WO2009063734A1 - Apparatus having electronic component mounted thereon - Google Patents

Apparatus having electronic component mounted thereon Download PDF

Info

Publication number
WO2009063734A1
WO2009063734A1 PCT/JP2008/069322 JP2008069322W WO2009063734A1 WO 2009063734 A1 WO2009063734 A1 WO 2009063734A1 JP 2008069322 W JP2008069322 W JP 2008069322W WO 2009063734 A1 WO2009063734 A1 WO 2009063734A1
Authority
WO
WIPO (PCT)
Prior art keywords
case
circuit board
printed circuit
electronic component
conductor section
Prior art date
Application number
PCT/JP2008/069322
Other languages
French (fr)
Japanese (ja)
Inventor
Masaharu Imazato
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2009541085A priority Critical patent/JPWO2009063734A1/en
Publication of WO2009063734A1 publication Critical patent/WO2009063734A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0009—Casings with provisions to reduce EMI leakage through the joining parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Disclosed is an apparatus having an electronic component mounted thereon. The apparatus has reduced electrical field intensity of noise radiation, which is proportional to a noise current path area, by minimizing the area, and is easily opened/closed. Specifically, an apparatus (10) having an electronic component mounted thereon is provided with a box-like first case (11) which has a conductor section and an opened top; a second case (12) which has a conductor section and an opened bottom and covers the first case (11) by having the bottom opening face the top opening of the first case (11); a printed circuit board (14) which is mounted in the first case (11) and has an electronic component (13) mounted thereon; and a connecting member (16) which electrically connects the conductor section of the first case (11) and that of the second case (12) to each other. The outer circumference of the printed circuit board (14) and the inner circumference sections of the first case (11) and the second case (12) are arranged close to each other, a substrate attaching member (11A) for fixing the printed circuit board (14) is arranged at a position close to the outer circumference end of the printed circuit board (14), and one end portion of the connecting member (16) is fixed to the printed circuit board (14).
PCT/JP2008/069322 2007-11-13 2008-10-24 Apparatus having electronic component mounted thereon WO2009063734A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009541085A JPWO2009063734A1 (en) 2007-11-13 2008-10-24 Electronic component mounting equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007294003 2007-11-13
JP2007-294003 2007-11-13

Publications (1)

Publication Number Publication Date
WO2009063734A1 true WO2009063734A1 (en) 2009-05-22

Family

ID=40638587

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069322 WO2009063734A1 (en) 2007-11-13 2008-10-24 Apparatus having electronic component mounted thereon

Country Status (2)

Country Link
JP (1) JPWO2009063734A1 (en)
WO (1) WO2009063734A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283069A (en) * 2009-06-03 2010-12-16 Hitachi Ltd Electronic device and method for measuring noise current
US9521642B2 (en) 2012-08-20 2016-12-13 Qualcomm Incorporated Configuration of a new enrollee device for use in a communication network
US10154025B2 (en) 2013-03-15 2018-12-11 Qualcomm Incorporated Seamless device configuration in a communication network

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834797U (en) * 1981-09-01 1983-03-07 株式会社東芝 Shield fitting installation device
JPS6217198U (en) * 1985-07-16 1987-02-02
JPH05343880A (en) * 1992-06-09 1993-12-24 Sanyo Electric Co Ltd Casing structure of electronic equipment
JPH0714687U (en) * 1993-07-30 1995-03-10 株式会社電子技研 Electronic parts storage case
JP2000012113A (en) * 1998-06-22 2000-01-14 Matsushita Electric Ind Co Ltd Earth spring device
JP2000208981A (en) * 1999-01-14 2000-07-28 Nec Shizuoka Ltd Environment-oriented fg structure
JP2000324423A (en) * 1999-05-10 2000-11-24 Mitsubishi Electric Corp Video display device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834797U (en) * 1981-09-01 1983-03-07 株式会社東芝 Shield fitting installation device
JPS6217198U (en) * 1985-07-16 1987-02-02
JPH05343880A (en) * 1992-06-09 1993-12-24 Sanyo Electric Co Ltd Casing structure of electronic equipment
JPH0714687U (en) * 1993-07-30 1995-03-10 株式会社電子技研 Electronic parts storage case
JP2000012113A (en) * 1998-06-22 2000-01-14 Matsushita Electric Ind Co Ltd Earth spring device
JP2000208981A (en) * 1999-01-14 2000-07-28 Nec Shizuoka Ltd Environment-oriented fg structure
JP2000324423A (en) * 1999-05-10 2000-11-24 Mitsubishi Electric Corp Video display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283069A (en) * 2009-06-03 2010-12-16 Hitachi Ltd Electronic device and method for measuring noise current
US9521642B2 (en) 2012-08-20 2016-12-13 Qualcomm Incorporated Configuration of a new enrollee device for use in a communication network
US10154025B2 (en) 2013-03-15 2018-12-11 Qualcomm Incorporated Seamless device configuration in a communication network

Also Published As

Publication number Publication date
JPWO2009063734A1 (en) 2011-03-31

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