WO2009037458A3 - Mems device and process - Google Patents

Mems device and process Download PDF

Info

Publication number
WO2009037458A3
WO2009037458A3 PCT/GB2008/003165 GB2008003165W WO2009037458A3 WO 2009037458 A3 WO2009037458 A3 WO 2009037458A3 GB 2008003165 W GB2008003165 W GB 2008003165W WO 2009037458 A3 WO2009037458 A3 WO 2009037458A3
Authority
WO
WIPO (PCT)
Prior art keywords
outer portion
plate
anchor ring
mems device
thickness
Prior art date
Application number
PCT/GB2008/003165
Other languages
French (fr)
Other versions
WO2009037458A2 (en
Inventor
Richard Ian Laming
Colin Robert Jenkins
Original Assignee
Wolfson Microelectronics Plc
Richard Ian Laming
Colin Robert Jenkins
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfson Microelectronics Plc, Richard Ian Laming, Colin Robert Jenkins filed Critical Wolfson Microelectronics Plc
Priority to US12/678,884 priority Critical patent/US8841737B2/en
Publication of WO2009037458A2 publication Critical patent/WO2009037458A2/en
Publication of WO2009037458A3 publication Critical patent/WO2009037458A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00476—Releasing structures removing a sacrificial layer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/06—Bio-MEMS
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)

Abstract

A MEMS device comprises a back-plate (7) having an inner portion (7a) and an outer portion (7b), the inner portion (7a) connected to the outer portion (7b) by a sidewall (7c). A raised section or anchor ring (60) is formed in the outer portion (7b) of the back-plate, in a region of the back-plate near the inner perimeter of the outer portion. The anchor ring may comprise angled sidewalls. The thickness of the back-plate may be greater than the thickness of the material supporting the anchor ring. Embodiments are also disclosed in which a membrane comprises a raised portion and an outer portion connected by an angled sidewall.
PCT/GB2008/003165 2007-09-19 2008-09-18 Mems device and process WO2009037458A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/678,884 US8841737B2 (en) 2007-09-19 2008-09-18 MEMS device and process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0718305.6 2007-09-19
GB0718305A GB2453104B (en) 2007-09-19 2007-09-19 Mems device and process

Publications (2)

Publication Number Publication Date
WO2009037458A2 WO2009037458A2 (en) 2009-03-26
WO2009037458A3 true WO2009037458A3 (en) 2009-07-02

Family

ID=38670185

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2008/003165 WO2009037458A2 (en) 2007-09-19 2008-09-18 Mems device and process

Country Status (4)

Country Link
US (1) US8841737B2 (en)
GB (1) GB2453104B (en)
TW (1) TWI457269B (en)
WO (1) WO2009037458A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101096548B1 (en) * 2009-11-06 2011-12-20 주식회사 비에스이 Mems microphone and manufacturing method of the same
US8503699B2 (en) * 2011-06-01 2013-08-06 Infineon Technologies Ag Plate, transducer and methods for making and operating a transducer
KR101601219B1 (en) * 2014-10-17 2016-03-08 현대자동차주식회사 Micro phone and method manufacturing the same
CN107465983B (en) * 2016-06-03 2021-06-04 无锡华润上华科技有限公司 MEMS microphone and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19607379A1 (en) * 1995-03-01 1996-09-05 Fujitsu Ltd Thin-film magnetic head slider mfr. for use with electrostatic actuator
WO2001000523A1 (en) * 1999-06-29 2001-01-04 Regents Of The University Of Minnesota Micro-electromechanical devices and methods of manufacture
WO2002015636A2 (en) * 2000-08-11 2002-02-21 Knowles Electronics, Llc Miniature broadband transducer
GB2435544A (en) * 2006-02-24 2007-08-29 Oligon Ltd MEMS device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784721A (en) * 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
EP0561566B1 (en) * 1992-03-18 1999-07-28 Knowles Electronics, Inc. Solid state condenser and microphone
JP3611779B2 (en) * 1999-12-09 2005-01-19 シャープ株式会社 Electrical signal-acoustic signal converter, method for manufacturing the same, and electrical signal-acoustic converter
EP1307720A1 (en) * 2000-07-06 2003-05-07 California Institute Of Technology Surface-micromachined pressure sensor and high pressure application
DE20122617U1 (en) * 2000-08-03 2006-09-14 Reflectivity Inc., Sunnyvale Projection system with array of rectangular micro-mirror elements for providing images at angles depending on mirror tilt angle in light ray steering system
US6535460B2 (en) * 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
US6741709B2 (en) * 2000-12-20 2004-05-25 Shure Incorporated Condenser microphone assembly
US7943412B2 (en) * 2001-12-10 2011-05-17 International Business Machines Corporation Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
US6677176B2 (en) * 2002-01-18 2004-01-13 The Hong Kong University Of Science And Technology Method of manufacturing an integrated electronic microphone having a floating gate electrode
TWI235010B (en) * 2003-09-29 2005-06-21 Taiwan Carol Electronics Co Lt Micro-type single-chip microphone and its manufacturing method
US7936497B2 (en) * 2004-09-27 2011-05-03 Qualcomm Mems Technologies, Inc. MEMS device having deformable membrane characterized by mechanical persistence
US7701631B2 (en) * 2004-09-27 2010-04-20 Qualcomm Mems Technologies, Inc. Device having patterned spacers for backplates and method of making the same
US7885423B2 (en) * 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
TWI268115B (en) * 2005-07-26 2006-12-01 Taiwan Carol Electronics Co Lt The diaphragm chip of a silicon-based microphone and its manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19607379A1 (en) * 1995-03-01 1996-09-05 Fujitsu Ltd Thin-film magnetic head slider mfr. for use with electrostatic actuator
WO2001000523A1 (en) * 1999-06-29 2001-01-04 Regents Of The University Of Minnesota Micro-electromechanical devices and methods of manufacture
WO2002015636A2 (en) * 2000-08-11 2002-02-21 Knowles Electronics, Llc Miniature broadband transducer
GB2435544A (en) * 2006-02-24 2007-08-29 Oligon Ltd MEMS device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PEDERSEN M ET AL: "A silicon condenser microphone with polyimide diaphragm and backplate", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 63, no. 2, 30 October 1997 (1997-10-30), pages 97 - 104, XP004125898, ISSN: 0924-4247 *

Also Published As

Publication number Publication date
GB2453104B (en) 2012-04-25
GB2453104A (en) 2009-04-01
TW200914365A (en) 2009-04-01
WO2009037458A2 (en) 2009-03-26
TWI457269B (en) 2014-10-21
US20100308425A1 (en) 2010-12-09
US8841737B2 (en) 2014-09-23
GB0718305D0 (en) 2007-10-31

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