WO2009062696A3 - Vorrichtung zum kontaktieren von schaltungen - Google Patents
Vorrichtung zum kontaktieren von schaltungen Download PDFInfo
- Publication number
- WO2009062696A3 WO2009062696A3 PCT/EP2008/009558 EP2008009558W WO2009062696A3 WO 2009062696 A3 WO2009062696 A3 WO 2009062696A3 EP 2008009558 W EP2008009558 W EP 2008009558W WO 2009062696 A3 WO2009062696 A3 WO 2009062696A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contact
- connection
- circuits
- circuit
- test position
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Vorrichtung zum Kontaktieren (1), insbesondere zum Prüfen von Schaltungen (2), umfassend eine Mehrzahl an Kontaktmitteln (29) zum elektrischen Kontaktieren zumindest einer, in einer Prüfstellung in die Vorrichtung (1) eingelegten Schaltung (2) und einer relativ zu der, in der Prüfstellung befindlichen Schaltung (2) bewegbaren, Nadelträgerplatte (23), wobei die Kontaktmittel (29) mit der Nadelträgerplatte (23) relativ zu der in der Prüf Stellung befindlichen Schaltung (2) bewegt werden können.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007054168.8 | 2007-11-12 | ||
DE102007054168 | 2007-11-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009062696A2 WO2009062696A2 (de) | 2009-05-22 |
WO2009062696A3 true WO2009062696A3 (de) | 2009-09-11 |
Family
ID=40639228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/009558 WO2009062696A2 (de) | 2007-11-12 | 2008-11-12 | Vorrichtung zum kontaktieren von schaltungen |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102008057028A1 (de) |
WO (1) | WO2009062696A2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010026894A1 (de) | 2010-07-12 | 2012-01-12 | Christian Ratzky | Vorrichtung zur Ermittlung einer Position |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3639361A1 (de) * | 1986-11-18 | 1988-05-19 | Luther Erich | Geraet zum pruefen von leiterplatten |
US5500606A (en) * | 1993-09-16 | 1996-03-19 | Compaq Computer Corporation | Completely wireless dual-access test fixture |
US6005405A (en) * | 1997-06-30 | 1999-12-21 | Hewlett Packard Company | Probe plate assembly for high-node-count circuit board test fixtures |
DE10219619A1 (de) * | 2002-05-02 | 2003-11-27 | Scorpion Technologies Ag | Testvorrichtung für Leiterplatten |
US20070257690A1 (en) * | 2006-05-08 | 2007-11-08 | Aspen Test Engineering, Inc. | Low profile electronic assembly test fixtures and methods |
-
2008
- 2008-11-12 WO PCT/EP2008/009558 patent/WO2009062696A2/de active Application Filing
- 2008-11-12 DE DE102008057028A patent/DE102008057028A1/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3639361A1 (de) * | 1986-11-18 | 1988-05-19 | Luther Erich | Geraet zum pruefen von leiterplatten |
US5500606A (en) * | 1993-09-16 | 1996-03-19 | Compaq Computer Corporation | Completely wireless dual-access test fixture |
US6005405A (en) * | 1997-06-30 | 1999-12-21 | Hewlett Packard Company | Probe plate assembly for high-node-count circuit board test fixtures |
DE10219619A1 (de) * | 2002-05-02 | 2003-11-27 | Scorpion Technologies Ag | Testvorrichtung für Leiterplatten |
US20070257690A1 (en) * | 2006-05-08 | 2007-11-08 | Aspen Test Engineering, Inc. | Low profile electronic assembly test fixtures and methods |
Also Published As
Publication number | Publication date |
---|---|
DE102008057028A1 (de) | 2009-09-03 |
WO2009062696A2 (de) | 2009-05-22 |
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