WO2009005445A1 - Emballage et procédé permettant de fournir ledit emballage - Google Patents

Emballage et procédé permettant de fournir ledit emballage Download PDF

Info

Publication number
WO2009005445A1
WO2009005445A1 PCT/SE2008/050702 SE2008050702W WO2009005445A1 WO 2009005445 A1 WO2009005445 A1 WO 2009005445A1 SE 2008050702 W SE2008050702 W SE 2008050702W WO 2009005445 A1 WO2009005445 A1 WO 2009005445A1
Authority
WO
WIPO (PCT)
Prior art keywords
wall
hole
walls
package according
package
Prior art date
Application number
PCT/SE2008/050702
Other languages
English (en)
Inventor
Lars Sandberg
Per-Henrik Branzell
Original Assignee
Stora Enso Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stora Enso Ab filed Critical Stora Enso Ab
Publication of WO2009005445A1 publication Critical patent/WO2009005445A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/04—Articles or materials wholly enclosed in single sheets or wrapper blanks
    • B65D75/20—Articles or materials wholly enclosed in single sheets or wrapper blanks in sheets or blanks doubled around contents and having their opposed free margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/22—Articles or materials wholly enclosed in single sheets or wrapper blanks in sheets or blanks doubled around contents and having their opposed free margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding the sheet or blank being recessed to accommodate contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/76—Making non-permanent or releasable joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • B29C66/1312—Single flange to flange joints, the parts to be joined being rigid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/549—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles said hollow-preforms being interconnected during their moulding process, e.g. by a hinge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/836—Moving relative to and tangentially to the parts to be joined, e.g. transversely to the displacement of the parts to be joined, e.g. using a X-Y table
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/58—Snap connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • B29L2031/7162—Boxes, cartons, cases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • B29L2031/7162—Boxes, cartons, cases
    • B29L2031/7164—Blister packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2211/00—Anti-theft means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2401/00—Tamper-indicating means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Definitions

  • the invention relates to a package, e.g. a blister package, comprising two spaced apart first and second walls formed and joined to each other to define a cavity between them, said walls having peripheral edges and being sealed together at a peripheral joint essentially along the edges.
  • a package e.g. a blister package, comprising two spaced apart first and second walls formed and joined to each other to define a cavity between them, said walls having peripheral edges and being sealed together at a peripheral joint essentially along the edges.
  • the invention further relates to a method for providing a package as described above.
  • Background Packaging units for articles are usually made from two plastic material walls or foils. These walls are relatively stiff synthetic sheets, with a heat seal weld along the ma ⁇ or peripheral edges or surrounding the entire periphery.
  • Blister packages are also known to have a plastic blister front and a cardboard rear wall, the plastic front being glued to the cardboard.
  • Other known blister packages include a plastic blister front and a flat foil rear wall.
  • the prior art blister packages usually include some kind of a tear-out part for the user to get access to the product.
  • the composition disclosed m US 6,620,308 B2 has a matrix functionality and an electrolyte functionality, wherein the electrolyte functionality is provided by a block copolymer or a graft copolymer.
  • the matrix functionality provides an adhesive bond to a substrate, and the electrolyte functionality provides sufficient ionic conductivity to the composition to support a faradic reaction at an interface with an electrically conductive surface m contact with the composition, whereby the adhesive bond is weakened at the interface.
  • the composition may be a phase-separated composition having first regions or substantially matrix functionality and second regions of substantially electrolyte functionality.
  • WO2007/015674 discloses a blister package comprising two conductive surfaces and an electrochemically weakable adhesive at the peripheral edge of the package, wh ⁇ ch package is adapted to be swiped through a voltage supplying apparatus .
  • One problem with the package disclosed in WO2007/015674 is that it requires that the laminate formed by the two conductive surfaces and the electrochemically weakable adhesive is quite stable and, thus, puts high demands on the materials.
  • One object of the present invention is to provide a stable blister package that is easily opened.
  • Another object of the present invention is to provide a stable blister package that renders unauthorized opening difficult.
  • a thj rd object of the present invention is to provide a stable blister package that is easily opened and yet protected against theft or unauthorized tamper.
  • a package comprising two spaced apart first and second walls formed and joined to each other to define a cavity between them, said walls having peripheral edges and being sealed together at a peripheral joint essentially along the edges, wherein a portion of said peripheral joint comprises at least two conductive surfaces arranged at a distance from each other and an electrochemically weakable adhesive at least partly bridging said distance, wherein at least one of said walls comprises a hole and, wherein at least one of said two conductive surfaces is accessible through said hole.
  • a blister package with two conductive surfaces and an electrochemically weakable adhesive
  • a voltage is applied to the electrochemically weakable adhesive, preferably by an external electrical power source.
  • the portion of the peripheral joint comprising the electrochemically weakable adhesive can be opened.
  • This initial opening of the package triggers or facilitates the opening of the rest of the peripheral joint whereby the user can easily get access to the article contained in the package.
  • the need of an external electrical power source for the opening of the package prevents theft and/or tampering, since it makes it more difficult to an unauthorized user to get access to the article.
  • the external electrical power source can, for example, be located at the cash register and the cashier can supply the electrical current to the package when the customer pays for the article.
  • the portion of the package provided with two conductive surfaces and an electrochemically weakable adhesive can be the whole peripheral joint, i.e. 100% of the peripheral joint.
  • the portion of the package provided with two conductive surfaces and an electirically weakable adhesive only constitute a part of the peripheral joint, i.e. not the whole peripheral joint.
  • the portion provided with two conductive surfaces and an electrochemically weakable adhesive can, for example, constitute less than 50% of the peripheral joint, preferably less than 25% of the peripheral joint. This saves materials and reduces the production cost.
  • the conductive surfaces can be formed by conductors, such as foils or, alternatively, of films comprising at least one conductive polymer.
  • the hole provided in at least one of the walls renders the conductive surfaces easily accessible for an external power source, but still enables a stable package.
  • the conductive surfaces e.g. the foils, can be made very thin, since they are stabilized by the wall of the package surrounding to the hole or holes.
  • the two conductive surfaces and said electrochemical Iy weakable adhesive are preferably arranged at least partly between said first and second walls. Most preferably, a first conductive surface is located on the first wall and a second conductive surface is located on the second wall, and the electrochemically weakable adhesive is at least partly bridging the distance between the first and the second conductive surface.
  • the distance between the first and the second conductive surfaces can be bridged by the electrochemically weakable adhesive, or by the electrochemically weakable adhesive and a layer of a conventional conducting adhesive.
  • the first conductive surface can, e.g., be a conductor attached to the inner side of the first wall, i.e. to the side of the first wall facing the second wall, and the second conductive surface can be a conductor attached to the inner side of the second wall, i.e. to the side of the second wall facing the first wall .
  • the hole formed in one or both of the walls can have any shape, such as circular, square-shaped, triangular etc.
  • the hole is preferably situated a distance d from the end of the wall. This renders the conductive surfaces, and thus the package, more stable.
  • the first conductive surface is accessible through a first hole in the first wall
  • the second conductive surface is accessible through a second hole in the second wall.
  • the first hole is located in the first wall at a position substantially opposed to the second hole in the second wall. This minimizes the material consumption of the conductive surfaces and the electrochemically weakable adhesive .
  • a projection of the first hole on the second wall is separated from the second hole, i.e. the holes are offset in a plane laying m the direction of the extension of the walls. This enables the voltage apparatus to be designed such that short-circuiting is avoided .
  • the first conductive surface is arranged on the first wall and accessible through a first hole in the first wall and the second conductive surface is arranged on the first wall and accessible through a second hole m the first wall.
  • a part of the first conductive surface extends past the first wall in a direction of a normal to a plane laying in the direction of the extension of the walls.
  • a part of the second conductive surface can be arranged to extend past the second wall m a direction of a normal to a plane laying m the direction of the extension of the walls. This can be accomplished by bending the conductive surface/conductor or surfaces/conductors or by forming, e.g. molding, a blister m the conductive surface or surfaces so that it protrude or bulge out of the hole or holes. This facilitates the access to the conductive surfaces by a voltage supplying apparatus even further. Moreover, the user can push the bulge of the conductive surface in order to open the package after the adhesive bonds are broken or weakened. This facilitates the opening of the package.
  • the package comprises means to ensure that the conductive surfaces and the electrochemically weakable adhesive is arranged between said walls at a position so that at least one of the conductive surfaces is accessible through the hole. This facilitates the manufacturing of the package, since a pre-manufactured laminate, comprising the conductive surfaces and the electrochemically weakable adhesive, easily can be arranged at the correct position before the sealing of the peripheral edges of the package.
  • the package may, e.g., comprise a formation of a defined area in at least one of the walls .
  • the package comprises a defined area in the first wall, which defined area has a concave formation.
  • the second wall comprises an aperture located opposite to said concave formation in the first wall and said concave formation is adapted to extend through said aperture when the package is sealed.
  • the conductive surfaces may comprise an edge that at least partly abuts on the edge of said defined area.
  • the conductive surfaces of the package are adapted to be inserted between a first and a second electrode, which electrodes are arranged spring-loaded adjacent to each other.
  • the conductive surfaces are adapted to be swiped through a voltage supplying apparatus. The swiping movement improves the contact between the conductive surfaces of the package and the conductors on the flanges and thus improves the current supply to the conductive surfaces. Furthermore the friction between the conductors and the flanges scratches off potential impurities, such as potential oxide layers on the conductors, which improves the contact even further.
  • the invention may further be said to involve an apparatus for supplying current across the electrochemically weakable adhesive of the package described above, which apparatus comprises two electrodes arranged adjacent to, but at a small distance, from each other and means for applying a voltage across said electrodes.
  • said electrodes comprise electrically conducting bristles, e.g. copper bristles. This enables the apparatus to be used for supplying current to different forms of blister packages, i.e. independent of the forms and locations of the conducting surfaces and the holes or the thickness of the package.
  • the distance between the electrodes is adjustable, e.g. by arranging the electrodes on a clamp or the like.
  • the electrodes are arranged at a distance from each other in an offset position, i.e. so that when the package is introduced between the electrodes, a projection of one of the electrodes on one of the walls of the package does not overlap a projection of the other electrode on the wall of the package. This assures that direct contact between the electrodes is avoided and thus prevents short- circuiting .
  • the electrodes form part of a first and a second flange forming a swipe slot.
  • the voltage supplying apparatus can form a part of a cash register system and the cashier or sales clerk swipes the package through the voltage supplying apparatus when the customer is paying for the product. This gives a good protection against theft and/or tampering, since the package has to be swiped through the voltage supplying apparatus before it can be opened.
  • the swiping movement is a well known working operation to the sales clerk, since a similar operation is performed today with credit cards .
  • the invention may also be said to involve a method comprising the steps of; a) providing two spaced apart first and second walls forming a cavity between them, said walls having peripheral edges, b) providing one or both of said walls with at least one hole, c) providing a portion of said peripheral edges with two conductive surfaces and an electrochemically weakable adhesive so that at least one of said conductive surfaces at least partly covers said hole, and d) sealing said walls together at a peripheral joint essentially along the edges.
  • Fig. 1 shows a blister package according to one embodiment of the invention.
  • Fig. 2a shows a cross section of the part of one embodiment of a blister package comprising a basic structure.
  • Fig. 2b shows a cross section of the part of another embodiment of a blister package comprising a basic structure.
  • Fig. 2c shows a cross section of the part of another embodiment of a blister package comprising a basic structure.
  • Fig. 3 illustrates a method of manufacture a blister package comprising a basic structure according to one embodiment of the invention.
  • Fig. 4 illustrates a method of manufacture a blister package comprising a basic structure according to another embodiment of the invention.
  • Fig. 5 shows a blister package according to another embodiment of the invention.
  • Fig. 6 shows a cross section of an apparatus for supplying voltage to the electrochemically weakable adhesive.
  • Fig. 7 and 8 shows another embodiment of an apparatus for supplying voltage to the electrochemically weakable adhesive.
  • the packages described in the following make use of an electrochemically weakable adhesive material.
  • electrochemically weakable adhesive is an adhesive that possesses adhesive properties as well as ion conductive properties, which adhesive forms adhesive bonds to an electrically conductive surface in contact with said composition and which bonds are weakened or broken at the application of a voltage to said adhesive.
  • the adhesive thus possesses sufficient ion conductive properties to enable an electrochemical reaction, e.g. a faradic reaction, to occur at the adhesive bonds.
  • the adhesive bond is broken by the electrochemical reaction.
  • the adhesive is an electrochemically breakable adhesive.
  • electrochemically weakable adhesive is the one described in US6620308.
  • the voltage applied in order to weaken the adhesive bonds may be either alternating or direct depending upon the desired manner of weakening of the electrochemica] Iy weakable adhesive.
  • the electrochemically weakable adhesive may bridge the complete distance between the conductive surfaces but may also be completed with additional layers of other materials capable of performing the necessary electrical and/or mechanical connection.
  • Such materials may be conventional non electrochemically conductive adhesives, polymers, varnishes, or the like, or electrically conductive versions of respective materia1.
  • the inventive package comprises a basic structure, which basic structure comprises a first conductive surface and a second conductive surface being arranged at a distance from each other and an electrochemically weakable adhesive adapted to bridge the distance between the first and the second conductive surface.
  • the first conductive surface is separated from the second conductive surface in a direction of a normal to the first surface, wherein the electrochemically weakable adhesive is bridging the distance between the first and second conductive surface.
  • the electrical potential difference between the conductive surfaces is adapted to be provided by an external source of electrical energy. When a voltage is applied between the conductive surfaces current will flow between the conductive surfaces via the electrochemically weakable adhesive.
  • the conductive surfaces are formed of foils.
  • the conductive surfaces can be made of a film of conductive polymers.
  • the packaging unit comprises the basic structure described above.
  • the packaging unit comprises a first 1 and a second 2 spaced apart walls that have been formed to define a cavity 3 between them, commonly referred to as a blister.
  • the article-receiving cavity or blister can be formed into one wall and the other can be flat, or, both walls can define parts of the article-receiving blister.
  • at least one of the walls is formed of plastic material, preferably transparent plastic.
  • both the upper and lower walls are made of plastic.
  • one of the walls can be formed as a flat sheet of plastic, a flexible film or a fibrous material, such as cardboard, commonly referred to as a blister card.
  • the semi-rigid plastic material walls 1, 2 can be thermally formed from plastic materials, such as polyester materials.
  • suitable forming techniques include, but are not limited to, vacuum forming and deep drawing.
  • the packaging unit is sealed along the periphery.
  • the joint can be achieved by use of any convenient technique such as adhesives, ultrasonic, heat sealing, radioTMfrequency (RF) sealing or firm mechanical interlock.
  • the walls 1, 2 of the packaging unit shown in fig. 1 are formed of one sheet of material that has been creased and folded back on itself along one of the edges 4, which is further illustrated in fig. 3 and 4. It is however also possible that the walls are formed of two separate pieces.
  • a part of the peripheral joint comprises at least two conductive surfaces 5, 6 and an electrochemically weakable adhesive 8, i.e. a basic structure 9.
  • a first conductive surface, 5, is attached to the first wall, 1, and a second conductive surface, 6, is attached to the second wall 2 and the electrochemically weakable adhesive is applied between the first and second conductive surface 5, 6.
  • the first 1 and the second wall 2 comprise a first hole 10 and a second hole 11, at the location of the basic structure 9, so that the conductive surfaces 5, 6 are accessible through said holes 10, 11.
  • the holes 10, 11 are located opposed to each other, i.e. a projection of the first hole 10 on the second wall 2 overlaps the second hole 11.
  • the holes 10, 11 are located offset to each other, i.e. a projection of the first hole 10 on the second wall 2 is separated from the second hole 11.
  • the conductive surfaces, 5 and 6, are protruding out of the holes, 10 and 11.
  • the laminate 9 formed by the conductive surfaces 5, 6 and the electrochemically weakable adhesive 8 is bended so that a first part of the laminate bulge out of the first hole 10 and a second part of the laminate bulge out of the second hole 11. Since the thickness of the laminate is unchanged, the walls 1 and 2 can also be bended in order to be in contact with the conductive surfaces opposite to the holes.
  • the package is opened.
  • the laminate 9 might be cut so that it forms a first and a second part being connected by an uncut part.
  • the first part can be bended upwards so that it bulges out of the hole 10, and the second part can be bended downwards so that it bulges out of the hole 11.
  • the basic structure 9 comprising the conductive surfaces and the electrochemically weakable adhesive, is located in the peripheral joint at the approximate intersection of two adjacent side edges of the packing unit.
  • the basic structure can be located anywhere in the peripheral joint of the packaging unit.
  • a voltage is applied between the conductive surfaces, 5, 6, current will flow between the conductive surfaces via the electrochemically weakable adhesive. This will cause bonds in the electrochemically weakable adhesive or between the electrochemically weakable adhesive and one of the conductive surfaces to break or to weaken.
  • the voltage needed to break or weaken the bonds in the electrochemically weakable adhesive can be applied by an external power supply. This can be achieved by contacting one of the conductive surfaces with one electrode (e.g.
  • the cathode of an voltage supplying apparatus through the hole in the wall and by contacting the other conductive surface with the other electrode (e.g. the anode) through the hole in the other wall.
  • the voltage is supplied by the user swiping the part of the package comprising the basic structure through a swipe slot m a voltage supplying apparatus.
  • the package can also be inserted between a first and a second electrode, which electrodes are arranged spring-loaded adjacent to each other.
  • a basic structure 9 comprising a first and a second conductive surface and an electrochemically weakable adhesive is manufactured separately from the walls adapted to be sealed together and thereby form the cavity or blister.
  • the blister package is provided with two holes 10, 11, at the periphery of the walls, e.g. by punching or die-cutting.
  • said structure 9 Prior to the sealing of the package along the periphery, said structure 9 is arranged between the walls so that it covers a portion of the periphery and the hole 10. Thereafter, the package is sealed along the periphery using any convenient technique.
  • the first hole is formed in the first wall at a position substantially opposed to the second hole in the second wall when the package is sealed.
  • FIG. 4 shows another embodiment of a manufacturing process, wherein the holes are located offset in relation to each other when the package is sealed, i.e. a projection of the first hole on the second wall substantially overlaps the second hole.
  • Fig. 5 shows another embodiment of the package, which package comprises means to ensure that the basic structure 9 is arranged between said walls at a position so that at least one of the conductive surfaces is accessible through the hole. The package shown in fig.
  • the 5 comprises a iirst wall 1 and a second wall (not shown) , a first hole 10 in the first wall 1 and a second hole in the second wall opposite to the first hole, as well as a third hole 21 in the first wall 1 and a fourth hole in the second wall opposite to the first hole, through which holes the conductive surfaces of the basic structure 9 are accessible.
  • the edges of the basic structure 9 are shown as broken lines to clarify that the basic structure is arranged between the first wall 1 and the second wall.
  • the basic structure 9 is arranged underneath the first wall 1 m the figure.
  • the formation of two pairs of holes makes the opening, i.e. the application of a voltage to the conductive surfaces more flexible.
  • the first wall 1 comprises a defined area A having a concave formation with an edge A .
  • the second wall 2 comprises an aperture located opposite to the concave formation A in the first wall so that the concave formation A extends through said aperture when the package is sealed.
  • the basic structure 9 is arranged between the walls 1 and 2 so that an edge 9 of the basic structure 9 abuts on the edge A of the defined area A. In this way, the basic structure 9 is accessible through the holes in the walls.
  • the basic structure 9 comprises an aperture of the same size and area as the aperture formed in the wall 2.
  • the edge 9 of the aperture formed m the basic structure 9 abuts the whole peripheral edge A of the area A.
  • a peripheral edge of a basic structure can partly abut on the peripheral edge A of the area A.
  • Fig. 6 shows one example of an apparatus for supplying voltage to the conductive surfaces 5, 6 of the basic structure 9.
  • the apparatus comprises a mam body 22 and two electrodes
  • the edge 20 'of the blister of the blister package is adapted to abut on one of the edges 22 'of the apparatus' main body 22.
  • Fig. 7 and 8 shows another example of an apparatus for supplying voltage to the conductive surfaces 5, 6 of the basic structure 9.
  • the apparatus comprises a main body 11 and two flanges 12, 13 arranged spring-loaded adjacent to each other in a first direction (direct! on x) forming a swipe slot 14.
  • the flanges 12, 13 comprise a pair of conductors 15, 16, adapted to be connected to a power supply.
  • the user swipes the part of the package, which part is provided with the basic structure, through the slot 14 whereby current flows through the electrochemically weakable adhesive.
  • the swiping movement improves the contact between the conductive surfaces of the basic structure and the conductors of the flanges, thus improving the voltage supply to the conductive surfaces.
  • the friction between the conductors and the flanges scratches off potential impurities, such as potential oxide layers on the conductors, which improves the contact even further.
  • the apparatus further comprises at least one battery connected to the conductors 15, 16 or electrodes 23, 24.
  • the battery is arranged inside the main body 11 or 22.
  • the apparatus can be connected to an external voltage supply.
  • the apparatus can for example form an integrated part of the cash register system, whereby no extra voltage supply is needed .
  • the flanges 12, 13 forming the slot 14 are spring-loaded assuring contact between the conducting surfaces 5, 6 of the basic structure and the conductors 12, 13 regardless of the thickness of the conducting surfaces or the package .
  • the flanges 12, 13, can be arranged adjacent to each other in a first direction (direction x) .
  • the flanges, 12, 13, can be separated by a distance in the first direction, defining the width of the slot.
  • the conductors 15, 16 are arranged at a distance from each other in at least one direction.
  • the conductors 15, 16 are arranged at a distance from each other in a direction (direction z) of a normal to the first direction, i.e. in a direction perpendicular to the extension of the slot ⁇ i.e. perpendicular to the swiping movement), and also perpendicular to the width of the slot. This assures that direct contact between the conductors 15, 16 are avoided and thus prevents shortcircuiting.
  • the electrodes 23, 24 shown in fig. 6 can be arranged at offset positions.
  • the first conductor 15 is located at the upper part of the first flange facing the second flange and the second conductor 16 is located at the lower part of the second flange facing the first flange.
  • the first and the conductors are located on different parts of the flanges such that direct contact of the conductors is avoided .

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Packages (AREA)

Abstract

La présente invention concerne un emballage comprenant des première et seconde parois disposées à distance l'une de l'autre et assemblées l'une à l'autre pour définir une cavité entre elles, lesdites parois ayant des bords périphériques et étant scellées ensemble au niveau d'un joint périphérique essentiellement le long des bords, une partie dudit joint périphérique comprenant au moins deux surfaces conductrices disposées à distance l'une de l'autre et un adhésif pouvant être affaibli par voie électrochimique recouvrant au moins partiellement ladite distance, l'une desdites parois comprenant un trou et au moins une desdites deux surfaces conductrices étant accessible à travers ledit trou. La présente invention concerne également un procédé permettant de fournir ledit emballage.
PCT/SE2008/050702 2007-06-29 2008-06-11 Emballage et procédé permettant de fournir ledit emballage WO2009005445A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US93795207P 2007-06-29 2007-06-29
US60/937,952 2007-06-29
SE0702540-6 2007-11-19
SE0702540 2007-11-19

Publications (1)

Publication Number Publication Date
WO2009005445A1 true WO2009005445A1 (fr) 2009-01-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2008/050702 WO2009005445A1 (fr) 2007-06-29 2008-06-11 Emballage et procédé permettant de fournir ledit emballage

Country Status (1)

Country Link
WO (1) WO2009005445A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744655A (en) * 1953-09-22 1956-05-08 Vnuk Josef Lined container and closure therefor
US4448345A (en) * 1982-07-29 1984-05-15 Container Corporation Of America Composite lid
US20040057638A1 (en) * 2002-09-19 2004-03-25 Perell William S. Bubble-seal apparatus for easily opening a sealed package
WO2007015674A1 (fr) * 2005-08-01 2007-02-08 Stora Enso Ab Emballage

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2744655A (en) * 1953-09-22 1956-05-08 Vnuk Josef Lined container and closure therefor
US4448345A (en) * 1982-07-29 1984-05-15 Container Corporation Of America Composite lid
US20040057638A1 (en) * 2002-09-19 2004-03-25 Perell William S. Bubble-seal apparatus for easily opening a sealed package
WO2007015674A1 (fr) * 2005-08-01 2007-02-08 Stora Enso Ab Emballage

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