig.
  • FIG. 10 is a perspective view showing a 2-inch substrate upper side setting jig on which the substrate is set.
  • FIG. 11 is a plan view showing an arrangement plate.
  • FIG. 12 is a cross-sectional view showing the adapter plate.
  • FIG. 13 is a flowchart showing the operation in the first mode.
  • FIG. 14 is a flowchart showing the operation in the second mode.
  • a lamination joining apparatus 1 to which a jig for a lamination joining apparatus according to the present invention is applied includes a gantry 2, a base 3, a pressure contact driving device 5, a stage 6, a leaf spring 7, and an alignment tool.
  • a driving device 8, a lower chuck 11, an upper chuck 12, piezoelectric elements 14-1 to 14-3, load cells 15-1 to 15-3, and a control device 16 are provided.
  • the control device 16 is a computer and includes a CPU, a storage device, an input device, a display device, and an interface (not shown).
  • the CPU executes a computer program installed in the control device 16 to control the storage device, the input device, the output device, and the interface.
  • the storage device records the computer program, records information used by the CPU, and records information generated by the CPU.
  • the input device outputs information generated by being operated by the user to the CPU. Examples of the input device include a keyboard and a mouse.
  • the display device displays a screen generated by the CPU.
  • the interface outputs information generated by an external device connected to the control device 16 to the CPU, and outputs information generated by the CPU to the external device.
  • the base 3 is supported by the bottom plate 10 so as to be movable in the vertical direction.
  • the base 3 has a flat support surface at its upper end.
  • the support surface is perpendicular to the vertical direction.
  • the pressure contact driving device 5 is controlled by the control device 16 to drive the base 3 in parallel to the bottom plate 10 in the vertical direction.
  • the stage 6 is formed in a plate shape and is disposed on the upper side of the base 3 so as to face the support surface of the base 3.
  • the leaf spring 7 is formed of an elastic body and is joined to a part of the stage 6.
  • the alignment driving device 8 is supported by the base 3 and is supported by a leaf spring 7 so that the stage 6 is separated from the support surface of the base 3 by about 100 ⁇ m.
  • the alignment driving device 8 is controlled by the control device 16 so that the stage 6 translates in parallel in the horizontal direction, or the stage 6 rotates around a rotation axis parallel to the vertical direction.
  • the leaf spring 7 is driven.
  • the lower chuck 11 is generally formed in a disc shape.
  • the piezoelectric elements 14-1 to 14-3 are respectively arranged at three positions that divide the circumference of the disk of the lower chuck 11 into three equal parts.
  • Each of the piezoelectric elements 14-1 to 14-3 has one end joined to the base 3 and the other end joined to the lower chuck 11.
  • the piezoelectric elements 14-1 to 14-3 are each controlled by the control device 16 to expand and contract.
  • the gantry 2 is formed in a structure in which a base 3, a pressure driving device 5, a stage 6, a leaf spring 7, an alignment driving device 8, a lower chuck 11, and an upper chuck 12 are disposed inside. It is joined.
  • the upper chuck 12 is disposed so as to face the lower chuck 11 and is joined to the gantry 2.
  • the stage 6 is moved vertically upward by the press drive device 5.
  • the stage 6 is elastically deformed so as to come into contact with the support surface of the base 3.
  • the base 3 supports the stage 6 in this manner, so that the load of the alignment driving device 8 is applied to the substrate set on the lower chuck 11 and the substrate set on the upper chuck 12. Greater loads can be applied.
  • FIG. 2 shows the lower chuck 11.
  • the lower chuck 11 is formed of a support side portion 21 and a substrate side portion 22.
  • the support side portion 21 is a portion joined to the piezoelectric elements 14-1 to 14-3, and is made of quartz glass.
  • the substrate side portion 22 is a portion joined to the opposite side of the support side portion 21 to the side where the piezoelectric elements 14-1 to 14-3 are joined.
  • the substrate side portion 22 is made of aluminum nitride having better heat transfer than the support side portion 21. Is formed.
  • the lower chuck 11 includes a vacuum chuck pipe 23, a cooling pipe 24, and a heater 25.
  • One end of the vacuum chuck pipe 23 is connected to the holding surface of the lower chuck 11 facing the upper chuck 12, and the other end is connected to an external exhaust device.
  • the lower chuck 11 has its air exhausted through the vacuum chuck pipe 23 from the holding surface facing the upper chuck 12. Hold the substrate.
  • the cooling pipe 24 is formed in the support side portion 21 and cools the lower chuck 11 and cools the substrate held by the lower chuck 11 by flowing nitrogen gas.
  • the heater 25 is disposed inside the support side portion 21 and is controlled by the control device 16 to heat the substrate held by the lower chuck 11.
  • the lower chuck 11 further has a hole 26 formed therein.
  • the upper chuck 12 includes a support side portion 31 and a substrate side portion 32.
  • the support side portion 31 is a portion joined to the gantry 2 and is made of quartz glass.
  • the substrate side portion 32 is a portion that is joined to the opposite side of the support side portion 31 that is joined to the gantry 2, and is made of aluminum nitride that has better heat transfer than the support side portion 31.
  • the heater 35 is disposed inside the support side portion 31 and is controlled by the control device 16 to heat the substrate held by the upper chuck 12.
  • the upper chuck 12 includes a vacuum chuck pipe 33, a cooling pipe 34, a heater 35, and a hole 36.
  • One end of the vacuum chuck pipe 33 is connected to the holding surface facing the lower chuck 11 of the upper chuck 12, and the other end is connected to an external exhaust device.
  • the upper chuck 12 is configured such that when the substrate is disposed on the holding surface facing the lower chuck 11, air is exhausted from the holding surface facing the lower chuck 11 through the vacuum chuck pipe 33. Hold the substrate.
  • the vacuum chuck pipe 33 includes a central vacuum chuck pipe and a peripheral vacuum chuck pipe that can be evacuated independently of each other.
  • the central vacuum chuck pipe is arranged at the center of the holding surface of the upper chuck 12 so as to hold the center of the substrate held by the upper chuck 12.
  • the peripheral vacuum chuck piping (not shown) is arranged at the peripheral edge of the holding surface of the upper chuck 12 so as to hold the peripheral edge of the substrate held by the upper chuck 12.
  • the cooling pipe 34 is formed in the support side portion 31 and cools the upper chuck 12 and cools the substrate held by the upper chuck 12 by flowing nitrogen gas.
  • the upper chuck 12 is further formed with a hole 36.
  • the lower chuck 11 and the upper chuck 12 are made of aluminum nitride with relatively small thermal strain. For this reason, the laminate bonding apparatus 1 heats and bonds the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 to the substrate held by the lower chuck 11 and the upper chuck 12. Therefore, the change in parallelism with the substrate held by the substrate is small, a load is applied more uniformly, and bonding can be performed with higher accuracy.
  • the multilayer bonding apparatus 1 further includes an alignment apparatus 19.
  • the alignment device 19 includes a transmitted light illumination 41, a lens driving device 42, a coaxial incident illumination 45, a lens 44, and a camera 43.
  • the transmitted light illumination 41 is disposed inside the hole 26 and is controlled by the control device 16 to generate infrared rays.
  • the lens driving device 42 supports the coaxial incident illumination 45, the lens 44, and the camera 43 on the gantry 2, and is controlled by the control device 16 so that the coaxial incident illumination 45, the lens 44, and the camera 43 are attached to the gantry 2. Drive vertically.
  • the coaxial incident illumination 45 is controlled by the control device 16 to generate infrared rays.
  • the lens 44 is formed in a size smaller than the hole 36 of the lower chuck 11 and is disposed inside the hole 36.
  • the lens 44 irradiates the substrate held by the lower chuck 11 with infrared rays generated by the coaxial incident illumination 45 or irradiates the substrate held by the upper chuck 12 with the infrared rays. Further, the lens 44 transmits infrared rays reflected or transmitted through the substrate held by the lower chuck 11 to the camera 43, and transmits infrared rays reflected or transmitted through the substrate held by the upper chuck 12 to the camera 43.
  • the camera 43 generates an image of the substrate held by the lower chuck 11 based on the infrared light transmitted through the lens 44 and generates an image of the substrate held by the upper chuck 12.
  • the lens 44 generally has a shorter working distance as the magnification becomes higher.
  • the multi-layer bonding apparatus 1 can reduce the distance between the lens 44 and the substrate held by the lower chuck 11 or the upper chuck 12 by disposing the lens 44 inside the hole 36 of the lower chuck 11.
  • a lens having a higher magnification can be applied to the lens 44.
  • the multilayer bonding apparatus 1 can image the substrate held by the lower chuck 11 or the upper chuck 12 with higher accuracy.
  • the substrate held by the upper chuck 12 can be aligned with higher accuracy, and the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 can be joined with higher accuracy.
  • Piezoelectric elements 14-1 to 14-3 can rotate the lower chuck 11 around a rotation axis perpendicular to the vertical direction, that is, change the inclination of the lower chuck 11.
  • the piezoelectric elements 14-1 to 14-3 are further disposed closer to the lower chuck 11 than the alignment driving device 8 and the pressure contact driving device 5. Therefore, the multilayer bonding apparatus 1 can reduce the horizontal displacement of the lower chuck 11 when the inclination of the lower chuck 11 is changed using the piezoelectric elements 14-1 to 14-3.
  • the substrate held by the side chuck 11 and the substrate held by the upper chuck 12 can be bonded with higher accuracy.
  • FIG. 3 shows an 8-inch substrate lower set jig.
  • the 8-inch substrate lower set jig 51 includes a support portion 52, an alignment portion 53, an alignment portion 54, and a handle 55.
  • the alignment portion 53 is joined to the support portion 52.
  • the alignment portion 54 is joined to the support portion 52.
  • the handle 55 is joined to the support portion 52.
  • the lower chuck 11 has a holding surface 60, an attachment surface 61, an attachment surface 62, and a protrusion 63.
  • the holding surface 60 is formed flat so as to face the upper chuck 12.
  • the attachment surface 61 is formed along the side surface of the cylinder whose bottom surface is the holding surface 60, that is, is formed adjacent to the holding surface 60 and perpendicular to the holding surface 60.
  • the attachment surface 62 is formed flat so as to face the upper chuck 12 outside the holding surface 60 and the attachment surface 61.
  • the protrusion 63 is formed on the attachment surface 62.
  • the support portion 52 of the 8-inch substrate lower set jig 51 is provided with an attachment surface 56, an attachment surface 57, and a hole 58.
  • the attachment surface 56 is formed in a curved surface that is in close contact with a part of the attachment surface 61 of the lower chuck 11.
  • the attachment surface 57 is formed flat so as to be in close contact with a part of the attachment surface 62 of the lower chuck 11.
  • the hole 58 is formed so that the protrusion 63 of the lower chuck 11 is inserted.
  • the 8-inch substrate lower side setting jig 51 has a projection 63 inserted into the hole 58, the attachment surface 56 is in close contact with the attachment surface 62, and the attachment surface 57 is in close contact with the attachment surface 61. Attached to the side chuck 11.
  • the alignment portion 53 is formed with an alignment surface 59.
  • the alignment surface 59 is formed to be parallel to the vertical direction.
  • the alignment surface 59 contacts the edge of the substrate 50 disposed at a predetermined position on the holding surface 60 of the lower chuck 11 when the 8-inch substrate lower set jig 51 is attached to the lower chuck 11. It is formed to do.
  • the alignment portion 54 has a mark alignment surface.
  • the mark alignment surface is formed to be parallel to the vertical direction.
  • the mark alignment surface contacts the notch of the substrate 50 arranged at a predetermined position on the holding surface 60 of the lower chuck 11 when the 8-inch substrate lower set jig 51 is attached to the lower chuck 11. It is formed to do.
  • FIG. 5 shows an 8-inch substrate upper side setting jig.
  • the 8-inch substrate upper side setting jig 71 includes a support portion 72, two pedestal portions 73, two alignment portions 74, and a mark alignment portion 75.
  • the support portion 72 is formed in a ring shape.
  • the two pedestal portions 73 are joined to the support portion 72.
  • the two alignment portions 74 are joined to the two pedestal portions 73, respectively.
  • the mark alignment portion 75 is joined to the support portion 72.
  • the support portion 72 of the 8-inch substrate upper side setting jig 71 has an attachment surface 76, an attachment surface 77, and a hole 78.
  • the attachment surface 76 is formed in a curved surface that is in close contact with the attachment surface 61 of the lower chuck 11.
  • the attachment surface 77 is formed flat so as to be in close contact with the attachment surface 62 of the lower chuck 11.
  • the hole 78 is formed so that the protrusion 63 of the lower chuck 11 is inserted.
  • the 8-inch board upper set jig 71 has a protrusion 63 inserted into the hole 78, the attachment surface 76 is in close contact with the attachment surface 62, and the attachment surface 77 is in close contact with the attachment surface 61. Attached to the chuck 11.
  • the two pedestal portions 73 and the mark alignment portions 75 are respectively formed so that the thickness of the substrate 50 from the holding surface 60 of the lower chuck 11 when the 8-inch substrate upper setting jig 71 is attached to the lower chuck 11. It is supported by the support part 72 so that it may leave
  • Each of the two pedestal portions 73 is formed with a hole 80 and a substrate support surface 81.
  • the substrate support surface 81 is formed in the same manner as the pedestal portion 73.
  • the three substrate support surfaces 81 respectively formed on the two pedestal portions 73 and the mark alignment portions 75 are arranged along the same plane.
  • the alignment portion 74 is formed of an alignment main body portion 83, an elastic deformation portion 83, and a support portion 84.
  • the support portion 84 is joined to the pedestal portion 73 and supports the alignment portion 74 to the pedestal portion 73.
  • the elastic deformation portion 83 is formed of an elastic body, and can be elastically deformed such that the alignment main body portion 83 and the elastic deformation portion 83 are inserted into the holes 80 of the pedestal portion 73.
  • the alignment main body portion 83 is formed with an alignment surface 79. As shown in FIG. 5, the mark alignment portion 75 has a mark alignment surface 86 formed thereon.
  • the 8-inch substrate upper side setting jig 71 supports the substrate 70 at a predetermined position with the substrate support surface 81 coming into contact with the substrate 70.
  • the alignment surface 79 is formed so that the edge of the substrate 70 contacts when the 8-inch substrate upper setting jig 71 is attached to the lower chuck 11 and supports the substrate 70 at a predetermined position.
  • the mark alignment surface 86 follows a curved surface along which a notch 85 formed on the substrate 70 follows. Is formed.
  • FIG. 8 shows a jig for setting the lower side of the 2-inch substrate.
  • the 2-inch substrate lower set jig 91 includes a support portion 92, an alignment portion 93, a mark alignment portion 94, and a handle 95.
  • the alignment portion 93 is joined to the support portion 92.
  • the mark alignment portion 94 is joined to the support portion 92.
  • the handle 95 is joined to the support portion 92.
  • the support portion 92 of the 2-inch substrate lower set jig 91 is formed with two attachment surfaces and holes in the same manner as the 8-inch substrate lower set jig 51.
  • One of the two attachment surfaces is formed into a curved surface that is in close contact with a part of the attachment surface 61 of the lower chuck 11.
  • the other of the two attachment surfaces is formed flat so as to be in close contact with a part of the attachment surface 62 of the lower chuck 11.
  • the hole is formed so that the protrusion 63 of the lower chuck 11 is inserted.
  • the jig 91 for setting the lower side of the 2-inch substrate is attached to the lower chuck 11 by the protrusion 63 being inserted into the hole and the two attachment surfaces being in close contact with the attachment surface 62 and the attachment surface 61, respectively. It is done.
  • the alignment portion 93 has an alignment surface.
  • the alignment surface is formed so as to be parallel to the vertical direction.
  • the alignment surface contacts the edge of the substrate 90 disposed at a predetermined position on the holding surface 60 of the lower chuck 11 when the 2-inch substrate lower set jig 91 is attached to the lower chuck 11. It is formed to do.
  • the mark alignment portion 94 has a mark alignment surface.
  • the mark alignment surface is formed to be parallel to the vertical direction.
  • the mark alignment surface is an orientation flat of the substrate 90 arranged at a predetermined position on the holding surface 60 of the lower chuck 11 when the 2-inch substrate lower set jig 91 is attached to the lower chuck 11. It is formed to contact.
  • FIG. 9 shows the jig for setting the upper side of the 2-inch substrate.
  • the 2-inch substrate upper side setting jig 101 includes a support portion 102, two pedestal portions 103, two alignment portions 104, and a mark alignment portion 105. ing.
  • the support portion 102 is formed in a ring shape.
  • the two pedestal portions 103 are joined to the support portion 102.
  • the two alignment portions 104 are joined to the two pedestal portions 103, respectively.
  • the mark alignment part 105 is joined to the support part 102.
  • the support portion 102 of the 2-inch substrate upper side setting jig 101 is formed with two attachment surfaces and holes in the same manner as the support portion 72 of the 8-inch substrate upper side setting jig 71.
  • One of the two attachment surfaces is formed in a curved surface that is in close contact with the attachment surface 61 of the lower chuck 11.
  • the other of the two attachment surfaces is formed flat so as to be in close contact with the attachment surface 62 of the lower chuck 11.
  • the hole is formed so that the protrusion 63 of the lower chuck 11 is inserted.
  • the 2-inch substrate upper setting jig 101 is attached to the lower chuck 11 by inserting the protrusion 63 into the hole and bringing the two attachment surfaces into close contact with the attachment surface 62 and the attachment surface 61, respectively.
  • the two pedestal portions 103 and the mark aligning portion 105 are each equal to or more than the thickness of the substrate from the holding surface 60 of the lower chuck 11 when the 2-inch substrate upper setting jig 101 is attached to the lower chuck 11. It is supported by the support part 102 so that it may leave
  • the two pedestal portions 103 each have a hole and a substrate support surface.
  • the mark alignment portion 105 is formed with a substrate support surface in the same manner as the pedestal portion 103. Three substrate support surfaces respectively formed on the two pedestal portions 103 and the mark alignment portions 105 are arranged along the same plane.
  • the alignment portion 104 is formed with an alignment surface in the same manner as the alignment portion 74.
  • the alignment portion 104 is elastically deformable so that the portion where the alignment surface is formed is inserted into the hole of the pedestal portion 103.
  • a mark alignment surface 108 is formed in the mark alignment portion 105.
  • the 2-inch substrate upper side setting jig 101 supports the substrate 100 at a predetermined position with the substrate support surface coming into contact with the substrate 100.
  • the alignment surface of the alignment portion 104 is formed so that the edge of the substrate 100 contacts when the 2-inch substrate upper set jig 101 is attached to the lower chuck 11 and the substrate 100 is supported at a predetermined position.
  • the mark alignment surface 108 follows a plane along which an orientation flat formed on the substrate 100 is aligned. Is formed.
  • FIG. 11 shows an arrangement plate held by the lower chuck 11.
  • the hydrophobic portion 112 is formed to be more hydrophobic than the hydrophilic portions 113-1 to 113-n.
  • Each of the hydrophilic portions 113-1 to 113-n is formed in a shape (for example, a rectangular shape) that matches a chip to be bonded using the multilayer bonding apparatus 1, and is surrounded by the hydrophobic portion 112. Yes.
  • the arrangement plate 111 is further formed with a notch or an orientation flat at the periphery, and two alignment marks are formed on the hydrophobic portion 112.
  • FIG. 12 shows the adapter plate held by the upper chuck 12.
  • the adapter plate 114 is formed with a recess 115 and a plurality of holes 116.
  • the recess 115 is formed on the surface opposite to the surface facing the substrate to be bonded.
  • the plurality of holes 116 are formed so as to penetrate the surface facing the substrate to be bonded and the recess 115, and when the adapter plate 114 faces the placement plate 111, the holes 116-1 to 113-n are formed in the hydrophilic portions 113-1 to 113-n. It arrange
  • the adapter plate 114 is evacuated from the peripheral vacuum chuck piping of the vacuum chuck piping 33, so that the outer peripheral portion of the surface opposite to the surface facing the substrate to be joined is removed from the upper chuck 12. It is adsorbed and held on the upper chuck 12.
  • air is exhausted through the recess 115 and the plurality of holes 116 by the central vacuum chuck pipe of the vacuum chuck pipe 33, thereby the plurality of holes 116.
  • the chip 119 arranged in contact with the substrate is held.
  • the adapter plate 114 is further formed with a notch or an orientation flat at the periphery.
  • the chip 119 has an adhesive disposed on the surfaces to be joined. Examples of the adhesive include metal bumps and ultraviolet curable resins.
  • the lamination bonding method executed using the lamination bonding apparatus 1 includes an operation for holding the substrate on the chuck, an operation for holding the chip on the arrangement plate, an operation for aligning the substrate, and an operation for bonding the substrate. .
  • the operation of holding the substrate on the chuck includes the operation of holding the 8-inch substrate on the lower chuck 11, the operation of holding the 8-inch substrate on the upper chuck 12, the operation of holding the 2-inch substrate on the lower chuck 11, and the upper chuck. 12 to hold a 2-inch substrate.
  • the projection 63 of the lower chuck 11 is inserted into the hole 58 of the jig 51 for lowering the 8-inch substrate, and the attachment surface 56 is attached to the attachment surface 56.
  • the 8-inch substrate lower set jig 51 is attached to the lower chuck 11 by bringing the attachment surface 57 into close contact with the attachment surface 61.
  • the user places the 8 inch substrate in contact with the holding surface 60 of the lower chuck 11, and then the edge of the 8 inch substrate contacts the alignment surface 59 and the notch of the 8 inch substrate is aligned with the alignment portion 54.
  • the 8-inch substrate is slid so as to contact the mark alignment surface.
  • the user holds the 8-inch substrate on the lower chuck 11 and removes the 8-inch substrate lower set jig 51 from the lower chuck 11.
  • the protrusion 63 of the upper chuck 12 is inserted into the hole 78 of the upper jig 71 for setting the 8-inch substrate, and the mounting surface 76 is brought into close contact with the mounting surface 62. Then, the mounting surface 77 is brought into close contact with the mounting surface 61, thereby attaching the 8-inch substrate upper side setting jig 71 to the lower chuck 11. The user then places the 8-inch substrate in contact with the substrate support surface 81, and then the edge of the 8-inch substrate contacts the alignment surface 79 and the notch of the 8-inch substrate aligns with the mark alignment surface 86. Slide the 8-inch substrate.
  • the user uses the pressing drive device 5 to bring the lower chuck 11 closer to the upper chuck 12 and to hold the 8-inch substrate on the upper chuck 12 when the 8-inch substrate contacts the upper chuck 12.
  • the user removes the 8-inch substrate upper side setting jig 71 from the upper side chuck 12.
  • the projection 63 of the lower chuck 11 is inserted into the hole of the jig 91 for setting the lower side of the 2-inch substrate, and the two attachment surfaces are attached to the attachment surface.
  • the jig 91 for setting the lower side of the 2-inch substrate is attached to the lower chuck 11 by bringing it into close contact with 62 and the attachment surface 61.
  • the user places the 2 inch substrate in contact with the holding surface 60 of the lower chuck 11 and then the edge of the 2 inch substrate contacts the alignment surface of the alignment portion 93 and the orientation flat of the 2 inch substrate.
  • the 2 inch substrate is slid so that is in contact with the mark alignment surface of the mark alignment portion 94.
  • the user holds the 8-inch substrate on the lower chuck 11 and removes the 2-inch substrate lower set jig 91 from the lower chuck 11.
  • the protrusion 63 of the upper chuck 12 is inserted into the hole of the 2-inch substrate upper setting jig 101, and the two attachment surfaces are attached to the attachment surface 62.
  • the 2-inch substrate upper set jig 101 is attached to the lower chuck 11 by being in close contact with the surface 61.
  • the user then places the 2 inch substrate in contact with the substrate support surface, and then the edge of the 2 inch substrate contacts the alignment surface of the alignment portion 104 and the orientation flat of the 2 inch substrate aligns the mark alignment surface 108.
  • the 2 inch substrate is slid so as to be aligned with each other.
  • the user brings the lower chuck 11 close to the upper chuck 12 by using the pressure contact driving device 5 and causes the upper chuck 12 to hold the 2-inch substrate when the 2-inch substrate contacts the upper chuck 12.
  • the user removes the 2-inch substrate upper side setting jig 101 from the upper side chuck 12.
  • the user can more easily hold the substrate at a predetermined position of the lower chuck 11 so that the alignment mark of the substrate is imaged by the alignment device 19.
  • the substrate can be held more easily at a predetermined position.
  • the 8-inch substrate upper set jig 71 or the 2-inch substrate upper set jig 101 is placed on the substrate of the lower chuck 11. It is possible to prevent the substrate of the lower chuck 11 from being damaged without contact.
  • the user In the operation of holding the chip 119 on the placement plate 111, the user first holds the adapter plate 114 on the upper chuck 12 in the same manner as the operation of holding the substrate on the chuck.
  • the user uses the central vacuum chuck pipe of the vacuum chuck pipe 33 to exhaust air through the recess 115 and the plurality of holes 116.
  • the chip 119 disposed in contact with the hole 116 is held by the adapter plate 114.
  • the user causes the lower chuck 11 to hold the placement plate 111 by using an operation of holding the substrate by the chuck.
  • the user After the user drops water droplets on the hydrophilic portions 113-1 to 113-n of the arrangement plate 111, the user stops the exhaust by the central vacuum chuck pipe of the vacuum chuck pipe 33 of the upper chuck 12, and the arrangement plate
  • the chip 119 is dropped on the substrate 111.
  • the chip 119 moves so as to coincide with the hydrophilic portions 113-1 to 113-n due to the surface tension of the water droplets, and after the water droplets are dried, the hydrophilic portions 113-1 to 113-n have high accuracy. Retained.
  • the user removes the adapter plate 114 from the upper chuck 12 after the chip 119 is held on the placement plate 111. According to such an operation, the user does not need to place the chip directly on the placement plate 111 with high precision, and does not need to place the chip on the adapter plate 114 with high precision.
  • the chip 119 can be more easily held at the position.
  • the operation for aligning the substrate is executed after the operation for holding the substrate on the chuck is executed.
  • the control device 16 brings the lower chuck 11 closer to the upper chuck 12 to a predetermined distance by using the pressing drive device 5.
  • the control device 16 drives the lens 44 using the lens driving device 42 so that the lens 44 is disposed inside the hole 36 of the upper chuck 12.
  • the control device 16 irradiates the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 with infrared rays using the transmitted light illumination 41 or the coaxial incident illumination 45.
  • the control device 16 images the substrate alignment mark held by the lower chuck 11 and the substrate alignment mark held by the upper chuck 12 in an image using the camera 43.
  • control device 16 focuses by driving the lens 44 using the lens driving device 42.
  • the control device 16 uses the alignment drive device 8 so that the alignment mark of the substrate held by the lower chuck 11 and the alignment mark of the substrate held by the upper chuck 12 are projected onto the image.
  • the side chuck 11 is driven.
  • the operation for bonding the substrates is performed after the operation for aligning the substrates.
  • the control device 16 drives the lens 44 using the lens driving device 42 so that the lens 44 is disposed outside the hole 36 of the upper chuck 12.
  • the control device 16 heats the substrate held on the lower chuck 11 using the heater 25 and heats the substrate held on the upper chuck 12 using the heater 35.
  • the control device 16 keeps the load cells 15-1 to 15-3 fully extended.
  • the control device 16 executes the operation in the first mode and the operation in the second mode.
  • the lens 44 is thus disposed outside the hole 36 of the upper chuck 12, the lens 44 is damaged by the heat by heating the lower chuck 11 or the substrate held by the upper chuck 12. It is prevented.
  • the operation in the first mode is executed independently for each of the piezoelectric elements 14-1 to 14-3.
  • FIG. 13 shows the operation of the first mode in the piezoelectric element 14-i.
  • the control device 16 measures the force applied to the piezoelectric elements 14-1 to 14-3 using the load cells 15-1 to 15-3 (step S1).
  • the control device 16 determines whether or not a portion of the substrate held by the lower chuck 11 that corresponds to the piezoelectric element 14-i is in contact with the substrate held by the upper chuck 12 (step S2). That is, the control device 16 determines whether or not the force applied to the piezoelectric element 14-i is greater than a predetermined force.
  • step S3 NO When the force is smaller than the predetermined force (step S3, NO), the piezoelectric element 14-i is shortened by a predetermined length (step S4).
  • the control device 16 repeats the operations of steps S1 to S3 until all of the forces applied to the piezoelectric elements 14-1 to 14-3 are greater than a predetermined force.
  • step S3, YES the control device 16 starts the second mode operation.
  • FIG. 14 shows the operation in the second mode.
  • the control device 16 measures the force applied to the piezoelectric elements 14-1 to 14-3 using the load cells 15-1 to 15-3 (step S11).
  • the control device 16 drives the lower chuck 11 using the press contact driving device 5 so that the sum of the three measured forces becomes a predetermined value (step S12).
  • the control device 16 expands and contracts the piezoelectric element 14-1 so that the force applied to the piezoelectric element 14-1 is 1/3 of the predetermined force (step S13).
  • the control device 16 expands and contracts the piezoelectric element 14-2 so that the force applied to the piezoelectric element 14-2 becomes 1/3 of the predetermined force (step S14).
  • the control device 16 expands and contracts the piezoelectric element 14-3 so that the force applied to the piezoelectric element 14-3 is 1/3 of the predetermined force (step S15).
  • the control device 16 repeatedly executes the operations of steps S11 to S15 until the time when the sum of the three measured forces is a predetermined value exceeds the predetermined time.
  • the control device 16 causes the nitrogen gas to flow through the cooling pipe 24 so as to cool to a predetermined temperature, and separates the lower chuck 11 from the upper chuck 12 to a predetermined distance.
  • the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 are bonded by the adhesive, and one bonded substrate is generated.
  • the bonded substrate can be taken out from the lower chuck 11 or the upper chuck 12 earlier than cooling by cooling, and a plurality of pairs of bonding target substrates can be bonded faster. it can.
  • the substrate held by the lower chuck 11 or the upper chuck 12 can be replaced with another substrate that does not include the adapter plate 111.
  • a substrate in which a plurality of patterns respectively formed on a plurality of MEMS are formed on one semiconductor wafer is exemplified.
  • the multi-layer bonding apparatus 1 can be bonded with high accuracy in the same manner as the substrate including the adapter plate 111.
  • the multi-layer bonding apparatus 1 is a case where some of the plurality of patterns formed on the semiconductor wafer are defective, and when the semiconductor wafer is bonded, it may adversely affect other good patterns. is there.
  • the multi-layer bonding apparatus 1 can remove and bond the defective chips when the plurality of chips 119 include defective chips, and all of the plurality of chips 119 can be joined. Therefore, it is possible to join the plurality of chips 119 more efficiently.
  • the user can more easily arrange the joining target on the chuck that holds the joining target.

Abstract

Disclosed is a laminate joining apparatus jig comprising a positioning portion and a supporting portion. The positioning portion has a positioning face formed to contact the edge of a positioning object substrate. The supporting portion has a chuck contact face formed to contact a chuck for holding a joining object substrate. The chuck has a first fitting portion formed on a face to contact the chuck contact face. The supporting portion further has a second fitting portion formed on that chuck contact face. The laminate joining apparatus jig is arranged such that the first fitting portion and the second fitting portion fit each other. The positioning object substrate is arranged to have its edge contacting the positioning face, so that the positioning object substrate can be more easily arranged at a predetermined position.

Description

積層接合装置用治具Lamination bonding equipment jig
　本発明は、積層接合装置用治具に関し、特に、被接合対象を接合する積層接合装置にその被接合対象を保持させるときに利用される積層接合装置用治具に関する。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for a laminating / bonding apparatus, and more particularly, to a jig for a laminating / bonding apparatus that is used when a bonded object to be bonded is held by a stacked bonding apparatus that bonds the bonded objects.
　２枚の基板を接合する積層接合方法が知られている。このような積層接合方法は、その２枚の基板をより高精度に接合することが望まれ、その２枚の基板の対向する２つの表面が平行であることを維持したまま、その２枚の基板を接合することが望まれている。加熱して２枚の基板を接合する積層接合方法が知られている。このような積層接合方法は、その基板を保持するチャックに熱ひずみが発生し、その２枚の基板の接合される２つの表面の平行を維持することができないことがある。２枚の基板の接合される２つの表面の平行を維持しつつ、より高精度に接合することが望まれている。さらに、その２枚の基板をそのチャックに配置することをより容易にする積層接合装置用治具が望まれている。 A lamination joining method for joining two substrates is known. In such a laminated joining method, it is desired to join the two substrates with higher accuracy, and the two opposing surfaces of the two substrates are maintained parallel to each other. It is desirable to bond substrates. A lamination joining method is known in which two substrates are joined by heating. In such a laminated bonding method, thermal strain is generated in the chuck that holds the substrate, and the two surfaces to be bonded of the two substrates may not be maintained parallel to each other. It is desired to bond the two substrates with higher precision while maintaining the parallelness of the two surfaces to be bonded. Furthermore, there is a demand for a jig for a laminated bonding apparatus that makes it easier to place the two substrates on the chuck.
　特開２００１－１１８２９２号公報には、より簡単な手段で、面合わせ用に用いるプローブ電極のばらつきを検知し、面合わせの前又は最中にこのばらつきを補正することが行える情報処理装置における面合わせ方法が開示されている。その面合わせ方法は、記録媒体と、該記録媒体に対向して配置した複数のプローブ電極と、前記複数のプローブ電極のそれぞれに設けられたアクチュエータと、前記複数のプローブ電極を支持する支持体と、前記支持体の前記記録媒体に対する傾きを補正するチルト機構と、前記記録媒体表面に平行な面内方向に前記記録媒体と前記プローブ電極とを相対的に変位させる手段と、前記記録媒体の上の前記プローブ電極の存在において記録再生を行う手段を有する情報処理装置における、前記変位手段によって前記複数のプローブ電極の先端が描く走査面に対して前記記録媒体表面及び前記複数のプローブ電極の先端で構成される面との面合わせを行う面合わせ方法において、前記複数のプローブ電極のうちの特定のプローブ電極から信号を検出する段階と、前記検出信号を用いて前記特定のプローブ電極毎の前記検出信号の増加率を検知する段階と、前記特定のプローブ電極それぞれの前記増加率が同じになるように前記特定のプローブ電極に対応するアクチュエータを制御する、或は検出信号を補正する段階と、前記特定のプローブ電極それぞれから検出された信号が等しくなるように前記チルト機構を制御する段階とを備えることを特徴としている。 Japanese Patent Application Laid-Open No. 2001-118292 discloses a surface in an information processing apparatus capable of detecting variations in probe electrodes used for surface alignment by a simpler means and correcting the variations before or during surface alignment. A combination method is disclosed. The surface alignment method includes a recording medium, a plurality of probe electrodes arranged to face the recording medium, an actuator provided on each of the plurality of probe electrodes, and a support that supports the plurality of probe electrodes. A tilt mechanism for correcting the tilt of the support with respect to the recording medium, means for relatively displacing the recording medium and the probe electrode in an in-plane direction parallel to the surface of the recording medium, and an upper surface of the recording medium In the information processing apparatus having means for recording / reproducing in the presence of the probe electrode, the surface of the recording medium and the tip of the plurality of probe electrodes with respect to the scanning plane drawn by the tip of the plurality of probe electrodes by the displacement means In the surface alignment method for performing surface alignment with a configured surface, a signal is detected from a specific probe electrode among the plurality of probe electrodes. Detecting the increase rate of the detection signal for each specific probe electrode using the detection signal, and the specific probe electrode so that the increase rates of the specific probe electrodes are the same. And a step of controlling the tilt mechanism so that the signals detected from the specific probe electrodes are equal to each other.
　特開平０５－１６０３４０号公報には、層間の素子の位置が精密に位置合わせできるとともに貼り合わせできるようにした三次元ＬＳＩ用積層装置が開示されている。その三次元ＬＳＩ積層装置は、Ｘ，Ｙ，Ｚの３軸とこの各軸まわりの回転θX ，θY ，θZ のうち少なくとも１軸合計４軸以上の制御軸をもった大ストローク低分解能の粗動ステージと、Ｘ，Ｙ，Ｚの３軸とこの各軸まわりの回転θX ，θY ，θZ の３軸合計６軸の制御軸をもった小ストローク高分解能の微動ステージと、前記粗動ステージ及び微動ステージによりＸＹ方向位置合わせ及びＺ方向の位置決め押し当てが可能な二枚のウェーハと、二枚のウェーハの垂直方向であるＺ方向の間隔を検出するセンサと、ウェーハ貼り合わせ時の荷重を検出するロードセルと、二枚のウェーハの面内方向であるＸＹ方向の位置偏差を検出する位置検出手段と、二枚のウェーハを接着剤により硬化接着する硬化接着手段と、両手段を移動位置決めする移動機構を有した装置において、前記位置検出手段により検出された二枚のウェーハのＸＹ方向の位置偏差に基づいて、前記粗動ステージ及び微動ステージをクローズドループ制御することにより二枚のウェーハのＸＹ方向位置合わせを行うと共に前記センサにより検出された間隔及び前記ロードセルにより検出された荷重に基づき、前記粗動ステージ及び微動ステージをクローズドループ制御することにより二枚のウェーハの平行度調整及び二枚のウェーハの押し当てを行う制御装置を設けたことを特徴としている。 Japanese Laid-Open Patent Publication No. 05-160340 discloses a three-dimensional LSI laminating apparatus in which the positions of elements between layers can be precisely aligned and bonded. The three-dimensional LSI stacking device is a large stroke low-resolution coarse motion with three axes of X, Y, and Z and at least one control axis among the rotations θX, θY, and θZ around each axis. A fine stroke stage with a small stroke and high resolution having a stage, three axes of X, Y, and Z, and a total of six axes of rotation around each axis, θX, θY, and θZ, the coarse motion stage, and the fine motion Two wafers that can be aligned in the X and Y directions and positioned and pressed in the Z direction by the stage, a sensor that detects the interval in the Z direction, which is the vertical direction of the two wafers, and a load at the time of wafer bonding. A load cell, a position detecting means for detecting a positional deviation in the XY direction which is the in-plane direction of the two wafers, a curing bonding means for curing and bonding the two wafers with an adhesive, and a movement for moving and positioning both means In the apparatus having a structure, the coarse movement stage and the fine movement stage are controlled in a closed loop based on the positional deviation in the X and Y directions of the two wafers detected by the position detecting means, and the two wafers in the X and Y directions. Adjusting the parallelism of two wafers and performing two wafers by performing closed-loop control on the coarse movement stage and the fine movement stage based on the distance detected by the sensor and the load detected by the load cell. It is characterized by the provision of a control device that performs the pressing.
　特開平０９－１４８２０７号公報には、２枚のウェーハを変形なく精度良く接着することで高精度な三次元ＬＳＩを製造可能な三次元ＬＳＩ積層装置が開示されている。その三次元ＬＳＩ積層装置は、上ウェーハを下面に保持した石英ガラスがハウジングを介して本体ステージの上部に固定される一方、前記上ウェーハに対向する下ウェーハを上面に保持された移動ステージが前記本体ステージに対して互いに直交する３方向に移動調整自在に支持され、前記上ウェーハと下ウェーハとの対向する少なくとも一方の面に接着剤を塗布し、前記移動ステージを移動して前記上ウェーハに対して前記下ウェーハが位置決め押圧された状態で、上方より前記石英ガラスを透過した熱エネルギ線を照射して前記接着剤を硬化させることで、前記上ウェーハと下ウェーハとを接着して積層三次元ＬＳＩを形成する三次元ＬＳＩ積層装置において、前記上ウェーハに対する前記移動ステージ上の前記下ウェーハの押圧時における前記石英ガラスの変形を防止する透過性耐変形部材を該石英ガラスの上面に設けたことを特徴としている。 Japanese Unexamined Patent Publication No. 09-148207 discloses a three-dimensional LSI stacking apparatus that can manufacture a high-precision three-dimensional LSI by bonding two wafers with high accuracy without deformation. In the three-dimensional LSI stacking apparatus, the quartz glass holding the upper wafer on the lower surface is fixed to the upper part of the main body stage through the housing, while the moving stage holding the lower wafer facing the upper wafer on the upper surface is It is supported so as to be movable and adjustable in three directions orthogonal to the main body stage, and an adhesive is applied to at least one surface of the upper wafer and the lower wafer facing each other, and the moving stage is moved to the upper wafer. On the other hand, in the state where the lower wafer is positioned and pressed, the upper wafer and the lower wafer are bonded to each other by irradiating the thermal energy ray transmitted through the quartz glass from above to cure the adhesive. In the three-dimensional LSI stacking apparatus that forms the original LSI, the lower wafer on the moving stage is pressed against the upper wafer. It is characterized in that the transparent deformation resistance member for preventing deformation of the quartz glass is provided on the upper surface of the quartz glass that.
　本発明の課題は、接合対象を保持するチャックにその接合対象を配置することをより容易にする積層接合装置用治具を提供することにある。 An object of the present invention is to provide a jig for a laminating and joining apparatus that makes it easier to place a joining target on a chuck that holds the joining target.
　本発明による積層接合装置用治具は、接合対象基板を保持するチャックに接触するチャック接触面が形成される支持部分と、位置合わせ対象基板の縁に接触する位置合わせ面が形成される位置合わせ部分とを備えている。チャックは、チャック接触面に接触する面に第１嵌合部分が形成されている。支持部分は、第１嵌合部分に嵌合する第２嵌合部分がチャック接触面に形成される。このとき、積層接合装置用治具は、第１嵌合部分と第２嵌合部分とが嵌合するように配置することにより、チャックに対して所定の位置に配置されることができる。積層接合装置用治具は、さらに、チャックに対して所定の位置に配置されるときに、位置合わせ対象基板の縁が位置合わせ面に接触するように位置合わせ対象基板を配置することにより、所定の位置に位置合わせ対象基板をより容易に配置することができる。 A jig for a laminating and bonding apparatus according to the present invention includes a support portion on which a chuck contact surface that contacts a chuck that holds a substrate to be bonded is formed, and an alignment that forms an alignment surface that contacts an edge of the alignment target substrate. And a part. The chuck has a first fitting portion formed on a surface that contacts the chuck contact surface. As for a support part, the 2nd fitting part fitted to a 1st fitting part is formed in a chuck | zipper contact surface. At this time, the jig | tool for lamination | stacking joining apparatuses can be arrange | positioned in a predetermined position with respect to a chuck | zipper by arrange | positioning so that a 1st fitting part and a 2nd fitting part may fit. The jig for the laminating apparatus is further arranged by arranging the alignment target substrate so that the edge of the alignment target substrate is in contact with the alignment surface when being arranged at a predetermined position with respect to the chuck. It is possible to more easily arrange the alignment target substrate at the position.
　本発明による積層接合装置用治具は、位置合わせ対象基板のうちのチャックに対向する面の一部に接触してその位置合わせ対象を支持する支持面が形成される台座部分をさらに備えている。支持部分は、台座部分をチャックに接触しないように支持する。積層接合装置用治具は、チャックに対して所定の位置に配置されるときに、チャックに保持される他の対象に接触しないで、所定の位置に位置合わせ対象基板を配置することができる。 The jig for a laminated bonding apparatus according to the present invention further includes a pedestal portion on which a support surface for supporting the alignment target is formed by contacting a part of the surface of the alignment target substrate facing the chuck. . The support portion supports the pedestal portion so as not to contact the chuck. When the laminate bonding apparatus jig is disposed at a predetermined position with respect to the chuck, the alignment target substrate can be disposed at a predetermined position without contacting another object held by the chuck.
　本発明による積層接合装置用治具は、支持部分に対して移動可能に位置合わせ部分を支持する位置合わせ部分支持部分をさらに備えている。積層接合装置用治具は、チャックに対向する対向チャックが位置合わせ対象基板を保持するときに位置合わせ部分を退避させることができ、位置合わせ部分がその保持を妨害することを防止することができる。 The jig for the laminating and bonding apparatus according to the present invention further includes an alignment portion support portion that supports the alignment portion so as to be movable relative to the support portion. The jig for the laminating and bonding apparatus can retreat the alignment portion when the counter chuck facing the chuck holds the alignment target substrate, and can prevent the alignment portion from obstructing the holding. .
　位置合わせ部分支持部分は、一端が支持部分に接合され、他端が位置合わせ部分に接合される弾性体から形成される。積層接合装置用治具は、チャックに対向する対向チャックがその位置合わせ対象を保持するときに、支持部分が弾性変形することにより位置合わせ部分を退避させることが好ましい。 The alignment portion support portion is formed of an elastic body having one end joined to the support portion and the other end joined to the alignment portion. The jig for the laminating apparatus preferably retracts the alignment portion by elastically deforming the support portion when the counter chuck facing the chuck holds the alignment target.
　本発明による積層接合装置用治具は、位置合わせ対象基板が所定の位置に配置されたときにその縁に形成されるマークに揃うマーク合わせ面が形成されるマーク合わせ部分をさらに備えている。このとき、積層接合装置用治具は、マークがマーク合わせ面に揃うように位置合わせ対象基板が配置されることにより、所定の位置に位置合わせ対象基板をより容易に配置することができる。 The jig for the laminating and bonding apparatus according to the present invention further includes a mark aligning portion in which a mark aligning surface is formed that aligns with the mark formed on the edge when the alignment target substrate is arranged at a predetermined position. At this time, in the multilayer bonding apparatus jig, the alignment target substrate can be more easily disposed at a predetermined position by disposing the alignment target substrate so that the mark is aligned with the mark alignment surface.
　位置合わせ対象基板は、チャックに接触した状態でその縁が位置合わせ面に接触する。このとき、積層接合装置用治具は、チャック上の所定の位置に位置合わせ対象基板をより容易に配置することができる。 The alignment target substrate comes into contact with the alignment surface in a state where it is in contact with the chuck. At this time, the laminate bonding apparatus jig can more easily arrange the alignment target substrate at a predetermined position on the chuck.
　本発明による積層接合装置用治具は、位置合わせ対象基板が所定の位置に配置されたときにその縁に形成されるマークに接触するマーク合わせ面が形成されるマーク合わせ部分をさらに備えている。このとき、積層接合装置用治具は、マークが位置合わせ面に接触するように位置合わせ対象基板が配置されることにより、所定の位置に位置合わせ対象基板をより容易に配置することができる。 The jig for a laminating and bonding apparatus according to the present invention further includes a mark aligning portion on which a mark aligning surface is formed which comes into contact with a mark formed on an edge of the alignment target substrate when the alignment target substrate is disposed at a predetermined position. . At this time, the alignment bonding target substrate can be more easily arranged at a predetermined position by arranging the alignment target substrate so that the mark contacts the alignment surface.
図１は、本発明による積層接合装置の実施の形態を示す断面図である。FIG. 1 is a cross-sectional view showing an embodiment of a multilayer bonding apparatus according to the present invention. 図２は、下側チャックと上側チャックとを示し、アライメント装置を示す断面図である。FIG. 2 is a cross-sectional view showing the alignment apparatus, showing the lower chuck and the upper chuck. 図３は、８インチ基板下側セット用治具を示す斜視図である。FIG. 3 is a perspective view showing an 8-inch substrate lower set jig. 図４は、８インチ基板下側セット用治具を示す断面図である。FIG. 4 is a cross-sectional view showing an 8-inch substrate lower set jig. 図５は、８インチ基板上側セット用治具を示す斜視図である。FIG. 5 is a perspective view showing an 8-inch substrate upper side setting jig. 図６は、８インチ基板上側セット用治具を示す断面図である。FIG. 6 is a cross-sectional view showing an 8-inch substrate upper side setting jig. 図７は、基板がセットされた８インチ基板上側セット用治具を示す斜視図である。FIG. 7 is a perspective view showing an 8-inch substrate upper side setting jig on which a substrate is set. 図８は、２インチ基板下側セット用治具を示す斜視図である。FIG. 8 is a perspective view showing a jig for setting the lower side of the 2-inch substrate. 図９は、２インチ基板上側セット用治具を示す斜視図である。FIG. 9 is a perspective view showing a 2-inch substrate upper side setting jig. 図１０は、基板がセットされた２インチ基板上側セット用治具を示す斜視図である。FIG. 10 is a perspective view showing a 2-inch substrate upper side setting jig on which the substrate is set. 図１１は、配置用プレートを示す平面図である。FIG. 11 is a plan view showing an arrangement plate. 図１２は、アダプタプレートを示す断面図である。FIG. 12 is a cross-sectional view showing the adapter plate. 図１３は、第１モードの動作を示すフローチャートである。FIG. 13 is a flowchart showing the operation in the first mode. 図１４は、第２モードの動作を示すフローチャートである。FIG. 14 is a flowchart showing the operation in the second mode.
　図面を参照して、本発明による積層接合装置用治具の実施の形態を記載する。本発明による積層接合装置用治具が適用される積層接合装置１は、図１に示されているように、架台２とベース３と圧接用駆動装置５とステージ６と板ばね７とアライメント用駆動装置８と下側チャック１１と上側チャック１２と圧電素子１４－１～１４－３とロードセル１５－１～１５－３と制御装置１６とを備えている。制御装置１６は、コンピュータであり、図示されていないＣＰＵと記憶装置と入力装置と表示装置とインターフェースとを備えている。そのＣＰＵは、制御装置１６にインストールされるコンピュータプログラムを実行して、その記憶装置と入力装置と出力装置とインターフェースとを制御する。その記憶装置は、そのコンピュータプログラムを記録し、そのＣＰＵに利用される情報を記録し、そのＣＰＵにより生成される情報を記録する。その入力装置は、ユーザに操作されることにより生成される情報をそのＣＰＵに出力する。その入力装置としては、キーボード、マウスが例示される。その表示装置は、そのＣＰＵにより生成された画面を表示する。そのインターフェースは、制御装置１６に接続される外部機器により生成される情報をそのＣＰＵに出力し、そのＣＰＵにより生成された情報をその外部機器に出力する。 Referring to the drawings, an embodiment of a jig for a lamination joining apparatus according to the present invention will be described. As shown in FIG. 1, a lamination joining apparatus 1 to which a jig for a lamination joining apparatus according to the present invention is applied includes a gantry 2, a base 3, a pressure contact driving device 5, a stage 6, a leaf spring 7, and an alignment tool. A driving device 8, a lower chuck 11, an upper chuck 12, piezoelectric elements 14-1 to 14-3, load cells 15-1 to 15-3, and a control device 16 are provided. The control device 16 is a computer and includes a CPU, a storage device, an input device, a display device, and an interface (not shown). The CPU executes a computer program installed in the control device 16 to control the storage device, the input device, the output device, and the interface. The storage device records the computer program, records information used by the CPU, and records information generated by the CPU. The input device outputs information generated by being operated by the user to the CPU. Examples of the input device include a keyboard and a mouse. The display device displays a screen generated by the CPU. The interface outputs information generated by an external device connected to the control device 16 to the CPU, and outputs information generated by the CPU to the external device.
　ベース３は、鉛直方向に平行移動可能に底板１０に支持されている。ベース３は、その上端に平坦な支持面を有している。その支持面は、鉛直方向に垂直である。圧接用駆動装置５は、制御装置１６により制御されて、底板１０に対して鉛直方向に平行にベース３を駆動する。ステージ６は、板状に形成され、ベース３の支持面に対向するようにベース３の上側に配置されている。板ばね７は、弾性体から形成され、ステージ６の一部に接合されている。アライメント用駆動装置８は、ベース３に支持され、ステージ６がベース３の支持面から１００μｍ程度離れるように、板ばね７で支持している。アライメント用駆動装置８は、制御装置１６により制御されて、ステージ６が水平方向に平行に平行移動するように、または、ステージ６が鉛直方向に平行な回転軸を中心に回転移動するように、板ばね７を駆動する。 The base 3 is supported by the bottom plate 10 so as to be movable in the vertical direction. The base 3 has a flat support surface at its upper end. The support surface is perpendicular to the vertical direction. The pressure contact driving device 5 is controlled by the control device 16 to drive the base 3 in parallel to the bottom plate 10 in the vertical direction. The stage 6 is formed in a plate shape and is disposed on the upper side of the base 3 so as to face the support surface of the base 3. The leaf spring 7 is formed of an elastic body and is joined to a part of the stage 6. The alignment driving device 8 is supported by the base 3 and is supported by a leaf spring 7 so that the stage 6 is separated from the support surface of the base 3 by about 100 μm. The alignment driving device 8 is controlled by the control device 16 so that the stage 6 translates in parallel in the horizontal direction, or the stage 6 rotates around a rotation axis parallel to the vertical direction. The leaf spring 7 is driven.
　下側チャック１１は、概ね円盤状に形成されている。圧電素子１４－１～１４－３は、それぞれ、下側チャック１１の円盤の円周を３等分する３位置に配置されている。圧電素子１４－１～１４－３は、それぞれ、一端がベース３に接合され、他端が下側チャック１１に接合されている。圧電素子１４－１～１４－３は、それぞれ、制御装置１６により制御されて、伸び縮みする。ロードセル１５－ｉ（ｉ＝１，２，３）は、圧電素子１４－ｉに印加される力を測定し、その力を制御装置１６に出力する。 The lower chuck 11 is generally formed in a disc shape. The piezoelectric elements 14-1 to 14-3 are respectively arranged at three positions that divide the circumference of the disk of the lower chuck 11 into three equal parts. Each of the piezoelectric elements 14-1 to 14-3 has one end joined to the base 3 and the other end joined to the lower chuck 11. The piezoelectric elements 14-1 to 14-3 are each controlled by the control device 16 to expand and contract. The load cell 15-i (i = 1, 2, 3) measures the force applied to the piezoelectric element 14-i and outputs the force to the control device 16.
　架台２は、ベース３と圧接用駆動装置５とステージ６と板ばね７とアライメント用駆動装置８と下側チャック１１と上側チャック１２とが内部に配置される構造体に形成され、底板１０に接合されている。上側チャック１２は、下側チャック１１に対向するように配置され、架台２に接合されている。 The gantry 2 is formed in a structure in which a base 3, a pressure driving device 5, a stage 6, a leaf spring 7, an alignment driving device 8, a lower chuck 11, and an upper chuck 12 are disposed inside. It is joined. The upper chuck 12 is disposed so as to face the lower chuck 11 and is joined to the gantry 2.
　このとき、板ばね７は、下側チャック１１にセットされた基板と上側チャック１２にセットされた基板とを圧接したときに、すなわち、圧接用駆動装置５によりステージ６が鉛直上方向に移動されたときに、ステージ６がベース３の支持面に接触するように弾性変形する。積層接合装置１は、このようにベース３がステージ６を支持することにより、下側チャック１１にセットされた基板と上側チャック１２にセットされた基板とに、アライメント用駆動装置８の耐荷重を越えるより大きな荷重を加えることができる。 At this time, when the plate spring 7 presses the substrate set on the lower chuck 11 and the substrate set on the upper chuck 12, that is, the stage 6 is moved vertically upward by the press drive device 5. The stage 6 is elastically deformed so as to come into contact with the support surface of the base 3. In the multi-layer bonding apparatus 1, the base 3 supports the stage 6 in this manner, so that the load of the alignment driving device 8 is applied to the substrate set on the lower chuck 11 and the substrate set on the upper chuck 12. Greater loads can be applied.
　図２は、下側チャック１１を示している。下側チャック１１は、支持側部分２１と基板側部分２２とから形成されている。支持側部分２１は、圧電素子１４－１～１４－３に接合されている部分であり、石英ガラスから形成されている。基板側部分２２は、支持側部分２１の圧電素子１４－１～１４－３に接合されている側の反対側に接合されている部分であり、支持側部分２１より熱伝達がよい窒化アルミから形成されている。 FIG. 2 shows the lower chuck 11. The lower chuck 11 is formed of a support side portion 21 and a substrate side portion 22. The support side portion 21 is a portion joined to the piezoelectric elements 14-1 to 14-3, and is made of quartz glass. The substrate side portion 22 is a portion joined to the opposite side of the support side portion 21 to the side where the piezoelectric elements 14-1 to 14-3 are joined. The substrate side portion 22 is made of aluminum nitride having better heat transfer than the support side portion 21. Is formed.
　下側チャック１１は、真空チャック用配管２３と冷却用配管２４とヒータ２５とを備えている。真空チャック用配管２３は、一端が下側チャック１１の上側チャック１２に対向する保持面に接続され、他端が外部の排気装置に接続されている。下側チャック１１は、上側チャック１２に対向する保持面に基板が配置されているときに、上側チャック１２に対向する保持面から真空チャック用配管２３を介して空気が排気されることにより、その基板を保持する。冷却用配管２４は、支持側部分２１に形成され、窒素ガスが流通されることにより、下側チャック１１を冷却し、下側チャック１１に保持される基板を冷却する。ヒータ２５は、支持側部分２１の内部に配置され、制御装置１６により制御されて、下側チャック１１に保持される基板を加熱する。下側チャック１１は、さらに、穴２６が形成されている。 The lower chuck 11 includes a vacuum chuck pipe 23, a cooling pipe 24, and a heater 25. One end of the vacuum chuck pipe 23 is connected to the holding surface of the lower chuck 11 facing the upper chuck 12, and the other end is connected to an external exhaust device. When the substrate is disposed on the holding surface facing the upper chuck 12, the lower chuck 11 has its air exhausted through the vacuum chuck pipe 23 from the holding surface facing the upper chuck 12. Hold the substrate. The cooling pipe 24 is formed in the support side portion 21 and cools the lower chuck 11 and cools the substrate held by the lower chuck 11 by flowing nitrogen gas. The heater 25 is disposed inside the support side portion 21 and is controlled by the control device 16 to heat the substrate held by the lower chuck 11. The lower chuck 11 further has a hole 26 formed therein.
　上側チャック１２は、支持側部分３１と基板側部分３２とを備えている。支持側部分３１は、架台２に接合されている部分であり、石英ガラスから形成されている。基板側部分３２は、支持側部分３１の架台２に接合されている側の反対側に接合されている部分であり、支持側部分３１より熱伝達がよい窒化アルミから形成されている。ヒータ３５は、支持側部分３１の内部に配置され、制御装置１６により制御されて、上側チャック１２に保持される基板を加熱する。 The upper chuck 12 includes a support side portion 31 and a substrate side portion 32. The support side portion 31 is a portion joined to the gantry 2 and is made of quartz glass. The substrate side portion 32 is a portion that is joined to the opposite side of the support side portion 31 that is joined to the gantry 2, and is made of aluminum nitride that has better heat transfer than the support side portion 31. The heater 35 is disposed inside the support side portion 31 and is controlled by the control device 16 to heat the substrate held by the upper chuck 12.
　上側チャック１２は、真空チャック用配管３３と冷却用配管３４とヒータ３５と穴３６とを備えている。真空チャック用配管３３は、一端が上側チャック１２の下側チャック１１に対向する保持面に接続され、他端が外部の排気装置に接続されている。上側チャック１２は、下側チャック１１に対向する保持面に基板が配置されているときに、下側チャック１１に対向する保持面から真空チャック用配管３３を介して空気が排気されることにより、その基板を保持する。真空チャック用配管３３は、互いに独立して排気することができる中央真空チャック用配管と周縁真空チャック用配管とを含んでいる。その中央真空チャック用配管は、上側チャック１２に保持される基板の中央を保持するように、上側チャック１２の保持面の中央に配置されている。その周縁真空チャック用配管（図示されていない）は、上側チャック１２に保持される基板の周縁を保持するように、上側チャック１２の保持面の周縁に配置されている。冷却用配管３４は、支持側部分３１に形成され、窒素ガスが流通されることにより、上側チャック１２を冷却し、上側チャック１２に保持される基板を冷却する。上側チャック１２は、さらに、穴３６が形成されている。 The upper chuck 12 includes a vacuum chuck pipe 33, a cooling pipe 34, a heater 35, and a hole 36. One end of the vacuum chuck pipe 33 is connected to the holding surface facing the lower chuck 11 of the upper chuck 12, and the other end is connected to an external exhaust device. The upper chuck 12 is configured such that when the substrate is disposed on the holding surface facing the lower chuck 11, air is exhausted from the holding surface facing the lower chuck 11 through the vacuum chuck pipe 33. Hold the substrate. The vacuum chuck pipe 33 includes a central vacuum chuck pipe and a peripheral vacuum chuck pipe that can be evacuated independently of each other. The central vacuum chuck pipe is arranged at the center of the holding surface of the upper chuck 12 so as to hold the center of the substrate held by the upper chuck 12. The peripheral vacuum chuck piping (not shown) is arranged at the peripheral edge of the holding surface of the upper chuck 12 so as to hold the peripheral edge of the substrate held by the upper chuck 12. The cooling pipe 34 is formed in the support side portion 31 and cools the upper chuck 12 and cools the substrate held by the upper chuck 12 by flowing nitrogen gas. The upper chuck 12 is further formed with a hole 36.
　下側チャック１１と上側チャック１２とは、比較的熱歪みが小さい窒化アルミから形成されている。このため、積層接合装置１は、下側チャック１１により保持される基板と上側チャック１２により保持される基板とを加熱して接合するときに、下側チャック１１により保持される基板と上側チャック１２により保持される基板との平行度の変化が少なく、より均一に荷重が印加され、より高精度に接合することができる。 The lower chuck 11 and the upper chuck 12 are made of aluminum nitride with relatively small thermal strain. For this reason, the laminate bonding apparatus 1 heats and bonds the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 to the substrate held by the lower chuck 11 and the upper chuck 12. Therefore, the change in parallelism with the substrate held by the substrate is small, a load is applied more uniformly, and bonding can be performed with higher accuracy.
　積層接合装置１は、さらに、アライメント装置１９を備えている。アライメント装置１９は、透過光照明４１とレンズ駆動装置４２と同軸落射用照明４５とレンズ４４とカメラ４３とを備えている。透過光照明４１は、穴２６の内部に配置され、制御装置１６により制御されて赤外線を生成する。レンズ駆動装置４２は、同軸落射用照明４５とレンズ４４とカメラ４３とを架台２に支持し、制御装置１６に制御されて、同軸落射用照明４５とレンズ４４とカメラ４３とを架台２に対して鉛直方向に駆動する。同軸落射用照明４５は、制御装置１６により制御されて赤外線を生成する。レンズ４４は、下側チャック１１の穴３６より小さいサイズに形成され、穴３６の内部に配置されている。レンズ４４は、同軸落射用照明４５により生成される赤外線を下側チャック１１により保持される基板に照射し、または、上側チャック１２により保持される基板にその赤外線を照射する。レンズ４４は、さらに、下側チャック１１により保持される基板を反射または透過する赤外線をカメラ４３に透過し、上側チャック１２により保持される基板を反射または透過する赤外線をカメラ４３に透過する。カメラ４３は、レンズ４４を透過した赤外線に基づいて下側チャック１１により保持される基板の画像を生成し、上側チャック１２により保持される基板の画像を生成する。 The multilayer bonding apparatus 1 further includes an alignment apparatus 19. The alignment device 19 includes a transmitted light illumination 41, a lens driving device 42, a coaxial incident illumination 45, a lens 44, and a camera 43. The transmitted light illumination 41 is disposed inside the hole 26 and is controlled by the control device 16 to generate infrared rays. The lens driving device 42 supports the coaxial incident illumination 45, the lens 44, and the camera 43 on the gantry 2, and is controlled by the control device 16 so that the coaxial incident illumination 45, the lens 44, and the camera 43 are attached to the gantry 2. Drive vertically. The coaxial incident illumination 45 is controlled by the control device 16 to generate infrared rays. The lens 44 is formed in a size smaller than the hole 36 of the lower chuck 11 and is disposed inside the hole 36. The lens 44 irradiates the substrate held by the lower chuck 11 with infrared rays generated by the coaxial incident illumination 45 or irradiates the substrate held by the upper chuck 12 with the infrared rays. Further, the lens 44 transmits infrared rays reflected or transmitted through the substrate held by the lower chuck 11 to the camera 43, and transmits infrared rays reflected or transmitted through the substrate held by the upper chuck 12 to the camera 43. The camera 43 generates an image of the substrate held by the lower chuck 11 based on the infrared light transmitted through the lens 44 and generates an image of the substrate held by the upper chuck 12.
　レンズ４４は、一般的に、高倍率であるほどワーキングディスタンスが短い。積層接合装置１は、レンズ４４を下側チャック１１の穴３６の内部に配置することにより、下側チャック１１または上側チャック１２により保持される基板とレンズ４４との距離を短縮することができ、より高倍率であるレンズをレンズ４４に適用することができる。積層接合装置１は、より高倍率であるレンズをレンズ４４に適用したときに、下側チャック１１または上側チャック１２により保持される基板をより高精度に撮像することができ、下側チャック１１または上側チャック１２により保持される基板をより高精度に位置合わせすることができ、下側チャック１１により保持される基板と上側チャック１２により保持される基板とをより高精度に接合することができる。 The lens 44 generally has a shorter working distance as the magnification becomes higher. The multi-layer bonding apparatus 1 can reduce the distance between the lens 44 and the substrate held by the lower chuck 11 or the upper chuck 12 by disposing the lens 44 inside the hole 36 of the lower chuck 11. A lens having a higher magnification can be applied to the lens 44. When the lens having a higher magnification is applied to the lens 44, the multilayer bonding apparatus 1 can image the substrate held by the lower chuck 11 or the upper chuck 12 with higher accuracy. The substrate held by the upper chuck 12 can be aligned with higher accuracy, and the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 can be joined with higher accuracy.
　圧電素子１４－１～１４－３は、鉛直方向に垂直である回転軸を中心に下側チャック１１を回転移動させ、すなわち、下側チャック１１の傾きを変更することができる。圧電素子１４－１～１４－３は、さらに、アライメント用駆動装置８と圧接用駆動装置５とに比較して、下側チャック１１により近い位置に配置されている。このため、積層接合装置１は、圧電素子１４－１～１４－３を用いて下側チャック１１の傾きを変更するときに、下側チャック１１の水平方向の変位を低減することができ、下側チャック１１に保持される基板と上側チャック１２に保持される基板とをより高精度に接合することができる。 Piezoelectric elements 14-1 to 14-3 can rotate the lower chuck 11 around a rotation axis perpendicular to the vertical direction, that is, change the inclination of the lower chuck 11. The piezoelectric elements 14-1 to 14-3 are further disposed closer to the lower chuck 11 than the alignment driving device 8 and the pressure contact driving device 5. Therefore, the multilayer bonding apparatus 1 can reduce the horizontal displacement of the lower chuck 11 when the inclination of the lower chuck 11 is changed using the piezoelectric elements 14-1 to 14-3. The substrate held by the side chuck 11 and the substrate held by the upper chuck 12 can be bonded with higher accuracy.
　図３は、８インチ基板下側セット用治具を示している。その８インチ基板下側セット用治具５１は、支持部分５２と位置合わせ部分５３と位置合わせ部分５４とハンドル５５とを備えている。位置合わせ部分５３は、支持部分５２に接合されている。位置合わせ部分５４は、支持部分５２に接合されている。ハンドル５５は、支持部分５２に接合されている。 FIG. 3 shows an 8-inch substrate lower set jig. The 8-inch substrate lower set jig 51 includes a support portion 52, an alignment portion 53, an alignment portion 54, and a handle 55. The alignment portion 53 is joined to the support portion 52. The alignment portion 54 is joined to the support portion 52. The handle 55 is joined to the support portion 52.
　下側チャック１１は、図４に示されているように、保持面６０と取り付け面６１と取り付け面６２と突起６３とが形成されている。保持面６０は、上側チャック１２に対向するように平坦に形成されている。取り付け面６１は、保持面６０を底面とする円柱の側面に沿って形成され、すなわち、保持面６０に隣接し、かつ、保持面６０に垂直になるように形成されている。取り付け面６２は、保持面６０と取り付け面６１より外側に上側チャック１２に対向するように平坦に形成されている。突起６３は、取り付け面６２に形成されている。 As shown in FIG. 4, the lower chuck 11 has a holding surface 60, an attachment surface 61, an attachment surface 62, and a protrusion 63. The holding surface 60 is formed flat so as to face the upper chuck 12. The attachment surface 61 is formed along the side surface of the cylinder whose bottom surface is the holding surface 60, that is, is formed adjacent to the holding surface 60 and perpendicular to the holding surface 60. The attachment surface 62 is formed flat so as to face the upper chuck 12 outside the holding surface 60 and the attachment surface 61. The protrusion 63 is formed on the attachment surface 62.
　８インチ基板下側セット用治具５１の支持部分５２は、図４に示されているように、取り付け面５６と取り付け面５７と穴５８とが形成されている。取り付け面５６は、下側チャック１１の取り付け面６１の一部に密着する曲面に形成されている。取り付け面５７は、下側チャック１１の取り付け面６２の一部に密着するように平坦に形成されている。穴５８は、下側チャック１１の突起６３が挿入されるように形成されている。８インチ基板下側セット用治具５１は、穴５８に突起６３が挿入され、かつ、取り付け面５６が取り付け面６２に密着し、かつ、取り付け面５７が取り付け面６１に密着することにより、下側チャック１１に取り付けられる。 As shown in FIG. 4, the support portion 52 of the 8-inch substrate lower set jig 51 is provided with an attachment surface 56, an attachment surface 57, and a hole 58. The attachment surface 56 is formed in a curved surface that is in close contact with a part of the attachment surface 61 of the lower chuck 11. The attachment surface 57 is formed flat so as to be in close contact with a part of the attachment surface 62 of the lower chuck 11. The hole 58 is formed so that the protrusion 63 of the lower chuck 11 is inserted. The 8-inch substrate lower side setting jig 51 has a projection 63 inserted into the hole 58, the attachment surface 56 is in close contact with the attachment surface 62, and the attachment surface 57 is in close contact with the attachment surface 61. Attached to the side chuck 11.
　位置合わせ部分５３は、位置合わせ面５９が形成されている。位置合わせ面５９は、鉛直方向に平行になるように形成されている。位置合わせ面５９は、８インチ基板下側セット用治具５１が下側チャック１１に取り付けられたときに、下側チャック１１の保持面６０の所定の位置に配置された基板５０の縁に接触するように形成されている。位置合わせ部分５４は、マーク合わせ面が形成されている。そのマーク合わせ面は、鉛直方向に平行になるように形成されている。そのマーク合わせ面は、８インチ基板下側セット用治具５１が下側チャック１１に取り付けられたときに、下側チャック１１の保持面６０の所定の位置に配置された基板５０のノッチに接触するように形成されている。 The alignment portion 53 is formed with an alignment surface 59. The alignment surface 59 is formed to be parallel to the vertical direction. The alignment surface 59 contacts the edge of the substrate 50 disposed at a predetermined position on the holding surface 60 of the lower chuck 11 when the 8-inch substrate lower set jig 51 is attached to the lower chuck 11. It is formed to do. The alignment portion 54 has a mark alignment surface. The mark alignment surface is formed to be parallel to the vertical direction. The mark alignment surface contacts the notch of the substrate 50 arranged at a predetermined position on the holding surface 60 of the lower chuck 11 when the 8-inch substrate lower set jig 51 is attached to the lower chuck 11. It is formed to do.
　図５は、８インチ基板上側セット用治具を示している。その８インチ基板上側セット用治具７１は、支持部分７２と２つの台座部分７３と２つの位置合わせ部分７４とマーク合わせ部分７５とを備えている。支持部分７２は、リング状に形成されている。２つの台座部分７３は、支持部分７２に接合されている。２つの位置合わせ部分７４は、２つの台座部分７３にそれぞれ接合されている。マーク合わせ部分７５は、支持部分７２に接合されている。 FIG. 5 shows an 8-inch substrate upper side setting jig. The 8-inch substrate upper side setting jig 71 includes a support portion 72, two pedestal portions 73, two alignment portions 74, and a mark alignment portion 75. The support portion 72 is formed in a ring shape. The two pedestal portions 73 are joined to the support portion 72. The two alignment portions 74 are joined to the two pedestal portions 73, respectively. The mark alignment portion 75 is joined to the support portion 72.
　８インチ基板上側セット用治具７１の支持部分７２は、図６に示されているように、取り付け面７６と取り付け面７７と穴７８とが形成されている。取り付け面７６は、下側チャック１１の取り付け面６１に密着する曲面に形成されている。取り付け面７７は、下側チャック１１の取り付け面６２に密着するように平坦に形成されている。穴７８は、下側チャック１１の突起６３が挿入されるように形成されている。８インチ基板上側セット用治具７１は、穴７８に突起６３が挿入され、かつ、取り付け面７６が取り付け面６２に密着し、かつ、取り付け面７７が取り付け面６１に密着することにより、下側チャック１１に取り付けられる。 As shown in FIG. 6, the support portion 72 of the 8-inch substrate upper side setting jig 71 has an attachment surface 76, an attachment surface 77, and a hole 78. The attachment surface 76 is formed in a curved surface that is in close contact with the attachment surface 61 of the lower chuck 11. The attachment surface 77 is formed flat so as to be in close contact with the attachment surface 62 of the lower chuck 11. The hole 78 is formed so that the protrusion 63 of the lower chuck 11 is inserted. The 8-inch board upper set jig 71 has a protrusion 63 inserted into the hole 78, the attachment surface 76 is in close contact with the attachment surface 62, and the attachment surface 77 is in close contact with the attachment surface 61. Attached to the chuck 11.
　２つの台座部分７３とマーク合わせ部分７５とは、それぞれ、８インチ基板上側セット用治具７１が下側チャック１１に取り付けられたときに、下側チャック１１の保持面６０から基板５０の厚さ以上に離れるように、支持部分７２に支持されている。２つの台座部分７３は、それぞれ、穴８０と基板支持面８１とが形成されている。マーク合わせ部分７５は、台座部分７３と同様にして基板支持面８１が形成されている。２つの台座部分７３とマーク合わせ部分７５とにそれぞれ形成される３つの基板支持面８１は、同一平面上に沿うように配置されている。 The two pedestal portions 73 and the mark alignment portions 75 are respectively formed so that the thickness of the substrate 50 from the holding surface 60 of the lower chuck 11 when the 8-inch substrate upper setting jig 71 is attached to the lower chuck 11. It is supported by the support part 72 so that it may leave | separate above. Each of the two pedestal portions 73 is formed with a hole 80 and a substrate support surface 81. In the mark alignment portion 75, the substrate support surface 81 is formed in the same manner as the pedestal portion 73. The three substrate support surfaces 81 respectively formed on the two pedestal portions 73 and the mark alignment portions 75 are arranged along the same plane.
　位置合わせ部分７４は、位置合わせ本体部分８３と弾性変形部分８３と支持部分８４とから形成されている。支持部分８４は、台座部分７３に接合され、位置合わせ部分７４を台座部分７３に支持している。弾性変形部分８３は、弾性体から形成され、位置合わせ本体部分８３と弾性変形部分８３とが台座部分７３の穴８０に挿入されるように、弾性変形可能である。位置合わせ本体部分８３は、位置合わせ面７９が形成されている。マーク合わせ部分７５は、図５に示されているように、マーク合わせ面８６が形成されている。 The alignment portion 74 is formed of an alignment main body portion 83, an elastic deformation portion 83, and a support portion 84. The support portion 84 is joined to the pedestal portion 73 and supports the alignment portion 74 to the pedestal portion 73. The elastic deformation portion 83 is formed of an elastic body, and can be elastically deformed such that the alignment main body portion 83 and the elastic deformation portion 83 are inserted into the holes 80 of the pedestal portion 73. The alignment main body portion 83 is formed with an alignment surface 79. As shown in FIG. 5, the mark alignment portion 75 has a mark alignment surface 86 formed thereon.
　８インチ基板上側セット用治具７１は、図７に示されているように、基板支持面８１が基板７０に接触して、基板７０を所定の位置に支持する。位置合わせ面７９は、８インチ基板上側セット用治具７１が下側チャック１１に取り付けられ、基板７０を所定の位置に支持したときに、基板７０の縁が接触するように形成されている。マーク合わせ面８６は、８インチ基板上側セット用治具７１が下側チャック１１に取り付けられ、基板７０を所定の位置に支持したときに、基板７０に形成されるノッチ８５が沿う曲面に沿うように形成されている。 As shown in FIG. 7, the 8-inch substrate upper side setting jig 71 supports the substrate 70 at a predetermined position with the substrate support surface 81 coming into contact with the substrate 70. The alignment surface 79 is formed so that the edge of the substrate 70 contacts when the 8-inch substrate upper setting jig 71 is attached to the lower chuck 11 and supports the substrate 70 at a predetermined position. When the 8-inch substrate upper set jig 71 is attached to the lower chuck 11 and the substrate 70 is supported at a predetermined position, the mark alignment surface 86 follows a curved surface along which a notch 85 formed on the substrate 70 follows. Is formed.
　図８は、２インチ基板下側セット用治具を示している。その２インチ基板下側セット用治具９１は、支持部分９２と位置合わせ部分９３とマーク合わせ部分９４とハンドル９５とを備えている。位置合わせ部分９３は、支持部分９２に接合されている。マーク合わせ部分９４は、支持部分９２に接合されている。ハンドル９５は、支持部分９２に接合されている。 FIG. 8 shows a jig for setting the lower side of the 2-inch substrate. The 2-inch substrate lower set jig 91 includes a support portion 92, an alignment portion 93, a mark alignment portion 94, and a handle 95. The alignment portion 93 is joined to the support portion 92. The mark alignment portion 94 is joined to the support portion 92. The handle 95 is joined to the support portion 92.
　２インチ基板下側セット用治具９１の支持部分９２は、８インチ基板下側セット用治具５１と同様にして、２つの取り付け面と穴とが形成されている。その２つの取り付け面の一方は、下側チャック１１の取り付け面６１の一部に密着する曲面に形成されている。その２つの取り付け面の他方は、下側チャック１１の取り付け面６２の一部に密着するように平坦に形成されている。その穴は、下側チャック１１の突起６３が挿入されるように形成されている。２インチ基板下側セット用治具９１は、その穴に突起６３が挿入され、かつ、その２つの取り付け面が取り付け面６２と取り付け面６１とにそれぞれ密着することにより、下側チャック１１に取り付けられる。 The support portion 92 of the 2-inch substrate lower set jig 91 is formed with two attachment surfaces and holes in the same manner as the 8-inch substrate lower set jig 51. One of the two attachment surfaces is formed into a curved surface that is in close contact with a part of the attachment surface 61 of the lower chuck 11. The other of the two attachment surfaces is formed flat so as to be in close contact with a part of the attachment surface 62 of the lower chuck 11. The hole is formed so that the protrusion 63 of the lower chuck 11 is inserted. The jig 91 for setting the lower side of the 2-inch substrate is attached to the lower chuck 11 by the protrusion 63 being inserted into the hole and the two attachment surfaces being in close contact with the attachment surface 62 and the attachment surface 61, respectively. It is done.
　位置合わせ部分９３は、位置合わせ面が形成されている。その位置合わせ面は、鉛直方向に平行になるように形成されている。その位置合わせ面は、２インチ基板下側セット用治具９１が下側チャック１１に取り付けられたときに、下側チャック１１の保持面６０の所定の位置に配置された基板９０の縁に接触するように形成されている。マーク合わせ部分９４は、マーク合わせ面が形成されている。そのマーク合わせ面は、鉛直方向に平行になるように形成されている。そのマーク合わせ面は、２インチ基板下側セット用治具９１が下側チャック１１に取り付けられたときに、下側チャック１１の保持面６０の所定の位置に配置された基板９０のオリエンテーションフラットに接触するように形成されている。 The alignment portion 93 has an alignment surface. The alignment surface is formed so as to be parallel to the vertical direction. The alignment surface contacts the edge of the substrate 90 disposed at a predetermined position on the holding surface 60 of the lower chuck 11 when the 2-inch substrate lower set jig 91 is attached to the lower chuck 11. It is formed to do. The mark alignment portion 94 has a mark alignment surface. The mark alignment surface is formed to be parallel to the vertical direction. The mark alignment surface is an orientation flat of the substrate 90 arranged at a predetermined position on the holding surface 60 of the lower chuck 11 when the 2-inch substrate lower set jig 91 is attached to the lower chuck 11. It is formed to contact.
　図９は、２インチ基板上側セット用治具を示している。その２インチ基板上側セット用治具１０１は、８インチ基板上側セット用治具７１と同様にして、支持部分１０２と２つの台座部分１０３と２つの位置合わせ部分１０４とマーク合わせ部分１０５とを備えている。支持部分１０２は、リング状に形成されている。２つの台座部分１０３は、支持部分１０２に接合されている。２つの位置合わせ部分１０４は、２つの台座部分１０３にそれぞれ接合されている。マーク合わせ部分１０５は、支持部分１０２に接合されている。 FIG. 9 shows the jig for setting the upper side of the 2-inch substrate. Similar to the 8-inch substrate upper side setting jig 71, the 2-inch substrate upper side setting jig 101 includes a support portion 102, two pedestal portions 103, two alignment portions 104, and a mark alignment portion 105. ing. The support portion 102 is formed in a ring shape. The two pedestal portions 103 are joined to the support portion 102. The two alignment portions 104 are joined to the two pedestal portions 103, respectively. The mark alignment part 105 is joined to the support part 102.
　２インチ基板上側セット用治具１０１の支持部分１０２は、８インチ基板上側セット用治具７１の支持部分７２と同様にして、２つの取り付け面と穴とが形成されている。その２つの取り付け面の一方は、下側チャック１１の取り付け面６１に密着する曲面に形成されている。その２つの取り付け面の他方は、下側チャック１１の取り付け面６２に密着するように平坦に形成されている。その穴は、下側チャック１１の突起６３が挿入されるように形成されている。２インチ基板上側セット用治具１０１は、その穴に突起６３が挿入され、かつ、２つの取り付け面が取り付け面６２と取り付け面６１とにそれぞれ密着することにより、下側チャック１１に取り付けられる。 The support portion 102 of the 2-inch substrate upper side setting jig 101 is formed with two attachment surfaces and holes in the same manner as the support portion 72 of the 8-inch substrate upper side setting jig 71. One of the two attachment surfaces is formed in a curved surface that is in close contact with the attachment surface 61 of the lower chuck 11. The other of the two attachment surfaces is formed flat so as to be in close contact with the attachment surface 62 of the lower chuck 11. The hole is formed so that the protrusion 63 of the lower chuck 11 is inserted. The 2-inch substrate upper setting jig 101 is attached to the lower chuck 11 by inserting the protrusion 63 into the hole and bringing the two attachment surfaces into close contact with the attachment surface 62 and the attachment surface 61, respectively.
　２つの台座部分１０３とマーク合わせ部分１０５とは、それぞれ、２インチ基板上側セット用治具１０１が下側チャック１１に取り付けられたときに、下側チャック１１の保持面６０から基板の厚さ以上に離れるように、支持部分１０２に支持されている。２つの台座部分１０３は、それぞれ、穴と基板支持面とが形成されている。マーク合わせ部分１０５は、台座部分１０３と同様にして基板支持面が形成されている。２つの台座部分１０３とマーク合わせ部分１０５とにそれぞれ形成される３つの基板支持面は、同一平面上に沿うように配置されている。 The two pedestal portions 103 and the mark aligning portion 105 are each equal to or more than the thickness of the substrate from the holding surface 60 of the lower chuck 11 when the 2-inch substrate upper setting jig 101 is attached to the lower chuck 11. It is supported by the support part 102 so that it may leave | separate. The two pedestal portions 103 each have a hole and a substrate support surface. The mark alignment portion 105 is formed with a substrate support surface in the same manner as the pedestal portion 103. Three substrate support surfaces respectively formed on the two pedestal portions 103 and the mark alignment portions 105 are arranged along the same plane.
　位置合わせ部分１０４は、位置合わせ部分７４と同様にして、位置合わせ面が形成されている。位置合わせ部分１０４は、位置合わせ面が形成されている部分が台座部分１０３の穴に挿入されるように、弾性変形可能である。マーク合わせ部分１０５は、マーク合わせ面１０８が形成されている。 The alignment portion 104 is formed with an alignment surface in the same manner as the alignment portion 74. The alignment portion 104 is elastically deformable so that the portion where the alignment surface is formed is inserted into the hole of the pedestal portion 103. In the mark alignment portion 105, a mark alignment surface 108 is formed.
　２インチ基板上側セット用治具１０１は、図１０に示されているように、基板支持面が基板１００に接触して、基板１００を所定の位置に支持する。位置合わせ部分１０４の位置合わせ面は、２インチ基板上側セット用治具１０１が下側チャック１１に取り付けられ、基板１００を所定の位置に支持したときに、基板１００の縁が接触するように形成されている。マーク合わせ面１０８は、２インチ基板上側セット用治具１０１が下側チャック１１に取り付けられ、基板１００を所定の位置に支持したときに、基板１００に形成されるオリエンテーションフラットが沿う平面に沿うように形成されている。 As shown in FIG. 10, the 2-inch substrate upper side setting jig 101 supports the substrate 100 at a predetermined position with the substrate support surface coming into contact with the substrate 100. The alignment surface of the alignment portion 104 is formed so that the edge of the substrate 100 contacts when the 2-inch substrate upper set jig 101 is attached to the lower chuck 11 and the substrate 100 is supported at a predetermined position. Has been. When the 2-inch substrate upper setting jig 101 is attached to the lower chuck 11 and the substrate 100 is supported at a predetermined position, the mark alignment surface 108 follows a plane along which an orientation flat formed on the substrate 100 is aligned. Is formed.
　図１１は、下側チャック１１により保持される配置用プレートを示している。その配置用プレート１１１は、半導体ウェハから形成され、接合される基板に対向する面が疎水性部分１１２と親水性部分１１３－１～１１３－ｎ（ｎ＝２，３，４，…）とから形成されている。疎水性部分１１２は、親水性部分１１３－１～１１３－ｎより疎水性に形成されている。親水性部分１１３－１～１１３－ｎの各々は、積層接合装置１を用いて接合されるチップに一致する形状（たとえば、長方形状）に形成され、疎水性部分１１２に囲まれて配置されている。配置用プレート１１１は、さらに、周縁にノッチまたはオリエンテーションフラットが形成され、疎水性部分１１２に２つのアライメントマークが形成されている。 FIG. 11 shows an arrangement plate held by the lower chuck 11. The arrangement plate 111 is formed of a semiconductor wafer, and the surface facing the substrate to be bonded is composed of a hydrophobic portion 112 and hydrophilic portions 113-1 to 113-n (n = 2, 3, 4,...). Is formed. The hydrophobic portion 112 is formed to be more hydrophobic than the hydrophilic portions 113-1 to 113-n. Each of the hydrophilic portions 113-1 to 113-n is formed in a shape (for example, a rectangular shape) that matches a chip to be bonded using the multilayer bonding apparatus 1, and is surrounded by the hydrophobic portion 112. Yes. The arrangement plate 111 is further formed with a notch or an orientation flat at the periphery, and two alignment marks are formed on the hydrophobic portion 112.
　図１２は、上側チャック１２により保持されるアダプタプレートを示している。そのアダプタプレート１１４は、くぼみ１１５と複数の孔１１６とが形成されている。くぼみ１１５は、接合される基板に対向する面の反対側の面に形成されている。複数の孔１１６は、接合される基板に対向する面とくぼみ１１５とを貫通するように形成され、アダプタプレート１１４が配置用プレート１１１に対向するときに親水性部分１１３－１～１１３－ｎに対向するように配置されている。アダプタプレート１１４は、真空チャック用配管３３の周縁真空チャック用配管から排気されることにより、接合される基板に対向する面の反対側の面のうちのくぼみ１１５を除く外周部が上側チャック１２に吸着されて、上側チャック１２に保持される。アダプタプレート１１４は、上側チャック１２により保持されているときに、真空チャック用配管３３の中央真空チャック用配管によりくぼみ１１５と複数の孔１１６を介して空気が排気されることにより、複数の孔１１６に接して配置されているチップ１１９を保持する。アダプタプレート１１４は、さらに、周縁にノッチまたはオリエンテーションフラットが形成されている。チップ１１９は、接合される面に接着剤が配置されている。その接着剤としては、金属バンプ、紫外線硬化樹脂が例示される。 FIG. 12 shows the adapter plate held by the upper chuck 12. The adapter plate 114 is formed with a recess 115 and a plurality of holes 116. The recess 115 is formed on the surface opposite to the surface facing the substrate to be bonded. The plurality of holes 116 are formed so as to penetrate the surface facing the substrate to be bonded and the recess 115, and when the adapter plate 114 faces the placement plate 111, the holes 116-1 to 113-n are formed in the hydrophilic portions 113-1 to 113-n. It arrange | positions so that it may oppose. The adapter plate 114 is evacuated from the peripheral vacuum chuck piping of the vacuum chuck piping 33, so that the outer peripheral portion of the surface opposite to the surface facing the substrate to be joined is removed from the upper chuck 12. It is adsorbed and held on the upper chuck 12. When the adapter plate 114 is held by the upper chuck 12, air is exhausted through the recess 115 and the plurality of holes 116 by the central vacuum chuck pipe of the vacuum chuck pipe 33, thereby the plurality of holes 116. The chip 119 arranged in contact with the substrate is held. The adapter plate 114 is further formed with a notch or an orientation flat at the periphery. The chip 119 has an adhesive disposed on the surfaces to be joined. Examples of the adhesive include metal bumps and ultraviolet curable resins.
　積層接合装置１を用いて実行される積層接合方法は、基板をチャックに保持させる動作と配置用プレートにチップを保持させる動作と基板を位置合わせする動作と基板を接合する動作とを備えている。 The lamination bonding method executed using the lamination bonding apparatus 1 includes an operation for holding the substrate on the chuck, an operation for holding the chip on the arrangement plate, an operation for aligning the substrate, and an operation for bonding the substrate. .
　その基板をチャックに保持させる動作は、下側チャック１１に８インチ基板を保持させる動作と上側チャック１２に８インチ基板を保持させる動作と下側チャック１１に２インチ基板を保持させる動作と上側チャック１２に２インチ基板を保持させる動作とを備えている。 The operation of holding the substrate on the chuck includes the operation of holding the 8-inch substrate on the lower chuck 11, the operation of holding the 8-inch substrate on the upper chuck 12, the operation of holding the 2-inch substrate on the lower chuck 11, and the upper chuck. 12 to hold a 2-inch substrate.
　ユーザは、下側チャック１１に８インチ基板を保持させるときに、まず、８インチ基板下側セット用治具５１の穴５８に下側チャック１１の突起６３を挿入し、取り付け面５６を取り付け面６２に密着させ、取り付け面５７を取り付け面６１に密着させることにより、８インチ基板下側セット用治具５１を下側チャック１１に取り付ける。ユーザは、次いで、８インチ基板を下側チャック１１の保持面６０に接触するように配置した後に、８インチ基板の縁が位置合わせ面５９に接触し、８インチ基板のノッチが位置合わせ部分５４のマーク合わせ面に接触するように、８インチ基板を摺動させる。ユーザは、次いで、下側チャック１１に８インチ基板を保持させて、８インチ基板下側セット用治具５１を下側チャック１１から取り外す。 When the user holds the 8-inch substrate on the lower chuck 11, first, the projection 63 of the lower chuck 11 is inserted into the hole 58 of the jig 51 for lowering the 8-inch substrate, and the attachment surface 56 is attached to the attachment surface 56. The 8-inch substrate lower set jig 51 is attached to the lower chuck 11 by bringing the attachment surface 57 into close contact with the attachment surface 61. The user then places the 8 inch substrate in contact with the holding surface 60 of the lower chuck 11, and then the edge of the 8 inch substrate contacts the alignment surface 59 and the notch of the 8 inch substrate is aligned with the alignment portion 54. The 8-inch substrate is slid so as to contact the mark alignment surface. Next, the user holds the 8-inch substrate on the lower chuck 11 and removes the 8-inch substrate lower set jig 51 from the lower chuck 11.
　ユーザは、上側チャック１２に８インチ基板を保持させるときに、まず、８インチ基板上側セット用治具７１の穴７８に上側チャック１２の突起６３を挿入し、取り付け面７６を取り付け面６２に密着させ、取り付け面７７を取り付け面６１に密着させることにより、８インチ基板上側セット用治具７１を下側チャック１１に取り付ける。ユーザは、次いで、８インチ基板を基板支持面８１に接触するように配置した後に、８インチ基板の縁が位置合わせ面７９に接触し、８インチ基板のノッチがマーク合わせ面８６に揃うように、８インチ基板を摺動させる。ユーザは、次いで、圧接用駆動装置５を用いて、下側チャック１１を上側チャック１２に近づけ、８インチ基板が上側チャック１２に接触したときに、上側チャック１２に８インチ基板を保持させる。ユーザは、次いで、８インチ基板上側セット用治具７１を上側チャック１２から取り外す。 When the user holds the 8-inch substrate on the upper chuck 12, first, the protrusion 63 of the upper chuck 12 is inserted into the hole 78 of the upper jig 71 for setting the 8-inch substrate, and the mounting surface 76 is brought into close contact with the mounting surface 62. Then, the mounting surface 77 is brought into close contact with the mounting surface 61, thereby attaching the 8-inch substrate upper side setting jig 71 to the lower chuck 11. The user then places the 8-inch substrate in contact with the substrate support surface 81, and then the edge of the 8-inch substrate contacts the alignment surface 79 and the notch of the 8-inch substrate aligns with the mark alignment surface 86. Slide the 8-inch substrate. Next, the user uses the pressing drive device 5 to bring the lower chuck 11 closer to the upper chuck 12 and to hold the 8-inch substrate on the upper chuck 12 when the 8-inch substrate contacts the upper chuck 12. Next, the user removes the 8-inch substrate upper side setting jig 71 from the upper side chuck 12.
　ユーザは、下側チャック１１に２インチ基板を保持させるときに、まず、２インチ基板下側セット用治具９１の穴に下側チャック１１の突起６３を挿入し、２つの取り付け面を取り付け面６２と取り付け面６１とに密着させることにより、２インチ基板下側セット用治具９１を下側チャック１１に取り付ける。ユーザは、次いで、２インチ基板を下側チャック１１の保持面６０に接触するように配置した後に、２インチ基板の縁が位置合わせ部分９３の位置合わせ面に接触し、２インチ基板のオリエンテーションフラットがマーク合わせ部分９４のマーク合わせ面に接触するように、２インチ基板を摺動させる。ユーザは、次いで、下側チャック１１に８インチ基板を保持させて、２インチ基板下側セット用治具９１を下側チャック１１から取り外す。 When the user holds the 2-inch substrate on the lower chuck 11, first, the projection 63 of the lower chuck 11 is inserted into the hole of the jig 91 for setting the lower side of the 2-inch substrate, and the two attachment surfaces are attached to the attachment surface. The jig 91 for setting the lower side of the 2-inch substrate is attached to the lower chuck 11 by bringing it into close contact with 62 and the attachment surface 61. The user then places the 2 inch substrate in contact with the holding surface 60 of the lower chuck 11 and then the edge of the 2 inch substrate contacts the alignment surface of the alignment portion 93 and the orientation flat of the 2 inch substrate. The 2 inch substrate is slid so that is in contact with the mark alignment surface of the mark alignment portion 94. Next, the user holds the 8-inch substrate on the lower chuck 11 and removes the 2-inch substrate lower set jig 91 from the lower chuck 11.
　ユーザは、上側チャック１２に２インチ基板を保持させるときに、まず、２インチ基板上側セット用治具１０１の穴に上側チャック１２の突起６３を挿入し、２つの取り付け面を取り付け面６２と取り付け面６１とに密着させることにより、２インチ基板上側セット用治具１０１を下側チャック１１に取り付ける。ユーザは、次いで、２インチ基板を基板支持面に接触するように配置した後に、２インチ基板の縁が位置合わせ部分１０４の位置合わせ面に接触し、２インチ基板のオリエンテーションフラットがマーク合わせ面１０８に揃うように、２インチ基板を摺動させる。ユーザは、次いで、圧接用駆動装置５を用いて、下側チャック１１を上側チャック１２に近づけ、２インチ基板が上側チャック１２に接触したときに、上側チャック１２に２インチ基板を保持させる。ユーザは、次いで、２インチ基板上側セット用治具１０１を上側チャック１２から取り外す。 When the user holds the 2-inch substrate on the upper chuck 12, first, the protrusion 63 of the upper chuck 12 is inserted into the hole of the 2-inch substrate upper setting jig 101, and the two attachment surfaces are attached to the attachment surface 62. The 2-inch substrate upper set jig 101 is attached to the lower chuck 11 by being in close contact with the surface 61. The user then places the 2 inch substrate in contact with the substrate support surface, and then the edge of the 2 inch substrate contacts the alignment surface of the alignment portion 104 and the orientation flat of the 2 inch substrate aligns the mark alignment surface 108. The 2 inch substrate is slid so as to be aligned with each other. Next, the user brings the lower chuck 11 close to the upper chuck 12 by using the pressure contact driving device 5 and causes the upper chuck 12 to hold the 2-inch substrate when the 2-inch substrate contacts the upper chuck 12. Next, the user removes the 2-inch substrate upper side setting jig 101 from the upper side chuck 12.
　このような動作によれば、ユーザは、基板のアライメントマークがアライメント装置１９により撮像されるように、下側チャック１１の所定の位置に基板をより容易に保持させることができ、上側チャック１２の所定の位置に基板をより容易に保持させることができる。下側チャック１１に基板を保持させた後に上側チャック１２に基板を保持させるときに、８インチ基板上側セット用治具７１または２インチ基板上側セット用治具１０１は、下側チャック１１の基板に接触することがなく、下側チャック１１の基板が破損することを防止することができる。 According to such an operation, the user can more easily hold the substrate at a predetermined position of the lower chuck 11 so that the alignment mark of the substrate is imaged by the alignment device 19. The substrate can be held more easily at a predetermined position. When holding the substrate on the upper chuck 12 after holding the substrate on the lower chuck 11, the 8-inch substrate upper set jig 71 or the 2-inch substrate upper set jig 101 is placed on the substrate of the lower chuck 11. It is possible to prevent the substrate of the lower chuck 11 from being damaged without contact.
　配置用プレート１１１にチップ１１９を保持させる動作では、ユーザは、まず、その基板をチャックに保持させる動作と同様にして、アダプタプレート１１４を上側チャック１２に保持させる。ユーザは、アダプタプレート１１４が上側チャック１２により保持されているときに、真空チャック用配管３３の中央真空チャック用配管を用いてくぼみ１１５と複数の孔１１６を介して空気を排気することにより、複数の孔１１６に接して配置されているチップ１１９をアダプタプレート１１４に保持させる。ユーザは、次いで、その基板をチャックに保持させる動作を用いて配置用プレート１１１を下側チャック１１に保持させる。ユーザは、配置用プレート１１１の親水性部分１１３－１～１１３－ｎに水滴を滴下した後に、上側チャック１２の真空チャック用配管３３の中央真空チャック用配管による排気を停止して、配置用プレート１１１上にチップ１１９を落下させる。このとき、チップ１１９は、その水滴の表面張力により親水性部分１１３－１～１１３－ｎに一致するように移動し、その水滴が乾燥した後に親水性部分１１３－１～１１３－ｎに高精度に保持される。ユーザは、チップ１１９が配置用プレート１１１に保持された後にアダプタプレート１１４を上側チャック１２から取り外す。このような動作によれば、ユーザは、配置用プレート１１１にチップを直に高精度に配置する必要がなく、アダプタプレート１１４にチップを高精度に配置する必要がなく、配置用プレート１１１の所定の位置にチップ１１９をより容易に保持させることができる。 In the operation of holding the chip 119 on the placement plate 111, the user first holds the adapter plate 114 on the upper chuck 12 in the same manner as the operation of holding the substrate on the chuck. When the adapter plate 114 is held by the upper chuck 12, the user uses the central vacuum chuck pipe of the vacuum chuck pipe 33 to exhaust air through the recess 115 and the plurality of holes 116. The chip 119 disposed in contact with the hole 116 is held by the adapter plate 114. Next, the user causes the lower chuck 11 to hold the placement plate 111 by using an operation of holding the substrate by the chuck. After the user drops water droplets on the hydrophilic portions 113-1 to 113-n of the arrangement plate 111, the user stops the exhaust by the central vacuum chuck pipe of the vacuum chuck pipe 33 of the upper chuck 12, and the arrangement plate The chip 119 is dropped on the substrate 111. At this time, the chip 119 moves so as to coincide with the hydrophilic portions 113-1 to 113-n due to the surface tension of the water droplets, and after the water droplets are dried, the hydrophilic portions 113-1 to 113-n have high accuracy. Retained. The user removes the adapter plate 114 from the upper chuck 12 after the chip 119 is held on the placement plate 111. According to such an operation, the user does not need to place the chip directly on the placement plate 111 with high precision, and does not need to place the chip on the adapter plate 114 with high precision. The chip 119 can be more easily held at the position.
　その基板を位置合わせする動作は、その基板をチャックに保持させる動作を実行した後に実行される。制御装置１６は、まず、圧接用駆動装置５を用いて、下側チャック１１を上側チャック１２に所定の距離まで近づける。制御装置１６は、レンズ４４が上側チャック１２の穴３６の内部に配置されるように、レンズ駆動装置４２を用いてレンズ４４を駆動する。制御装置１６は、透過光照明４１を用いて、または、同軸落射用照明４５を用いて、下側チャック１１に保持される基板と上側チャック１２に保持される基板とに赤外線を照射する。制御装置１６は、カメラ４３を用いて下側チャック１１に保持される基板のアライメントマークと上側チャック１２に保持される基板のアライメントマークとを画像に撮像する。このとき、制御装置１６は、レンズ駆動装置４２を用いてレンズ４４を駆動することにより、ピントを合わせる。制御装置１６は、下側チャック１１に保持される基板のアライメントマークと上側チャック１２に保持される基板のアライメントマークとがその画像に重なって映し出されるように、アライメント用駆動装置８を用いて下側チャック１１を駆動する。 The operation for aligning the substrate is executed after the operation for holding the substrate on the chuck is executed. First, the control device 16 brings the lower chuck 11 closer to the upper chuck 12 to a predetermined distance by using the pressing drive device 5. The control device 16 drives the lens 44 using the lens driving device 42 so that the lens 44 is disposed inside the hole 36 of the upper chuck 12. The control device 16 irradiates the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 with infrared rays using the transmitted light illumination 41 or the coaxial incident illumination 45. The control device 16 images the substrate alignment mark held by the lower chuck 11 and the substrate alignment mark held by the upper chuck 12 in an image using the camera 43. At this time, the control device 16 focuses by driving the lens 44 using the lens driving device 42. The control device 16 uses the alignment drive device 8 so that the alignment mark of the substrate held by the lower chuck 11 and the alignment mark of the substrate held by the upper chuck 12 are projected onto the image. The side chuck 11 is driven.
　その基板を接合する動作は、その基板を位置合わせする動作の後に実行される。制御装置１６は、まず、レンズ４４が上側チャック１２の穴３６の外に配置されるように、レンズ駆動装置４２を用いてレンズ４４を駆動する。制御装置１６は、ヒータ２５を用いて下側チャック１１に保持される基板を加熱し、ヒータ３５を用いて上側チャック１２に保持される基板を加熱する。制御装置１６は、ロードセル１５－１～１５－３を伸び切った状態にする。制御装置１６は、次いで、第１モードの動作と第２モードの動作とを実行する。 The operation for bonding the substrates is performed after the operation for aligning the substrates. First, the control device 16 drives the lens 44 using the lens driving device 42 so that the lens 44 is disposed outside the hole 36 of the upper chuck 12. The control device 16 heats the substrate held on the lower chuck 11 using the heater 25 and heats the substrate held on the upper chuck 12 using the heater 35. The control device 16 keeps the load cells 15-1 to 15-3 fully extended. Next, the control device 16 executes the operation in the first mode and the operation in the second mode.
　このようにレンズ４４が上側チャック１２の穴３６の外に配置された後に、下側チャック１１または上側チャック１２に保持される基板を加熱することによれば、レンズ４４は、その熱により破損することが防止される。 After the lens 44 is thus disposed outside the hole 36 of the upper chuck 12, the lens 44 is damaged by the heat by heating the lower chuck 11 or the substrate held by the upper chuck 12. It is prevented.
　第１モードの動作は、圧電素子１４－１～１４－３ごとに独立して実行される。図１３は、圧電素子１４－ｉにおける第１モードの動作を示している。制御装置１６は、ロードセル１５－１～１５－３を用いて圧電素子１４－１～１４－３に印加される力を測定する（ステップＳ１）。制御装置１６は、下側チャック１１に保持される基板のうちの圧電素子１４－ｉに対応する部位が上側チャック１２に保持される基板に接触しているかどうかを判別する（ステップＳ２）。すなわち、制御装置１６は、圧電素子１４－ｉに印加される力が所定の力より大きいかどうかを判別する。 The operation in the first mode is executed independently for each of the piezoelectric elements 14-1 to 14-3. FIG. 13 shows the operation of the first mode in the piezoelectric element 14-i. The control device 16 measures the force applied to the piezoelectric elements 14-1 to 14-3 using the load cells 15-1 to 15-3 (step S1). The control device 16 determines whether or not a portion of the substrate held by the lower chuck 11 that corresponds to the piezoelectric element 14-i is in contact with the substrate held by the upper chuck 12 (step S2). That is, the control device 16 determines whether or not the force applied to the piezoelectric element 14-i is greater than a predetermined force.
　制御装置１６は、圧電素子１４－ｉに印加される力が所定の力より大きく（ステップＳ２、ＹＥＳ）、圧電素子１４－ｊ（ｊ＝１，２，３；ｊ≠ｉ）に印加される力が所定の力より小さいときに（ステップＳ３、ＮＯ）、圧電素子１４－ｉを所定の長さだけ短縮させる（ステップＳ４）。制御装置１６は、圧電素子１４－１～１４－３に印加される力の全部が所定の力より大きくなるまで、ステップＳ１～Ｓ３の動作を繰り返して実行する。制御装置１６は、圧電素子１４－１～１４－３に印加される力の全部が所定の力より大きいときに（ステップＳ３、ＹＥＳ）、第２モードの動作を開始する。 The control device 16 applies a force applied to the piezoelectric element 14-i larger than a predetermined force (step S2, YES), and is applied to the piezoelectric element 14-j (j = 1, 2, 3; j ≠ i). When the force is smaller than the predetermined force (step S3, NO), the piezoelectric element 14-i is shortened by a predetermined length (step S4). The control device 16 repeats the operations of steps S1 to S3 until all of the forces applied to the piezoelectric elements 14-1 to 14-3 are greater than a predetermined force. When all of the forces applied to the piezoelectric elements 14-1 to 14-3 are larger than the predetermined force (step S3, YES), the control device 16 starts the second mode operation.
　図１４は、第２モードの動作を示している。制御装置１６は、ロードセル１５－１～１５－３を用いて圧電素子１４－１～１４－３に印加される力を測定する（ステップＳ１１）。制御装置１６は、その測定された３つの力の和が所定の値になるように、圧接用駆動装置５を用いて下側チャック１１駆動する（ステップＳ１２）。制御装置１６は、圧電素子１４－１に印加される力がその所定の力の１／３になるように、圧電素子１４－１を伸縮させる（ステップＳ１３）。制御装置１６は、圧電素子１４－２に印加される力がその所定の力の１／３になるように、圧電素子１４－２を伸縮させる（ステップＳ１４）。制御装置１６は、圧電素子１４－３に印加される力がその所定の力の１／３になるように、圧電素子１４－３を伸縮させる（ステップＳ１５）。制御装置１６は、その測定された３つの力の和が所定の値になっている時間が所定の時間を越えるまで、ステップＳ１１～Ｓ１５の動作を繰り返して実行する。制御装置１６は、第２モードの動作が終了すると、所定の温度まで冷却するように冷却用配管２４に窒素ガスを流通させ、下側チャック１１を上側チャック１２に所定の距離まで離す。 FIG. 14 shows the operation in the second mode. The control device 16 measures the force applied to the piezoelectric elements 14-1 to 14-3 using the load cells 15-1 to 15-3 (step S11). The control device 16 drives the lower chuck 11 using the press contact driving device 5 so that the sum of the three measured forces becomes a predetermined value (step S12). The control device 16 expands and contracts the piezoelectric element 14-1 so that the force applied to the piezoelectric element 14-1 is 1/3 of the predetermined force (step S13). The control device 16 expands and contracts the piezoelectric element 14-2 so that the force applied to the piezoelectric element 14-2 becomes 1/3 of the predetermined force (step S14). The control device 16 expands and contracts the piezoelectric element 14-3 so that the force applied to the piezoelectric element 14-3 is 1/3 of the predetermined force (step S15). The control device 16 repeatedly executes the operations of steps S11 to S15 until the time when the sum of the three measured forces is a predetermined value exceeds the predetermined time. When the operation of the second mode is completed, the control device 16 causes the nitrogen gas to flow through the cooling pipe 24 so as to cool to a predetermined temperature, and separates the lower chuck 11 from the upper chuck 12 to a predetermined distance.
　このような動作によれば、下側チャック１１に保持される基板と上側チャック１２に保持される基板とが接着剤により接合され、１枚の接合基板が生成される。このような冷却によれば、接合基板は、放冷による冷却に比較して、下側チャック１１または上側チャック１２からより早く取り出すことができ、複数対の接合対象基板をより速く接合することができる。 According to such an operation, the substrate held by the lower chuck 11 and the substrate held by the upper chuck 12 are bonded by the adhesive, and one bonded substrate is generated. According to such cooling, the bonded substrate can be taken out from the lower chuck 11 or the upper chuck 12 earlier than cooling by cooling, and a plurality of pairs of bonding target substrates can be bonded faster. it can.
　なお、下側チャック１１または上側チャック１２により保持される基板は、アダプタプレート１１１を備えない他の基板に置換されることができる。その基板としては、複数のＭＥＭＳにそれぞれ形成される複数のパターンが１枚の半導体ウェハに形成されているものが例示される。このとき、積層接合装置１は、アダプタプレート１１１を備える基板と同様にして、高精度に接合することができる。積層接合装置１は、半導体ウェハに形成されている複数のパターンのうちの一部のパターンが不良である場合で、その半導体ウェハを接合したときに、他の良品のパターンに悪影響を及ぼすことがある。積層接合装置１は、アダプタプレート１１１を用いた場合で、複数のチップ１１９が不良である不良チップを含んでいるときに、その不良チップを取り外して接合することができ、複数のチップ１１９の全部を不良とする必要がなく、複数のチップ１１９をより効率よく接合することができる。 Note that the substrate held by the lower chuck 11 or the upper chuck 12 can be replaced with another substrate that does not include the adapter plate 111. As the substrate, a substrate in which a plurality of patterns respectively formed on a plurality of MEMS are formed on one semiconductor wafer is exemplified. At this time, the multi-layer bonding apparatus 1 can be bonded with high accuracy in the same manner as the substrate including the adapter plate 111. The multi-layer bonding apparatus 1 is a case where some of the plurality of patterns formed on the semiconductor wafer are defective, and when the semiconductor wafer is bonded, it may adversely affect other good patterns. is there. In the case of using the adapter plate 111, the multi-layer bonding apparatus 1 can remove and bond the defective chips when the plurality of chips 119 include defective chips, and all of the plurality of chips 119 can be joined. Therefore, it is possible to join the plurality of chips 119 more efficiently.
　本発明による積層接合装置用治具によれば、ユーザは、接合対象を保持するチャックにその接合対象をより容易に配置することができる。 According to the jig for the laminating and joining apparatus according to the present invention, the user can more easily arrange the joining target on the chuck that holds the joining target.

Claims (7)

  1. 　接合対象基板を保持するチャックに接触するチャック接触面が形成される支持部分と、
    　位置合わせ対象基板の縁に接触する位置合わせ面が形成される位置合わせ部分とを具備し、
    　前記チャックは、前記チャック接触面に接触する面に第１嵌合部分が形成され、
    　前記支持部分は、前記第１嵌合部分に嵌合する第２嵌合部分が前記チャック接触面に形成される
    　積層接合装置用治具。     A support portion on which a chuck contact surface that contacts a chuck that holds a bonding target substrate is formed;
    An alignment portion formed with an alignment surface that contacts the edge of the alignment target substrate,
    The chuck has a first fitting portion formed on a surface that contacts the chuck contact surface,
    The jig for a laminating and bonding apparatus, wherein the support part is formed with a second fitting part that fits into the first fitting part on the chuck contact surface.
  2. 　請求の範囲１において、
    　前記位置合わせ対象基板のうちの前記チャックに対向する面の一部に接触して前記位置合わせ対象を支持する支持面が形成される台座部分を更に具備し、
    　前記支持部分は、前記台座部分を前記チャックに接触しないように支持する
    　積層接合装置用治具。     In claim 1,
    A pedestal portion on which a support surface for supporting the alignment target is formed in contact with a part of the surface of the alignment target substrate facing the chuck;
    The support portion supports the pedestal portion so as not to contact the chuck.
  3. 　請求の範囲２において、
    　前記支持部分に対して移動可能に前記位置合わせ部分を支持する位置合わせ部分支持部分
    　を更に具備する積層接合装置用治具。     In claim 2,
    The jig | tool for lamination | stacking joining apparatuses which further comprises the alignment part support part which supports the said alignment part so that a movement with respect to the said support part is possible.
  4. 　請求の範囲３において、
    　前記位置合わせ部分支持部分は、一端が前記支持部分に接合され、他端が前記位置合わせ部分に接合される弾性体から形成される
    　積層接合装置用治具。     In claim 3,
    The alignment part support part is formed from an elastic body having one end joined to the support part and the other end joined to the alignment part.
  5. 　請求の範囲２～請求の範囲４のいずれかにおいて、
    　前記位置合わせ対象基板が所定の位置に配置されたときに前記縁に形成されるマークに揃うマーク合わせ面が形成されるマーク合わせ部分
    　を更に具備する積層接合装置用治具。     In any one of claims 2 to 4,
    A jig for a laminating and bonding apparatus, further comprising: a mark alignment portion on which a mark alignment surface aligned with a mark formed on the edge when the alignment target substrate is disposed at a predetermined position.
  6. 　請求の範囲１において、
    　前記位置合わせ対象基板は、前記チャックに接触した状態で前記縁が前記位置合わせ面に接触する
    　積層接合装置用治具。     In claim 1,
    The alignment target substrate has the edge in contact with the alignment surface in a state of being in contact with the chuck.
  7. 　請求の範囲６において、
    　前記位置合わせ対象基板が所定の位置に配置されたときに前記縁に形成されるマークに接触するマーク合わせ面が形成されるマーク合わせ部分
    　を更に具備する積層接合装置用治具。     In claim 6,
    A jig for a laminating and bonding apparatus, further comprising: a mark aligning portion on which a mark aligning surface that contacts a mark formed on the edge when the alignment target substrate is disposed at a predetermined position.
PCT/JP2008/073720 2008-02-22 2008-12-26 Jig for laminate joining apparatus WO2009104345A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114472098A (en) * 2022-01-27 2022-05-13 苏州希盟智能装备有限公司 Optical waveguide piece dispensing and laminating equipment

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9922862B2 (en) 2014-01-28 2018-03-20 Ev Group E. Thallner Gmbh Device and method for loosening a first substrate
US10133186B2 (en) 2016-10-20 2018-11-20 Mapper Lithography Ip B.V. Method and apparatus for aligning substrates on a substrate support unit
TWI738449B (en) * 2020-08-03 2021-09-01 致茂電子股份有限公司 Wafer inspection system and wafer inspection equipment thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005288673A (en) * 2004-04-06 2005-10-20 Mitsubishi Heavy Ind Ltd Device for manufacturing micro-structure
JP2006232477A (en) * 2005-02-24 2006-09-07 Fuji Photo Film Co Ltd Sheet body positioning fixture and drawing device using it

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2662131B2 (en) * 1991-12-26 1997-10-08 松下電器産業株式会社 Bonding equipment
DE69738783D1 (en) * 1996-10-08 2008-07-31 Hitachi Chemical Co Ltd SEMICONDUCTOR ARRANGEMENT, SEMICONDUCTOR CHIP SUPPLEMENT, ARRANGEMENT METHOD FOR ARRANGEMENT AND SUBSTRATE, ADHESIVE AND DOUBLE-SIDED ADHESIVE TAPE
JP2000106391A (en) * 1998-07-28 2000-04-11 Ngk Insulators Ltd Semiconductor supporting device and its manufacture, composite body and its manufacture
JP3896938B2 (en) * 2002-09-25 2007-03-22 松下電工株式会社 Laminate production method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005288673A (en) * 2004-04-06 2005-10-20 Mitsubishi Heavy Ind Ltd Device for manufacturing micro-structure
JP2006232477A (en) * 2005-02-24 2006-09-07 Fuji Photo Film Co Ltd Sheet body positioning fixture and drawing device using it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114472098A (en) * 2022-01-27 2022-05-13 苏州希盟智能装备有限公司 Optical waveguide piece dispensing and laminating equipment

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