WO2009041774A3 - Electrospray vaporizer - Google Patents

Electrospray vaporizer Download PDF

Info

Publication number
WO2009041774A3
WO2009041774A3 PCT/KR2008/005691 KR2008005691W WO2009041774A3 WO 2009041774 A3 WO2009041774 A3 WO 2009041774A3 KR 2008005691 W KR2008005691 W KR 2008005691W WO 2009041774 A3 WO2009041774 A3 WO 2009041774A3
Authority
WO
WIPO (PCT)
Prior art keywords
reagent liquid
nozzle
electrospray
vaporizer
housing
Prior art date
Application number
PCT/KR2008/005691
Other languages
French (fr)
Other versions
WO2009041774A2 (en
Inventor
Kang-Ho Ahn
Yong-Taek Kwon
Jeong-Suk Choi
Jin-Hong Ahn
Original Assignee
Hyundai Calibration & Certific
Kang-Ho Ahn
Yong-Taek Kwon
Jeong-Suk Choi
Jin-Hong Ahn
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020070097672A external-priority patent/KR20090032427A/en
Priority claimed from KR1020070128917A external-priority patent/KR100929866B1/en
Application filed by Hyundai Calibration & Certific, Kang-Ho Ahn, Yong-Taek Kwon, Jeong-Suk Choi, Jin-Hong Ahn filed Critical Hyundai Calibration & Certific
Publication of WO2009041774A2 publication Critical patent/WO2009041774A2/en
Publication of WO2009041774A3 publication Critical patent/WO2009041774A3/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4486Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles

Abstract

An electrospray vaporizer is capable of producing fine spray droplets and vapor molecules through electrohydrodynamic spraying of a reagent liquid. The electrospray vaporizer includes a housing with a flow path, a reagent liquid supplying device, a nozzle, a perforated plate, a power supply device and a heating device. The reagent liquid supplying device is designed to supply a reagent liquid containing precursors to the upstream end of the housing. The nozzle is mounted to the upstream end of the housing and connected to the reagent liquid supplying device so that it can spray the reagent liquid into the flow path. The perforated plate is arranged on the downstream side of the nozzle. The power supply device is adapted to apply a high voltage to one of the nozzle and the perforated plate. The heating device is designed to apply thermal energy to the flow path.
PCT/KR2008/005691 2007-09-28 2008-09-25 Electrospray vaporizer WO2009041774A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2007-0097672 2007-09-28
KR1020070097672A KR20090032427A (en) 2007-09-28 2007-09-28 Electrospray vaporizer
KR10-2007-0128917 2007-12-12
KR1020070128917A KR100929866B1 (en) 2007-12-12 2007-12-12 Electrostatic spray vaporizer

Publications (2)

Publication Number Publication Date
WO2009041774A2 WO2009041774A2 (en) 2009-04-02
WO2009041774A3 true WO2009041774A3 (en) 2009-05-28

Family

ID=40512019

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/005691 WO2009041774A2 (en) 2007-09-28 2008-09-25 Electrospray vaporizer

Country Status (1)

Country Link
WO (1) WO2009041774A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110171398A1 (en) * 2010-01-12 2011-07-14 Oladeji Isaiah O Apparatus and method for depositing alkali metals
CN103035471B (en) * 2011-09-29 2015-07-29 江苏天瑞仪器股份有限公司 ESI ion source, for its controllable high-voltage DC power supply
GB2555125B (en) 2016-10-19 2020-05-13 Univ Cape Town Coating system
EP3529847A1 (en) 2016-10-21 2019-08-28 QuantumScape Corporation Electrolyte separators including lithium borohydride and composite electrolyte separators of lithium-stuffed garnet and lithium borohydride

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999493A (en) * 1990-04-24 1991-03-12 Vestec Corporation Electrospray ionization interface and method for mass spectrometry
JPH09316644A (en) * 1996-05-23 1997-12-09 Nippon Sanso Kk Shower head nozzle of cvd device
KR20010098715A (en) * 2000-04-18 2001-11-08 안강호 Apparatus for manufacturing ultra-fine particles using electrospray device and method thereof
JP2004160388A (en) * 2002-11-14 2004-06-10 Matsushita Electric Ind Co Ltd Production method and equipment for thin film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999493A (en) * 1990-04-24 1991-03-12 Vestec Corporation Electrospray ionization interface and method for mass spectrometry
JPH09316644A (en) * 1996-05-23 1997-12-09 Nippon Sanso Kk Shower head nozzle of cvd device
KR20010098715A (en) * 2000-04-18 2001-11-08 안강호 Apparatus for manufacturing ultra-fine particles using electrospray device and method thereof
JP2004160388A (en) * 2002-11-14 2004-06-10 Matsushita Electric Ind Co Ltd Production method and equipment for thin film

Also Published As

Publication number Publication date
WO2009041774A2 (en) 2009-04-02

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