WO2009082868A1

WO2009082868A1 - Solar cell board and fabricating method thereof

Info

Publication number: WO2009082868A1
Application number: PCT/CN2008/000534
Authority: WO
Inventors: Dongqi Wang
Original assignee: Dongqi Wang
Priority date: 2007-12-26
Filing date: 2008-03-18
Publication date: 2009-07-09
Also published as: CN100550435C; CN101217168A

Abstract

A solar cell board and fabricating method thereof are provided. On one side of the PCB board (200) of the solar cell board, there are arranged at least one set of mounting sites (210) for solar wafer, there are arranged a plurality solder points (211) staggered on each set of the mounting sites (210), for connecting the positive electrode, negative electrode of the solar wafer, respectively; there are mounted a solar wafer on each set of the mounting sites, each of the solar wafer constructs a single cell; there are arranged two electrode pads (240) on the same side of the PCB board, all of the single cells are connected in series or in parallel and thereafter connected to the two electrode pads (240), respectively, therein, one of the electrode pads acts as positive output of the source, and the other acts as the negative output of the source.

Description

Solar panel and manufacturing method thereof

Technical field

The present invention relates to the technical field of design of solar panels, and more particularly to a solar panel and a method of fabricating the same. Background technique

Solar panels are a core part of solar power systems and the most valuable part of solar power systems. They are used to convert the sun's radiation capacity into electrical energy, or to be stored in batteries, or to drive loads. The quality and cost of solar panels will directly determine the quality and cost of the entire system.

At present, the positive and negative electrodes of a commonly used solar wafer are respectively distributed on both sides of a battery wafer. For such a solar wafer, it is necessary to use manual soldering, soldering and drawing the positive and negative electrodes of the solar wafer on both sides of the battery wafer, and then manually attaching the solar wafer to the PCB and soldering the leads to the PCB. ,As shown in Figure 1. This type of production greatly affects production efficiency and product reliability, and cannot achieve high-efficiency and high-volume production.

However, with the development and use of new energy by the public and the awareness of the public's environmental protection and energy conservation, the demand for solar cells is increasing. Therefore, there is a need to improve the design of solar panel structures to meet the needs of mass production. Summary of the invention

An object of the present invention is to provide a solar panel and a manufacturing method thereof, the sun Energy panels can be widely used in solar lamps and mobile power supplies, and can be used

The SMT process is mass-produced, and the technical problem to be solved is to improve the productivity of the production and the reliability of the product.

In order to achieve the above object, the present invention adopts the following technical solutions:

The solar panel of the present invention is provided with a mounting position of at least one set of solar wafers on one side of the PCB board of the solar panel, and a plurality of staggered pads are disposed on each set of mounting positions. a positive and negative electrode for respectively connecting the solar wafers; a solar wafer is attached to each set of mounting positions, and each of the solar wafers constitutes a single battery; and two electrode weldings are also disposed on the same side of the PCB Disk, all the cells composed of solar wafers are connected in series or in parallel through the conduction belts to connect two sets of electrode pads, wherein one set of electrode pads serves as the positive output of the power supply, and the other set of electrode pads serves as the negative of the power supply. Out.

Wherein, on the same side of the PCB board, a test point is respectively disposed on each side of each solar chip, wherein one test point connects all the pads connected to the positive electrode of the solar chip through the conduction band, and another test point All of the pads connected to the negative electrode of the solar wafer are connected by a conduction band. Wherein, in each of the mounting positions, at least one pad is disposed on the conduction band connecting the same electrode of the solar wafer. Each of the solar wafers is a small solar chip that is cut to a length of 30 to 40 mm or 40 to 50 mm, and each of the solar small wafers has at least one set of positive and negative electrodes.

Wherein, in the mounting position, the conduction band and the pad width connecting the positive electrode of the solar wafer are smaller than the positive electrode width of the solar wafer, and the width of the conduction band and the disk connected to the negative electrode of the solar wafer is smaller than the negative electrode width of the solar wafer. Wherein, two element through holes are disposed on each of the electrode pads for guiding the electrodes to the other side of the PCB board through jumpers. The PCB board is provided with at least two positioning holes for precise alignment in the automatic patching process.

In the above method for manufacturing a solar panel, the method is carried out according to the following steps: A. drawing a circuit board according to requirements, and setting a mounting position of at least one set of solar wafers on one side of the PCB board, in each group of mounting positions Providing a plurality of staggered pads for respectively connecting the positive and negative electrodes of the solar wafer; and providing two sets of electrode pads on the same side of the PCB, all the solders connected to the positive and negative electrodes of the solar wafer The points are respectively connected to the two sets of electrode pads through the conduction band, wherein one set of electrode pads serves as a positive output of the power source, and the other set of electrode pads serves as a negative output of the power source; B. a silk screen is displayed on the PCB to indicate a positioning line And indicating the orientation of the patch in the silk screen; C. positioning the PCB board, and mounting the solar wafer on the PCB board by using an SMT process to fabricate a solar panel. Wherein, in the step C, each solar wafer is pre-fixed with a high temperature resistant adhesive or the like, for example, the adhesive may be preferably red plastic, and the solar cell wafer is positioned by using an auxiliary positioning fixture.

The structural design of the solar panel of the present invention can be combined with a new high-efficiency solar wafer represented by SUNPOWER, USA (as shown in FIG. 2, the special structure solar wafer has the positive electrode and the negative electrode on the same side of the solar cell crystal. ) and SMT process (surface mount technology, SMT for efficient mass production), the solar panel of this structure has a photoelectric conversion efficiency of up to 22%, and its product has compact structure, small size, vibration resistance and impact resistance. Excellent performance and high production efficiency. The invention completely overcomes the defects that the existing solar panel must be manually soldered, and adopts the advanced SMT process design. It is a new type of PCB solar panel, especially suitable for high-efficiency mass production, and can improve product performance and reliability. Sex, reduce production costs. The solar panel of the invention can be widely used in solar lawn lamps, garden lamps, street lamps and mobile power sources. DRAWINGS

FIG. 1 is a schematic structural view of a solar panel in the prior art.

2 is a schematic structural view of a novel solar wafer.

3 is a schematic view showing the circuit design structure of a solar cell PCB printed board according to the present invention. 4 is a schematic structural view of the PCB printed board of FIG. 3 after being packaged.

Fig. 5 is a structural schematic view of a solar panel using the PCB of the structure of Fig. 3. Fig. 6 is a schematic view showing the structure of another embodiment of the solar cell PCB printed board of the present invention.

Fig. 7 is a schematic structural view showing still another embodiment of a solar cell PCB printed board of the present invention. detailed description

The technical solution of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in FIG. 3 and FIG. 4, the present invention mainly provides a structural design of a solar panel. The structure of the PCB board of the solar panel of the present invention is as shown in FIG. 3. On one side of the PCB board 200, at least one set of mounting positions 210 of solar wafers for automatically or manually mounting the solar wafers is provided. Group placement bit 20 is provided with a plurality of interleaved points The solder joints 211 of the cloth are used to respectively connect the positive and negative electrodes of the solar wafer; on the same side of the PCB board 200, two sets of electrode pads 240 are further disposed, and all the solder joints 211 connected to the positive and negative electrodes of the solar wafer pass through The conduction strips 230, 231, and 232 are respectively connected to the two sets of electrode pads 240, wherein one set of the electrode pads 240 serves as the positive output of the power source, and the other set of the electrode pads 240 serves as the negative output of the power source. After mounting the solar wafers manually or automatically on the various sets of mounting locations 210 of the PCB board 200 of the above structure (the concept includes the slicing of the solar wafers, the same below), the package can form the solar cell of the present invention. The board, as shown in FIG. 5, is mounted with a solar wafer on each set of mounting positions, and each of the solar wafers constitutes a single battery, and the positive and negative electrodes pass through the solder joints 211 and the conduction strips 231, 232 connected thereto. The positive and negative electrodes of the single cell are led to both sides of the solar wafer, and then all the cells composed of the solar wafer are connected in series or in parallel through the conduction band 230, and then the two sets of electrode pads 240 are respectively connected to provide different voltages for the user. And current. Of course, each of the above-mentioned electrode pads can be set as two pads, and each group of pads is appropriately staggered. According to the needs of different occasions, design PCB boards with different sizes or different specifications.

The above solar cell PCB board is designed to apply solar wafers with positive and negative electrodes on the same side, and uses SMT technology to achieve high-volume patch production. A new type of high-efficiency solar wafer represented by SU POWER in the United States has a special structure. The positive and negative electrodes of the solar wafer are distributed on the same side of the battery wafer. For different models, the positive electrode width is about 0.9mm, or l.lmm, or 1.3mm, or 1.5mm, the negative electrode width is about 0.23mm, or 0.29mm, or 0.28mm, or 0.4mm, the spacing between the positive and negative electrodes is about 0.33mm, or 0.3mm, or 0.37mm, or 0.2mm. Each set of electrodes can provide a voltage of about 0.6V, through the string

S A higher voltage can be supplied. Different lengths are available to provide different currents; more parallel currents provide more current. Therefore, according to different design requirements, each solar wafer can be cut into solar small wafers having a length of 30 ~ 40mm or 40 ~ 50mm, and each solar small wafer has at least one set of positive and negative electrodes, such as two electrodes, three electrodes, A multi-electrode solar small wafer such as a four-electrode is then mounted on a PCB for serial and parallel connection to obtain the required current and voltage.

When designing a solar cell using a slice of a solar wafer, it is necessary to determine the size of a mounting position on the PCB according to the specifications of the small solar chip. As shown in FIG. 3, it is provided with 7 sets of mounting sites 210 for mounting solar small wafers, wherein each small wafer has a size of about 42 mm x 6 mm or 42 mm x 7 mm (corresponding to different wafer types) Cutting). Three sets of positive and negative electrodes are reserved on the PCB, the positive and negative poles are connected in parallel, and the whole board uses seven wafers to cross each other; ^ output can reach 4.2V voltage, 80mA current, and the entire PCB board size can be 60mm x 60mm. Two electrode pads 240 may be designed in the middle of the PCB board, and two element via holes are provided in each of the electrode pads, which may connect the output electrodes of the power source to the other side of the PCB board 200 through jumpers, which A structural design can be applied to other embodiments. As shown in Figures 6 and 7, the present invention also shows an embodiment of the other two PCB boards. In Fig. 6, each solar wafer has a size of 31 mm X 6 mm (or 31 mm x 7 mm), and three sets of positive and negative electrodes are reserved, and the positive and negative electrodes are respectively connected in parallel. The whole board uses two solar chips in series to output a current of 1.2V and 50mA, and the entire PCB board size is 46mm x l9mm. As shown in Fig. 7, each solar wafer has a size of 31mm X 4mm (or 31mm x 5mm), and two sets of positive and negative electrodes are reserved, and the positive and negative electrodes are respectively connected in parallel, and the whole plate is connected in series with four wafers to achieve a voltage of 2.4V. , 35mA current. The entire PCB board has a size of 60mm x 60mm square and a diameter of 65mm, and the middle design pad. For positioning of the circular PCB board, several positioning holes 300 can be designed, which is convenient for batching by SMT process. Precise positioning during production.

As shown in FIG. 3 and FIG. 4, on the same side of the PCB board, a test point 220 is further disposed on each side of each of the solar panels (ie, each set of mounting locations 210) for each of The voltage or current provided by the single cell composed of the solar wafer is tested to facilitate the on-off test of the solar panel produced by the SMT process in large quantities to ensure the batch yield of the product. In FIG. 5, the test point 220 on the left side of each solar wafer is connected to all the solder joints 211 connected to the positive electrode of the solar wafer through a conduction band (ie, 231 in FIG. 3), and the test point 220 on the right side thereof passes through the conduction band (ie, 232) in Fig. 3 connects all the solder joints 211 connected to the negative electrode of the solar wafer. As can be seen from Fig. 3 to Fig. 7, this structural feature can also be applied in other embodiments. Also after the PCB board is packaged, the test pilot needs to be exposed, so that it can be tested after the solar wafer is automatically mounted.

As can be seen from FIG. 3, in the PCB design, in the mounting position 210, the widths of the conduction strips 231 and the pads 211 connecting the positive electrodes of the solar wafer are smaller than the positive electrode width of the solar wafer, and the negative electrodes of the solar wafer are connected. The width of the conduction band 232 and the pad 211 is smaller than the positive electrode width of the solar wafer, and this is for effectively avoiding a phenomenon in which the positive and negative electrodes are short-circuited during the automatic placement welding. For example, if the present invention employs a solar wafer of a structure and size having a positive electrode width of about 0.9 mm and a negative electrode width of about 0.23 mm, the width of the conduction band 231 connecting the positive electrode of the solar wafer may be within the mounting position. 0.3 to 0.4 mm, the width of the conduction band 232 connecting the negative electrode of the solar wafer can be For 0.1 ~ 0.29mm, the optimal choice is 0.2 mm. Moreover, in FIG. 3, it can be seen that, on the same side of the PCB board, in each set of mounting locations 210, at least one pad is disposed on the conductive strip connecting the same electrode of the solar wafer, and a plurality of soldering is ensured. In the case of the disk, each solder joint has a certain interval and is staggered. This is to avoid the phenomenon that the electrode is broken when performing automatic placement welding.

It can be seen from the above structural description that the solar panel of the present invention can adopt a small-sized solar wafer, that is, it can be cut into small wafers by using a waste solar wafer board, and then the PCB board design of the present invention can be adopted as needed. The combination is made into a solar cell, which can effectively reduce the manufacturing cost of the solar panel and reduce the waste of resources.

The present invention also provides a method of fabricating a solar cell, the method being carried out according to the following process:

First, draw a circuit to make a PCB board according to requirements, and install at least one set of mounting positions of the solar wafer on one side of the PCB board for automatically mounting the solar wafer, and set a plurality of staggered weldings on each set of mounting positions. Point, for connecting the positive and negative electrodes of the solar wafer respectively; two sets of electrode pads are disposed on the same side of the PCB board, and all the solder joints connected to the positive and negative electrodes of the solar wafer are respectively connected to the two sets of electrodes through the conduction band A pad, wherein one set of electrode pads serves as a positive output of the power source and the other set of electrode pads serves as a negative output of the power source.

In this process, in order to reduce the manufacturing cost, a single-panel wiring design can be adopted to select a low-cost paper PCB board or a fireproof PCB board. According to the process characteristics of SMT, the board thickness is preferably about 1.2 mm to 1.6 mm, and according to Different usage requirements can be set Different PCB board versions. At least two positioning holes (such as the positioning holes 300 in FIG. 3 to FIG. 7) need to be disposed on the PCB, mainly for accurately aligning in the automatic patching process, preventing the board from sliding, thereby affecting the sticking of the solar wafer. Install the effect.

Then, a silk screen indicating positioning line is set on the above PCB board, and the patch direction is indicated in the silk screen, so that each solar chip can be accurately positioned and avoided by the SMT process, and the large offset can be avoided. Open or short circuit of the electrode during mass production.

Next, the above PCB board is positioned, and a solar wafer is mounted on the PCB by an SMT process to fabricate a solar panel. Since the solar wafer used is only 270 μm thick, it is fragile and fragile. Therefore, the following points should be noted when performing the above SMT production process:

1. Design loading trays or braids for different specifications of solar wafers;

2. Manual or automatic placement of nozzles and suitable mold fixtures for different specifications of solar wafer design, such as nozzle heads can be extended to meet the needs of rectangular solar wafers, and auxiliary positioning fixtures for solar energy The wafer is positioned;

3. In order to prevent the solar wafer from being displaced during the reflow process, each solar wafer is pre-fixed with a red glue or the like at the same time as the patch;

4. In order to prevent the deformation of the PCB board, it is necessary to reasonably set the furnace temperature of each temperature zone of the reflow oven, which can be derived according to the SMT production process requirements, and belongs to the common knowledge of the prior art.

In summary, in the structural design of the PCB board of the present invention, it is necessary to accurately measure the solar wafer by the root vibration, accurately design the pad line width, distribution and spacing, and also pay attention to the above when performing the SMT mounting process. Several key points can be effectively carried out Mass production of solar panels. It is to be understood that those skilled in the art will be able to make modifications and changes in accordance with the above description, and all such modifications and variations are intended to fall within the scope of the appended claims.

Claims

Rights request

A solar panel, characterized in that, on one side of a PCB board of the solar panel, at least one set of mounting positions of solar chips is disposed, and a plurality of staggers are disposed on each set of mounting positions. Distributed solder joints for respectively connecting the positive and negative electrodes of the solar wafer;

A solar wafer is attached to each set of mounting positions, and each solar wafer constitutes a single battery;

Two electrode pads are also disposed on the same surface of the PCB board, and all the cells composed of the solar wafers are connected in series or in parallel through the conduction bands, and then two sets of electrode pads are respectively connected, wherein one set of electrode pads is used as a power source. The positive output, the other set of electrode pads as the negative of the power supply and r out.

2. The solar panel according to claim 1, wherein a test point is disposed on each side of each of the solar chips on the same side of the PCB, wherein one test point is connected by a conduction band. The pad connected to the positive electrode of the solar wafer, the other test point is connected to all the pads connected to the negative electrode of the solar wafer through a conduction band.

The solar cell panel according to claim 1, wherein at least one of the pads is disposed on the conduction band connecting the same electrode of the solar wafer in each of the mounting positions.

4. The solar panel according to claim 1, wherein each of the solar wafers is cut into solar crystals having a length of 30 to 40 mm or 40 to 50 mm.

U Each of the solar small wafers has at least one set of positive and negative electrodes.

The solar panel according to claim 1, wherein in the mounting position, the conduction band and the pad width connecting the positive electrode of the solar wafer are smaller than the positive electrode width of the solar wafer, and the negative electrode of the solar wafer is connected. The conduction band and pad width are smaller than the negative electrode width of the solar wafer. '

The solar panel according to claim 1, wherein two element through holes are provided on each of the electrode pads for guiding the electrodes to the other side of the PCB through jumpers .

7, the solar cell panel according to claim 1, characterized in that, on the PCB is provided with at least two positioning holes for automatic placement process for precise alignment ₀

8. A method of fabricating a solar panel, characterized in that the method is carried out according to the following steps:

A. Draw a circuit to prepare a PCB board according to requirements, set at least one set of mounting positions of the solar chips on one side of the PCB board, and set a plurality of staggered pads on each set of mounting positions for respectively connecting the solar chips Positive and negative electrodes; two sets of electrode pads are disposed on the same side of the PCB, and all the pads connected to the positive and negative electrodes of the solar chip are respectively connected to the two sets of electrode pads through the conduction band, wherein, one set The electrode plate is used as the positive output of the power source, and the other electrode pad is used as the negative output of the power source;

B. setting a silk screen on the PCB to indicate a positioning line, and indicating a patch direction in the silk screen;

42 C. Positioning the PCB board, and mounting a solar wafer on the PCB board by using an SMT process to fabricate a solar panel.

9. The method of claim 8 wherein in step C, each solar wafer is pre-fixed with an adhesive.

10. The method of claim 8 wherein in step C, the solar wafer is positioned using an auxiliary positioning fixture.