WO2009001859A1 - 固体撮像装置、その製造方法およびその固体撮像装置を備える撮影装置 - Google Patents

固体撮像装置、その製造方法およびその固体撮像装置を備える撮影装置 Download PDF

Info

Publication number
WO2009001859A1
WO2009001859A1 PCT/JP2008/061550 JP2008061550W WO2009001859A1 WO 2009001859 A1 WO2009001859 A1 WO 2009001859A1 JP 2008061550 W JP2008061550 W JP 2008061550W WO 2009001859 A1 WO2009001859 A1 WO 2009001859A1
Authority
WO
WIPO (PCT)
Prior art keywords
solid
state imaging
imaging device
transparent substrate
manufacturing
Prior art date
Application number
PCT/JP2008/061550
Other languages
English (en)
French (fr)
Inventor
Renzaburo Miki
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008164916A external-priority patent/JP4268997B2/ja
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2009001859A1 publication Critical patent/WO2009001859A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)

Abstract

　本発明の固体撮像装置（１０）は、有効画素領域が形成された固体撮像素子（１）と、上記有効画素領域と同等の平面寸法を有し、かつ上記有効画素領域と対向する透明板（３）と、上記透明板（３）上に形成された光学素子（５）と、上記光学素子（５）と上記透明板（３）とを固定する固定部（７）とを少なくとも備え、上記固定部（７）が、上記透明板（３）の壁面の内、上記光学素子（５）側の端部を含む領域と密着している。これにより、簡便かつ安価な方法を用いて、小型化および薄型化を達成し、かつ高い信頼性（耐環境性）および性能を付与した固体撮像装置を提供することができる。
PCT/JP2008/061550 2007-06-28 2008-06-25 固体撮像装置、その製造方法およびその固体撮像装置を備える撮影装置 WO2009001859A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007171273 2007-06-28
JP2007-171273 2007-06-28
JP2008164916A JP4268997B2 (ja) 2007-06-28 2008-06-24 固体撮像装置、その製造方法およびその固体撮像装置を備える撮影装置
JP2008-164916 2008-06-24

Publications (1)

Publication Number Publication Date
WO2009001859A1 true WO2009001859A1 (ja) 2008-12-31

Family

ID=40185672

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061550 WO2009001859A1 (ja) 2007-06-28 2008-06-25 固体撮像装置、その製造方法およびその固体撮像装置を備える撮影装置

Country Status (1)

Country Link
WO (1) WO2009001859A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3982412A1 (en) * 2020-10-08 2022-04-13 Samsung Electronics Co., Ltd. Image sensor package and method of fabricating the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347398A (ja) * 2004-06-01 2005-12-15 Fuji Photo Film Co Ltd 固体撮像装置用実装基板及びカメラモジュール及び携帯電話機

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347398A (ja) * 2004-06-01 2005-12-15 Fuji Photo Film Co Ltd 固体撮像装置用実装基板及びカメラモジュール及び携帯電話機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3982412A1 (en) * 2020-10-08 2022-04-13 Samsung Electronics Co., Ltd. Image sensor package and method of fabricating the same

Similar Documents

Publication Publication Date Title
EP1889285A4 (en) METHOD AND SYSTEM FOR PRODUCING THE SIDE OF SEMICONDUCTOR COMPONENTS WITH CONDUCTIVE INTERCONNECTIONS
WO2008132802A1 (ja) 固体撮像装置およびその製造方法
ES2545429A2 (es) Pixel de sensor de imagen y método para fabricar un pixel de sensor de imagen
EP2375448A3 (en) Solid-state image sensor and imaging system
WO2010053718A3 (en) Positioning wafer lenses on electronic imagers
WO2006123288A3 (en) Electrowetting element, lens system, electronic device and driving method
WO2008057517A3 (en) Camera module with contamination reduction feature
EP2107608A3 (en) Photoelectric conversion imaging device with anti-reflective coating, its designing method and its manufacturing method
WO2009016949A1 (ja) 撮像装置
WO2009069476A1 (ja) 電子デバイス、表示装置および電子デバイスの製造方法
EP1777748A3 (en) Organic light emitting display and method of fabricating the same
EP2048923A3 (en) Method of manufacturing silicon substrate with a conductive through-hole
EP1708278A3 (en) Optical device module, lens holding device, and method for manufacturing optical device module
WO2008108271A1 (ja) 撮像レンズ、撮像ユニットおよびそれを備えた携帯型情報端末
EP1865559A3 (en) Organic light-emitting display device and method for fabricating the same
WO2008146243A3 (en) An electronic device comprising a convertible structure, and a method of manufacturing an electronic device
WO2009057655A1 (ja) 半導体発光素子およびその製造方法
EP1918995A3 (en) Semiconductor device
EP1445803A3 (en) Solid state imaging device with sealing window smaller than the imager chip
EP1939942A3 (en) Semiconductor device and method of fabricating the same
EP2045842A3 (en) Solid-state image sensing device and method for manufacturing the same
WO2007143134A3 (en) Camera module with premolded lens housing and method of manufacture
EP2533288A3 (en) Range sensor and range image sensor
EP1826604A3 (en) Display device
WO2008078541A1 (ja) レンズアッセンブリ、及び光デバイス、並びに光デバイスの光軸調整方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08777575

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08777575

Country of ref document: EP

Kind code of ref document: A1