WO2009025014A1 - ヘッドアセンブリ製造装置、ヘッドアセンブリ製造方法 - Google Patents

ヘッドアセンブリ製造装置、ヘッドアセンブリ製造方法 Download PDF

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Publication number
WO2009025014A1
WO2009025014A1 PCT/JP2007/066003 JP2007066003W WO2009025014A1 WO 2009025014 A1 WO2009025014 A1 WO 2009025014A1 JP 2007066003 W JP2007066003 W JP 2007066003W WO 2009025014 A1 WO2009025014 A1 WO 2009025014A1
Authority
WO
WIPO (PCT)
Prior art keywords
head assembly
assembly production
dimple
gimbal
section
Prior art date
Application number
PCT/JP2007/066003
Other languages
English (en)
French (fr)
Inventor
Kazuyuki Mizuishi
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/066003 priority Critical patent/WO2009025014A1/ja
Priority to JP2009528888A priority patent/JPWO2009025014A1/ja
Publication of WO2009025014A1 publication Critical patent/WO2009025014A1/ja
Priority to US12/704,219 priority patent/US20100139084A1/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Supporting Of Heads In Record-Carrier Devices (AREA)

Abstract

　ディンプル２３を有するロードビーム２２と、ディンプル２３にてロードビーム２２と接するジンバル２１等より構成されるサスペンションとヘッドスライダ２３をアセンブリするヘッドアセンブリ製造装置であって、ディンプル２３をロードビーム２２の背面より加熱する加熱部２と、ジンバル２１の表面から赤外線を照射し、ジンバル２１の温度分布の画像を生成する熱検出部３および画像生成部４と、生成された画像に基づきジンバル２１上におけるディンプル２３の位置を検出する演算部５とを備えた。
PCT/JP2007/066003 2007-08-17 2007-08-17 ヘッドアセンブリ製造装置、ヘッドアセンブリ製造方法 WO2009025014A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2007/066003 WO2009025014A1 (ja) 2007-08-17 2007-08-17 ヘッドアセンブリ製造装置、ヘッドアセンブリ製造方法
JP2009528888A JPWO2009025014A1 (ja) 2007-08-17 2007-08-17 ヘッドアセンブリ製造装置、ヘッドアセンブリ製造方法
US12/704,219 US20100139084A1 (en) 2007-08-17 2010-02-11 Head assembly manufacturing apparatus and head assembly manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/066003 WO2009025014A1 (ja) 2007-08-17 2007-08-17 ヘッドアセンブリ製造装置、ヘッドアセンブリ製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/704,219 Continuation US20100139084A1 (en) 2007-08-17 2010-02-11 Head assembly manufacturing apparatus and head assembly manufacturing method

Publications (1)

Publication Number Publication Date
WO2009025014A1 true WO2009025014A1 (ja) 2009-02-26

Family

ID=40377925

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/066003 WO2009025014A1 (ja) 2007-08-17 2007-08-17 ヘッドアセンブリ製造装置、ヘッドアセンブリ製造方法

Country Status (3)

Country Link
US (1) US20100139084A1 (ja)
JP (1) JPWO2009025014A1 (ja)
WO (1) WO2009025014A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016033840A (ja) * 2014-07-31 2016-03-10 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
CN113436654A (zh) * 2017-09-29 2021-09-24 富士胶片株式会社 磁带及磁记录回放装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5225647B2 (ja) * 2007-10-03 2013-07-03 日本発條株式会社 ヘッドサスペンション、ロードビーム、ロードビームの製造方法、及びワーク加工方法
JP4839293B2 (ja) * 2007-10-04 2011-12-21 日本発條株式会社 ヘッドサスペンション、ロードビーム、及びロードビームの製造方法
JP4954013B2 (ja) * 2007-10-11 2012-06-13 日本発條株式会社 ヘッドサスペンション、ロードビーム、及びロードビームの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216752A (ja) * 2000-01-31 2001-08-10 Sony Corp 磁気ヘッド装置の製造方法及び磁気ヘッド装置
JP2003050220A (ja) * 2001-08-03 2003-02-21 Nec San-Ei Instruments Ltd 光ビーム照射装置及びその照射方法
JP2005149613A (ja) * 2003-11-14 2005-06-09 Tdk Corp 磁気ヘッドの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6284073B1 (en) * 1997-12-11 2001-09-04 Seiko Instruments Inc. Core slider mount apparatus and core slider mount method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216752A (ja) * 2000-01-31 2001-08-10 Sony Corp 磁気ヘッド装置の製造方法及び磁気ヘッド装置
JP2003050220A (ja) * 2001-08-03 2003-02-21 Nec San-Ei Instruments Ltd 光ビーム照射装置及びその照射方法
JP2005149613A (ja) * 2003-11-14 2005-06-09 Tdk Corp 磁気ヘッドの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016033840A (ja) * 2014-07-31 2016-03-10 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
CN113436654A (zh) * 2017-09-29 2021-09-24 富士胶片株式会社 磁带及磁记录回放装置
CN113436654B (zh) * 2017-09-29 2022-12-02 富士胶片株式会社 磁带及磁记录回放装置

Also Published As

Publication number Publication date
US20100139084A1 (en) 2010-06-10
JPWO2009025014A1 (ja) 2010-11-18

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