WO2009021207A3 - Apparatus and method for wafer edge exclusion measurement - Google Patents

Apparatus and method for wafer edge exclusion measurement Download PDF

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Publication number
WO2009021207A3
WO2009021207A3 PCT/US2008/072683 US2008072683W WO2009021207A3 WO 2009021207 A3 WO2009021207 A3 WO 2009021207A3 US 2008072683 W US2008072683 W US 2008072683W WO 2009021207 A3 WO2009021207 A3 WO 2009021207A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
wafer edge
edge exclusion
exterior
light diffuser
Prior art date
Application number
PCT/US2008/072683
Other languages
French (fr)
Other versions
WO2009021207A2 (en
Inventor
Ju Jin
Satish Sadam
Vishal Verma
Zhiyan Huang
Siming Lin
Michael D Robbins
Paul F Forderhase
Original Assignee
Accretech Usa Inc
Ju Jin
Satish Sadam
Vishal Verma
Zhiyan Huang
Siming Lin
Michael D Robbins
Paul F Forderhase
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/891,657 external-priority patent/US7508504B2/en
Application filed by Accretech Usa Inc, Ju Jin, Satish Sadam, Vishal Verma, Zhiyan Huang, Siming Lin, Michael D Robbins, Paul F Forderhase filed Critical Accretech Usa Inc
Publication of WO2009021207A2 publication Critical patent/WO2009021207A2/en
Publication of WO2009021207A3 publication Critical patent/WO2009021207A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

Abstract

A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system uses a light diffuser with a plurality of lights disposed at its exterior or interior for providing uniform diffuse illumination of a substrate. An optic and imaging system exterior of the light diffuser are used to inspect the plurality of surfaces of the substrate including specular surfaces. An automatic defect characterization processor is provided.
PCT/US2008/072683 2007-08-09 2008-08-08 Apparatus and method for wafer edge exclusion measurement WO2009021207A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US96414907P 2007-08-09 2007-08-09
US60/964,149 2007-08-09
US11/891,657 2007-08-09
US11/891,657 US7508504B2 (en) 2006-05-02 2007-08-09 Automatic wafer edge inspection and review system

Publications (2)

Publication Number Publication Date
WO2009021207A2 WO2009021207A2 (en) 2009-02-12
WO2009021207A3 true WO2009021207A3 (en) 2009-04-02

Family

ID=40342067

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/072683 WO2009021207A2 (en) 2007-08-09 2008-08-08 Apparatus and method for wafer edge exclusion measurement

Country Status (1)

Country Link
WO (1) WO2009021207A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9784688B2 (en) 2012-10-10 2017-10-10 Seagate Technology Llc Apparatus for uniformly irradiating and imaging an article
CN112858319A (en) 2014-12-05 2021-05-28 科磊股份有限公司 Apparatus and method for defect detection in a workpiece
AT519679A1 (en) * 2017-02-27 2018-09-15 Zactrack Gmbh Method for calibrating a rotating and pivoting stage equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02275344A (en) * 1989-04-17 1990-11-09 Nec Kyushu Ltd Apparatus for measuring edge tip of semiconductor substrate
US5408338A (en) * 1992-02-19 1995-04-18 Ricoh Company, Ltd. Image processing unit processing pixel data according to scan line density
EP1001460B1 (en) * 1998-10-15 2001-05-02 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Method and apparatus for detecting, monitoring and characterizing edge defects on semiconductor wafers
KR20050024922A (en) * 2003-09-05 2005-03-11 김광렬 Apparatus for detecting a defect on edge area of a wafer and method therefor
US20070098259A1 (en) * 2005-10-31 2007-05-03 Shesha Shah Method and mechanism for analyzing the texture of a digital image

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02275344A (en) * 1989-04-17 1990-11-09 Nec Kyushu Ltd Apparatus for measuring edge tip of semiconductor substrate
US5408338A (en) * 1992-02-19 1995-04-18 Ricoh Company, Ltd. Image processing unit processing pixel data according to scan line density
EP1001460B1 (en) * 1998-10-15 2001-05-02 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Method and apparatus for detecting, monitoring and characterizing edge defects on semiconductor wafers
KR20050024922A (en) * 2003-09-05 2005-03-11 김광렬 Apparatus for detecting a defect on edge area of a wafer and method therefor
US20070098259A1 (en) * 2005-10-31 2007-05-03 Shesha Shah Method and mechanism for analyzing the texture of a digital image

Also Published As

Publication number Publication date
WO2009021207A2 (en) 2009-02-12

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