WO2009025138A1 - Semiconductor integrated circuit and high frequency circuit module - Google Patents

Semiconductor integrated circuit and high frequency circuit module Download PDF

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Publication number
WO2009025138A1
WO2009025138A1 PCT/JP2008/062887 JP2008062887W WO2009025138A1 WO 2009025138 A1 WO2009025138 A1 WO 2009025138A1 JP 2008062887 W JP2008062887 W JP 2008062887W WO 2009025138 A1 WO2009025138 A1 WO 2009025138A1
Authority
WO
WIPO (PCT)
Prior art keywords
high frequency
semiconductor integrated
integrated circuit
inductor
capacitor
Prior art date
Application number
PCT/JP2008/062887
Other languages
French (fr)
Japanese (ja)
Inventor
Nobuo Sakai
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Publication of WO2009025138A1 publication Critical patent/WO2009025138A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Filters And Equalizers (AREA)

Abstract

An inductor (4) and a capacitor (5) are formed on a semiconductor circuit board (2). One end of the inductor (4) is connected to a signal line (3), and the other end is connected to a ground pattern (6) formed to surround the region where the inductor (4) is formed. One end of the capacitor (5) is connected to the signal line (3) and the other end is connected to a ground pattern (7) formed to surround the region where the capacitor (5) is formed. Then, the ground patterns (6, 7) are separated and an LC resonator is configured. By using such LC resonator as an LC filter, a high frequency module is configured by integrating a plurality of semiconductor elements on one semiconductor chip.
PCT/JP2008/062887 2007-08-21 2008-07-17 Semiconductor integrated circuit and high frequency circuit module WO2009025138A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-214221 2007-08-21
JP2007214221 2007-08-21

Publications (1)

Publication Number Publication Date
WO2009025138A1 true WO2009025138A1 (en) 2009-02-26

Family

ID=40378046

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062887 WO2009025138A1 (en) 2007-08-21 2008-07-17 Semiconductor integrated circuit and high frequency circuit module

Country Status (1)

Country Link
WO (1) WO2009025138A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018110393A1 (en) * 2016-12-14 2018-06-21 株式会社村田製作所 Switch ic, front-end module, and communication device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996027905A1 (en) * 1995-03-06 1996-09-12 Hitachi, Ltd. High-frequency amplifier circuit
JP2001326558A (en) * 2000-05-16 2001-11-22 Mitsubishi Electric Corp Phase shifter
JP2005198241A (en) * 2003-12-12 2005-07-21 Sony Corp Filter circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996027905A1 (en) * 1995-03-06 1996-09-12 Hitachi, Ltd. High-frequency amplifier circuit
JP2001326558A (en) * 2000-05-16 2001-11-22 Mitsubishi Electric Corp Phase shifter
JP2005198241A (en) * 2003-12-12 2005-07-21 Sony Corp Filter circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018110393A1 (en) * 2016-12-14 2018-06-21 株式会社村田製作所 Switch ic, front-end module, and communication device
KR20190040041A (en) * 2016-12-14 2019-04-16 가부시키가이샤 무라타 세이사쿠쇼 Switch IC, front-end module and communication device
KR102359559B1 (en) 2016-12-14 2022-02-08 가부시키가이샤 무라타 세이사쿠쇼 Switch ICs, front-end modules and communication devices
US11270961B2 (en) 2016-12-14 2022-03-08 Murata Manufacturing Co., Ltd. Switch IC, front-end module, and communication apparatus

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