WO2009037108A3 - Pick und place system für eine halbleiter-montageeinrichtung - Google Patents

Pick und place system für eine halbleiter-montageeinrichtung Download PDF

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Publication number
WO2009037108A3
WO2009037108A3 PCT/EP2008/061589 EP2008061589W WO2009037108A3 WO 2009037108 A3 WO2009037108 A3 WO 2009037108A3 EP 2008061589 W EP2008061589 W EP 2008061589W WO 2009037108 A3 WO2009037108 A3 WO 2009037108A3
Authority
WO
WIPO (PCT)
Prior art keywords
pivoting
drive system
pick
assembly device
semiconductor assembly
Prior art date
Application number
PCT/EP2008/061589
Other languages
English (en)
French (fr)
Other versions
WO2009037108A2 (de
Inventor
Florentin Etter
Original Assignee
Oerlikon Assembly Equipment Ag
Florentin Etter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Assembly Equipment Ag, Florentin Etter filed Critical Oerlikon Assembly Equipment Ag
Publication of WO2009037108A2 publication Critical patent/WO2009037108A2/de
Publication of WO2009037108A3 publication Critical patent/WO2009037108A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/102—Gears specially adapted therefor, e.g. reduction gears
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • B25J9/1045—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons comprising tensioning means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)

Abstract

Eine Halbleiter-Montageeinrichtung enthält ein Pick und Place System (7) mit einem Bondkopf (8), das ein erstes Antriebssystem (13) und ein zweites Antriebssystem (14) aufweist für die Verschiebung des Bondkopfs (8) in einer vorbestimmten Richtung. Das erste Antriebssystem (13) weist einen ersten Schwenkarm (16) und einen ersten, stationär angeordneten Antrieb (19) auf, der dazu dient, den Schwenkarm (16) innerhalb eines vorgegebenen Schwenkbereichs hin und her zu schwenken. Das zweite Antriebssystem (14) ist auf dem Schwenkarm (16) gelagert und umfasst einen ersten Schwenkhebel (24), einen zweiten Schwenkhebel (26) und einen zweiten stationär angeordneten Antrieb (25), mit einem stationär angeordneten Elektromotor (44), der dazu dient, die beiden Schwenkhebel (24, 26) zueinander zwischen zwei gestreckten Endlagen (A, B) zu bewegen. Die Endlagen (A, B) variieren entlang der vorbestimmten Richtung, abhängig vom Schlag des ersten Antriebssystems (13).
PCT/EP2008/061589 2007-09-18 2008-09-03 Pick und place system für eine halbleiter-montageeinrichtung WO2009037108A2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH01560/07 2007-09-18
CH15602007 2007-09-18
CH00145/08 2008-01-29
CH1452008 2008-01-29

Publications (2)

Publication Number Publication Date
WO2009037108A2 WO2009037108A2 (de) 2009-03-26
WO2009037108A3 true WO2009037108A3 (de) 2009-06-25

Family

ID=39942730

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/061589 WO2009037108A2 (de) 2007-09-18 2008-09-03 Pick und place system für eine halbleiter-montageeinrichtung

Country Status (3)

Country Link
US (1) US20090070992A1 (de)
TW (1) TW200919620A (de)
WO (1) WO2009037108A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398931B (zh) * 2009-07-03 2013-06-11 Wecon Automation Corp 驅動裝置及固晶機
CN105762099B (zh) * 2014-12-17 2019-07-09 北京中电科电子装备有限公司 一种芯片供送机构及粘片机
US10093491B2 (en) * 2016-08-02 2018-10-09 Asm Technology Singapore Pte Ltd Wireless signal transmission in a pick-and-place apparatus
CN107248501B (zh) * 2017-07-21 2023-09-08 苏州艾科瑞思智能装备股份有限公司 一种接力式快速取片、装片装置及其采用它的装片机

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997032460A1 (de) * 1996-02-29 1997-09-04 Alphasem Ag Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen
US5741113A (en) * 1995-07-10 1998-04-21 Kensington Laboratories, Inc. Continuously rotatable multiple link robot arm mechanism
EP0923111A2 (de) * 1997-12-07 1999-06-16 ESEC Management SA Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
EP1480507A1 (de) * 2003-05-21 2004-11-24 Esec Trading S.A. Halbleiter-Montageeinrichtung
EP1768174A1 (de) * 2005-09-26 2007-03-28 Gisulfo Baccini Ein Robotergerät um ein Objekt zu bewegen

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2803221B2 (ja) * 1989-09-19 1998-09-24 松下電器産業株式会社 Ｉｃ実装装置及びその方法
US5862588A (en) * 1995-08-14 1999-01-26 International Business Machines Corporation Method for restraining circuit board warp during area array rework
US5671530A (en) * 1995-10-30 1997-09-30 Delco Electronics Corporation Flip-chip mounting assembly and method with vertical wafer feeder
DE20116653U1 (de) * 2001-05-07 2002-01-03 Esec Trading Sa Montageautomat für die Plazierung eines Halbleiterchips als Flipchip auf einem Substrat
TW567574B (en) * 2001-12-05 2003-12-21 Esec Trading Sa Apparatus for mounting semiconductor chips
TWI231561B (en) * 2003-05-21 2005-04-21 Esec Trading Sa Apparatus for mounting semiconductors
CH696103A5 (de) * 2003-06-06 2006-12-15 Esec Trading Sa Halbleiter-Montageeinrichtung.
DE102004052559A1 (de) * 2003-11-11 2005-07-14 Unaxis International Trading Ltd. Einrichtung für die Montage von Halbleiterchips
JP2007173801A (ja) * 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5741113A (en) * 1995-07-10 1998-04-21 Kensington Laboratories, Inc. Continuously rotatable multiple link robot arm mechanism
WO1997032460A1 (de) * 1996-02-29 1997-09-04 Alphasem Ag Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen
EP0923111A2 (de) * 1997-12-07 1999-06-16 ESEC Management SA Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
EP1480507A1 (de) * 2003-05-21 2004-11-24 Esec Trading S.A. Halbleiter-Montageeinrichtung
EP1768174A1 (de) * 2005-09-26 2007-03-28 Gisulfo Baccini Ein Robotergerät um ein Objekt zu bewegen

Also Published As

Publication number Publication date
TW200919620A (en) 2009-05-01
WO2009037108A2 (de) 2009-03-26
US20090070992A1 (en) 2009-03-19

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