WO2009013799A1 - Substrate adsorbing stage device - Google Patents

Substrate adsorbing stage device Download PDF

Info

Publication number
WO2009013799A1
WO2009013799A1 PCT/JP2007/064379 JP2007064379W WO2009013799A1 WO 2009013799 A1 WO2009013799 A1 WO 2009013799A1 JP 2007064379 W JP2007064379 W JP 2007064379W WO 2009013799 A1 WO2009013799 A1 WO 2009013799A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
stage device
ionizer
adsorbing stage
air hole
Prior art date
Application number
PCT/JP2007/064379
Other languages
French (fr)
Japanese (ja)
Inventor
Eiji Takao
Original Assignee
Hirata Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corporation filed Critical Hirata Corporation
Priority to PCT/JP2007/064379 priority Critical patent/WO2009013799A1/en
Publication of WO2009013799A1 publication Critical patent/WO2009013799A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Abstract

Provided is a substrate adsorbing stage device which is highly effective in neutralizing a substrate, in which the consumption of an ionizer is suppressed to a minimum, and the running cost of which is low. A substrate adsorbing stage device (1) comprises a mounting portion having an air hole (14) having an opening (14a) in a mounting surface (11) for a substrate (P), a vacuum pump (30) for suctioning gas from the air hole (14), a blower (40) for spraying gas from the air hole (14), and an ionizer (50) for ionizing the sprayed gas. The substrate adsorbing stage device (1) sprays the gas from the blower (40) on the substrate (P) held by adsorption by the mounting surface (11) by suction by the vacuum pump (30) and thereby separates the substrate (P) from the mounting surface (11). In the substrate adsorbing stage device (1), the ionizer (50) is provided on the position of a common pipe (62) between the air hole (14) and a suctioning pipe (63) and a blast pipe (64). The substrate adsorbing stage device (1) further comprises an ionizer control unit (75) for activating the ionizer (50) in communication with the operating condition of the blower (40).
PCT/JP2007/064379 2007-07-20 2007-07-20 Substrate adsorbing stage device WO2009013799A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/064379 WO2009013799A1 (en) 2007-07-20 2007-07-20 Substrate adsorbing stage device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/064379 WO2009013799A1 (en) 2007-07-20 2007-07-20 Substrate adsorbing stage device

Publications (1)

Publication Number Publication Date
WO2009013799A1 true WO2009013799A1 (en) 2009-01-29

Family

ID=40281063

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/064379 WO2009013799A1 (en) 2007-07-20 2007-07-20 Substrate adsorbing stage device

Country Status (1)

Country Link
WO (1) WO2009013799A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116480A (en) * 2012-12-11 2014-06-26 Disco Abrasive Syst Ltd Processing device
CN109427620A (en) * 2017-08-31 2019-03-05 株式会社斯库林集团 Pump installation, processing liquid supplying device, substrate board treatment, fluid-discharge method and liquid displacement method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927540A (en) * 1995-07-10 1997-01-28 Nikon Corp Substrate-retaining device
JP2006049390A (en) * 2004-07-30 2006-02-16 Sharp Corp Substrate-retaining device, program for controlling the same, static elimination method, and recording medium thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927540A (en) * 1995-07-10 1997-01-28 Nikon Corp Substrate-retaining device
JP2006049390A (en) * 2004-07-30 2006-02-16 Sharp Corp Substrate-retaining device, program for controlling the same, static elimination method, and recording medium thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116480A (en) * 2012-12-11 2014-06-26 Disco Abrasive Syst Ltd Processing device
CN109427620A (en) * 2017-08-31 2019-03-05 株式会社斯库林集团 Pump installation, processing liquid supplying device, substrate board treatment, fluid-discharge method and liquid displacement method
CN109427620B (en) * 2017-08-31 2022-04-01 株式会社斯库林集团 Pump device, processing liquid supply device, substrate processing device, liquid discharge method, and liquid replacement method

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