WO2009102335A1 - Coolant pulsing for computer system - Google Patents

Coolant pulsing for computer system Download PDF

Info

Publication number
WO2009102335A1
WO2009102335A1 PCT/US2008/054054 US2008054054W WO2009102335A1 WO 2009102335 A1 WO2009102335 A1 WO 2009102335A1 US 2008054054 W US2008054054 W US 2008054054W WO 2009102335 A1 WO2009102335 A1 WO 2009102335A1
Authority
WO
WIPO (PCT)
Prior art keywords
recited
coolant flow
channels
pulsing
channel
Prior art date
Application number
PCT/US2008/054054
Other languages
French (fr)
Inventor
Roger Tipley
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to EP08743482.5A priority Critical patent/EP2247994B1/en
Priority to PCT/US2008/054054 priority patent/WO2009102335A1/en
Priority to US12/866,858 priority patent/US8270155B2/en
Priority to CN200880126791.5A priority patent/CN101946223B/en
Publication of WO2009102335A1 publication Critical patent/WO2009102335A1/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Definitions

  • Computer components can generate considerable heat that must be removed from the computer, least it cause damage to computer components, burn or at least cause discomfort to users, or ignite a fire.
  • Most computers rely on some form of coolant fluid, typically air, to remove heat.
  • the coolant is air forced by fans through a computer system.
  • the fans for the most part, provide a consistent flow of coolant.
  • the coolant flow rate can be regulated as a function of the temperature, either internal temperature, or a combination of internal and external temperature. Some systems turn the fans off when the internal temperature is low and speed up a fan as temperature increases.
  • FIGURE 1 is a combination of a schematic representation of a blade server system and a flow chart of a heat removal method used with the system in accordance with an embodiment of the invention. Note that in the figures, the fans are drawn orthogonal to their actual orientation.
  • FIGURE 2 is a schematic illustration of a single-computer system in accordance with another embodiment of the invention.
  • the laminar flow produced by cooling fans can leave dead spots and limit heat absorption.
  • the present invention provides for pulsed coolant flow along a channel through a computer system.
  • the coolant flow speed alternates between relatively low (or no) speed and relatively high speed.
  • the relatively “calm” sub-periods facilitate heat absorption by the air, while the relatively “windy” sub-periods help reduce dead spots. In the latter case, the high speed, more turbulent, coolant flow can entrain heated fluid that would (in a laminar flow system) be less likely to be exhausted.
  • FIG. 1 depicts a blade-server computer system API in which four blades 11, 12, 13, and 14 are inserted into a chassis 15.
  • a standard rack-mount server can exist with (at least) a power cord and network cable
  • blade servers have many components removed for space, power and other considerations while still having all the functional components to be considered a computer.
  • a blade enclosure provides services such as power, cooling, networking, various interconnects and management— though different blade providers have differing principles around what should and should not be included in the blade itself (and sometimes in the enclosure altogether).
  • the present invention provides embodiments for all these variations and for any number of blades, as well as other forms of modular and non-modular computer systems.
  • Blades 11-14 include processors 16, media 17 (e.g., solid-state and disk-based memory), and communications devices 18 (e.g., I/O devices, network interface cards), all of which generate heat. Power for the blades is provided via chassis 15. Six fans 20, installed in chassis 15, provide for drawing coolant into and exhausting coolant out of blades 11-14. Of course, other numbers of types of fans can be used. Tubes 21-24, couple respective blades 11-14 to a common plenum 27 located adjacent fans 20. Each combination of tube and blade defines a coolant flow channel 31-34 in which flowing coolant can contact computer components 16-18 to remove heat therefrom.
  • media 17 e.g., solid-state and disk-based memory
  • communications devices 18 e.g., I/O devices, network interface cards
  • Each tube includes a barn-door valve 35-38 that can be switched from an open position, which minimally restricts coolant flow through the respective channel 31-34, and a closed position, which maximally restricts coolant flow through the respective channel.
  • a coolant flow controller 39 controls valves 35-38 so that they open and close in an alternating staggered pattern, as shown in the timing diagram at the right in Fig. 1.
  • Coolant flow controller 39 can be responsive to internal (to the blades) temperature via thermometers 19 and an ambient temperature via ambient thermometer 41. At cooler temperatures, fans 20 can be shut off and valves 35-38 left open. At moderate temperatures, a constant coolant flow can be provided with valves 35- 38 open.
  • the staggered pattern can be used with fans 20 at a relatively high speed.
  • Each channel 31-34 is then subjected to short sub-periods 43 of turbulent windy conditions separated by longer sub-periods 45 of relatively calm laminar flow.
  • the calm sub-periods 45 there is sufficient opportunity for heat to be absorbed by the coolant; during the windy sub-periods 43, the coolant is whisked away, entraining coolant that was contained in relatively stagnant pockets during the respective preceding calm sub-periods 45.
  • the windy sub-periods 43 should be shorter than the calm sub-periods, with the ratio being 2:3 or more extreme.
  • the ratio is 1:4 so that one valve is closed at all times, but the total coolant flow through channels 31-34 is essentially constant.
  • the amount the total coolant flow varies in volume per unit time is less than the amount the coolant flow varies in each of the channels 31-34.
  • coolant flow controller 39 can achieve the pulsed flow without changing fan speeds.
  • Coolant-flow controller 39 can close barn-door valves 35-38 entirely for maximum turbulence or leave them slightly open so that at least a minimal coolant flow exists at all times as long as fans 20 are running. Instead of using valves 35-38, coolant-flow controller 39 can control the speed of fans 20 to pulse all four channels synchronously. Varying fan speed to control coolant flow has the advantage that it works with single as well as multiple channels. Coolant-flow controller 39 can pulse the fan speed and valve positions in various ways and even alternate degrees and types of control so that different turbulence patterns are generated. Thus, if one type of control leaves certain stagnant areas in place, another type of control might be able to entrain the previously stagnant air.
  • a method MEl of the invention is flow charted in the lower portion of Fig. 1.
  • coolant flow is pulsed to create cycles with calm and windy sub-periods 45 and 43.
  • the windy sub-periods 43 are on a duty cycle of 40% or less. If there are multiple channels, the windy sub-periods can be the reciprocal of the number of channels.
  • the relatively slow moving coolant absorbs heat from exposed computer components in the respective channel at method segment MS2.
  • heat is expelled with the coolant that absorbed it.
  • the invention provides alternative means for producing pulsed coolant flow.
  • controlled pumping into the channel intake can be used instead of pulling at the exhaust.
  • Coolant flow can be diverted from a single channel and dumped before entering the channel during calm periods.
  • Another approach is to change the cross section or volume of a channel while maintaining a constant volume per time coolant flow.
  • a computer system AP2 has many components that correspond to parts of computer system API, so like components are given the same numbers.
  • System AP2 eschews the valves of system API for opposing baffles 60, which operate in the manner of an audio subwoofer.
  • Each baffle includes a frame 61, a coil 63, and a baffle membrane 65.
  • Airflow controller 67 drives these baffles 60 sinusoidally to vary the pressure in plenum 27. This causes baffle membranes 65 to move in toward each other than out away from each other; this in turn alters the effective volume of plenum 27 periodically, which in turn causes the air pressure in plenum 27 to vary periodically.
  • Airflow controller 67 controls this volume to alternate calm and turbulent sub-cycles within server blades 11-14. This has the effect of allowing heat to be absorbed during calm sub- periods and causing stagnant heated coolant to be entrained for exhaust during turbulent sub-periods. Baffles 60 are driven synchronously so that their motions oppose, minimizing net motions to computer system AP2.
  • the pulse period or signal frequency can vary according to the topology of the computer system, heat characteristics of components, and ambient conditions. In general, enough calm time should be allotted to permit heat to be absorbed, but not so long that heat builds up unacceptably. Enough time should be allotted to the windy sub- period to allow a full exchange of air or other coolant, but not so much longer so as to not waste opportunity to absorb heat. The higher the baseline flow (e.g., the flow rate during a calm sub-period), the longer the calm sub-period can be without heat buildup. In general, the frequency can be anywhere from 0.01 Hz to 100 Hz. A variety of shapes can be used as can be gleaned from a comparison of FIGS. 1 and 2. Noise from a sinusoidal waveform is easy to filter for purposes of minimizing radio frequency noise.
  • the coolant can be air, especially for systems in which the coolant gas is not contained, other fluids can be used, including other gases, liquids, and fluids that change phase as heat is absorbed in the computer system. Heated exhaust air can be dumped to the ambient air surrounding computer system API. However, this can heat the ambient air and reduce its ability to cool. The ambient air can be cooled, e.g., using air conditioning or heat exchange so that it retains its cooling effectiveness. Alternatively, air or other coolant gas can be contained in a closed system with heat removed using a heat exchanger external to computer AP2.
  • the coolant flow through individual channels can vary considerably even though the total coolant flow through the channels collectively remains essentially constant. Of course, some variation in the total flow can still occur. For the most part, however, the amount of variation in the total volume-rate flow can be less than the amount of variation in the volume-rate flows for the individual channels.
  • the calm period can involve positive coolant flow (in the same direction as the exhaust), negative coolant flow (e.g., intake and exhaust through same port, as in breathing) or zero coolant flow.
  • Zero coolant flow can be achieved by closing intake and/or exhaust openings.
  • Negative coolant flow can be achieved by reversing fan direction, either by changing the direction the fan blades rotate (e.g., clockwise versus counterclockwise) or by rotating the fans 180° so they face in the opposite direction.
  • the invention can apply to various types of blade systems, other types of modular computer systems including rack- mount systems, self-standing computers, etc.

Abstract

The present invention provides for repeatedly pulsing coolant through a first channel exposed to heat-generating computer components. The pulsing involves a relatively low baseline coolant flow rate with repeated excursions to a relatively high expulsion coolant flow rate.

Description

Coolant Pulsing for Computer System
[01 ] BACKGROUND OF THE INVENTION
[02] Computer components, especially microprocessors, can generate considerable heat that must be removed from the computer, least it cause damage to computer components, burn or at least cause discomfort to users, or ignite a fire. Most computers rely on some form of coolant fluid, typically air, to remove heat. Most often, the coolant is air forced by fans through a computer system. The fans, for the most part, provide a consistent flow of coolant. In some systems, the coolant flow rate can be regulated as a function of the temperature, either internal temperature, or a combination of internal and external temperature. Some systems turn the fans off when the internal temperature is low and speed up a fan as temperature increases.
[03] As widely used as fans are, they are not always sufficiently effective at removing heat. Some systems supplement or replace airflow with liquid heat exchange, but this can be an expensive solution. What is needed is a more-effect yet economical approach to heat removal.
[04] Herein, related art is described to facilitate understanding of the invention. Related art labeled "prior art" is admitted prior art; related art not labeled "prior art" is not admitted prior art.
[05] BRIEF DESCRIPTION OF THE DRAWINGS
[06] The figures depict implementations/embodiments of the invention and not the invention itself. [07] FIGURE 1 is a combination of a schematic representation of a blade server system and a flow chart of a heat removal method used with the system in accordance with an embodiment of the invention. Note that in the figures, the fans are drawn orthogonal to their actual orientation.
[08] FIGURE 2 is a schematic illustration of a single-computer system in accordance with another embodiment of the invention.
[09] DETAILED DESCRIPTION
[10] In the course of the present invention, it was recognized that the laminar flow produced by cooling fans can leave dead spots and limit heat absorption. The present invention provides for pulsed coolant flow along a channel through a computer system. In other words, the coolant flow speed alternates between relatively low (or no) speed and relatively high speed. The relatively "calm" sub-periods facilitate heat absorption by the air, while the relatively "windy" sub-periods help reduce dead spots. In the latter case, the high speed, more turbulent, coolant flow can entrain heated fluid that would (in a laminar flow system) be less likely to be exhausted.
[11] FIG. 1 depicts a blade-server computer system API in which four blades 11, 12, 13, and 14 are inserted into a chassis 15. Whereas a standard rack-mount server can exist with (at least) a power cord and network cable, blade servers have many components removed for space, power and other considerations while still having all the functional components to be considered a computer. A blade enclosure provides services such as power, cooling, networking, various interconnects and management— though different blade providers have differing principles around what should and should not be included in the blade itself (and sometimes in the enclosure altogether). The present invention provides embodiments for all these variations and for any number of blades, as well as other forms of modular and non-modular computer systems.
[12] Blades 11-14 include processors 16, media 17 (e.g., solid-state and disk-based memory), and communications devices 18 (e.g., I/O devices, network interface cards), all of which generate heat. Power for the blades is provided via chassis 15. Six fans 20, installed in chassis 15, provide for drawing coolant into and exhausting coolant out of blades 11-14. Of course, other numbers of types of fans can be used. Tubes 21-24, couple respective blades 11-14 to a common plenum 27 located adjacent fans 20. Each combination of tube and blade defines a coolant flow channel 31-34 in which flowing coolant can contact computer components 16-18 to remove heat therefrom.
[13] Each tube includes a barn-door valve 35-38 that can be switched from an open position, which minimally restricts coolant flow through the respective channel 31-34, and a closed position, which maximally restricts coolant flow through the respective channel. A coolant flow controller 39 controls valves 35-38 so that they open and close in an alternating staggered pattern, as shown in the timing diagram at the right in Fig. 1. Coolant flow controller 39 can be responsive to internal (to the blades) temperature via thermometers 19 and an ambient temperature via ambient thermometer 41. At cooler temperatures, fans 20 can be shut off and valves 35-38 left open. At moderate temperatures, a constant coolant flow can be provided with valves 35- 38 open.
[14] At higher temperatures, the staggered pattern can be used with fans 20 at a relatively high speed. Each channel 31-34 is then subjected to short sub-periods 43 of turbulent windy conditions separated by longer sub-periods 45 of relatively calm laminar flow. During the calm sub-periods 45, there is sufficient opportunity for heat to be absorbed by the coolant; during the windy sub-periods 43, the coolant is whisked away, entraining coolant that was contained in relatively stagnant pockets during the respective preceding calm sub-periods 45.
[15] In general, the windy sub-periods 43 should be shorter than the calm sub-periods, with the ratio being 2:3 or more extreme. In Fig. 1, the ratio is 1:4 so that one valve is closed at all times, but the total coolant flow through channels 31-34 is essentially constant. The amount the total coolant flow varies in volume per unit time is less than the amount the coolant flow varies in each of the channels 31-34. Thus, coolant flow controller 39 can achieve the pulsed flow without changing fan speeds.
[16] Coolant-flow controller 39 can close barn-door valves 35-38 entirely for maximum turbulence or leave them slightly open so that at least a minimal coolant flow exists at all times as long as fans 20 are running. Instead of using valves 35-38, coolant-flow controller 39 can control the speed of fans 20 to pulse all four channels synchronously. Varying fan speed to control coolant flow has the advantage that it works with single as well as multiple channels. Coolant-flow controller 39 can pulse the fan speed and valve positions in various ways and even alternate degrees and types of control so that different turbulence patterns are generated. Thus, if one type of control leaves certain stagnant areas in place, another type of control might be able to entrain the previously stagnant air.
[17] A method MEl of the invention is flow charted in the lower portion of Fig. 1. At method segment MSl, coolant flow is pulsed to create cycles with calm and windy sub-periods 45 and 43. Typically, the windy sub-periods 43 are on a duty cycle of 40% or less. If there are multiple channels, the windy sub-periods can be the reciprocal of the number of channels. During the relatively long calm sub-periods 45, the relatively slow moving coolant absorbs heat from exposed computer components in the respective channel at method segment MS2. During the relatively short windy sub-periods 43, heat is expelled with the coolant that absorbed it.
[18] The invention provides alternative means for producing pulsed coolant flow. Of course, controlled pumping into the channel intake can be used instead of pulling at the exhaust. Coolant flow can be diverted from a single channel and dumped before entering the channel during calm periods. Another approach is to change the cross section or volume of a channel while maintaining a constant volume per time coolant flow.
[19] In Fig. 2, a computer system AP2 has many components that correspond to parts of computer system API, so like components are given the same numbers. System AP2 eschews the valves of system API for opposing baffles 60, which operate in the manner of an audio subwoofer. Each baffle includes a frame 61, a coil 63, and a baffle membrane 65. Airflow controller 67 drives these baffles 60 sinusoidally to vary the pressure in plenum 27. This causes baffle membranes 65 to move in toward each other than out away from each other; this in turn alters the effective volume of plenum 27 periodically, which in turn causes the air pressure in plenum 27 to vary periodically.
[20] When the fan speed is constant, the amount of coolant in volume per time stays constant, so the speed at which coolant flows changes with the channel volume. Airflow controller 67 controls this volume to alternate calm and turbulent sub-cycles within server blades 11-14. This has the effect of allowing heat to be absorbed during calm sub- periods and causing stagnant heated coolant to be entrained for exhaust during turbulent sub-periods. Baffles 60 are driven synchronously so that their motions oppose, minimizing net motions to computer system AP2.
[21] The pulse period or signal frequency can vary according to the topology of the computer system, heat characteristics of components, and ambient conditions. In general, enough calm time should be allotted to permit heat to be absorbed, but not so long that heat builds up unacceptably. Enough time should be allotted to the windy sub- period to allow a full exchange of air or other coolant, but not so much longer so as to not waste opportunity to absorb heat. The higher the baseline flow (e.g., the flow rate during a calm sub-period), the longer the calm sub-period can be without heat buildup. In general, the frequency can be anywhere from 0.01 Hz to 100 Hz. A variety of shapes can be used as can be gleaned from a comparison of FIGS. 1 and 2. Noise from a sinusoidal waveform is easy to filter for purposes of minimizing radio frequency noise.
[22] While the coolant can be air, especially for systems in which the coolant gas is not contained, other fluids can be used, including other gases, liquids, and fluids that change phase as heat is absorbed in the computer system. Heated exhaust air can be dumped to the ambient air surrounding computer system API. However, this can heat the ambient air and reduce its ability to cool. The ambient air can be cooled, e.g., using air conditioning or heat exchange so that it retains its cooling effectiveness. Alternatively, air or other coolant gas can be contained in a closed system with heat removed using a heat exchanger external to computer AP2.
[23] In some multi-channel embodiments, such as the embodiment of Fig. 1, the coolant flow through individual channels can vary considerably even though the total coolant flow through the channels collectively remains essentially constant. Of course, some variation in the total flow can still occur. For the most part, however, the amount of variation in the total volume-rate flow can be less than the amount of variation in the volume-rate flows for the individual channels.
[24] The calm period can involve positive coolant flow (in the same direction as the exhaust), negative coolant flow (e.g., intake and exhaust through same port, as in breathing) or zero coolant flow. Zero coolant flow can be achieved by closing intake and/or exhaust openings. Negative coolant flow can be achieved by reversing fan direction, either by changing the direction the fan blades rotate (e.g., clockwise versus counterclockwise) or by rotating the fans 180° so they face in the opposite direction. The invention can apply to various types of blade systems, other types of modular computer systems including rack- mount systems, self-standing computers, etc. These and other modifications to and variations upon the illustrated embodiments are provided for by the present invention, the scope of which is defined by the following claims.
[25] What Is Claimed Is:

Claims

1. A method of cooling a computer system comprising: repeatedly pulsing coolant through a first channel exposed to heat- generating computer components, said pulsing involving a zero or relatively low baseline coolant flow rate with repeated excursions to a relatively high expulsion coolant flow rate.
2. A method as recited in Claim 1 wherein said baseline coolant flow rate is non-zero.
3. A method as recited in Claim 1 wherein said pulsing involves controlling valves between said components and fans in fluidic communication with said first channel.
4. A method as recited in Claim 1 wherein said pulsing involves varying the speed of fans in fluidic communication with said channel.
5. A method as recited in Claim 1 wherein said excursions occur on a less than 40% duty cycle.
6. A method as recited in Claim 1 wherein said excursions occur repeatedly, with an average period between .01 and 10 seconds.
7. A method as recited in Claim 1 wherein there are plural channels with exposed heat-generating computer components, for each of said channels, said pulsing involving a zero or relatively low baseline coolant flow rate with repeated excursions to a relatively high expulsion coolant flow rate, said pulsing being staggered across channels so that the total coolant flow rate through said channels varies less than the coolant flow through said first channel.
8. A method as recited in Claim 1 wherein said computer system includes plural computers, each of said computers including a data processor, memory, and communications devices, each of said computers corresponding to a respective one of said channels.
9. A method as recited in Claim 1 wherein said pulsing involves changing a volume of said first channel.
10. A method as recited in Claim 9 wherein said pulsing involves moving opposing diaphragms.
11. A system comprising: structural components defining plural coolant flow channels in contact with heat-generating computer components; and means for inducing pulsed coolant flow through said channels on a staggered basis across said channels.
12. A system as recited in Claim 11 wherein the total coolant flow through each of said channels varies more than the total coolant flow through said channels.
13. A system as recited in Claim 11 further comprising fans for inducing said coolant flow and valves in respective channels for pulsing said coolant flow.
14. A system as recited in Claim 13 wherein said valves switch between relatively open and relatively closed conditions with an average period within an order of magnitude of 3 seconds.
15. A system as recited in Claim 14 wherein each of said valves is in a relatively closed condition less than 40% of the time on average.
16. A system as recited in Claim 16 wherein more than 60% of the time at least one of said valves is in a relatively open condition.
17. A system as recited in Claim 11 wherein said system includes modular computers, each of which defines at least one of said channels.
18. A system as recited in Claim 17 wherein each of said modular computers is attached to a common chassis including fans for inducing said coolant flow.
19. A system as recited in Claim 16 wherein said valves are barndoor valves.
20. A computer system comprising: heat-generating computer components; a fluid channel; means for causing coolant gas to flow through said channel so as to remove heat from said heat-generating components; and means for periodically changing the volume of said fluid channel so as to vary the speed with which fluid flowing at a constant volume rate flows through said channel.
PCT/US2008/054054 2008-02-15 2008-02-15 Coolant pulsing for computer system WO2009102335A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08743482.5A EP2247994B1 (en) 2008-02-15 2008-02-15 Coolant pulsing for computer system
PCT/US2008/054054 WO2009102335A1 (en) 2008-02-15 2008-02-15 Coolant pulsing for computer system
US12/866,858 US8270155B2 (en) 2008-02-15 2008-02-15 Coolant pulsing for computer system
CN200880126791.5A CN101946223B (en) 2008-02-15 2008-02-15 Coolant pulsing for computer system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2008/054054 WO2009102335A1 (en) 2008-02-15 2008-02-15 Coolant pulsing for computer system

Publications (1)

Publication Number Publication Date
WO2009102335A1 true WO2009102335A1 (en) 2009-08-20

Family

ID=40957208

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/054054 WO2009102335A1 (en) 2008-02-15 2008-02-15 Coolant pulsing for computer system

Country Status (4)

Country Link
US (1) US8270155B2 (en)
EP (1) EP2247994B1 (en)
CN (1) CN101946223B (en)
WO (1) WO2009102335A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9723759B2 (en) * 2009-11-30 2017-08-01 Facebook, Inc. Cooling servers in a data center using fans external to servers
CN102541222A (en) * 2010-12-31 2012-07-04 鸿富锦精密工业(深圳)有限公司 Rack-mounted server system
US20140120440A1 (en) * 2012-10-25 2014-05-01 GM Global Technology Operations LLC Coolant flow pulsing in a fuel cell system
US8885335B2 (en) 2012-10-26 2014-11-11 Facebook, Inc. Server cooling by airflow throttling
US9137930B2 (en) 2013-05-28 2015-09-15 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Protecting devices against hot air backflow in a computer system rack having a rear door heat exchanger
US10595446B2 (en) * 2016-02-22 2020-03-17 Quanta Computer Inc. Optimized and intelligent fan control mechanism inside rack system
US10108233B1 (en) 2017-04-06 2018-10-23 Johann Wischnesky Computer cooling assembly
US10619953B2 (en) * 2017-11-15 2020-04-14 Baltimore Aircoil Company, Inc. Automated control of heat exchanger operation
EP3942241A4 (en) 2019-03-19 2022-11-23 Baltimore Aircoil Company, Inc. Heat exchanger having plume abatement assembly bypass
EP4073438A4 (en) 2019-12-11 2023-12-20 Baltimore Aircoil Company, Inc. Heat exchanger system with machine-learning based optimization
US11976882B2 (en) 2020-11-23 2024-05-07 Baltimore Aircoil Company, Inc. Heat rejection apparatus, plume abatement system, and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219234B1 (en) 1999-03-30 2001-04-17 International Business Corporation Method for using pulsating flow to improve thermal transport in systems
KR200256258Y1 (en) * 2001-09-14 2001-12-14 (주)클루닉스 Main Box of Computer
KR200289467Y1 (en) * 2002-06-17 2002-09-16 전준진 A parallel computer cooling device
KR20050008968A (en) * 2003-07-14 2005-01-24 엘지전자 주식회사 Apparatus and method for controling a fan drive in computer system
KR20050019096A (en) * 2002-05-31 2005-02-28 베라리 시스템즈, 인코포레이티드 Methods and apparatus for mounting computer components

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270694A (en) 1977-11-21 1981-06-02 Knauth Berthold A Fluid flow regulating systems
US5190099A (en) * 1991-05-01 1993-03-02 The United States Of The America As Represented By The Secretary Of The Army Pulsatile impinging cooling system for electronic IC modules and systems using fluidic oscillators
US5263537A (en) * 1992-04-27 1993-11-23 International Business Machines Corporation Oscillating cooling system
US5566377A (en) * 1995-07-10 1996-10-15 Lee; Richard Heat dissipating apparatus
JPH1065372A (en) * 1996-08-19 1998-03-06 Hitachi Inf Technol:Kk Shield plate for cooling electronic part
US5794450A (en) * 1997-01-03 1998-08-18 Ncr Corporation Remotely located pulse tube for cooling electronics
US5863246A (en) * 1997-12-15 1999-01-26 Carrier Corporation Variable air volume control system
US7024573B2 (en) 2002-02-05 2006-04-04 Hewlett-Packard Development Company, L.P. Method and apparatus for cooling heat generating components
US6751094B2 (en) * 2002-05-14 2004-06-15 Dell Products L.P. Computer system cooling using temperature monitoring
US6945866B2 (en) * 2002-05-17 2005-09-20 Airfixture L.L.C. Method and apparatus for delivering conditioned air using pulse modulation
US7075788B2 (en) * 2003-06-11 2006-07-11 Hewlett-Packard Development Company, L.P. Computer cooling system and method
US20050168941A1 (en) 2003-10-22 2005-08-04 Sokol John L. System and apparatus for heat removal
US20050168942A1 (en) * 2004-02-04 2005-08-04 Steinbrecher Robin A. Airflow gates for electronic devices
US7233493B2 (en) * 2004-08-10 2007-06-19 E. I. Du Pont De Nemours And Company Electronic device having a temperature control system including a ductwork assembly
JP4797023B2 (en) * 2004-11-03 2011-10-19 ザイラテックス・テクノロジー・リミテッド Hard disk drive temperature control device and hard disk drive temperature changing method
US7554803B2 (en) * 2005-04-13 2009-06-30 Dell Products L.P. Method and apparatus for cooling an information handling system
EP1722412B1 (en) * 2005-05-02 2012-08-29 Sony Corporation Jet generator and electronic device
US8051671B2 (en) * 2005-10-03 2011-11-08 Hewlett-Packard Development Company, L.P. System and method for cooling computers
US7438124B2 (en) * 2005-10-04 2008-10-21 Delphi Technologies, Inc. Evaporative cooling system for a data-communications cabinet
FR2905556B1 (en) * 2006-08-30 2009-06-26 Thales Sa ELECTRONIC BAY ASSOCIATING NATURAL CONVECTION AND FORCE AIR CIRCULATION FOR ITS COOLING
US7450381B2 (en) * 2006-12-04 2008-11-11 International Business Machines Corporation Thermal management apparatus and method for printed circuit boards
FR2910779A1 (en) * 2006-12-21 2008-06-27 Thales Sa Electronic equipment casing i.e. electronic rack, for aircraft, has heat collectors inserted between hot spots and inner thermal radiators, and heat conductors connecting outer thermal radiator with collectors through front wall of casing
US20090016019A1 (en) * 2007-07-13 2009-01-15 International Business Machines Corporation Airflow control and dust removal for electronic systems
US8035970B2 (en) * 2009-11-30 2011-10-11 International Business Machines Corporation Regulation of air flow through a computer blade chassis using mechanically actuated variable air flow dampers

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219234B1 (en) 1999-03-30 2001-04-17 International Business Corporation Method for using pulsating flow to improve thermal transport in systems
KR200256258Y1 (en) * 2001-09-14 2001-12-14 (주)클루닉스 Main Box of Computer
KR20050019096A (en) * 2002-05-31 2005-02-28 베라리 시스템즈, 인코포레이티드 Methods and apparatus for mounting computer components
KR200289467Y1 (en) * 2002-06-17 2002-09-16 전준진 A parallel computer cooling device
KR20050008968A (en) * 2003-07-14 2005-01-24 엘지전자 주식회사 Apparatus and method for controling a fan drive in computer system

Also Published As

Publication number Publication date
EP2247994B1 (en) 2017-09-27
US20100315770A1 (en) 2010-12-16
EP2247994A1 (en) 2010-11-10
EP2247994A4 (en) 2013-10-16
CN101946223A (en) 2011-01-12
US8270155B2 (en) 2012-09-18
CN101946223B (en) 2014-01-08

Similar Documents

Publication Publication Date Title
US8270155B2 (en) Coolant pulsing for computer system
US8081459B2 (en) Air conditioning systems for computer systems and associated methods
TWI686578B (en) Electronic system, enclosure therefor, and method of cooling an electronic system
JP2011060414A5 (en)
US7898799B2 (en) Airflow management apparatus for computer cabinets and associated methods
US20170311487A1 (en) Fan controlled ambient air cooling of equipment in a controlled airflow environment
TW201212804A (en) Data center
WO2013127314A1 (en) Cooling system and method for wind power generator and wind power generator set
TWI482581B (en) Temprature control system and temprature control method thereof
JP2003218572A (en) Method and device for radiating heat from outdoor apparatus
JP5159791B2 (en) Thermoelectric temperature control with convection air flow to cool elevator components
RU2515530C2 (en) Device of conditioning for cooling of air in cabinet for electronic devices
CN201199768Y (en) Cooling apparatus and communication apparatus
RU2006108604A (en) AIR COOLING CONTROL SYSTEM
US20220201902A1 (en) Control systems for air-assisted and liquid-cooled enclosures
CN115551318A (en) Energy-saving communication cabinet and energy-saving communication machine room
CN208317243U (en) Radiate loop structure
CN109022251A (en) Refrigeration temperature control device based on biological 3D printing equipment
CN211087143U (en) Heat dissipation formula server box and server
CN109862761A (en) Radiator and high-voltage frequency converter
CN214281893U (en) Computer room server rack cooling device
RU2605930C2 (en) Device for air cooling of radioelectronic devices
CN210922263U (en) Energy-saving air-cooled cooling tower
JP2003343893A (en) Double fan type cooler
CN215404468U (en) Baffle with cooling circulation function

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880126791.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08743482

Country of ref document: EP

Kind code of ref document: A1

REEP Request for entry into the european phase

Ref document number: 2008743482

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2008743482

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12866858

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE