WO2009075322A1 - Resin-carbon composite material - Google Patents

Resin-carbon composite material Download PDF

Info

Publication number
WO2009075322A1
WO2009075322A1 PCT/JP2008/072502 JP2008072502W WO2009075322A1 WO 2009075322 A1 WO2009075322 A1 WO 2009075322A1 JP 2008072502 W JP2008072502 W JP 2008072502W WO 2009075322 A1 WO2009075322 A1 WO 2009075322A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
composite material
carbon composite
carbon
volume
Prior art date
Application number
PCT/JP2008/072502
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshimitsu Kankawa
Original Assignee
Starlite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Starlite Co., Ltd. filed Critical Starlite Co., Ltd.
Publication of WO2009075322A1 publication Critical patent/WO2009075322A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon

Abstract

Disclosed is a functional resin material having high heat dissipation, electromagnetic shielding properties, electrical conductivity and strength. Specifically disclosed is a resin-carbon composite material obtained by uniformly dispersing carbon fibers (a) and a graphite powder (b) in a resin. This resin-carbon composite material is characterized in that the ratio of the component (a) in the resin-carbon composite material is 10-60% by volume, the ratio of the component (b) in the resin-carbon composite material is 10-60% by volume, and the ratio of the components (a) and (b) in total is 20-80% by volume. The carbon fibers (a) are preferably pitch-based carbon fibers or carbon nanotubes.
PCT/JP2008/072502 2007-12-12 2008-12-11 Resin-carbon composite material WO2009075322A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-320775 2007-12-12
JP2007320775A JP5205947B2 (en) 2007-12-12 2007-12-12 Resin carbon composite material

Publications (1)

Publication Number Publication Date
WO2009075322A1 true WO2009075322A1 (en) 2009-06-18

Family

ID=40755561

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072502 WO2009075322A1 (en) 2007-12-12 2008-12-11 Resin-carbon composite material

Country Status (2)

Country Link
JP (1) JP5205947B2 (en)
WO (1) WO2009075322A1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2381756A3 (en) * 2010-04-26 2011-12-28 Nitto Denko Corporation Electromagnetic wave absorber
JP2012062584A (en) * 2010-09-14 2012-03-29 Bridgestone Corp Tire cord and pneumatic tire using the same
CN102702648A (en) * 2012-06-19 2012-10-03 上海交通大学 Preparation method of heat-conducting polyvinyl chloride composite material with microwave absorption characteristic
CN102993603A (en) * 2012-11-29 2013-03-27 宁波先锋新材料股份有限公司 Polyvinyl chloride composite material with microwave absorption property and preparation method thereof
US8735489B2 (en) 2011-12-06 2014-05-27 Kabushiki Kaisha Toyota Chuo Kenkyusho Resin composite material
CN103958583A (en) * 2011-12-07 2014-07-30 二村化学株式会社 Electrically conductive interconnected porous film and method for producing same
JP2014532092A (en) * 2011-09-16 2014-12-04 ピーアールシー−デソト インターナショナル，インコーポレイティド Conductive sealant composition
JP2014532093A (en) * 2011-09-16 2014-12-04 ピーアールシー−デソト インターナショナル，インコーポレイティド Conductive sealant composition
US9096736B2 (en) 2010-06-07 2015-08-04 Kabushiki Kaisha Toyota Chuo Kenkyusho Fine graphite particles, graphite particle-dispersed liquid containing the same, and method for producing fine graphite particles
WO2017065009A1 (en) * 2015-10-16 2017-04-20 三菱レイヨン株式会社 Thermoplastic resin composition, method for producing thermoplastic resin composition, and molded body
US9728294B2 (en) 2010-06-07 2017-08-08 Kabushiki Kaisha Toyota Chuo Kenkyusho Resin composite material
JP2017203093A (en) * 2016-05-11 2017-11-16 日東電工株式会社 Manufacturing method of conductive resin composite and conductive resin composite
WO2018199008A1 (en) 2017-04-26 2018-11-01 積水テクノ成型株式会社 Resin molded body
WO2019188291A1 (en) * 2018-03-27 2019-10-03 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition and cured product thereof
JP2020079412A (en) * 2015-03-31 2020-05-28 三菱ケミカル株式会社 Rein pellet, method for producing resin pellet, molded body and method for producing molded body
CN113462071A (en) * 2020-03-31 2021-10-01 日铁化学材料株式会社 Conductive resin composition and electromagnetic wave shielding material using the same
WO2022181696A1 (en) * 2021-02-25 2022-09-01 三菱エンジニアリングプラスチックス株式会社 Resin composition, molded body, electromagnetic wave absorber, and method for manufacturing resin composition

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5413215B2 (en) * 2010-01-25 2014-02-12 三菱エンジニアリングプラスチックス株式会社 Electromagnetic wave suppressing resin composition and molded product
DE102010043473A1 (en) * 2010-11-05 2012-05-10 Evonik Degussa Gmbh Carbon nanotube-containing polyamide 12 composition
DE102010043470A1 (en) * 2010-11-05 2012-05-10 Evonik Degussa Gmbh Composition of polyamides with low concentration of carboxylic acid amide groups and electrically conductive carbon
JP6003010B2 (en) * 2010-11-18 2016-10-05 三菱レイヨン株式会社 Electromagnetic wave shielding composite material, electronic equipment casing and battery case
JP6184056B2 (en) * 2012-04-09 2017-08-23 リケンテクノス株式会社 Resin composition
JP6091859B2 (en) * 2012-11-21 2017-03-08 Ntn株式会社 Wheel bearing device
JP2014133842A (en) * 2013-01-11 2014-07-24 Yazaki Corp Conductive resin composition
JP6139284B2 (en) * 2013-06-11 2017-05-31 住友電工プリントサーキット株式会社 Shield film and printed wiring board
JP2015012098A (en) * 2013-06-27 2015-01-19 住友電工プリントサーキット株式会社 Shield film and printed wiring board
CN105637977A (en) * 2013-11-22 2016-06-01 东洋德来路博株式会社 Carbon heating composition and carbon heating element
JP6779863B2 (en) * 2014-05-09 2020-11-04 カウンスィル オブ サイエンティフィック アンド インダストリアル リサーチＣｏｕｎｃｉｌ Ｏｆ Ｓｃｉｅｎｔｉｆｉｃ ＆ Ｉｎｄｕｓｔｒｉａｌ Ｒｅｓｅａｒｃｈ Improved next-generation outdoor polymer chip electrodes
JP6527010B2 (en) * 2015-04-27 2019-06-05 スターライト工業株式会社 Thermally conductive resin molding and method for producing the same
CN108727819B (en) * 2017-04-13 2021-01-26 青岛创合新材料有限公司 Carbon fiber reinforced polyphenylene sulfide nano composite material, preparation method and application of novel radiating pipe
JP7116056B2 (en) * 2017-06-06 2022-08-09 ダウ・東レ株式会社 SILICONE RUBBER COMPOSITION FOR FORMING FIXING MEMBER AND FIXING MEMBER
WO2019235561A1 (en) * 2018-06-06 2019-12-12 株式会社新日本電波吸収体 Electromagnetic shielding material and signal processing unit provided with same
JP2020143227A (en) * 2019-03-07 2020-09-10 住友ベークライト株式会社 Molding
KR102581385B1 (en) * 2019-10-31 2023-09-22 주식회사 엘지화학 Thermoplastic resin composition, and manufacturing method of molded article using the same
WO2023182394A1 (en) * 2022-03-25 2023-09-28 積水テクノ成型株式会社 Resin composition, and resin molded body

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0277442A (en) * 1988-09-14 1990-03-16 Showa Denko Kk Electrically conductive thermoplastic resin composition
JP2003049081A (en) * 2001-08-08 2003-02-21 Sumitomo Bakelite Co Ltd Thermoplastic resin composition excellent in heat radiation property
JP2003082247A (en) * 2001-06-28 2003-03-19 Toray Ind Inc Thermoplastic resin composition and molded product
JP2003192917A (en) * 2001-05-24 2003-07-09 Toray Ind Inc Tableted resin composition, method for producing the same, and molding obtained from the same
JP2006307358A (en) * 2005-04-26 2006-11-09 Shimane Pref Gov Nanofiber-containing pitch-based carbon fiber and method for producing the same
JP2007099798A (en) * 2005-09-30 2007-04-19 Mitsubishi Engineering Plastics Corp Heat-conductive insulating polycarbonate-based resin composition and molding
JP2007106950A (en) * 2005-10-17 2007-04-26 Tosoh Corp Polyarylene sulfide composition
JP2007191718A (en) * 2000-06-05 2007-08-02 Showa Denko Kk Electroconductive curable resin composition, its cured product and molded article thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4628143B2 (en) * 2004-03-03 2011-02-09 昭和電工株式会社 Conductive resin composition and molded body thereof
JP4812391B2 (en) * 2005-10-14 2011-11-09 昭和電工株式会社 Thermally conductive resin composition, structure thereof and use thereof
JP2007191178A (en) * 2006-01-18 2007-08-02 Marukin Insatsu Kk Packaging box
JP2007291267A (en) * 2006-04-26 2007-11-08 Teijin Ltd Thermally conductive molding material and molded sheet using this

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0277442A (en) * 1988-09-14 1990-03-16 Showa Denko Kk Electrically conductive thermoplastic resin composition
JP2007191718A (en) * 2000-06-05 2007-08-02 Showa Denko Kk Electroconductive curable resin composition, its cured product and molded article thereof
JP2003192917A (en) * 2001-05-24 2003-07-09 Toray Ind Inc Tableted resin composition, method for producing the same, and molding obtained from the same
JP2003082247A (en) * 2001-06-28 2003-03-19 Toray Ind Inc Thermoplastic resin composition and molded product
JP2003049081A (en) * 2001-08-08 2003-02-21 Sumitomo Bakelite Co Ltd Thermoplastic resin composition excellent in heat radiation property
JP2006307358A (en) * 2005-04-26 2006-11-09 Shimane Pref Gov Nanofiber-containing pitch-based carbon fiber and method for producing the same
JP2007099798A (en) * 2005-09-30 2007-04-19 Mitsubishi Engineering Plastics Corp Heat-conductive insulating polycarbonate-based resin composition and molding
JP2007106950A (en) * 2005-10-17 2007-04-26 Tosoh Corp Polyarylene sulfide composition

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2381756A3 (en) * 2010-04-26 2011-12-28 Nitto Denko Corporation Electromagnetic wave absorber
US8643531B2 (en) 2010-04-26 2014-02-04 Nitto Denko Corporation Electromagnetic wave absorber
US9728294B2 (en) 2010-06-07 2017-08-08 Kabushiki Kaisha Toyota Chuo Kenkyusho Resin composite material
US9096736B2 (en) 2010-06-07 2015-08-04 Kabushiki Kaisha Toyota Chuo Kenkyusho Fine graphite particles, graphite particle-dispersed liquid containing the same, and method for producing fine graphite particles
JP2012062584A (en) * 2010-09-14 2012-03-29 Bridgestone Corp Tire cord and pneumatic tire using the same
JP2014532092A (en) * 2011-09-16 2014-12-04 ピーアールシー−デソト インターナショナル，インコーポレイティド Conductive sealant composition
JP2014532093A (en) * 2011-09-16 2014-12-04 ピーアールシー−デソト インターナショナル，インコーポレイティド Conductive sealant composition
US8735489B2 (en) 2011-12-06 2014-05-27 Kabushiki Kaisha Toyota Chuo Kenkyusho Resin composite material
CN103958583A (en) * 2011-12-07 2014-07-30 二村化学株式会社 Electrically conductive interconnected porous film and method for producing same
CN102702648B (en) * 2012-06-19 2014-06-25 上海交通大学 Preparation method of heat-conducting polyvinyl chloride composite material with microwave absorption characteristic
CN102702648A (en) * 2012-06-19 2012-10-03 上海交通大学 Preparation method of heat-conducting polyvinyl chloride composite material with microwave absorption characteristic
CN102993603B (en) * 2012-11-29 2014-07-30 宁波先锋新材料股份有限公司 Polyvinyl chloride composite material with microwave absorption property and preparation method thereof
CN102993603A (en) * 2012-11-29 2013-03-27 宁波先锋新材料股份有限公司 Polyvinyl chloride composite material with microwave absorption property and preparation method thereof
JP2020079412A (en) * 2015-03-31 2020-05-28 三菱ケミカル株式会社 Rein pellet, method for producing resin pellet, molded body and method for producing molded body
WO2017065009A1 (en) * 2015-10-16 2017-04-20 三菱レイヨン株式会社 Thermoplastic resin composition, method for producing thermoplastic resin composition, and molded body
CN108137932A (en) * 2015-10-16 2018-06-08 三菱化学株式会社 Thermoplastic resin composition, the manufacturing method of thermoplastic resin composition and formed body
JPWO2017065009A1 (en) * 2015-10-16 2018-08-02 三菱ケミカル株式会社 Thermoplastic resin composition, method for producing thermoplastic resin composition, and molded article
US11279808B2 (en) 2015-10-16 2022-03-22 Mitsubishi Chemical Corporation Thermoplastic resin composition, method for producing thermoplastic resin composition, and molded body
JP2017203093A (en) * 2016-05-11 2017-11-16 日東電工株式会社 Manufacturing method of conductive resin composite and conductive resin composite
WO2018199008A1 (en) 2017-04-26 2018-11-01 積水テクノ成型株式会社 Resin molded body
KR20190138769A (en) 2017-04-26 2019-12-16 세끼스이 테크노 세이께이 가부시끼가이샤 Resin molded body
WO2019188291A1 (en) * 2018-03-27 2019-10-03 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition and cured product thereof
JPWO2019188291A1 (en) * 2018-03-27 2021-04-22 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition and its cured product
CN113462071A (en) * 2020-03-31 2021-10-01 日铁化学材料株式会社 Conductive resin composition and electromagnetic wave shielding material using the same
WO2022181696A1 (en) * 2021-02-25 2022-09-01 三菱エンジニアリングプラスチックス株式会社 Resin composition, molded body, electromagnetic wave absorber, and method for manufacturing resin composition

Also Published As

Publication number Publication date
JP2009144000A (en) 2009-07-02
JP5205947B2 (en) 2013-06-05

Similar Documents

Publication Publication Date Title
WO2009075322A1 (en) Resin-carbon composite material
Jia et al. Synergistic effect of graphite and carbon nanotubes on improved electromagnetic interference shielding performance in segregated composites
MX2016007703A (en) Composite materials with electrically conductive and delamination resistant properties.
SG129379A1 (en) Enhanced performance conductive filler and conductive polymers made therefrom
Li et al. Super-compression-resistant multiwalled carbon nanotube/nickel-coated carbonized loofah fiber/polyether ether ketone composite with excellent electromagnetic shielding performance
WO2009005029A1 (en) Resin heat sink
TW200737466A (en) Carbon nanotubes solder composite for high performance interconnect
GB2499334A (en) Nanomatrix carbon composite
EP2412741A4 (en) Epoxy resin composition, prepreg, carbon fiber reinforced composite material, and housing for electronic or electrical component
BR112012003936A2 (en) improvements in composite materials
TW200732252A (en) Carbon materials
MX2014007667A (en) Process for preparing cured epoxy composites.
EP2123711A4 (en) Thermosetting resin composition having rubbery polymer particle dispersed therein, and process for production thereof
WO2009041170A1 (en) Conductive film and method for producing the same
EP1961701A4 (en) Graphite particle, carbon-graphite composite particle and their production processes
SG145658A1 (en) Conductive materials
MY153335A (en) Conductive surfacing films for lightning strike and electromagnetic interferance shielding of thermoset composite materials
WO2005118469A3 (en) Sensing/actuating materials made from carbon nanotube polymer composites and methods for making same
TW200728344A (en) Resin composition and the circuit board of hybride integrated circuit of the same
WO2007143237A3 (en) Polymeric meterials incorporating carbon nanostructures and methods for making same
EP2192644A3 (en) Molding material for fuel cell separator
Li et al. In situ fabrication of magnetic and hierarchically porous carbon films for efficient electromagnetic wave shielding and absorption
WO2014189549A3 (en) Carbon nanotube composite conductors
MY149267A (en) Conductive paste
Zhou et al. Controllable construction of CNT-Interconnected liquid metal networks for thermal management

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08859732

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08859732

Country of ref document: EP

Kind code of ref document: A1