WO2009014077A1 - Curable composition - Google Patents

Curable composition Download PDF

Info

Publication number
WO2009014077A1
WO2009014077A1 PCT/JP2008/062987 JP2008062987W WO2009014077A1 WO 2009014077 A1 WO2009014077 A1 WO 2009014077A1 JP 2008062987 W JP2008062987 W JP 2008062987W WO 2009014077 A1 WO2009014077 A1 WO 2009014077A1
Authority
WO
WIPO (PCT)
Prior art keywords
fields
reactive silicon
silicon group
curable composition
specific reactive
Prior art date
Application number
PCT/JP2008/062987
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuhiro Ando
Kazuhide Fujimoto
Kensuke Kondo
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to JP2009524471A priority Critical patent/JP5421106B2/en
Publication of WO2009014077A1 publication Critical patent/WO2009014077A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds

Abstract

The present invention aims to improve the balance among transparency, adhesiveness and yellowing resistance of a curable composition which is obtained by using an organic polymer having a reactive silicon group and applicable to sealing materials and adhesives used in various fields such as architectural fields, DIY fields, electrical/electronic fields and industrial fields. Specifically disclosed is a curable composition containing an organic polymer having a specific reactive silicon group, a compound having a specific reactive silicon group and an amino group, another compound having a specific reactive silicon group and an amino group, a hydrophobic fine powdered silica, a curing agent and a phosphorus stabilizer.
PCT/JP2008/062987 2007-07-24 2008-07-18 Curable composition WO2009014077A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009524471A JP5421106B2 (en) 2007-07-24 2008-07-18 Curable composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007192024 2007-07-24
JP2007-192024 2007-07-24

Publications (1)

Publication Number Publication Date
WO2009014077A1 true WO2009014077A1 (en) 2009-01-29

Family

ID=40281331

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062987 WO2009014077A1 (en) 2007-07-24 2008-07-18 Curable composition

Country Status (2)

Country Link
JP (1) JP5421106B2 (en)
WO (1) WO2009014077A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010111745A (en) * 2008-11-05 2010-05-20 Momentive Performance Materials Inc Room temperature curable composition
JP2013509463A (en) * 2009-10-30 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Adhesive for bonding having silane crosslinking
JP2015515503A (en) * 2012-02-06 2015-05-28 ワッカー ケミー アクチエンゲゼルシャフトＷａｃｋｅｒ Ｃｈｅｍｉｅ ＡＧ Composition based on a polymer having an organyloxysilane end

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000038560A (en) * 1998-07-22 2000-02-08 Konishi Co Ltd Moisture-curing adhesive composition excellent in transparency
JP2000095952A (en) * 1998-09-18 2000-04-04 Yokohama Rubber Co Ltd:The Primer composition
JP2004323843A (en) * 2003-04-23 2004-11-18 Kanegafuchi Chem Ind Co Ltd Curable composition
WO2005108499A1 (en) * 2004-05-07 2005-11-17 Kaneka Corporation Curable composition with improved curability and adhesiveness
JP2006225487A (en) * 2005-02-16 2006-08-31 Kaneka Corp Curable composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000038560A (en) * 1998-07-22 2000-02-08 Konishi Co Ltd Moisture-curing adhesive composition excellent in transparency
JP2000095952A (en) * 1998-09-18 2000-04-04 Yokohama Rubber Co Ltd:The Primer composition
JP2004323843A (en) * 2003-04-23 2004-11-18 Kanegafuchi Chem Ind Co Ltd Curable composition
WO2005108499A1 (en) * 2004-05-07 2005-11-17 Kaneka Corporation Curable composition with improved curability and adhesiveness
WO2005108498A1 (en) * 2004-05-07 2005-11-17 Kaneka Corporation Curable composition
JP2006225487A (en) * 2005-02-16 2006-08-31 Kaneka Corp Curable composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010111745A (en) * 2008-11-05 2010-05-20 Momentive Performance Materials Inc Room temperature curable composition
JP2013509463A (en) * 2009-10-30 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Adhesive for bonding having silane crosslinking
JP2015515503A (en) * 2012-02-06 2015-05-28 ワッカー ケミー アクチエンゲゼルシャフトＷａｃｋｅｒ Ｃｈｅｍｉｅ ＡＧ Composition based on a polymer having an organyloxysilane end
US10077386B2 (en) 2012-02-06 2018-09-18 Wacker Chemie Ag Compositions on the basis of organyloxysilane-terminated polymers

Also Published As

Publication number Publication date
JPWO2009014077A1 (en) 2010-09-30
JP5421106B2 (en) 2014-02-19

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