WO2009008047A1 - 半導体ウエハ収納容器内へのドライエアまたは窒素ガス充填装置並びに該装置を用いたウエハ静電除去装置 - Google Patents

半導体ウエハ収納容器内へのドライエアまたは窒素ガス充填装置並びに該装置を用いたウエハ静電除去装置 Download PDF

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Publication number
WO2009008047A1
WO2009008047A1 PCT/JP2007/063651 JP2007063651W WO2009008047A1 WO 2009008047 A1 WO2009008047 A1 WO 2009008047A1 JP 2007063651 W JP2007063651 W JP 2007063651W WO 2009008047 A1 WO2009008047 A1 WO 2009008047A1
Authority
WO
WIPO (PCT)
Prior art keywords
storage container
nitrogen gas
semiconductor wafer
dry air
wafer storage
Prior art date
Application number
PCT/JP2007/063651
Other languages
English (en)
French (fr)
Inventor
Toshirou Kisakibaru
Makoto Okada
Naoji Iida
Yasushi Honda
Original Assignee
Kondoh Industries, Ltd.
Cambridge Filter Japan, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kondoh Industries, Ltd., Cambridge Filter Japan, Ltd. filed Critical Kondoh Industries, Ltd.
Priority to US12/667,806 priority Critical patent/US20100175781A1/en
Priority to JP2009522440A priority patent/JPWO2009008047A1/ja
Priority to PCT/JP2007/063651 priority patent/WO2009008047A1/ja
Priority to KR1020107001197A priority patent/KR20100038382A/ko
Priority to CN200780053696A priority patent/CN101730933A/zh
Priority to EP07790472A priority patent/EP2166566A4/en
Publication of WO2009008047A1 publication Critical patent/WO2009008047A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Elimination Of Static Electricity (AREA)

Abstract

　半導体ウエハ収納容器の蓋を開けることなく、該半導体ウエハ収納容器内のケミカルガスを除去すると共に、酸の発生を阻止する。 半導体ウエハ（９）を収納した半導体ウエハ収納容器（１）の底板（５）に複数個設けられた呼吸口（８）のうち、供給側の呼吸口（８ａ）と排出側の呼吸口（８ｂ）に連結固定するドライエアまたは窒素ガス充填装置（Ａ）において、前記各呼吸口（８ａ）・（８ｂ）は、ＰＴＦＥフィルター（７）を備えて形成され、且つ前記充填装置Ａは、半導体ウエハ収納容器（１）内にドライエアまたは窒素ガスを供給するドライエア・窒素ガス供給部（１１）と、半導体ウエハ収納容器（１）内に供給されたドライエアまたは窒素ガスにより、半導体ウエハ収納容器（１）内のケミカルガスを除去すると共に、水分を除去により半導体ウエハ表面の酸の発生を阻止した後のドライエアまたは窒素ガスを排出する使用済ドライエア・窒素ガス排出部（１２）とにより構成される。
PCT/JP2007/063651 2007-07-09 2007-07-09 半導体ウエハ収納容器内へのドライエアまたは窒素ガス充填装置並びに該装置を用いたウエハ静電除去装置 WO2009008047A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/667,806 US20100175781A1 (en) 2007-07-09 2007-07-09 Apparatus for Charging Dry Air or Nitrogen Gas into a Container for Storing Semiconductor Wafers and an Apparatus for Thereby Removing Static Electricity from the Wafers
JP2009522440A JPWO2009008047A1 (ja) 2007-07-09 2007-07-09 半導体ウエハ収納容器内へのドライエアまたは窒素ガス充填装置並びに該装置を用いたウエハ静電除去装置
PCT/JP2007/063651 WO2009008047A1 (ja) 2007-07-09 2007-07-09 半導体ウエハ収納容器内へのドライエアまたは窒素ガス充填装置並びに該装置を用いたウエハ静電除去装置
KR1020107001197A KR20100038382A (ko) 2007-07-09 2007-07-09 반도체 웨이퍼 수납용기 내로의 드라이에어 또는 질소가스 충전 장치 및 그 장치를 이용한 웨이퍼 정전 제거장치
CN200780053696A CN101730933A (zh) 2007-07-09 2007-07-09 向半导体晶片收纳容器内填充干燥空气或氮气的填充装置以及使用了该装置的晶片除静电装置
EP07790472A EP2166566A4 (en) 2007-07-09 2007-07-09 DEVICE FOR INTRODUCING DRY AIR OR NITROGEN GAS INTO A SEMICONDUCTOR WAFER STORAGE CONTAINER AND DEVICE USING DEVICE FOR REMOVING STATIC WAFER CHARGE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/063651 WO2009008047A1 (ja) 2007-07-09 2007-07-09 半導体ウエハ収納容器内へのドライエアまたは窒素ガス充填装置並びに該装置を用いたウエハ静電除去装置

Publications (1)

Publication Number Publication Date
WO2009008047A1 true WO2009008047A1 (ja) 2009-01-15

Family

ID=40228244

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/063651 WO2009008047A1 (ja) 2007-07-09 2007-07-09 半導体ウエハ収納容器内へのドライエアまたは窒素ガス充填装置並びに該装置を用いたウエハ静電除去装置

Country Status (6)

Country Link
US (1) US20100175781A1 (ja)
EP (1) EP2166566A4 (ja)
JP (1) JPWO2009008047A1 (ja)
KR (1) KR20100038382A (ja)
CN (1) CN101730933A (ja)
WO (1) WO2009008047A1 (ja)

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* Cited by examiner, † Cited by third party
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KR101131147B1 (ko) 2011-04-25 2012-03-28 (주)이노시티 웨이퍼 저장 장치
JP7421939B2 (ja) 2020-01-30 2024-01-25 信越ポリマー株式会社 基板収納容器

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FR2963327B1 (fr) * 2010-07-27 2012-08-24 Air Liquide Dispositif de stockage d'articles sous atmosphere controlee
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
JP2012204645A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd 蓋体開閉装置
US9536763B2 (en) * 2011-06-28 2017-01-03 Brooks Automation, Inc. Semiconductor stocker systems and methods
JP5598728B2 (ja) * 2011-12-22 2014-10-01 株式会社ダイフク 不活性ガス注入装置
US10403532B2 (en) * 2012-09-20 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor apparatus with inner wafer carrier buffer and method
US9837293B2 (en) * 2013-10-30 2017-12-05 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms for charging gas into cassette pod
KR102164544B1 (ko) 2014-01-22 2020-10-12 삼성전자 주식회사 가스 충진부를 구비하는 웨이퍼 스토리지 장치를 포함하는 반도체 제조 장치
US10610905B2 (en) * 2015-08-10 2020-04-07 Murata Machinery, Ltd. Purge device, purge stocker, and cleaning method
CN108012563A (zh) * 2015-09-30 2018-05-08 精工爱普生株式会社 电子元器件输送装置及电子元器件检查装置
JP6428575B2 (ja) * 2015-11-18 2018-11-28 株式会社ダイフク 搬送設備
JP6679907B2 (ja) * 2015-12-11 2020-04-15 Tdk株式会社 ロードポート装置及びロードポート装置における容器内への清浄化ガス導入方法
US10840121B2 (en) 2016-10-31 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for unpacking semiconductor wafer container
US20220310404A1 (en) * 2021-03-25 2022-09-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
TWI825975B (zh) * 2021-09-10 2023-12-11 美商愛玻索立克公司 已清洗的封裝用基板的製造方法以及已清洗的封裝用基板

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
KR101131147B1 (ko) 2011-04-25 2012-03-28 (주)이노시티 웨이퍼 저장 장치
JP7421939B2 (ja) 2020-01-30 2024-01-25 信越ポリマー株式会社 基板収納容器

Also Published As

Publication number Publication date
JPWO2009008047A1 (ja) 2010-09-02
CN101730933A (zh) 2010-06-09
KR20100038382A (ko) 2010-04-14
EP2166566A1 (en) 2010-03-24
EP2166566A4 (en) 2010-12-29
US20100175781A1 (en) 2010-07-15

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