WO2009028365A1 - Dicing apparatus - Google Patents

Dicing apparatus Download PDF

Info

Publication number
WO2009028365A1
WO2009028365A1 PCT/JP2008/064800 JP2008064800W WO2009028365A1 WO 2009028365 A1 WO2009028365 A1 WO 2009028365A1 JP 2008064800 W JP2008064800 W JP 2008064800W WO 2009028365 A1 WO2009028365 A1 WO 2009028365A1
Authority
WO
WIPO (PCT)
Prior art keywords
dicing apparatus
worktables
devices
alignment
improve
Prior art date
Application number
PCT/JP2008/064800
Other languages
French (fr)
Japanese (ja)
Inventor
Tomohiro Suzuki
Original Assignee
Tokyo Seimitsu Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co., Ltd. filed Critical Tokyo Seimitsu Co., Ltd.
Priority to JP2009530059A priority Critical patent/JP5464421B2/en
Publication of WO2009028365A1 publication Critical patent/WO2009028365A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0608—Grinders for cutting-off using a saw movable on slideways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

Provided is a dicing apparatus (1) comprising a plurality of worktables (12 and 14), a plurality of alignment devices (5 and 5) and a plurality of working devices (10 and 10). The alignment devices (5 and 5) are made so movable by themselves as to image the works placed on the worktables (12 and 14), individually. As a result, the alignment devices (5 and 5) can align the works placed on the worktables (12 and 14), separately or in associatively single work. Therefore, it is possible to improve the working efficiency of the expensive alignment device thereby to improve the working efficiency of the entire dicing apparatus.
PCT/JP2008/064800 2007-08-31 2008-08-20 Dicing apparatus WO2009028365A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009530059A JP5464421B2 (en) 2007-08-31 2008-08-20 Dicing apparatus and dicing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-226273 2007-08-31
JP2007226273 2007-08-31

Publications (1)

Publication Number Publication Date
WO2009028365A1 true WO2009028365A1 (en) 2009-03-05

Family

ID=40387088

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064800 WO2009028365A1 (en) 2007-08-31 2008-08-20 Dicing apparatus

Country Status (3)

Country Link
JP (1) JP5464421B2 (en)
TW (1) TW200913043A (en)
WO (1) WO2009028365A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200472836Y1 (en) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 Cutting unit and applied equipment of the cutting unit
JP2016129260A (en) * 2016-03-16 2016-07-14 リンテック株式会社 Light irradiation device and light irradiation method
US20230364730A1 (en) * 2020-11-23 2023-11-16 Hunan Brunp Ev Recycling Co., Ltd., Device for cutting connection of multi-piece module electrode

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005085972A (en) * 2003-09-09 2005-03-31 Disco Abrasive Syst Ltd Alignment method for cutting device
JP2006156809A (en) * 2004-11-30 2006-06-15 Disco Abrasive Syst Ltd Cutter

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290040A (en) * 1989-04-28 1990-11-29 Disco Abrasive Syst Ltd Alignment system
JP3765265B2 (en) * 2001-11-28 2006-04-12 株式会社東京精密 Dicing machine
JP4527559B2 (en) * 2005-01-31 2010-08-18 株式会社ディスコ Exposure equipment
JP2006222181A (en) * 2005-02-09 2006-08-24 Matsushita Electric Ind Co Ltd Apparatus and method for mounting chip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005085972A (en) * 2003-09-09 2005-03-31 Disco Abrasive Syst Ltd Alignment method for cutting device
JP2006156809A (en) * 2004-11-30 2006-06-15 Disco Abrasive Syst Ltd Cutter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200472836Y1 (en) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 Cutting unit and applied equipment of the cutting unit
JP2016129260A (en) * 2016-03-16 2016-07-14 リンテック株式会社 Light irradiation device and light irradiation method
US20230364730A1 (en) * 2020-11-23 2023-11-16 Hunan Brunp Ev Recycling Co., Ltd., Device for cutting connection of multi-piece module electrode
US11931852B2 (en) * 2020-11-23 2024-03-19 Hunan Brunp Ev Recycling Co., Ltd. Device for cutting connection of multi-piece module electrode

Also Published As

Publication number Publication date
JP5464421B2 (en) 2014-04-09
TW200913043A (en) 2009-03-16
JPWO2009028365A1 (en) 2010-12-02

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