WO2009089148A1

WO2009089148A1 - Reverse embossed thermoform coverstock

Info

Publication number: WO2009089148A1
Application number: PCT/US2009/030103
Authority: WO
Inventors: Tony M. Pokorzysnki; Heather R. Springer; Michael J. Von Holtz; John C. Hinken
Original assignee: Johnson Controls Technology Company
Priority date: 2008-01-04
Filing date: 2009-01-05
Publication date: 2009-07-16

Abstract

An interior component for a vehicle includes a coverstock layer that includes a foam layer. The coverstock layer is formed to include regions of reduced cross-sectional thickness of the foam layer. During a later injection molding process, a substrate is molded to the back surface of the coverstock layer, compressing the foam layer. After the injection molding process, the foam layer expands thereby deforming a surface layer of the coverstock layer to include recesses that correspond to the locations of the regions of reduced cross-sectional thickness of the foam layer.

Description

REVERSE EMBOSSED THERMOFORM COVERSTOCK

[0001] This application claims priority to U.S. Provisional Application 61/006,296, filed January 4, 2008, which is incorporated herein by reference in its entirety.

FIELD

[0002] This invention relates to a reverse embossed thermoform coverstock usable in mold-behind and partial-mold-behind applications.

BACKGROUND

[0003] The present disclosure relates to interior trim panels or structures for vehicles (e.g., automobiles, such as cars, trucks and the like; airplanes, boats, etc.). More specifically the present disclosure relates to a method for creating light style lines and geometric changes for interior trim panels or structures for vehicles.

[0004] It is generally known to provide padded or cushioned vehicle interior components. The cushioned components may be decorative, ornamental and/or functional. The padded or cushioned vehicle interior components may take the form of a trim panel (e.g., instrument panel, door panel, etc.). Such panels typically include a substrate made of a relatively rigid material, a relatively soft core (e.g., a foam layer), and an outer surface or skin.

SUMMARY

[0005] An embodiment of this invention relates to a trilaminate preform for partial mold behind and mold behind applications. The trilaminate preform includes a surface film layer, a foam layer and a back film layer. The trilaminate preform is thermoformed using a thermoforming tool that includes inserts. The inserts provide one or more pinch regions where the foam layer is compressed and/or displaced to provide regions of reduced cross- sectional thickness of the foam layer. A substrate is then injection molded to the back film layer, compressing the foam layer. After the substrate is molded to the back film layer, the foam layer is allowed to expand toward its uncompressed thickness. The substrate prevents expansion toward the back film layer and the regions of reduced cross-sectional thickness of the foam layer do not expand as much as the surrounding regions resulting in a desired deformation to the contour of the surface film layer.

[0006] An embodiment of this invention relates to a method of producing an interior component for a vehicle. The method includes providing a trilaminate coverstock that includes a surface film layer, a foam layer and a back film layer. The trilaminate coverstock is formed in a forming tool to a desired preform shape. The forming tool includes at least one insert. During the forming of the trilaminate coverstock, the at least one insert provides a region of reduced cross-sectional thickness of the foam layer. A substrate is then injection molded to the back film layer of the trilaminate coverstock. During the injection molding, the foam layer is compressed. After the injection molding, the foam layer is allowed to expand toward the surface film layer. The regions of reduced cross- sectional thickness of the foam layer do not expand as much as surrounding regions causing a desired pattern of the surface film layer.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Fig. 1 is an isometric view of a vehicle according to an exemplary embodiment;

[0008] Fig. 2 is an isometric view of an interior component according to an exemplary embodiment;

[0009] Fig. 3 is a cross-sectional view along the line 3-3 of the exemplary interior component of Fig. 2;

[0010] Fig. 4 is a cross-sectional view of a coverstock for an interior component according to an exemplary embodiment before the coverstock has been formed;

[0011] Fig. 5 is a cross-sectional view of the exemplary coverstock of Fig. 4 in a fhermoforming tool according to an exemplary embodiment;

[0012] Fig. 6 is a cross-sectional view of the exemplary coverstock of FIG. 5 after it has been removed from the thermoforming tool;

[0013] Fig. 7 is a cross-sectional view of exemplary coverstock of FIG. 6 in an injection molding tool for forming an interior component; and

[0014] Fig. 8 is a cross-sectional view of the interior component of FIG. 7 after it has been removed from the injection molding tool. DETAILED DESCRIPTION

[0015] Various methods of providing cushioning or light style lines are known in the art, although a method of providing cushioning oi light style lines without changing a injection molding tool would be advantageous Likewise, it would be advantageous to provide a method of forming light style lines in a cushioned component that does not require a post-forming embossing step, thcieby i educing oi eliminating the need foi high temperatuie embossing of a suiface layei of the cushioned component

[0016] Following is a desciiption of an exemplaiy embodiment of manufactuπng tril animate piefoims foi paitial mold behind (PMB) and mold behind applications that has been modified to add light style lines and geometiic changes to the A-surface (surface seen by the passengei oi consumei) of vehicle inteiior trim panels or structures It should be appreciated that the use of tπlammate preforms is exemplary Various exemplary embodiments may use bilammate preforms and/or piefoims with more than three layers Likewise, the pieforms may be used m applications othei than partial mold behind and mold behind applications

[0017] Fig 1 shows a vehicle 10 that includes an interior component 100 according to an exemplaiy embodiment As shown in the exemplary embodiment of Fig 1, the vehicle 10 is an automobile Howevei, it should be appreciated that the vehicle 10 may be other vehicles, such as, for example, a boat, a plane, etc Likewise, vanous exemplary embodiments of mtenoi components may be usable in non-vehiculai settings

[0018] Fig 2 shows a peispective view of the mtenoi component 100 of Fig 1 As shown m Fig 2, the mtenoi component 100 is a dooi panel However, it should be appreciated that the mtenoi component 100 may be othei components such as, for example, portions of a front dash, a headlmei, a ccntei console, etc

[0019] Fig 3 shows a cioss-sectional view of the mteiior component 100 of Fig 2 As shown in Fig 3, the mtenoi component 100 includes a coverstock layei 1 10 and a substiate layei 120 The coveistock layei 1 10 includes a suiface film layer 112, a foam layer 114 and a back film layei 1 16 It should be appieciated that, m various exemplary embodiments, the coveistock layei 1 10 may include more than or fewer than three layers In various exemplary embodiments, the covei stock layei 1 10 is a bilaminate layer that includes the surface film layer 1 12 and the foam layei 1 14 In various exemplary embodiments, the surface film layei 112 comprises at least a poition of the visible suiface (e g., the A-surface) of the interior component 100 In various exemplary embodiments, the substrate layer 120 additionally comprises at least a portion ot the visible surface of the interior component 100.

[0020] In the exemplary embodiment shown in Fig 3, recesses 108 are provided in the coverstock layer 110. The iecesses 108 piovide light style lines that are visible on the exterior surface of the mteπor component 100 (e.g , the A-surface). Referring back to Fig. 2, several recesses 108 are shown on the interior component 100 to provide a desired pattern. As shown in the exemplary embodiment of Fig 2, the recesses 108 are provided in a lined pattern. However, it should be appreciated that any desired number and pattern of recesses 108 may be provided on the interior component 100 In various exemplary embodiments, the recesses 108 are usable to provide a brand name, logo and/or other identifying indicia on the interior component 100. In various othei exemplary embodiments, a desired pattern or texture is provided using one or more of the recesses 108.

[0021] Fig. 4 shows the coverstock layer 1 10 separate from the interior component 100 As shown m Fig. 4, the coverstock layei 110 can be provided, and typically formed by a molding process (e g , thermoformmg, vacuum forming, etc ), as a tπlammate preform piece. In various exemplary embodiments, the suiface film layer 1 12 can be composed, for example, of polyvinyl chloride (PVC) or a theimoplastic polyolefin In general, the surface film layer 1 12 can be composed of any known oi latei -developed material that provides a desirable appeal ance and/oi textuie foi the A-surface of the mteπoi component 100. In various exemplary embodiments, the foam layei 1 14 can be, foi example, a compressible polymeric material such as a polyolefin foam oi othei foam material (e.g., urethane foam, closed cell foam, open celled foam, etc ) In general, the foam layer 114 can be any known or later-developed compressible material that can be coupled to the surface film layer 112. In various exemplary embodiments, the back film layer 116 can be, for example, a thermoplastic polyolefin. In general, the back film layer 116 can be any known or later- developed material that can be coupled to the foam layei 114.

[0022] The foam layer 1 14 is coupled (e g , bonded, fused, adhered, fastened, attached, etc.) to, and is located between, the surface film layer 112 and back film layer 116. In various exemplary embodiments, the foam layer 114 provides a "filler" or soft layer of the coverstock layer 1 10 In various exemplary embodiments, the foam layer 114 acts as a relatively soft or cushioning material to piovide the interior component 100 with at least a region that has a relatively soft or cushioned characteristic

[0023] The coverstock layer 110 (e g , the surface film layer 112, foam layer 114, and back film layer 116) can be formed to a desired configuration m a mold or forming tool. The process of molding can be, for example, a thermoformmg or a vacuum-forming process.

[0024] Fig. 5 shows the coverstock layer 110 m a thermoformmg tool 200 as a step m forming the interior component 100. As shown m Fig. 5, a plurality of inserts 228 are supplied on a plug-side 220 of the themioformmg tool 200 The inserts 228 coincide with desired locations of the recesses 108 that provide light style lines and geometry changes visible on the A-side of the mteπoi component 100

[0025] The inserts 228 can be integral parts of the forming tool 200 or may be readily lemovable In vaπous cxcmplaiy embodiments, the inserts 228 are lemovable fiom the plug-side 220 of the thermoformmg tool 200 In various exemplary embodiments, the inserts 228 can be moved, replaced and/oi exchanged to coincide with different desired patterns of light style lines on the A-surface of the finished interior component 100.

[0026] As the coverstock layei 1 10 is formed m the thermoformmg tool 200, the inserts 228 pmch the coverstock layei 110 Consequently, the foam layer 1 14 of the coverstock layer 110 is compressed or at least partially removed or displaced by the inserts 228 to provide regions 118 of the coverstock layer 110 that have a reduced cross-sectional thickness of the foam layer 114. The regions 118 of reduced cross-sectional thickness of the foam layer 114 coincide with the desired locations of the recesses 108 visible on the A- surface of the interior component 100

[0027] Fig. 6 shows the coverstock layei 110 after it has been removed from the thermoformmg tool 200 As shown in Fig 6, the foam layer 1 14 and the back film layer 116 have been deformed by the inserts 228 to piovide the regions 118 of reduced cross-sectional thickness of the foam layei 1 14 It should be appreciated that, as shown in Fig 6, the surface film layer 112, which will piovide at least a portion of the A-surface of the interior component 100, is not necessaiily deformed in the regions 1 18 of reduced cross-sectional thickness of the foam layer 114 [0028] Fig 7 shows the coverstock layer 110 m an mjection-moldmg tool 300. As shown in Fig. 7, the substrate layei 120 is molded to the back film layer 116 of the coverstock layer 1 10 to form the interior component 100 When the coverstock layer 1 10 is processed m the injection-molding tool 300, the foam layer 114 is compressed. That is, when the substrate layer 120 is molded to the back film layer 116 m the mjection-moldmg tool 300, the pressure from the injection molding process compresses the foam layer 114, and thus the coverstock layer 1 10 In vaπous exemplaiy embodiments, the foam layer 114 is compressed such that the regions 1 18 of i educed cross-sectional thickness of the foam layer 1 14 and the surrounding aiea have approximately the same thickness. That is, the foam layer 1 14 may be compiessed to an appioximately uniform thickness

[0029] Fig. 8 shows the mteπoi component 100 removed from the injection molding tool 300 As shown in Fig 8, aftei the intenoi component 100 is removed from the mjection-moldmg tool 300, the foam layei 1 14, and thus the coverstock layer 110, are allowed to expand back toward their uncompressed thicknesses. ^'However, m the regions 118 of reduced cross-sectional thickness of the foam layer 114, the foam layer 114 and the coverstock layer 110 will not expand as much as m the surrounding area and may not expand at all. The differential between the region 118 of reduced cross-sectional thickness and the surrounding area can be, for example, approximately 2 mm.

[0030] It should be appreciated that, due to the rigid nature of the substrate layer 120, the foam layer 114 expands toward the surface film layer 1 12 As such, the surface film layer 112 is deformed to piovide the icccsses 108 in the finished interior component 100 It should also be appieciatcd that by piovidmg the iegions 1 18 of reduced cross- sectional thickness of the foam layei 1 14 dming the forming of the coverstock layer 1 10, the need foi any post-forming embossing to pio\ ide the recesses 108 can be reduced or even eliminated Reducing or eliminated the need for post-forming embossing, reduces or eliminates potential heat damage to the suiface film layer 112 caused by the post- forming embossing

[0031] It should be appieciated that the construction and arrangement of the elements of this disclosure as shown m the preferred and other exemplary embodiments are illustrative only Although only a few embodiments have been described in detail m this disclosure, those skilled m the art who review this disclosure will readily appreciate that many modifications aie possible (e g , \ aπations m sizes, dimensions, structures, shapes and proportions of the various elements, values ot paiameteis, mounting arrangements, materials, colors, orientations, etc ) without materially departing from the novel teachings and advantages of the subject matter Accordingly, all such modifications are intended to be included withm the scope of this application The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. Other substitutions, modifications, changes and/or omissions may be made m the design, operating conditions and arrangement of the preferred and other exemplaiy embodiments.

Claims

In the claims:

1. A process of making a coverstock comprising: providing coverstock material, the coverstock material comprising a compressible layer and a first film layer coupled to the compressible layer; and forming the coverstock material into a coverstock; wherein forming the coverstock material comprises piovidmg at least a first portion of the coverstock wherein the cross-sectional thickness of the compiessible layer is thinner than in a surrounding portion.

2 The process of claim 1 wheiein the diffcience between the thickness of the compressible layer in the at least fust portion and the surrounding portion is approximately two millimeters

3 The process accoiding to any of the piecedmg claims, wherein the coverstock material further comprises a second film layei, the compressible layer being located between and coupled to the first and second film layeis

4 The process accoiding claim 3, wherein the first and second film layers comprise at least one of a thermoplastic polyolefin and polyvinyl chloride.

5 The process according to any of the preceding claims, wherein forming the coverstock material into a co\ei stock comprises thermo forming the coverstock mateπal into a desired laminated preform

6. The process according to any of the preceding claims, further comprising injection molding a substrate to a back suiface of the coverstock

7. The process according to claim 6, wherein injection molding the substrate comprises compressing the compressible layer

8 The process according to claim 7, wherein the compressible layer is compressed such that the first portion and the surrounding area have approximately the same thickness

9 The process accoiding to any of claims 7-8, further comprising allowing the compressible layei to expand attci injection molding the substrate to the back surface of the covei stock

10 The process accoiding to claim 7, wheiein the compressible layer of the at least first portion expands to a lessei thickness than the compressible layer of the surrounding portion

1 1. The process according to claim 10, wherein, as the compressible layer expands, the first film layer is deformed to include at least one recess corresponding to the location of the at least first portion.

12. A thermoforming tool for preforming coverstock material comprising: a mold cavity; a plug; and at least one insert, the insert removably attachable to the plug and usable to reduce a thickness of a compressible layer of coverstock material being formed in the thermoforming tool.

13. A preform that has been formed of coverstock material using the thermoforming tool of claim 12.