WO2009074368A3 - Herstellungsverfahren für ein mikromechanisches bauelement und mikromechanisches bauelement - Google Patents
Herstellungsverfahren für ein mikromechanisches bauelement und mikromechanisches bauelement Download PDFInfo
- Publication number
- WO2009074368A3 WO2009074368A3 PCT/EP2008/063670 EP2008063670W WO2009074368A3 WO 2009074368 A3 WO2009074368 A3 WO 2009074368A3 EP 2008063670 W EP2008063670 W EP 2008063670W WO 2009074368 A3 WO2009074368 A3 WO 2009074368A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- micromechanical component
- production method
- semiconductor substrate
- relates
- central part
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/033—Comb drives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Abstract
Die vorliegende Erfindung betrifft ein Herstellungsverfahren für ein mikromechanisches Bauelement (100) mit den Schritten: Bilden einer Isolierschicht (14) direkt auf einem ersten Halbleitersubstrat (10) und Ätzen mindestens eines Trenngrabens (26) durch das erste Halbleitersubstrat (10) zum Teilen des ersten Halbleitersubstrats (10) in mindestens ein elektrisch isoliertes Mittelteil (32 bis 38) und ein das Mittelteil (32 bis 38) umgebendes Rahmenteil (30). Des Weiteren betriff die Erfindung ein entsprechendes mikromechanisches Bauelement (100).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007059856A DE102007059856A1 (de) | 2007-12-12 | 2007-12-12 | Herstellungsverfahren für ein mikromechanisches Bauelement und mikromechaniches Bauelement |
DE102007059856.6 | 2007-12-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009074368A2 WO2009074368A2 (de) | 2009-06-18 |
WO2009074368A3 true WO2009074368A3 (de) | 2009-11-12 |
Family
ID=40679864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/063670 WO2009074368A2 (de) | 2007-12-12 | 2008-10-10 | Herstellungsverfahren für ein mikromechanisches bauelement und mikromechanisches bauelement |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102007059856A1 (de) |
WO (1) | WO2009074368A2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014210986A1 (de) * | 2014-06-10 | 2015-12-17 | Robert Bosch Gmbh | Mikromechanische Schichtenanordnung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1180493A2 (de) * | 2000-08-18 | 2002-02-20 | Samsung Electronics Co., Ltd. | Mikroaktor und dessen Herstellungsverfahren |
US20040081391A1 (en) * | 2002-10-18 | 2004-04-29 | Samsung Electronics Co., Ltd. | 2-D actuator and manufacturing method thereof |
US20050117235A1 (en) * | 2003-12-02 | 2005-06-02 | Samsung Electronics Co., Ltd. | Micro mirror and method for fabricating the same |
EP1659437A2 (de) * | 2004-10-19 | 2006-05-24 | Samsung Electronics Co., Ltd. | Zweiachsige Positioniereinrichtung und Verfahren zur Herstellung |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19728598C2 (de) | 1997-07-04 | 2000-12-14 | Bosch Gmbh Robert | Mikromechanische Spiegeleinrichtung |
JP3827977B2 (ja) | 2001-08-20 | 2006-09-27 | 富士通株式会社 | マイクロミラー素子の製造方法 |
-
2007
- 2007-12-12 DE DE102007059856A patent/DE102007059856A1/de not_active Withdrawn
-
2008
- 2008-10-10 WO PCT/EP2008/063670 patent/WO2009074368A2/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1180493A2 (de) * | 2000-08-18 | 2002-02-20 | Samsung Electronics Co., Ltd. | Mikroaktor und dessen Herstellungsverfahren |
US20040081391A1 (en) * | 2002-10-18 | 2004-04-29 | Samsung Electronics Co., Ltd. | 2-D actuator and manufacturing method thereof |
US20050117235A1 (en) * | 2003-12-02 | 2005-06-02 | Samsung Electronics Co., Ltd. | Micro mirror and method for fabricating the same |
EP1659437A2 (de) * | 2004-10-19 | 2006-05-24 | Samsung Electronics Co., Ltd. | Zweiachsige Positioniereinrichtung und Verfahren zur Herstellung |
Also Published As
Publication number | Publication date |
---|---|
DE102007059856A1 (de) | 2009-06-18 |
WO2009074368A2 (de) | 2009-06-18 |
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