WO2009084929A3 - A multilayer film for dry film resist - Google Patents

A multilayer film for dry film resist Download PDF

Info

Publication number
WO2009084929A3
WO2009084929A3 PCT/KR2008/007900 KR2008007900W WO2009084929A3 WO 2009084929 A3 WO2009084929 A3 WO 2009084929A3 KR 2008007900 W KR2008007900 W KR 2008007900W WO 2009084929 A3 WO2009084929 A3 WO 2009084929A3
Authority
WO
WIPO (PCT)
Prior art keywords
surface layer
film
adhesiveness
dry
resist
Prior art date
Application number
PCT/KR2008/007900
Other languages
French (fr)
Other versions
WO2009084929A2 (en
Inventor
Gi Sang Song
Original Assignee
Kolon Inc
Gi Sang Song
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Inc, Gi Sang Song filed Critical Kolon Inc
Priority to CN2008801235204A priority Critical patent/CN101911843B/en
Priority claimed from KR1020080138542A external-priority patent/KR101376477B1/en
Publication of WO2009084929A2 publication Critical patent/WO2009084929A2/en
Publication of WO2009084929A3 publication Critical patent/WO2009084929A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)

Abstract

A multilayer film includes a first surface layer and a second surface layer which opposes to the first surface layer, wherein an adhesiveness a of the first surface layer and an adhesiveness b of the second surface layer meet the following equation: [Equation 1] b > a. The dry film resist according to the present invention does not employ a conventional gel -free polyethylene cover film. Therefore, it is possible to reduce generation a poor pattern such as a chip or open circuit by fish-eyes or foreign substances generated by the cover film upon formation of a wiring pattern.
PCT/KR2008/007900 2007-12-31 2008-12-31 A multilayer film for dry film resist WO2009084929A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008801235204A CN101911843B (en) 2007-12-31 2008-12-31 A multilayer film for dry film resist

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20070141568 2007-12-31
KR10-2007-0141568 2007-12-31
KR1020080138542A KR101376477B1 (en) 2007-12-31 2008-12-31 A multilayer film for dry film resist
KR10-2008-0138542 2008-12-31

Publications (2)

Publication Number Publication Date
WO2009084929A2 WO2009084929A2 (en) 2009-07-09
WO2009084929A3 true WO2009084929A3 (en) 2009-08-20

Family

ID=40824918

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/007900 WO2009084929A2 (en) 2007-12-31 2008-12-31 A multilayer film for dry film resist

Country Status (1)

Country Link
WO (1) WO2009084929A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037100A (en) * 1997-11-07 2000-03-14 Kolon Industries, Inc. Dry film photoresist
JP2003342307A (en) * 2003-04-10 2003-12-03 Japan Polyolefins Co Ltd Protective film and its manufacturing process
US6664346B2 (en) * 2000-08-13 2003-12-16 Japan Polyolefins Co., Ltd. Protective film and method for preparing same
KR100698371B1 (en) * 2006-02-28 2007-03-23 (주)폴리웹 Protect film for dry film resist

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037100A (en) * 1997-11-07 2000-03-14 Kolon Industries, Inc. Dry film photoresist
US6664346B2 (en) * 2000-08-13 2003-12-16 Japan Polyolefins Co., Ltd. Protective film and method for preparing same
JP2003342307A (en) * 2003-04-10 2003-12-03 Japan Polyolefins Co Ltd Protective film and its manufacturing process
KR100698371B1 (en) * 2006-02-28 2007-03-23 (주)폴리웹 Protect film for dry film resist

Also Published As

Publication number Publication date
WO2009084929A2 (en) 2009-07-09

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