WO2009048234A3 - Retainer ring of cmp machine - Google Patents

Retainer ring of cmp machine Download PDF

Info

Publication number
WO2009048234A3
WO2009048234A3 PCT/KR2008/005764 KR2008005764W WO2009048234A3 WO 2009048234 A3 WO2009048234 A3 WO 2009048234A3 KR 2008005764 W KR2008005764 W KR 2008005764W WO 2009048234 A3 WO2009048234 A3 WO 2009048234A3
Authority
WO
WIPO (PCT)
Prior art keywords
retaining member
retainer ring
lower retaining
cmp machine
cmp
Prior art date
Application number
PCT/KR2008/005764
Other languages
French (fr)
Other versions
WO2009048234A2 (en
Inventor
Sang-Man Cho
Original Assignee
Sam Cheon Co Ltd
Sang-Man Cho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sam Cheon Co Ltd, Sang-Man Cho filed Critical Sam Cheon Co Ltd
Publication of WO2009048234A2 publication Critical patent/WO2009048234A2/en
Publication of WO2009048234A3 publication Critical patent/WO2009048234A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention provides a retainer ring for CMP machines. The retainer ring includes an upper retaining member (110), which is coupled to a head of a CMP machine, and a lower retaining member (120), which is integrally provided under the upper retaining member and polished along with a wafer. A support protrusion (124) is provided on the lower retaining member and is in contact with the lower surface of the upper retaining member to define a gap for applying adhesive between the upper and lower retaining members. Therefore, the retainer ring according to the present invention markedly enhances bonding force between the upper and lower retaining members, thus reliably preventing the lower retaining member which is made of engineering plastic from becoming separated from the upper retaining member.
PCT/KR2008/005764 2007-10-11 2008-10-01 Retainer ring of cmp machine WO2009048234A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070102703A KR100836752B1 (en) 2007-10-11 2007-10-11 Retainer ring of cmp machine
KR10-2007-0102703 2007-10-11

Publications (2)

Publication Number Publication Date
WO2009048234A2 WO2009048234A2 (en) 2009-04-16
WO2009048234A3 true WO2009048234A3 (en) 2009-07-02

Family

ID=39770761

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/005764 WO2009048234A2 (en) 2007-10-11 2008-10-01 Retainer ring of cmp machine

Country Status (2)

Country Link
KR (1) KR100836752B1 (en)
WO (1) WO2009048234A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100879086B1 (en) 2008-03-25 2009-01-15 (주)아이에스테크노 Retainer-ring for polishing wafer
KR101260364B1 (en) * 2011-04-25 2013-05-07 주식회사 지아이에프 Retainer ring for chemical mechanical polishing machine
KR102708235B1 (en) * 2019-06-03 2024-09-23 주식회사 케이씨텍 Retainer ring of carrier head for substrate polishing apparatus
US20230129597A1 (en) * 2021-10-27 2023-04-27 Sch Power Tech Co., Ltd. Retaining Ring for Wafer Polishing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010104015A (en) * 2000-05-12 2001-11-24 윤종용 Retainer ring in chemical mechanical polishing apparatus
US7214123B2 (en) * 2005-08-31 2007-05-08 Samsung Electronics Co., Ltd. Retainer ring, Polishing head, and chemical mechanical polishing apparatus
JP2007158201A (en) * 2005-12-08 2007-06-21 Nippon Seimitsu Denshi Co Ltd Retainer ring of cmp equipment
KR20070079604A (en) * 2006-02-03 2007-08-08 (주)선일테크론 Adhesive structure of metal and resin material and method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030012646A (en) * 2001-08-02 2003-02-12 삼성전자주식회사 Polishing head of a chemical mechanical polishing machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010104015A (en) * 2000-05-12 2001-11-24 윤종용 Retainer ring in chemical mechanical polishing apparatus
US7214123B2 (en) * 2005-08-31 2007-05-08 Samsung Electronics Co., Ltd. Retainer ring, Polishing head, and chemical mechanical polishing apparatus
JP2007158201A (en) * 2005-12-08 2007-06-21 Nippon Seimitsu Denshi Co Ltd Retainer ring of cmp equipment
KR20070079604A (en) * 2006-02-03 2007-08-08 (주)선일테크론 Adhesive structure of metal and resin material and method thereof

Also Published As

Publication number Publication date
WO2009048234A2 (en) 2009-04-16
KR100836752B1 (en) 2008-06-10

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