WO2009045281A1 - Recirculating gas rack cooling architecture - Google Patents
Recirculating gas rack cooling architecture Download PDFInfo
- Publication number
- WO2009045281A1 WO2009045281A1 PCT/US2008/010960 US2008010960W WO2009045281A1 WO 2009045281 A1 WO2009045281 A1 WO 2009045281A1 US 2008010960 W US2008010960 W US 2008010960W WO 2009045281 A1 WO2009045281 A1 WO 2009045281A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling
- heat
- medium
- fluid
- cabinet
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20754—Air circulating in closed loop within cabinets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20609—Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger
Definitions
- the present invention relates to cooling systems and, more particularly, to cooling systems adapted for electronic systems such as those found in an equipment room such as at a telecommunications central office or computer data center.
- Equipment rooms at facilities such as telecommunications central offices and computer data centers and the like house electronic systems, electro- optical systems, photonic systems, computing systems and the like (generally speaking, equipment).
- the equipment is installed in racks within cabinets arranged in rows separated by aisles over a raised floor in an equipment room. Cold air exits the raised floor from “cold aisles” and is pulled through the cabinets by fans. The air egresses the cabinets in the "hot aisles” where it is pulled by room-level air blowers through a centrally located heat exchanger. The heat exchanger cools the air down and returns it to a compartment beneath the cold aisles of the raised floor of the equipment room.
- Various modifications to the hot/cold aisles configuration are known.
- one modification uses a fluid cooled heat exchanger to insure that air exiting from the cabinet is cooled to some extent before entering the equipment room hot aisle.
- the main purpose of this approach is to prevent heated air from the "hot aisle" inadvertently entering another cabinet from the front due to limited equipment room airflow control.
- Flow-balancing problems can create hot-spots within the equipment room as well.
- refrigerant pumped loops with external chillers can be mounted in the ceiling above the cabinet, or directly on the cabinet, directing cool air towards the shelf intake vents.
- complex plumbing may be used to provide cooling fluids to individual circuit packs or circuit pack components.
- a method comprises: circulating within an enclosed cabinet a gaseous cooling medium in thermal communication with a plurality of heat generating component groups; cooling the gaseous cooling medium proximate each heat generating component group with a respective first heat exchanger including a first medium; cooling the first medium of each of the first heat exchangers with a respective second heat exchanger including a second medium; and cooling the second medium of the second heat exchangers with a cooling device.
- FIG. 1 depicts block diagram illustrating a cooling apparatus according to an embodiment of the present invention
- FIG. 2 depicts an enhancement to the cooling apparatus of FIG. 1 ;
- FIG. 3A depicts a side view of an arrangement of cabinets according to the invention such as within an equipment room;
- FIG. 3B depicts a top view of an arrangement of cabinets according to the invention such as within an equipment room.
- the invention will be primarily described within the context of a cabinet adapted to house equipment such as electrical systems, electronic systems, electro-optical systems, photonic systems, computing systems and the like. This type of equipment may be found within an equipment room at a telecommunications central office or computer data center. Those skilled in the art and informed by the teachings herein will realize that the invention is also applicable to any cabinet, housing or enclosure (or grouping thereof) in which cooling of heat generating components contained within is desired.
- any reference herein to particular equipment stored within racks is intended be broadly construed as referring to any type of equipment (electrical, optical, computing etc.).
- any reference herein to a Central Office, Data Center and the like is intended to be broadly construed as referring to an equipment room or similar facility, such as might by found in any of a Central Office, Data Center and the like.
- present invention concerns a novel cabinet design and related methodology that uses recirculating air (or other gas) within an enclosed cabinet to cool the air exiting each stage or shelf in a cabinet.
- increased acoustic damping is provided within (or outside of) the enclosed cabinet.
- an atomized mist is introduced to the recirculating air or gas to provide enhanced evaporation-based cooling within the enclosed cabinet.
- FIG. 1 depicts block diagram illustrating a cooling apparatus according to an embodiment of the present invention.
- the cooling apparatus 100 comprises a substantially closed cabinet 110 including a plurality of shelves 112-1 through 112-3 (collectively shelves 112) for housing heat generating components such as electronic circuit packs or other heat generating components plugged into, illustratively, a common backplane.
- Each of the shelves 112-1 through 112-3 is associated with a corresponding cooler 114-1 through 114-3 (located, illustratively, above the shelf).
- Each shelf 112 receives cooled air C from a preceding cooler 114 and passes heated air H to a next cooler 114.
- Each cooler 114 receives heated air from a preceding shelf 112 and passes cooled air C to a next shelf 112. Cooled air from the uppermost cooler 114-3 is recirculated through an air return zone 115 to the bottom shelf 112-1.
- the cooler associated with the top shelf is instead positioned underneath the bottom shelf.
- Each cooler includes a heat exchanger adapted to absorb heat from the warmed air received from a corresponding shelf 112. Heat from the warmed air is transferred into a medium within the cooler 114, thus providing a flow of cool air that can be used to cool the next shelf.
- the medium may comprise a fluid such as water, various dielectric materials and the like.
- the medium may also comprise a two-phase material (e.g., wax dispersion in fluid such as water).
- each cooler 114 includes an internal gas-to-liquid or gas-to-liquid+vapor type of heat exchanger, depending upon the selected design and type of first medium used.
- the coolers 114 include heat pipes having fins disposed thereon absorb heat from warmed air drawn across the fins.
- the coolers 114 include capillary pumped loops.
- Each of the coolers 114-1 through 114-3 is associated with a corresponding second heat exchanger 118-1 through 118-3.
- the second heat exchangers 118 are in thermal communication with each other and an external cooling device 130 via piping 120 to form thereby a external fluid cooling loop including a second medium.
- the second medium may be a fluid or a two-phase material.
- the second heat exchangers 118 may comprise liquid-to-liquid, liquid-to- liquid+vapor or liquid+vapor-to-liquid type of heat exchangers, depending upon the selected design and type of second medium used.
- the external cooling device 130 comprises, illustratively, a cooling device located in a different room than the cabinet, such as an outdoor cooling tower, heat exchanger, compressor and the like. IN the case of a compressor or other refrigeration system, external access is appropriate to avoid condensation.
- the invention advantageously provides for a closed cabinet such that the acoustic emanations are greatly reduced.
- the internally generated noise may be increased without exceeding ambient noise thresholds in the equipment room and remain within various safety specifications.
- Such increased noise may be devoted to increasing fan speed.
- the first fluid comprises either a either single phase fluid or evaporating/condensing fluid and vapor.
- the fluid or fluid/vapor is circulated passively by surface tension forces in a heat pipe and/or capillary pumped loop.
- the fluid or fluid/vapor is actively pumped in and out of the cabinet through coils (not shown).
- the fluid may also contain a polymer-encapsulated phase change material (e.g., wax). This use of wax increases the heat capacity of the fluid by utilizing excess heat for a phase change (melting).
- Any heat exchange between the second fluid (carried within cooling loop formed by second heat exchangers 1 18 and the external cooling device 130) and an external or building (facility) source of chilled water may be part of the cabinet or external to the cabinet within the CO and communicated by piping (not shown).
- FIG. 1 depicts second heat exchangers 118 protruding from the cabinet.
- the second heat exchangers 118 are integrated with the coolers 114.
- FIG. 2 depicts an enhancement to the cooling apparatus of FIG. 1. Specifically, FIG. 2 depicts the cabinet 110 of FIG. 1 with all of the other components omitted for clarity. Acoustic emanations may be further reduced by the optional application of sound absorbing/deadening material within or around the cabinet. Thus, FIG. 2 depicts the cabinet 110 lined (internally) with acoustic shielding material 120 such that the sound emanating from the fans and other components within the cabinet 110 is further attenuated before leaving the cabinet 110. In this manner, additional increases in fan speeds may be achieved.
- FIG. 3A depicts a side view of an arrangement of cabinets according to the invention such as within an equipment room.
- FIG. 3A depicts an arrangement 300A of a plurality of cabinets, illustratively denoted as cabinets C1- C6.
- the cabinets in this configuration are located extremely close to each other, the only separations being those necessary for access to circuitry within the cabinets.
- the cabinets C1-C6 may be butted up against each other if access is not needed or if a mechanism for moving the cabinets to a service position is provided.
- This arrangement which benefits from the cooling advantages provided by the above described invention, greatly reduces the area needed to implement an equipment room such that a significant savings in floor space for a given number of cabinets is achieved.
- the arrangement of FIG. 3 is possible because the hot aisle and cold aisle structure (and raised floor associated with airflow ductwork) of prior art arrangements is not needed within the context of the present invention.
- FIG. 3B depicts a top view of an arrangement of cabinets according to the invention such as within an equipment room.
- FIG. 3B depicts a top view of the cabinet arrangement depicted above with respect to FIG. 3A.
- the cabinet arrangement 300B of FIG. 3B is well adapted to an equipment room since the arrangement reduces the area necessary to support cabinets (compared to present solutions). Moreover, by avoiding the need for a raised floor and various room-size cooling systems, additional savings are realized.
- the cabinet arrangement 300B of FIG. 3B shows, illustratively six rows of cabinets depicted as rows R1-R6. Each of the cabinets in row R1 is depicted as including a cooling region C, indicative of the placement of cooling apparatus within the cabinets.
- cooling apparatus with a cabinet may be located immediately next to cooling apparatus of an adjoining cabinet.
- the spacing between the various rows is provided primarily for service access to the various electronics shelves within the cabinets.
- the cabinets themselves are closed cabinet having internally circulating air cooling mechanisms, air-fluid cooling mechanisms and fluid-fluid cooling mechanisms as described above with respect to FIGS. 1-2.
- the second heat exchangers of two or more cabinets are in fluid communication with each other. In one embodiment, the second heat exchangers of each cabinet are in fluid communication with the second heat exchangers of an adjoining cabinet. In one embodiment, the second heat exchangers of each cabinet in a row are in fluid communication with the second heat exchangers of each other cabinet in the row.
- FIG. 4 depicts an enhancement to the cooling apparatus described above with respect to FIGS. 1 or 2.
- FIG. 4A depicts circuit pack cooling arrangement 400A in which a populated circuit pack 410 (such as found on a shelf 112 in the cabinet 100 of FIG. 1 ) receiving cool airflow C from underneath and producing hot airflow H on top.
- the heat from the hot airflow H heats is removed by a finned heat pipe 420 (such as found on a cooler 114 in the cabinet 100 of FIG. 1 ) to produce cool airflow C.
- the air/heat flow depicted in FIG. 4A substantially conforms to that described above with respect to the various figures.
- FIG. 4B depicts an enhancement to the arrangements described above.
- the collector is slightly tilted to facilitate draining of the condensate toward a pump.
- a pump 450 extracts the fluid from collector 430 via a pipe 440 and conveys the extracted fluid to atomizer 470 via a pipe 460.
- the atomizer 470 atomizes the fluid for reintroduction into the cooling airflow as noted above.
- the mist operates to inhibit the temperature increase of the air flowing through the shelves.
- the air is cooler and more efficient as a heat transfer medium. Similar effects are realized by increased airflow (e.g., increased fan speeds).
- the mist (or the cooling fluid itself) is directed by a gravity-fed or pump-fed pipe or nozzle directly onto or towards individual components to provide enhanced cooling of the individual components.
- This intentional directing is extremely useful to accommodate certain high-powered components, regardless of whether or not the mist is used to cool the air stream itself in general. It is also noted that this mist is able to provide back up cooling in the case that water or other fluid lines or fans fail. If a cooling water/fluid circulation loop failed, then the mist would stop condensing because of a lack of cooling fluid, but a reservoir of mist would delay intolerable operating conditions for the hardware in the cabinet.
- the temperature change between the inlet and exit of the circuit pack is less than the corresponding temperature change in the embodiment of FIG. 4A.
- the inventors have determined in one case that when the inlet temperature to the circuit pack 410 in either embodiment of FIG. 4 is approximately 20 0 C, the outlet temperature from the circuit pack for 10 is approximately 35 0 C (FIG. 4A) or 27.5°C (FIG. 4B).
- the closed cabinet circulation embodiment of FIG. 1 may be augmented by the acoustic shielding described with respect to FIG. 2 (thereby allowing greater fan speed) and/or enhanced cooling may be provided by the circulation of mist and/or direct application of mist/fluid described with respect to FIG. 4.
- the use of mist is possible in the closed system of the present invention, where in an open system the mist would dissipate.
- heat pipes are used to implement the air-to-fluid-side heat transfer functions described above.
- a pumped refrigerant e.g., with a remote heat exchanger for condensation to take place rather than a fluid-zone in the rack
- capillary pumped loops similar to heat pipes, but with much higher capacity and in the form of a closed loop rather than a pipe
- pumped water is used.
- a second fan, or set of fans may optionally be included to blow air through the cabinet (e.g., one large fan at the top, optionally battery powered).
- a fail safe mechanism is less important and easier to arrange.
- the fluid itself preferably has a reasonable heat capacity such that it could continue to absorb heat for, illustratively, a few minutes.
- secondary piping and an (optionally) battery operated pumping system with a chilled water storage tank e.g., gravity fed
- a normally closed valve opens to allow the flow of chilled water to be gravity fed and/or pumped into the system for a short period of time.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880109573.0A CN101904231B (en) | 2007-09-30 | 2008-09-22 | Recirculating gas rack cooling architecture |
EP08836781.8A EP2198682B1 (en) | 2007-09-30 | 2008-09-22 | Recirculating gas rack cooling architecture |
JP2010526913A JP5576282B2 (en) | 2007-09-30 | 2008-09-22 | Recirculating gas rack cooling architecture |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/865,020 US9025330B2 (en) | 2007-09-30 | 2007-09-30 | Recirculating gas rack cooling architecture |
US11/865,020 | 2007-09-30 |
Publications (1)
Publication Number | Publication Date |
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WO2009045281A1 true WO2009045281A1 (en) | 2009-04-09 |
Family
ID=40329014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/010960 WO2009045281A1 (en) | 2007-09-30 | 2008-09-22 | Recirculating gas rack cooling architecture |
Country Status (6)
Country | Link |
---|---|
US (1) | US9025330B2 (en) |
EP (1) | EP2198682B1 (en) |
JP (1) | JP5576282B2 (en) |
KR (1) | KR20100061708A (en) |
CN (1) | CN101904231B (en) |
WO (1) | WO2009045281A1 (en) |
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- 2008-09-22 EP EP08836781.8A patent/EP2198682B1/en not_active Not-in-force
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Also Published As
Publication number | Publication date |
---|---|
US20090086434A1 (en) | 2009-04-02 |
JP2010541238A (en) | 2010-12-24 |
CN101904231B (en) | 2012-11-07 |
EP2198682A1 (en) | 2010-06-23 |
JP5576282B2 (en) | 2014-08-20 |
CN101904231A (en) | 2010-12-01 |
KR20100061708A (en) | 2010-06-08 |
US9025330B2 (en) | 2015-05-05 |
EP2198682B1 (en) | 2013-05-15 |
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