WO2009038081A1 - Unsaturated polyester resin composition and electrical/electronic component molded by using the same - Google Patents

Unsaturated polyester resin composition and electrical/electronic component molded by using the same Download PDF

Info

Publication number
WO2009038081A1
WO2009038081A1 PCT/JP2008/066754 JP2008066754W WO2009038081A1 WO 2009038081 A1 WO2009038081 A1 WO 2009038081A1 JP 2008066754 W JP2008066754 W JP 2008066754W WO 2009038081 A1 WO2009038081 A1 WO 2009038081A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyester resin
unsaturated polyester
resin composition
electrical
same
Prior art date
Application number
PCT/JP2008/066754
Other languages
French (fr)
Japanese (ja)
Inventor
Hidekazu Kaneoka
Ryujin Ishiuchi
Akifumi Tamura
Hiroaki Sugita
Original Assignee
Showa Highpolymer Co., Ltd.
Toyota Jidosha Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Highpolymer Co., Ltd., Toyota Jidosha Kabushiki Kaisha filed Critical Showa Highpolymer Co., Ltd.
Publication of WO2009038081A1 publication Critical patent/WO2009038081A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Motor Or Generator Frames (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is an unsaturated polyester resin composition characterized by containing an unsaturated polyester resin, a crosslinking agent, a low shrinking agent, an inorganic filler having a thermal conductivity of 20-250 W/m•K, and a glass fiber. This unsaturated polyester resin composition is also characterized in that the low shrinking agent is composed of a styrene-vinyl acetate block copolymer. The styrene-vinyl acetate block copolymer preferably has a molar ratio between styrene and vinyl acetate of from 90:10 to 40:60. This unsaturated polyester resin composition enables to obtain a cured product which is extremely low in shrinkage during curing, while maintaining a thermal conductivity of not less than 1.0 W/m•K.
PCT/JP2008/066754 2007-09-21 2008-09-17 Unsaturated polyester resin composition and electrical/electronic component molded by using the same WO2009038081A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007245528A JP2009073975A (en) 2007-09-21 2007-09-21 Unsaturated polyester resin composition, and molded article of electrical or electronic component using the same
JP2007-245528 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009038081A1 true WO2009038081A1 (en) 2009-03-26

Family

ID=40467891

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066754 WO2009038081A1 (en) 2007-09-21 2008-09-17 Unsaturated polyester resin composition and electrical/electronic component molded by using the same

Country Status (2)

Country Link
JP (1) JP2009073975A (en)
WO (1) WO2009038081A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014188854A1 (en) * 2013-05-21 2014-11-27 昭和電工株式会社 Molding material for damping material, and damping material and structural member molded article obtained by molding same
WO2018193735A1 (en) * 2017-04-20 2018-10-25 昭和電工株式会社 Resin composition for sealing electronic control device, electronic control device, and method for manufacturing same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011006542A (en) * 2009-06-24 2011-01-13 Showa Denko Kk Unsaturated polyester resin composition and encapsulated motor
US9518205B2 (en) 2011-12-14 2016-12-13 Showa Denko K.K. Unsaturated polyester resin composition and encapsulated motor
EP3101042B1 (en) * 2014-01-29 2019-07-03 Showa Denko K.K. Thermosetting resin composition, cured product thereof, and electric/electronic component

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113011A (en) * 1982-12-21 1984-06-29 Toshiba Corp Manufacture of unsaturated polyester resin molding material
JPH03285947A (en) * 1990-04-02 1991-12-17 Showa Highpolymer Co Ltd Unsaturated polyester resin composition
JPH047353A (en) * 1990-04-25 1992-01-10 Toshiba Chem Corp Unsaturated polyester resin molding material
JPH05222282A (en) * 1992-02-12 1993-08-31 Nippon Oil & Fats Co Ltd Low-shrinkage unsaturated polyester resin composition
JPH0797417A (en) * 1993-09-29 1995-04-11 Nippon Oil & Fats Co Ltd Shrinkage reducing agent comprising particulate block copolymer, its production, and unsaturated polyester resin composition containing same
WO1995029205A1 (en) * 1994-04-27 1995-11-02 Matsushita Electric Industrial Co., Ltd. Thermosetting composition, molding material, molded structure, and method of decomposing them
JPH09316311A (en) * 1996-05-31 1997-12-09 Matsushita Electric Ind Co Ltd Molding material, mold motor and decomposition method of molding material
JPH1095904A (en) * 1996-09-25 1998-04-14 Matsushita Electric Ind Co Ltd Mold material and mold motor
JPH1095910A (en) * 1996-09-26 1998-04-14 Fuji Electric Co Ltd Unsaturated polyester resin composition for semiconductor sealing use and molding thereof
JP2000234050A (en) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd Unsaturated polyester resin molding material and molded product
JP2001226573A (en) * 2000-02-10 2001-08-21 Showa Highpolymer Co Ltd Unsaturated polyester resin composition
JP2002097377A (en) * 2000-09-26 2002-04-02 Nitto Shinko Kk Molding composition
JP2006206691A (en) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd Ester resin composition and its molded article
WO2006095414A1 (en) * 2005-03-08 2006-09-14 Showa Highpolymer Co., Ltd. Unsaturated polyester resin composition for lamp reflectors and moldings thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099115A (en) * 1983-11-02 1985-06-03 Nippon Oil & Fats Co Ltd Unsaturated polyester resin composition
JPS62141058A (en) * 1985-12-16 1987-06-24 Nippon Oil & Fats Co Ltd Low-shrinkage unsaturated polyester resin composition
JPH11130953A (en) * 1997-10-30 1999-05-18 Hitachi Chem Co Ltd Low-shrinkage unsaturated polyester resin composition

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113011A (en) * 1982-12-21 1984-06-29 Toshiba Corp Manufacture of unsaturated polyester resin molding material
JPH03285947A (en) * 1990-04-02 1991-12-17 Showa Highpolymer Co Ltd Unsaturated polyester resin composition
JPH047353A (en) * 1990-04-25 1992-01-10 Toshiba Chem Corp Unsaturated polyester resin molding material
JPH05222282A (en) * 1992-02-12 1993-08-31 Nippon Oil & Fats Co Ltd Low-shrinkage unsaturated polyester resin composition
JPH0797417A (en) * 1993-09-29 1995-04-11 Nippon Oil & Fats Co Ltd Shrinkage reducing agent comprising particulate block copolymer, its production, and unsaturated polyester resin composition containing same
WO1995029205A1 (en) * 1994-04-27 1995-11-02 Matsushita Electric Industrial Co., Ltd. Thermosetting composition, molding material, molded structure, and method of decomposing them
JPH09316311A (en) * 1996-05-31 1997-12-09 Matsushita Electric Ind Co Ltd Molding material, mold motor and decomposition method of molding material
JPH1095904A (en) * 1996-09-25 1998-04-14 Matsushita Electric Ind Co Ltd Mold material and mold motor
JPH1095910A (en) * 1996-09-26 1998-04-14 Fuji Electric Co Ltd Unsaturated polyester resin composition for semiconductor sealing use and molding thereof
JP2000234050A (en) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd Unsaturated polyester resin molding material and molded product
JP2001226573A (en) * 2000-02-10 2001-08-21 Showa Highpolymer Co Ltd Unsaturated polyester resin composition
JP2002097377A (en) * 2000-09-26 2002-04-02 Nitto Shinko Kk Molding composition
JP2006206691A (en) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd Ester resin composition and its molded article
WO2006095414A1 (en) * 2005-03-08 2006-09-14 Showa Highpolymer Co., Ltd. Unsaturated polyester resin composition for lamp reflectors and moldings thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014188854A1 (en) * 2013-05-21 2014-11-27 昭和電工株式会社 Molding material for damping material, and damping material and structural member molded article obtained by molding same
WO2018193735A1 (en) * 2017-04-20 2018-10-25 昭和電工株式会社 Resin composition for sealing electronic control device, electronic control device, and method for manufacturing same
JPWO2018193735A1 (en) * 2017-04-20 2020-02-27 昭和電工株式会社 Electronic control device sealing resin composition, electronic control device, and method of manufacturing the same

Also Published As

Publication number Publication date
JP2009073975A (en) 2009-04-09

Similar Documents

Publication Publication Date Title
WO2009038081A1 (en) Unsaturated polyester resin composition and electrical/electronic component molded by using the same
WO2004040590A3 (en) Conductive thermoplastic composites and methods of making
WO2008027280A3 (en) Optical devices and silicone compositions and processes fabricating the optical devices
TW200631040A (en) Circuit connecting adhesive
TW200833770A (en) Thermally conductive material
JPS5298084A (en) Unsaturated polyester resin compositions for pressure molding
EP1719803A4 (en) Copolymer-containing aliphatic polyester resin composition
GB2432811A (en) Moulded plastic components with anti-reflective and anti-glare properties and method for their manufacture
AU2003217483A8 (en) Electroconductive curable resin composition, cured product thereof and process for producing the same
WO2008008689A3 (en) Polymer matrix and filler with a curie temperature for a circuit opening device
WO2008146723A1 (en) Resin composition, resin spacer film, and semiconductor device
TW200615693A (en) Photosensitive insulating resin composition, cured production thereof and the use
WO2008126505A1 (en) Glass with molding and method of producing the same
WO2005085347A8 (en) Resin molded article with reduced dielectric loss tangent and production method therefor
WO2009072606A1 (en) Peroxide-curable, electrically conductive fluoroelastomer composition
WO2009060936A1 (en) Powdery processing aid for polyolefin-based resins, method of producing the same, resin composition and molded article
CN108017891A (en) A kind of anlistatig unsaturated polyester glass fibre enhancing tubular molding compound
WO2009011280A1 (en) Graft copolymer, thermoplastic resin composition, and molded object
WO2009009731A3 (en) Thermoplastic poly(arylene ether)/polyester blends and articles thereof
ATE287934T1 (en) HEAT CURING EPOXY POWDER COATINGS THAT EXHIBIT IMPROVED DEGASSING PROPERTIES
EP1916267A4 (en) Block copolymer and method for producing same, composition for resin modification, and modified resin composition and method for producing same
TW200706591A (en) Flame retardant molding composition
WO2009005064A1 (en) Thermoplastic resin composition, and molded article thereof
WO2005012605A3 (en) Filler-fixed fiber, fiber structure, molded fiber, and processes for producing these
EP1167417A4 (en) Flame-retardant vinyl esters, resins and resin compositions containing the same, and cured products thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08832348

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08832348

Country of ref document: EP

Kind code of ref document: A1