WO2009019788A1 - 半導体集積回路 - Google Patents
半導体集積回路 Download PDFInfo
- Publication number
- WO2009019788A1 WO2009019788A1 PCT/JP2007/065640 JP2007065640W WO2009019788A1 WO 2009019788 A1 WO2009019788 A1 WO 2009019788A1 JP 2007065640 W JP2007065640 W JP 2007065640W WO 2009019788 A1 WO2009019788 A1 WO 2009019788A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- switching means
- voltage
- integrated circuit
- semiconductor integrated
- processor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 230000014759 maintenance of location Effects 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
- G06F1/3234—Power saving characterised by the action undertaken
- G06F1/3296—Power saving characterised by the action undertaken by lowering the supply or operating voltage
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0008—Arrangements for reducing power consumption
- H03K19/0013—Arrangements for reducing power consumption in field effect transistor circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0008—Arrangements for reducing power consumption
- H03K19/0016—Arrangements for reducing power consumption by using a control or a clock signal, e.g. in order to apply power supply
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Power Sources (AREA)
- Microcomputers (AREA)
- Logic Circuits (AREA)
Abstract
本発明は、プロセッサブロックとプロセッサ以外の論理演算ブロックを有しており間欠動作を行う半導体集積回路において、前記プロセッサ以外の論理演算ブロックに通常動作用電圧を供給する第1のスイッチ手段と、前記プロセッサブロックに通常動作用電圧を供給する第2のスイッチ手段と、前記プロセッサブロックに前記通常動作用電圧より低いデータ保持用電圧を供給するための第3のスイッチ手段と、前記第2のスイッチ手段がオフで前記第3のスイッチ手段がオンしているときにオンして前記プロセッサブロックに前記データ保持用電圧を供給する第4のスイッチ手段とを有する。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/065640 WO2009019788A1 (ja) | 2007-08-09 | 2007-08-09 | 半導体集積回路 |
JP2009526315A JP5333219B2 (ja) | 2007-08-09 | 2007-08-09 | 半導体集積回路 |
EP07792290.4A EP2178115B1 (en) | 2007-08-09 | 2007-08-09 | Semiconductor integrated circuit |
US12/688,499 US8022753B2 (en) | 2007-08-09 | 2010-01-15 | Semiconductor integrated circuit with intermittent power supply operation of circuit blocks |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/065640 WO2009019788A1 (ja) | 2007-08-09 | 2007-08-09 | 半導体集積回路 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/688,499 Continuation US8022753B2 (en) | 2007-08-09 | 2010-01-15 | Semiconductor integrated circuit with intermittent power supply operation of circuit blocks |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009019788A1 true WO2009019788A1 (ja) | 2009-02-12 |
Family
ID=40341036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/065640 WO2009019788A1 (ja) | 2007-08-09 | 2007-08-09 | 半導体集積回路 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8022753B2 (ja) |
EP (1) | EP2178115B1 (ja) |
JP (1) | JP5333219B2 (ja) |
WO (1) | WO2009019788A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101859600A (zh) * | 2009-04-03 | 2010-10-13 | 台湾积体电路制造股份有限公司 | 集成电路结构 |
JP2010251445A (ja) * | 2009-04-14 | 2010-11-04 | Hitachi Ltd | 半導体装置およびそれを用いた情報処理装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8411525B2 (en) | 2010-04-29 | 2013-04-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory circuits having a diode-connected transistor with back-biased control |
FR2967797A1 (fr) * | 2010-11-18 | 2012-05-25 | St Microelectronics Sa | Systeme et procede d'alimentation d'un composant par exemple un processeur |
US9166567B2 (en) * | 2013-03-15 | 2015-10-20 | University Of California, San Diego | Data-retained power-gating circuit and devices including the same |
US9350332B1 (en) * | 2015-02-11 | 2016-05-24 | SK Hynix Inc. | Semiconductor device including retention circuit |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175909A (ja) * | 1987-01-16 | 1988-07-20 | Nec Corp | 1チツプマイクロコンピユ−タ |
JPH05108850A (ja) * | 1991-10-15 | 1993-04-30 | Nec Kyushu Ltd | 1チツプマイクロコンピユータ |
JP2003114742A (ja) | 2001-10-04 | 2003-04-18 | Matsushita Electric Ind Co Ltd | 電源遮断制御装置 |
JP2006127152A (ja) * | 2004-10-28 | 2006-05-18 | Fujitsu Ltd | 半導体装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3549602B2 (ja) * | 1995-01-12 | 2004-08-04 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
KR100269643B1 (ko) * | 1997-11-27 | 2000-10-16 | 김영환 | 전력소비 억제회로 |
DE10120790A1 (de) * | 2001-04-27 | 2002-11-21 | Infineon Technologies Ag | Schaltungsanordnung zur Verringerung der Versorgungsspannung eines Schaltungsteils sowie Verfahren zum Aktivieren eines Schaltungsteils |
JP4082706B2 (ja) * | 2005-04-12 | 2008-04-30 | 学校法人早稲田大学 | マルチプロセッサシステム及びマルチグレイン並列化コンパイラ |
JP2006318380A (ja) * | 2005-05-16 | 2006-11-24 | Handotai Rikougaku Kenkyu Center:Kk | 回路システム |
-
2007
- 2007-08-09 EP EP07792290.4A patent/EP2178115B1/en not_active Not-in-force
- 2007-08-09 WO PCT/JP2007/065640 patent/WO2009019788A1/ja active Application Filing
- 2007-08-09 JP JP2009526315A patent/JP5333219B2/ja not_active Expired - Fee Related
-
2010
- 2010-01-15 US US12/688,499 patent/US8022753B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175909A (ja) * | 1987-01-16 | 1988-07-20 | Nec Corp | 1チツプマイクロコンピユ−タ |
JPH05108850A (ja) * | 1991-10-15 | 1993-04-30 | Nec Kyushu Ltd | 1チツプマイクロコンピユータ |
JP2003114742A (ja) | 2001-10-04 | 2003-04-18 | Matsushita Electric Ind Co Ltd | 電源遮断制御装置 |
JP2006127152A (ja) * | 2004-10-28 | 2006-05-18 | Fujitsu Ltd | 半導体装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101859600A (zh) * | 2009-04-03 | 2010-10-13 | 台湾积体电路制造股份有限公司 | 集成电路结构 |
JP2010263194A (ja) * | 2009-04-03 | 2010-11-18 | Taiwan Semiconductor Manufacturing Co Ltd | 集積回路構造 |
JP2010251445A (ja) * | 2009-04-14 | 2010-11-04 | Hitachi Ltd | 半導体装置およびそれを用いた情報処理装置 |
Also Published As
Publication number | Publication date |
---|---|
US8022753B2 (en) | 2011-09-20 |
EP2178115A1 (en) | 2010-04-21 |
JP5333219B2 (ja) | 2013-11-06 |
EP2178115B1 (en) | 2017-12-13 |
EP2178115A4 (en) | 2011-01-26 |
US20100117714A1 (en) | 2010-05-13 |
JPWO2009019788A1 (ja) | 2010-10-28 |
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