WO2009026975A3 - Trägerfolie - Google Patents

Trägerfolie Download PDF

Info

Publication number
WO2009026975A3
WO2009026975A3 PCT/EP2008/004431 EP2008004431W WO2009026975A3 WO 2009026975 A3 WO2009026975 A3 WO 2009026975A3 EP 2008004431 W EP2008004431 W EP 2008004431W WO 2009026975 A3 WO2009026975 A3 WO 2009026975A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier foil
design
particularly suitable
circuit boards
order
Prior art date
Application number
PCT/EP2008/004431
Other languages
English (en)
French (fr)
Other versions
WO2009026975A2 (de
Inventor
Michael Schlipf
Katja Widmann
Original Assignee
Elringklinger Ag
Michael Schlipf
Katja Widmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elringklinger Ag, Michael Schlipf, Katja Widmann filed Critical Elringklinger Ag
Priority to EP08758992A priority Critical patent/EP2179631A2/de
Priority to CN200880103811.7A priority patent/CN101803474B/zh
Publication of WO2009026975A2 publication Critical patent/WO2009026975A2/de
Publication of WO2009026975A3 publication Critical patent/WO2009026975A3/de
Priority to US12/658,802 priority patent/US8252406B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/50—Details of extruders
    • B29C48/505—Screws
    • B29C48/53—Screws having a varying channel depth, e.g. varying the diameter of the longitudinal screw trunk
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
    • B29K2027/18—PTFE, i.e. polytetrafluorethene, e.g. ePTFE, i.e. expanded polytetrafluorethene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

Um eine Trägerfolie für Leiterplatten bereitzustellen, die sich insbesondere für hohe Bauteildichten eignet, wird vorgeschlagen diese aus einem Polymermaterial herzustellen, welches ein thermoplastisch verarbeitbares im Wesentlichen voll fluoriertes Kunststoffmaterial umfasst.
PCT/EP2008/004431 2007-08-24 2008-06-04 Trägerfolie WO2009026975A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08758992A EP2179631A2 (de) 2007-08-24 2008-06-04 Trägerfolie
CN200880103811.7A CN101803474B (zh) 2007-08-24 2008-06-04 载体箔片
US12/658,802 US8252406B2 (en) 2007-08-24 2010-02-16 Carrier foil

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710040098 DE102007040098A1 (de) 2007-08-24 2007-08-24 Trägerfolie
DE102007040098.7 2007-08-24

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/658,802 Continuation US8252406B2 (en) 2007-08-24 2010-02-16 Carrier foil

Publications (2)

Publication Number Publication Date
WO2009026975A2 WO2009026975A2 (de) 2009-03-05
WO2009026975A3 true WO2009026975A3 (de) 2009-07-30

Family

ID=40152557

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/004431 WO2009026975A2 (de) 2007-08-24 2008-06-04 Trägerfolie

Country Status (5)

Country Link
US (1) US8252406B2 (de)
EP (1) EP2179631A2 (de)
CN (1) CN101803474B (de)
DE (1) DE102007040098A1 (de)
WO (1) WO2009026975A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101838431B (zh) * 2010-05-21 2012-11-14 广东生益科技股份有限公司 氟树脂混合物、使用其制作的覆铜板及其制作方法
WO2019156071A1 (ja) * 2018-02-07 2019-08-15 ダイキン工業株式会社 低分子量ポリテトラフルオロエチレンを含む組成物の製造方法
JP7104351B2 (ja) * 2018-07-26 2022-07-21 ダイキン工業株式会社 樹脂成形体の製造方法
TW202206286A (zh) 2020-07-28 2022-02-16 美商聖高拜塑膠製品公司 介電基板及其形成方法
WO2022133402A1 (en) 2020-12-16 2022-06-23 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4519969A (en) * 1983-09-09 1985-05-28 Unitika Ltd. Stretched fluorine type film and method for manufacture thereof
EP0291629A2 (de) * 1987-05-16 1988-11-23 Aeg Isolier- Und Kunststoff Gmbh Verfahren zum kontinuierlichen Herstellen von bandförmigem Basismaterial
US5006382A (en) * 1981-08-20 1991-04-09 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
WO2001060911A1 (en) * 2000-02-16 2001-08-23 Omlidon Technologies Llc Melt-processible poly(tetrafluoroethylene)
WO2005084940A1 (de) * 2004-03-02 2005-09-15 Ist Ionenstrahltechnologie Gmbh Haftfester verbund und verfahren zur herstellung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3716531A1 (de) * 1987-04-09 1988-10-27 Aeg Isolier Kunststoff Verfahren zum kontinuierlichen herstellen von bandfoermigem basismaterial
US5359767A (en) * 1993-08-26 1994-11-01 International Business Machines Corporation Method of making multilayered circuit board
US20030069343A1 (en) 1998-08-06 2003-04-10 Paul Smith Melt-processible poly(tetrafluoroethylene)
US6653379B2 (en) * 2001-07-12 2003-11-25 3M Innovative Properties Company Fluoropolymers resistant to stress cracking
US20070158020A1 (en) * 2006-01-06 2007-07-12 Chen-Yuan Tu Method for modificating fluoropolymers and their application

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006382A (en) * 1981-08-20 1991-04-09 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US4519969A (en) * 1983-09-09 1985-05-28 Unitika Ltd. Stretched fluorine type film and method for manufacture thereof
EP0291629A2 (de) * 1987-05-16 1988-11-23 Aeg Isolier- Und Kunststoff Gmbh Verfahren zum kontinuierlichen Herstellen von bandförmigem Basismaterial
WO2001060911A1 (en) * 2000-02-16 2001-08-23 Omlidon Technologies Llc Melt-processible poly(tetrafluoroethylene)
WO2005084940A1 (de) * 2004-03-02 2005-09-15 Ist Ionenstrahltechnologie Gmbh Haftfester verbund und verfahren zur herstellung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
M. COLLAUD COEN: "Modification of the micro- and nanotopography of several polymers by plasma treatments", APPLIED SURFACE SCIENCE, vol. 207, 2003, pages 276 - 286, XP002528155, Retrieved from the Internet <URL:http://dx.doi.org/10.1016/S0169-4332(02)01503-9> [retrieved on 20090514] *

Also Published As

Publication number Publication date
WO2009026975A2 (de) 2009-03-05
CN101803474A (zh) 2010-08-11
DE102007040098A1 (de) 2009-02-26
EP2179631A2 (de) 2010-04-28
US8252406B2 (en) 2012-08-28
CN101803474B (zh) 2014-01-29
US20100221529A1 (en) 2010-09-02

Similar Documents

Publication Publication Date Title
EP2236560A4 (de) Poly(arylensulfid)harzzusammensetzungen, herstellungsverfahren dafür und elektronisches bauteil für oberflächenmontage
WO2008102113A3 (en) Printed circuit boards
WO2009026975A3 (de) Trägerfolie
GB2458066B (en) Conductive polymer foams, method of manufacture, and uses thereof
EP2554561A4 (de) Epoxidharzzusammensetzung für ein prepreg, prepreg und mehrschichtige bestückte leiterplatte
GB2462356B (en) Conductive polymer foams,method of manufacture,and articles and uses thereof
EP2624671A4 (de) Kupferfolie für bestückte leiterplatten, verfahren zur herstellung dieser kupferfolie, harzsubstrat für bestückte leiterplatten und bestückte leiterplatte
EP2610277A4 (de) Harzzusammensetzung, aus der harzzusammensetzung gewonnener formkörper und substratmaterial sowie platine mit dem substratmaterial
WO2009058630A3 (en) Thermally conductive adhesives and adhesive tape using the same
HK1125960A1 (en) Composition of polythiophene-based conductive polymers having high conductivity, transparency, waterproof property and a membrane prepared using the same
EP2087151A4 (de) Rolle-zu-rolle-galvanisierung zur herstellung von pv-folien
GB201100111D0 (en) Conductive polymer foams, method of manufacture, and articles thereof
WO2012169866A3 (en) Printed circuit board and method for manufacturing the same
EP2604639A4 (de) Harzzusammensetzung, gehärtetes harzprodukt, leiterplatte und herstellungsverfahren für die leiterplatte
WO2007079026A3 (en) Flame retardant flexible thermoplastic composition, method of making, and articles thereof
EP3056343A4 (de) Fluorharzbasismaterial, leiterplatte und schaltungsmodul
EP1997848A4 (de) Film mit norbornenverbindungszusatzpolymer, herstellungsverfahren und verwendung
EP2679384A4 (de) Metallfolienverbundstoff, flexible bestückte leiterplatte damit, formkörper und herstellungsverfahren für den formkörper
WO2010030478A3 (en) Poly(arylene ether) composition, method, and article background of the invention
EP2187717A4 (de) Leiterplatte, leitermodul und verfahren zur herstellung einer leiterplatte
EP2136400A4 (de) Strahlungsglied, das glied verwendende leiterplatte, elektronisches teilemodul und verfahren zur herstellung des moduls
WO2011056455A3 (en) Dielectric material with non-halogenated curing agent
WO2012083003A3 (en) Methods of multi-shot injection molding and metal-plated multi-layered polymeric articles made therefrom
DE502006004213D1 (de) Bauteil mit einer elektrischen Flachbaugruppe
EP2163164A3 (de) Weicher Schaum, geformtes Produkt und Stoßdämpfer mit dem geformten Produkt

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880103811.7

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08758992

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2008758992

Country of ref document: EP