WO2009014357A3 - Concentric buckling based vertical probe and its fabrication method - Google Patents

Concentric buckling based vertical probe and its fabrication method Download PDF

Info

Publication number
WO2009014357A3
WO2009014357A3 PCT/KR2008/004237 KR2008004237W WO2009014357A3 WO 2009014357 A3 WO2009014357 A3 WO 2009014357A3 KR 2008004237 W KR2008004237 W KR 2008004237W WO 2009014357 A3 WO2009014357 A3 WO 2009014357A3
Authority
WO
WIPO (PCT)
Prior art keywords
concentric
vertical probe
fabrication method
based vertical
buckling
Prior art date
Application number
PCT/KR2008/004237
Other languages
French (fr)
Other versions
WO2009014357A2 (en
Inventor
Jae-Hyun Kim
Hak-Joo Lee
Jung-Yup Kim
Byung-Ik Choi
Seung-Woo Han
Seung-Min Hyun
Original Assignee
Korea Mach & Materials Inst
Jae-Hyun Kim
Hak-Joo Lee
Jung-Yup Kim
Byung-Ik Choi
Seung-Woo Han
Seung-Min Hyun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Mach & Materials Inst, Jae-Hyun Kim, Hak-Joo Lee, Jung-Yup Kim, Byung-Ik Choi, Seung-Woo Han, Seung-Min Hyun filed Critical Korea Mach & Materials Inst
Publication of WO2009014357A2 publication Critical patent/WO2009014357A2/en
Publication of WO2009014357A3 publication Critical patent/WO2009014357A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Geometry (AREA)

Abstract

The present invention relates to a vertical probe and its fabrication method wherein the vertical probe is configured in a concentric pattern such that large elastic deformation can be made in a vertical direction and a simple fabrication process can also be performed. According to the present invention, there is provided a vertical probe for use in testing whether a semiconductor device normally operates by applying an electrical signal to the device, wherein one or more cylindrical structures are arranged in a concentric pattern and are subjected to concentric elastic buckling when longitudinal load is applied thereto.
PCT/KR2008/004237 2007-07-25 2008-07-21 Concentric buckling based vertical probe and its fabrication method WO2009014357A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0074570 2007-07-25
KR1020070074570A KR100952195B1 (en) 2007-07-25 2007-07-25 Concentric buckling-based vertical probe and its fabrication method

Publications (2)

Publication Number Publication Date
WO2009014357A2 WO2009014357A2 (en) 2009-01-29
WO2009014357A3 true WO2009014357A3 (en) 2009-03-19

Family

ID=40281969

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/004237 WO2009014357A2 (en) 2007-07-25 2008-07-21 Concentric buckling based vertical probe and its fabrication method

Country Status (2)

Country Link
KR (1) KR100952195B1 (en)
WO (1) WO2009014357A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102571582B1 (en) * 2021-07-01 2023-08-28 주식회사 아이에스시 Testor socket
KR102582796B1 (en) * 2021-07-15 2023-09-26 주식회사 아이에스시 Testor socket
KR102475091B1 (en) * 2022-08-23 2022-12-07 주식회사 프로이천 Contact pin including probe needle

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997060A (en) * 1982-11-26 1984-06-04 Toshiba Corp Probe apparatus
JPH04127581U (en) * 1991-02-08 1992-11-20 山形日本電気株式会社 pogo pin
KR20010083033A (en) * 2000-02-21 2001-08-31 시라토리 노부오 Probe for inspection and device of inspection having the same
KR20050040716A (en) * 2003-10-27 2005-05-03 스미토모덴키고교가부시키가이샤 Method of manufacturing contact, contact made by the method, and inspection equipment or electronic equipment having the contact
KR20070017935A (en) * 2003-12-12 2007-02-13 스미토모덴키고교가부시키가이샤 Fine terminal, its manufacturing method, and contact sheet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997060A (en) * 1982-11-26 1984-06-04 Toshiba Corp Probe apparatus
JPH04127581U (en) * 1991-02-08 1992-11-20 山形日本電気株式会社 pogo pin
KR20010083033A (en) * 2000-02-21 2001-08-31 시라토리 노부오 Probe for inspection and device of inspection having the same
KR20050040716A (en) * 2003-10-27 2005-05-03 스미토모덴키고교가부시키가이샤 Method of manufacturing contact, contact made by the method, and inspection equipment or electronic equipment having the contact
KR20070017935A (en) * 2003-12-12 2007-02-13 스미토모덴키고교가부시키가이샤 Fine terminal, its manufacturing method, and contact sheet

Also Published As

Publication number Publication date
KR20090011206A (en) 2009-02-02
KR100952195B1 (en) 2010-04-15
WO2009014357A2 (en) 2009-01-29

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