WO2009025059A1 - プリント基板およびその製造方法 - Google Patents

プリント基板およびその製造方法 Download PDF

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Publication number
WO2009025059A1
WO2009025059A1 PCT/JP2007/066396 JP2007066396W WO2009025059A1 WO 2009025059 A1 WO2009025059 A1 WO 2009025059A1 JP 2007066396 W JP2007066396 W JP 2007066396W WO 2009025059 A1 WO2009025059 A1 WO 2009025059A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate material
printed board
plate
conductive pattern
tapered portion
Prior art date
Application number
PCT/JP2007/066396
Other languages
English (en)
French (fr)
Inventor
Koji Ishikawa
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/066396 priority Critical patent/WO2009025059A1/ja
Publication of WO2009025059A1 publication Critical patent/WO2009025059A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　板材（２５）には均一な厚みの板厚部（２５ａ）が規定される。板厚部（２５ａ）の縁にはテーパー部（２５ｂ）の内縁が接続される。テーパー部（２５ｂ）は、外縁に近づくにつれて板材（２５）の厚みを減少させる。板材（２５）の表面には導電パターン（２８）を区画するフレキシブルプリント基板（２６）が貼り付けられる。導電パターン（２８）は板厚部（２５ａ）の表面からテーパー部（２５ｂ）の表面に確立される。こうしたプリント基板（１５）の製造にあたって、板材（２５）には予め板厚部（２５ａ）およびテーパー部（２５ｂ）が規定される。板厚部（２５ａ）の表面およびテーパー部（２５ｂ）の表面にはフレキシブルプリント基板（２６）が貼り付けられる。板材（２５）の表面に極めて簡単に導電パターン（２８）が確立される。しかも、板材（２５）にはプレス加工は施されない。板材（２５）の破損や導電パターン（２８）の剥離は確実に防止される。
PCT/JP2007/066396 2007-08-23 2007-08-23 プリント基板およびその製造方法 WO2009025059A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/066396 WO2009025059A1 (ja) 2007-08-23 2007-08-23 プリント基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/066396 WO2009025059A1 (ja) 2007-08-23 2007-08-23 プリント基板およびその製造方法

Publications (1)

Publication Number Publication Date
WO2009025059A1 true WO2009025059A1 (ja) 2009-02-26

Family

ID=40377969

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/066396 WO2009025059A1 (ja) 2007-08-23 2007-08-23 プリント基板およびその製造方法

Country Status (1)

Country Link
WO (1) WO2009025059A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020021833A (ja) * 2018-08-01 2020-02-06 株式会社ケーヒン 電子制御装置及び同製造方法
CN111432553A (zh) * 2020-03-26 2020-07-17 深圳市拓普艾科技有限公司 一种导体柔性电路板
EP3955709A1 (en) * 2020-08-13 2022-02-16 Tyco Electronics Japan G.K. Circuit board and method of forming the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63131161U (ja) * 1987-02-17 1988-08-26
JPH03126289A (ja) * 1989-10-12 1991-05-29 Oki Electric Ind Co Ltd プリント配線板のカードエッジコネクタおよびその製造方法
JP2006237112A (ja) * 2005-02-23 2006-09-07 Victor Co Of Japan Ltd フレックスリジッド配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63131161U (ja) * 1987-02-17 1988-08-26
JPH03126289A (ja) * 1989-10-12 1991-05-29 Oki Electric Ind Co Ltd プリント配線板のカードエッジコネクタおよびその製造方法
JP2006237112A (ja) * 2005-02-23 2006-09-07 Victor Co Of Japan Ltd フレックスリジッド配線板

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020021833A (ja) * 2018-08-01 2020-02-06 株式会社ケーヒン 電子制御装置及び同製造方法
JP7049957B2 (ja) 2018-08-01 2022-04-07 日立Astemo株式会社 電子制御装置の製造方法
CN111432553A (zh) * 2020-03-26 2020-07-17 深圳市拓普艾科技有限公司 一种导体柔性电路板
EP3955709A1 (en) * 2020-08-13 2022-02-16 Tyco Electronics Japan G.K. Circuit board and method of forming the same
US11602049B2 (en) 2020-08-13 2023-03-07 Tyco Electronics Japan G.K. Circuit board

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