WO2009060787A1 - Dicing die-bonding film - Google Patents

Dicing die-bonding film Download PDF

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Publication number
WO2009060787A1
WO2009060787A1 PCT/JP2008/069798 JP2008069798W WO2009060787A1 WO 2009060787 A1 WO2009060787 A1 WO 2009060787A1 JP 2008069798 W JP2008069798 W JP 2008069798W WO 2009060787 A1 WO2009060787 A1 WO 2009060787A1
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WO
WIPO (PCT)
Prior art keywords
bonding film
die
dicing
adhesive layer
work
Prior art date
Application number
PCT/JP2008/069798
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuhiko Kamiya
Takeshi Matsumura
Shuuhei Murata
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007314899A external-priority patent/JP4717051B2/en
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Priority to KR1020137027287A priority Critical patent/KR101420993B1/en
Priority to CN2008801150899A priority patent/CN101855710B/en
Priority to DE112008003005T priority patent/DE112008003005T5/en
Priority to KR1020107025179A priority patent/KR101420903B1/en
Priority to US12/741,875 priority patent/US20100233409A1/en
Publication of WO2009060787A1 publication Critical patent/WO2009060787A1/en

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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • H01L2924/3025—Electromagnetic shielding

Abstract

Disclosed is a dicing die-bonding film which has an excellent balance between a holding force during the dicing of a work and detachability upon the detachment of a chip-type work produced by the dicing together with the die-bonding film even when the work is thin. The dicing die-bonding film comprises a base material, a dicing film arranged on the base material and having an adhesive layer, and a die-bonding film arranged on the adhesive layer, wherein the adhesive layer comprises a polymer comprising an acrylic acid ester as the main monomer, a hydroxyl-containing monomer at a content of 10 to 30 mol% relative to the amount of the acrylic acid ester, and an isocyanate compound having a radical-reactive carbon-carbon double bond at a content of 70 to 90 mol% relative to the amount of the hydroxyl-containing monomer, and wherein the die-bonding film comprises an epoxy resin.
PCT/JP2008/069798 2007-11-08 2008-10-30 Dicing die-bonding film WO2009060787A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020137027287A KR101420993B1 (en) 2007-11-08 2008-10-30 Dicing die-bonding film
CN2008801150899A CN101855710B (en) 2007-11-08 2008-10-30 Dicing die-bonding film
DE112008003005T DE112008003005T5 (en) 2007-11-08 2008-10-30 Adhesive foil for cutting chips
KR1020107025179A KR101420903B1 (en) 2007-11-08 2008-10-30 Dicing die-bonding film
US12/741,875 US20100233409A1 (en) 2007-11-08 2008-10-30 Dicing die-bonding film

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007291056 2007-11-08
JP2007-291056 2007-11-08
JP2007314899A JP4717051B2 (en) 2007-11-08 2007-12-05 Dicing die bond film
JP2007-314899 2007-12-05

Publications (1)

Publication Number Publication Date
WO2009060787A1 true WO2009060787A1 (en) 2009-05-14

Family

ID=40625680

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069798 WO2009060787A1 (en) 2007-11-08 2008-10-30 Dicing die-bonding film

Country Status (1)

Country Link
WO (1) WO2009060787A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2239763A1 (en) * 2008-01-18 2010-10-13 Nitto Denko Corporation Dicing/die bonding film
EP2242089A1 (en) * 2008-01-18 2010-10-20 Nitto Denko Corporation Dicing/die bonding film
CN103608902A (en) * 2011-06-27 2014-02-26 电气化学工业株式会社 Adhesive sheet
US20140203458A1 (en) * 2010-04-19 2014-07-24 Nitto Denko Corporation Dicing tape-integrated film for semiconductor back surface
CN113261153A (en) * 2019-01-04 2021-08-13 三星Sdi株式会社 Separator for lithium secondary battery and lithium secondary battery including the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001226647A (en) * 2000-02-18 2001-08-21 Kumamoto Nippon Denki Kk Self-adhesive sheet for sticking wafer
JP2002226796A (en) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd Pressure-sensitive adhesive sheet for sticking wafer and semiconductor device
JP2003096412A (en) * 2001-09-26 2003-04-03 Nitto Denko Corp Adhesive sheet for dicing of semiconductor part and method for producing semiconductor part
JP2005005355A (en) * 2003-06-10 2005-01-06 Nitto Denko Corp Dicing die-bonded film
JP2005116920A (en) * 2003-10-10 2005-04-28 Nitto Denko Corp Adhesive sheet for semiconductor processing and method for processing semiconductor
JP2005239884A (en) * 2004-02-26 2005-09-08 Nitto Denko Corp Adhesive sheet for processing semiconductor wafer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001226647A (en) * 2000-02-18 2001-08-21 Kumamoto Nippon Denki Kk Self-adhesive sheet for sticking wafer
JP2002226796A (en) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd Pressure-sensitive adhesive sheet for sticking wafer and semiconductor device
JP2003096412A (en) * 2001-09-26 2003-04-03 Nitto Denko Corp Adhesive sheet for dicing of semiconductor part and method for producing semiconductor part
JP2005005355A (en) * 2003-06-10 2005-01-06 Nitto Denko Corp Dicing die-bonded film
JP2005116920A (en) * 2003-10-10 2005-04-28 Nitto Denko Corp Adhesive sheet for semiconductor processing and method for processing semiconductor
JP2005239884A (en) * 2004-02-26 2005-09-08 Nitto Denko Corp Adhesive sheet for processing semiconductor wafer

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2239763A1 (en) * 2008-01-18 2010-10-13 Nitto Denko Corporation Dicing/die bonding film
EP2242089A1 (en) * 2008-01-18 2010-10-20 Nitto Denko Corporation Dicing/die bonding film
EP2239763A4 (en) * 2008-01-18 2011-08-03 Nitto Denko Corp Dicing/die bonding film
EP2242089A4 (en) * 2008-01-18 2011-08-03 Nitto Denko Corp Dicing/die bonding film
US20140203458A1 (en) * 2010-04-19 2014-07-24 Nitto Denko Corporation Dicing tape-integrated film for semiconductor back surface
US9478454B2 (en) * 2010-04-19 2016-10-25 Nitto Denko Corporation Dicing tape-integrated film for semiconductor back surface
CN103608902A (en) * 2011-06-27 2014-02-26 电气化学工业株式会社 Adhesive sheet
CN113261153A (en) * 2019-01-04 2021-08-13 三星Sdi株式会社 Separator for lithium secondary battery and lithium secondary battery including the same
CN113261153B (en) * 2019-01-04 2023-10-20 三星Sdi株式会社 Separator for lithium secondary battery and lithium secondary battery comprising same

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