WO2008156002A1 - 研磨シートおよびその製造方法 - Google Patents

研磨シートおよびその製造方法 Download PDF

Info

Publication number
WO2008156002A1
WO2008156002A1 PCT/JP2008/060522 JP2008060522W WO2008156002A1 WO 2008156002 A1 WO2008156002 A1 WO 2008156002A1 JP 2008060522 W JP2008060522 W JP 2008060522W WO 2008156002 A1 WO2008156002 A1 WO 2008156002A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing sheet
manufacturing
same
sheet
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/060522
Other languages
English (en)
French (fr)
Inventor
Shigeyuki Yoshida
Tomoyuki Honda
Masahiro Sugimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Toray Industries Inc
Original Assignee
NEC Electronics Corp
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp, Toray Industries Inc filed Critical NEC Electronics Corp
Publication of WO2008156002A1 publication Critical patent/WO2008156002A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

　本発明の目的は、立ち上げまでの時間が短くて済む研磨シートを提供することにあり、さらに、そのような研磨シートの製造方法を提供することにある。 　本発明の研磨シートは、シート状の発泡体からなり、その表面が、最終仕上げとして６０～２００番手（６０～２００メッシュ）の砥粒径の研磨剤でバフ掛けが行われて仕上げられていることを特徴とする研磨シートである。
PCT/JP2008/060522 2007-06-20 2008-06-09 研磨シートおよびその製造方法 Ceased WO2008156002A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007162375A JP2009000761A (ja) 2007-06-20 2007-06-20 研磨シートおよびその製造方法
JP2007-162375 2007-06-20

Publications (1)

Publication Number Publication Date
WO2008156002A1 true WO2008156002A1 (ja) 2008-12-24

Family

ID=40156160

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060522 Ceased WO2008156002A1 (ja) 2007-06-20 2008-06-09 研磨シートおよびその製造方法

Country Status (2)

Country Link
JP (1) JP2009000761A (ja)
WO (1) WO2008156002A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5567280B2 (ja) * 2009-02-06 2014-08-06 富士紡ホールディングス株式会社 研磨パッド

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004001169A (ja) * 2001-12-12 2004-01-08 Toyobo Co Ltd 半導体ウエハ研磨用研磨パッド
JP2006062058A (ja) * 2004-08-30 2006-03-09 Fujibo Holdings Inc 仕上げ研磨用研磨布及び研磨布の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004001169A (ja) * 2001-12-12 2004-01-08 Toyobo Co Ltd 半導体ウエハ研磨用研磨パッド
JP2006062058A (ja) * 2004-08-30 2006-03-09 Fujibo Holdings Inc 仕上げ研磨用研磨布及び研磨布の製造方法

Also Published As

Publication number Publication date
JP2009000761A (ja) 2009-01-08

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