WO2009072176A1 - マルチワイヤソーおよびインゴットの切断方法 - Google Patents

マルチワイヤソーおよびインゴットの切断方法 Download PDF

Info

Publication number
WO2009072176A1
WO2009072176A1 PCT/JP2007/073328 JP2007073328W WO2009072176A1 WO 2009072176 A1 WO2009072176 A1 WO 2009072176A1 JP 2007073328 W JP2007073328 W JP 2007073328W WO 2009072176 A1 WO2009072176 A1 WO 2009072176A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
work
saw
holding
multiwirer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/073328
Other languages
English (en)
French (fr)
Inventor
Seiichi Mimura
Hirokazu Nishida
Takafumi Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to PCT/JP2007/073328 priority Critical patent/WO2009072176A1/ja
Priority to TW097108462A priority patent/TW200924933A/zh
Publication of WO2009072176A1 publication Critical patent/WO2009072176A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

　複数のワイヤ溝を有する複数のローラ間にワイヤが巻きかけられて形成されたワイヤ列を走行させ、前記ワイヤ列に砥粒を含む加工液を供給しながらワークを前記ワイヤに圧接して前記ワークを複数のウエハに切断するマルチワイヤソーにおいて、前記ワークにおいて切断が開始される面と反対側の面を、ダミー部材を介して接着剤で固定保持する第１の保持部材と、前記ワイヤの配列方向において前記ワークの両側方から前記ワークを挟み込んで固定保持する第２の保持部材と、を備える。
PCT/JP2007/073328 2007-12-03 2007-12-03 マルチワイヤソーおよびインゴットの切断方法 Ceased WO2009072176A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/073328 WO2009072176A1 (ja) 2007-12-03 2007-12-03 マルチワイヤソーおよびインゴットの切断方法
TW097108462A TW200924933A (en) 2007-12-03 2008-03-11 Multi-wire saw and workpiece cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/073328 WO2009072176A1 (ja) 2007-12-03 2007-12-03 マルチワイヤソーおよびインゴットの切断方法

Publications (1)

Publication Number Publication Date
WO2009072176A1 true WO2009072176A1 (ja) 2009-06-11

Family

ID=40717362

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073328 Ceased WO2009072176A1 (ja) 2007-12-03 2007-12-03 マルチワイヤソーおよびインゴットの切断方法

Country Status (2)

Country Link
TW (1) TW200924933A (ja)
WO (1) WO2009072176A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011032599A1 (en) * 2009-09-18 2011-03-24 Applied Materials, Inc. Wire saw work piece support device, support spacer and method of sawing using same
JP2012101310A (ja) * 2010-11-09 2012-05-31 Yasunaga Corp ワイヤソー装置及びこれを用いたウエハの製造方法
JP2014087911A (ja) * 2012-10-31 2014-05-15 Komatsu Ntc Ltd ワイヤソーによるワーク切断方法
TWI632041B (zh) * 2017-09-11 2018-08-11 環球晶圓股份有限公司 晶棒切割方法及切削磨料套組
CN109747057A (zh) * 2019-02-14 2019-05-14 厦门芯光润泽科技有限公司 碳化硅晶棒多线切割方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113618546A (zh) * 2020-10-26 2021-11-09 怀化市健霆竹业有限公司 一种竹筷子加工用稳固型竹拉丝机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550422A (ja) * 1991-08-20 1993-03-02 Sumitomo Metal Ind Ltd マルチワイヤソーによる切断方法
JP2004001409A (ja) * 2002-03-29 2004-01-08 Sumitomo Mitsubishi Silicon Corp 硬脆性材料の切断方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550422A (ja) * 1991-08-20 1993-03-02 Sumitomo Metal Ind Ltd マルチワイヤソーによる切断方法
JP2004001409A (ja) * 2002-03-29 2004-01-08 Sumitomo Mitsubishi Silicon Corp 硬脆性材料の切断方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011032599A1 (en) * 2009-09-18 2011-03-24 Applied Materials, Inc. Wire saw work piece support device, support spacer and method of sawing using same
CN102574226A (zh) * 2009-09-18 2012-07-11 应用材料公司 线锯工件支撑装置、支撑间隔件及其使用方法
JP2012101310A (ja) * 2010-11-09 2012-05-31 Yasunaga Corp ワイヤソー装置及びこれを用いたウエハの製造方法
JP2014087911A (ja) * 2012-10-31 2014-05-15 Komatsu Ntc Ltd ワイヤソーによるワーク切断方法
TWI632041B (zh) * 2017-09-11 2018-08-11 環球晶圓股份有限公司 晶棒切割方法及切削磨料套組
CN109747057A (zh) * 2019-02-14 2019-05-14 厦门芯光润泽科技有限公司 碳化硅晶棒多线切割方法

Also Published As

Publication number Publication date
TW200924933A (en) 2009-06-16
TWI334818B (ja) 2010-12-21

Similar Documents

Publication Publication Date Title
WO2009072176A1 (ja) マルチワイヤソーおよびインゴットの切断方法
TW200634917A (en) Semiconductor-device manufacturing method
EP2252421A4 (en) QUICK CHANGE DORN, PUNCH CUTTER AND METHOD
WO2008018062A3 (en) Chatter-resistant end mill
WO2013040125A3 (en) Cutting elements for earth-boring tools, earth-boring tools including such cutting elements and related methods
WO2009078130A1 (ja) ワイヤソーによるワークの切断方法およびワイヤソー
WO2008039839A3 (en) Lattice dressing
EP2535143A4 (en) Method of cutting workpiece with wire saw, and wire saw
EP2006040A4 (en) CUTTING TOOL, METHOD FOR PRODUCING THE CUTTING TOOL, AND CUTTING METHOD
EP2752398A4 (en) POLYCRYSTALLINE FABRIC WITH CUBIC BORONITRIDE COMPLEX, MANUFACTURING METHOD, CUTTING TOOL, WIRE PULLER AND GRINDING TOOL
WO2008092135A3 (en) Multi-wire electron discharge machine
EP2058070A4 (en) CUTTING TOOL, MANUFACTURING METHOD AND CUTTING PROCESS
EP1779988A4 (en) CUTTING TOOL WHEEL AND MANUFACTURING METHOD THEREOF, ROLLING TOOL TOOL, AND TRACING DEVICE
CA2551507A1 (en) Downhole cutting device including a selectively presentable cutter
WO2008153362A3 (en) Wire saw device and its machining method using thereof
CA2552031A1 (en) Mill and pump-off sub
WO2012109109A3 (en) Multiple motor/pump array
WO2009041266A1 (ja) 太陽電池用ウエハの製造方法
FI20050790L (fi) Menetelmä sahalaitteen terän jännittämiseksi ja ohjaamiseksi sekä ohjaus- ja jännityslaitteet
JP2008078473A5 (ja)
WO2008055489A3 (de) Vorrichtung zur spanenden bearbeitung eines werkstücks
WO2009120006A3 (ko) 와이어 소우 및 와이어 소우의 제조방법
TW200605146A (en) Spacer die structure and method for attaching
WO2005011071A3 (en) Vertical comb drive and uses thereof
WO2009098664A3 (en) Structured cutting

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07832948

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: JP

122 Ep: pct application non-entry in european phase

Ref document number: 07832948

Country of ref document: EP

Kind code of ref document: A1