WO2009034236A1 - Apparatus and method for monitoring deposition in systems containing process liquids - Google Patents
Apparatus and method for monitoring deposition in systems containing process liquids Download PDFInfo
- Publication number
- WO2009034236A1 WO2009034236A1 PCT/FI2008/050511 FI2008050511W WO2009034236A1 WO 2009034236 A1 WO2009034236 A1 WO 2009034236A1 FI 2008050511 W FI2008050511 W FI 2008050511W WO 2009034236 A1 WO2009034236 A1 WO 2009034236A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- deposition
- flow meter
- liquid
- pressure equalizer
- flow
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/008—Control or steering systems not provided for elsewhere in subclass C02F
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/02—Non-contaminated water, e.g. for industrial water supply
- C02F2103/023—Water in cooling circuits
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/40—Liquid flow rate
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F5/00—Softening water; Preventing scale; Adding scale preventatives or scale removers to water, e.g. adding sequestering agents
Definitions
- Deposition can be chemical or biological. Deposition can be e.g. due to aggregation and flocculation of inorganic and organic matter. Development of deposition can be very fast. In some cases deposition as such might not be a problem as long as the deposits are attached on the depositing surfaces. However, in some processes, e.g. at the paper machine, deposits detached from the surfaces may cause specks in the paper or even web breaks. In addition, deposits may also consume chemicals in processes, e.g. bio- cides and clarification agents. Deposition can also cause corrosion in surfaces of pipes, tanks and instruments.
- An apparatus according to the invention for monitoring deposition in systems containing process liquids comprises:
- the apparatus 1 comprises a liquid level equalizer 22 for gathering aqueous stream L1.
- Said equalizer acts as a hydrostatic pressure equalizer.
- Rate of flow L1 can be adjusted with valve V1 and with liquid level detector 15 connected to the equalizer 22.
- a pipeline 3 for leading process liquid from said equalizer.
- valve V2 an initial value for the flow rate from the measuring unit L2 can be adjusted.
- a flow meter 4 is connected for measuring rate of flow for monitoring deposition on surfaces in contact with process waters.
- Said flow meter unit 4 is a flow meter, advantageously a magnetic flow meter.
- Said process liquid L2 flowed through said flow meter 4 can be discharged to a discharge funnel 6, which is lower than said flow meter 4.
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Measuring Volume Flow (AREA)
Abstract
The present invention relates to an apparatus for monitoring deposition in systems containing process liquids, e.g. process waters. The invention also relates to the use of said apparatus and a method for monitoring deposition on surfaces. The invention also relates to feeding of deposition inhibitors. Said apparatus comprises an overflow holder (2) for gathering liquid (L) from the liquid process, a discharge unit (3) for leading liquid (L) from said overflow holder (2), a flow meter unit (4) connected to said discharge unit (3) for measuring rate of flow for monitoring deposition on surfaces.
Description
Apparatus and method for monitoring deposition in systems containing process liquids
Field of the invention
The present invention relates to an apparatus for monitoring deposition in systems containing process liquids, e.g. process waters. The invention also relates to the use of said apparatus and a method for monitoring deposition on surfaces. The invention also relates to feeding of deposition inhibitors.
A problem in systems containing process liquids, e.g. process waters, is build up of deposits on surfaces, e.g. in pipes and tanks. Deposition can be chemical or biological. Deposition can be e.g. due to aggregation and flocculation of inorganic and organic matter. Development of deposition can be very fast. In some cases deposition as such might not be a problem as long as the deposits are attached on the depositing surfaces. However, in some processes, e.g. at the paper machine, deposits detached from the surfaces may cause specks in the paper or even web breaks. In addition, deposits may also consume chemicals in processes, e.g. bio- cides and clarification agents. Deposition can also cause corrosion in surfaces of pipes, tanks and instruments.
Deposition on surfaces is usually measured off-line. Spectroscopy and ultrasonic methods has been used. These methods are however off-line methods and quite complicated. Thus it is also difficult to prevent or reduce deposition by these known apparatuses and methods.
General description of the invention
It is the object of the present invention to provide a simple apparatus for monitoring deposition in systems where process liquids are involved.
Another object of the present invention is to provide an apparatus and method for monitoring deposition in liquid processes, in which processes fluctuation of pressure may be present. Still another object of the invention is to have a system for feeding agents inhibiting deposition.
For achieving this aim, the invention is characterized by features that are enlisted in the independent claims. Other claims represent preferred embodiments of the invention.
An apparatus according to the invention for monitoring deposition in systems containing process liquids comprises:
- a pressure equalizer for continuous gathering process liquid,
- a discharge unit for leading at least part of said process liquid from said pressure equalizer,
- a flow meter unit connected to said discharge unit for measuring rate of flow of said discharged process liquid.
According to an embodiment of the invention deposition on surfaces is monitored by a method, which comprises at least following steps: - continuous gathering of process liquid to a pressure equalizer,
- leading at least part of said process liquid from said pressure equalizer by a discharge unit,
- measuring rate of flow of discharged process liquid by a flow meter unit connected to said discharge unit. According to an embodiment of the invention method for dosing deposition inhibitors to the process liquids comprises at least following steps continuous gathering of process liquid to a pressure equalizer,
- leading at least part of said process liquid from said pressure equalizer by a discharge unit, - monitoring rate of flow of discharged process liquid by a flow meter unit connected to said discharge unit,
- dosing deposition inhibitors to the process liquids based on the rate of flow measured by a flow meter connected to said discharge unit.
Advantageously said pressure equalizer is a hydrostatic pressure equalizer, e.g. an overflow holder, by which hydrostatic pressure is kept constant in said pressure equalizer. Advantageously said overflow holder comprises a launder for gathering overflow of the liquid from the pressure equalizer. Pressure equalizer can also be a liquid level equalizer where hydrostatic pressure is kept constant. Pressure equalizer can also be a process unit, e.g. pipeline, where the pressure is kept con- stant by a pump.
Pressure equalizer can be a separate unit. Also a process apparatus can be used as a pressure equalizer, e.g. a wire pit with over flow can be used as a pressure equalizer.
Possible pressure variations in incoming process liquids are eliminated by said pressure equalizer. Thus hydrostatic pressure is constant in said pressure equalizer and in discharge unit. Pressure in said flow meter is constant and the rate of flow is thus only dependent on deposition in said discharge unit. The flow rate can be adjusted e.g. with valves connected before and/or after said measuring unit. Monitoring of deposition is in that case very accurate. In addition said measuring apparatus is technically simple and cheap.
Earlier there has not been good apparatus and method for accurate monitoring of deposition in systems containing process liquids. New arrangement according to the present invention provides both technical and economical benefits compared to known systems.
Deposition in systems containing process liquids can be detected online in early stage and it is thus far more easy to prevent deposition e.g. by feeding biocide to the process.
Said discharge unit can vary. It can be an assembly. It can be e.g. a pipeline or an outlet connected to said pressure equalizer. It can also be a process unit, e.g. a pipeline joining two other process units. This arrangement equalizes liquid flow and increases the accuracy of said apparatus and method. Inner diameter of said flow meter can vary depending on process liquid. Advantageously it can be 10 to 20 mm in certain embodiments. This arrangement increases the accuracy of said method.
Advantageously nominal size of said discharge unit and said flow metering device are equal or near equal. This arrangement decreases pressure drops and thus in- creases measuring accuracy of said apparatus and method. The apparatus of the invention is in that case technically easier to manufacture.
According to an embodiment of the invention said flow meter is a magnetic flow meter. Magnetic flow meters are usually inexpensive and they are also very accurate. Magnetic flow meter has no moving parts in liquid phase. It causes minimal pressure loss to the system. This furthermore improves monitoring accuracy.
Chemical and biological depositions are of great importance. Thus embodiments used in chemical and biological processes are relevant.
According to an embodiment of the invention said apparatus is used for monitoring deposition in process liquids in
- open process water systems,
- closed process water systems, - open white water systems,
- closed white water systems,
- water treatment units in cooling water systems,
- circulation water systems in open cooling column,
- sea water and brackish water circulations in heat exchanger.
According to an embodiment of the invention said apparatus and method is used to dose deposition inhibitors to the process liquids. Deposition inhibitor can be e.g. a biocide. It is now possible to feed inhibitors to the process before deposition causes disadvantage in machines and products.
According to an embodiment of the invention said flow meter comprises a remote interface. By this arrangement deposition caused by process liquids can be remote monitored which provides extra benefit e.g. in cases of disturbances and in un- staffed plants. Also feeding of deposition inhibitors can be remote controlled. This further diversifies said apparatus and method.
In these systems controlling and prevention of deposition is of great importance. Thus the use of this new apparatus and method brings special advantage.
Detailed description of the invention
An embodiment of the invention is explained in more detail below, with reference to the appended drawing.
Figure 1 , 3 and 4 shows diagram of the apparatus and the process.
Figure 2 shows cleanness of the system.
In figures 1 and 3 the apparatus 1 comprises an overflow holder 2 for gathering aqueous stream L1. Said overflow holder acts as a pressure equalizer. Rate of flow L1 can be adjusted with valve V1. At the bottom area of the overflow holder 2 there is a discharge pipeline 3 for leading process liquid from said overflow holder 2. With valve V2 an initial value for the flow rate from the measuring unit L2 can be adjusted. To said discharge pipeline 3 a flow meter 4 is connected for measuring rate of flow for monitoring deposition on surfaces in contact with process waters.
Said flow meter unit 4 is a flow meter, advantageously a magnetic flow meter. At the top area of the overflow holder 2 there is launder 5 for collecting spill liquid SL overflow from overflow holder 2. Said spill liquid SL and process liquid L2 flowed through said flow meter 4 can be discharged to a discharge funnel 6, which is lower than said flow meter 4.
In figure 4 the apparatus 1 comprises a liquid level equalizer 22 for gathering aqueous stream L1. Said equalizer acts as a hydrostatic pressure equalizer. Rate of flow L1 can be adjusted with valve V1 and with liquid level detector 15 connected to the equalizer 22. At the bottom area of the equalizer 22 there is a dis- charge unit, a pipeline 3, for leading process liquid from said equalizer. With valve V2 an initial value for the flow rate from the measuring unit L2 can be adjusted. To said discharge pipeline 3 a flow meter 4 is connected for measuring rate of flow for monitoring deposition on surfaces in contact with process waters. Said flow meter unit 4 is a flow meter, advantageously a magnetic flow meter. Said process liquid L2 flowed through said flow meter 4 can be discharged to a discharge funnel 6, which is lower than said flow meter 4.
Example
In fig. 1 and 3 a side flow L1 from a clear filter tank of a paper machine was led to through an apparatus 1 according to the invention. Low solids waters like clear or clean filtrate is preferred to avoid rapid blocking of the flow meter. Rate of flow L1 can be adjusted with valve V1. Liquid flow L1 was led to the overflow holder 2, which acts as a pressure equalizer. The flow rate of flow L1 was so adjusted that there was a continuous overflow of the liquid to the launder 5. Thereby the pressure in the overflow holder 2 is kept constant. Also, flow to the measuring unit is thereby kept constant. With valve V2 an initial value for the flow rate L2 from the measuring unit can be adjusted. Flow L2 is discharged from the overflow holder to the measuring unit. In this case the discharge 3 unit is a pipe. The discharge unit is located from a distance of the top liquid level of the over flow holder. Advantageously it is connected to the lower part or to the base of said overflow holder. The measuring unit 4 comprises means for metering flow rate of L2. A magnetic flow meter 4 is connected to the said pipe 3 for measuring flow rate. When the amount of biofilm forming bacteria increases in the flow L1 , deposits starts to form on the walls of the discharge unit 3 and flow meter 4. Amount of flow measured by the flow meter 4 starts to decrease. Hence, by measuring the flow the amount of formed biofilm could be monitored.
The measurement according to the invention can be treated advantageously as a relative measure of the cleanness of the system. In Figure 2 cleanness of the system, proportional to the values from the flow meter are shown as a function of time. In the decreasing slope there was rapid slime formation on the walls of the flow meter in contact with the flow L2. When there is no deposition or the deposition stays constant, the curve is vertical.
When the monitoring apparatus according to the invention gets dirty, it is easy to clean. Especially, as the interior of a magnetic flow meter is basically a pipe.
Usually, when at the paper machine the amount of depositions, e.g. biofilms formed increases, specks of different size in the paper increases. Normally this is a sign for an operator of deposits formation. With the system according to the invention is possible to monitor biofilm formation. Thus, it is possible to dose bio- cides to the papermaking process before biofilm formation is observed as wors- ened quality of the produced paper. In addition, it is possible to avoid or decrease situations where parts in the papermaking system has to be thoroughly cleaned and only after which biofilm formation can be affected by biocide additions.
Claims
1. An apparatus for monitoring deposition in systems containing process liquids, characterized in that the apparatus (1 ) comprises:
- a pressure equalizer (2, 22) for continuous gathering of process liquid (L1 ) from the liquid process,
- a discharge unit (3) for leading at least part of the liquid (L2) from said pressure equalizer (2, 22),
- a flow meter unit (4) connected to said discharge unit (3) for measuring rate of flow for monitoring deposition on surfaces.
2. An apparatus according to claim 1 , characterized in that said discharge unit (3) is a pipeline (PL) connected to the base of said pressure equalizer (2, 22).
3. An apparatus according to claim 1 or 2, characterized in that said flow meter unit (4) is a magnetic flow meter.
4. An apparatus according to any of the preceding claims, characterized in that said flow meter unit (4) comprises a remote interface.
5. An apparatus according to any of the preceding claims, characterized in that said pressure equalizer (2, 22) is an overflow holder.
6. An apparatus according to any of the preceding claims, characterized in that said pressure equalizer (2, 22) is a liquid level equalizer.
7. An apparatus according to any of the preceding claims, characterized in that said apparatus (1 ) comprises a dosing apparatus for dosing deposition inhibitors.
8. A method for monitoring deposition in systems containing process liquids, characterized in that said method comprises at least following steps continuous gathering of process liquid (L1 ) from the liquid process to an a pressure equalizer (2, 22),
- leading at least part of the liquid (L2) from said a pressure equalizer (2, 22) by a discharge unit (3),
- measuring rate of flow by a flow meter unit (4) connected to said discharge unit (3).
9. A method according to claim 8, characterized in that said discharge unit (3) is a pipeline (PL) connected to said a pressure equalizer (2, 22).
10. A method according to claim 8 to 9, characterized in that deposition is due to chemical fouling.
11. A method according to claim 8 to 9, characterized in that deposition is due to biological fouling.
12. A method according to claim 8 to 11 D, characterized in that said flow meter unit (4) is a magnetic flow meter.
13. A method for dosing deposition inhibitors to the systems containing process liquids, characterized in that said method comprises at least following steps continuous gathering of process liquid (L1 ) to an a pressure equalizer (2, 22),
- leading at least part of process liquid (L2) from said pressure equalizer (2, 22) by a discharge unit (3),
- measuring rate of flow of process liquid by a flow meter unit (4) connected to said discharge unit, - dosing deposition inhibitors to the process liquids based on rate of flow measured by a flow meter unit (4).
14. The use of an apparatus according to any of claims 1 to 7, characterized in that said apparatus (1 ) is used for monitoring deposition on surfaces in
- open process water systems, - closed process water systems,
- open white water systems,
- closed white water systems,
- water treatment units in cooling water systems,
- circulation water systems in open cooling column, - sea water and brackish water circulations in heat exchanger.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08805434A EP2188611A1 (en) | 2007-09-14 | 2008-09-15 | Apparatus and method for monitoring deposition in systems containing process liquids |
| CN200880106730A CN101802587A (en) | 2007-09-14 | 2008-09-15 | Apparatus and method for monitoring deposition in a system containing a process liquid |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20070706A FI20070706A0 (en) | 2007-09-14 | 2007-09-14 | Device and method for monitoring deposition in systems comprising process water |
| FI20070706 | 2007-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009034236A1 true WO2009034236A1 (en) | 2009-03-19 |
Family
ID=38572902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FI2008/050511 WO2009034236A1 (en) | 2007-09-14 | 2008-09-15 | Apparatus and method for monitoring deposition in systems containing process liquids |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2188611A1 (en) |
| CN (1) | CN101802587A (en) |
| FI (1) | FI20070706A0 (en) |
| WO (1) | WO2009034236A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102359930A (en) * | 2011-09-19 | 2012-02-22 | 西安公路养护技术工程研究中心有限公司 | Test method for porosity of asphalt mixture, and apparatus thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103163045B (en) * | 2013-02-25 | 2014-12-10 | 上海海事大学 | Water surface oil spillage monitoring device driven by solar energy |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157833A (en) * | 1984-08-29 | 1986-03-24 | Babcock Hitachi Kk | Continuous measuring method of viscosity of coal and water slurry |
| US4765963A (en) * | 1985-09-24 | 1988-08-23 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for measuring impurities in water |
| GB2361548A (en) * | 2000-03-18 | 2001-10-24 | John Barnes | Determining the level of particulate contamination in a fluid power system |
| DE10135448A1 (en) * | 2000-07-21 | 2002-03-21 | Moog Inc | Liquid degredation detection device, has liquid fed through flow channel configured for gradual blockage by soil components |
| US20030205079A1 (en) * | 2002-04-25 | 2003-11-06 | Taylor John A. | Coating stretch tester |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3253740A (en) * | 1964-12-10 | 1966-05-31 | Beloit Corp | Apparatus for continuous measurement and control of shive content |
| GB9104195D0 (en) * | 1991-02-28 | 1991-04-17 | Eden Robert D | Fouling probe |
| GB2326113B (en) * | 1995-07-19 | 1999-06-16 | Baker Hughes Ltd | Biofouling reduction |
-
2007
- 2007-09-14 FI FI20070706A patent/FI20070706A0/en not_active Application Discontinuation
-
2008
- 2008-09-15 CN CN200880106730A patent/CN101802587A/en active Pending
- 2008-09-15 EP EP08805434A patent/EP2188611A1/en not_active Ceased
- 2008-09-15 WO PCT/FI2008/050511 patent/WO2009034236A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157833A (en) * | 1984-08-29 | 1986-03-24 | Babcock Hitachi Kk | Continuous measuring method of viscosity of coal and water slurry |
| US4765963A (en) * | 1985-09-24 | 1988-08-23 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for measuring impurities in water |
| GB2361548A (en) * | 2000-03-18 | 2001-10-24 | John Barnes | Determining the level of particulate contamination in a fluid power system |
| DE10135448A1 (en) * | 2000-07-21 | 2002-03-21 | Moog Inc | Liquid degredation detection device, has liquid fed through flow channel configured for gradual blockage by soil components |
| US20030205079A1 (en) * | 2002-04-25 | 2003-11-06 | Taylor John A. | Coating stretch tester |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP2188611A1 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102359930A (en) * | 2011-09-19 | 2012-02-22 | 西安公路养护技术工程研究中心有限公司 | Test method for porosity of asphalt mixture, and apparatus thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| FI20070706A0 (en) | 2007-09-14 |
| EP2188611A1 (en) | 2010-05-26 |
| CN101802587A (en) | 2010-08-11 |
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