WO2008155860A1 - Die coater and process for producing substrate structure for plasma display panel - Google Patents

Die coater and process for producing substrate structure for plasma display panel Download PDF

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Publication number
WO2008155860A1
WO2008155860A1 PCT/JP2007/062528 JP2007062528W WO2008155860A1 WO 2008155860 A1 WO2008155860 A1 WO 2008155860A1 JP 2007062528 W JP2007062528 W JP 2007062528W WO 2008155860 A1 WO2008155860 A1 WO 2008155860A1
Authority
WO
WIPO (PCT)
Prior art keywords
die coater
display panel
plasma display
substrate structure
coating stage
Prior art date
Application number
PCT/JP2007/062528
Other languages
French (fr)
Japanese (ja)
Inventor
Kimiyo Izasa
Tetsuya Horinouchi
Makoto Hidaka
Original Assignee
Hitachi Plasma Display Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plasma Display Limited filed Critical Hitachi Plasma Display Limited
Priority to PCT/JP2007/062528 priority Critical patent/WO2008155860A1/en
Publication of WO2008155860A1 publication Critical patent/WO2008155860A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Abstract

A die coater with which a coating layer having evenness of thickness can be formed. The die coater is characterized by comprising a coating stage to which a substrate is fixed and a pasty-material application part where a pasty material is applied to the substrate. It is further characterized in that the coating stage comprises a coating stage main body and a foreign-substance-absorbing layer disposed on the coating stage main body, the foreign-substance-absorbing layer having such a constitution that it absorbs any foreign substance present between the coating stage and the substrate.
PCT/JP2007/062528 2007-06-21 2007-06-21 Die coater and process for producing substrate structure for plasma display panel WO2008155860A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/062528 WO2008155860A1 (en) 2007-06-21 2007-06-21 Die coater and process for producing substrate structure for plasma display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/062528 WO2008155860A1 (en) 2007-06-21 2007-06-21 Die coater and process for producing substrate structure for plasma display panel

Publications (1)

Publication Number Publication Date
WO2008155860A1 true WO2008155860A1 (en) 2008-12-24

Family

ID=40156025

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/062528 WO2008155860A1 (en) 2007-06-21 2007-06-21 Die coater and process for producing substrate structure for plasma display panel

Country Status (1)

Country Link
WO (1) WO2008155860A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015183008A (en) * 2014-03-20 2015-10-22 リンテック株式会社 adhesive sheet

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63256326A (en) * 1987-04-15 1988-10-24 Hitachi Ltd Vacuum chuck and manufacture thereof
JPH01129438A (en) * 1987-11-16 1989-05-22 Hitachi Ltd Vacuum suction anchor block
JP2003159556A (en) * 2001-11-27 2003-06-03 Toray Ind Inc Coating method and coating equipment and method for color filter manufacturing and manufacturing equipment
JP2005303048A (en) * 2004-04-13 2005-10-27 Reitetsukusu:Kk Substrate chuck and shape measuring apparatus
JP2006134873A (en) * 2004-11-04 2006-05-25 Samsung Sdi Co Ltd Dielectric layer forming device and manufacturing method for plasma display panel using it
JP2006305713A (en) * 2005-03-28 2006-11-09 Nikon Corp Suction apparatus, polishing device, semiconductor device and semiconductor device manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63256326A (en) * 1987-04-15 1988-10-24 Hitachi Ltd Vacuum chuck and manufacture thereof
JPH01129438A (en) * 1987-11-16 1989-05-22 Hitachi Ltd Vacuum suction anchor block
JP2003159556A (en) * 2001-11-27 2003-06-03 Toray Ind Inc Coating method and coating equipment and method for color filter manufacturing and manufacturing equipment
JP2005303048A (en) * 2004-04-13 2005-10-27 Reitetsukusu:Kk Substrate chuck and shape measuring apparatus
JP2006134873A (en) * 2004-11-04 2006-05-25 Samsung Sdi Co Ltd Dielectric layer forming device and manufacturing method for plasma display panel using it
JP2006305713A (en) * 2005-03-28 2006-11-09 Nikon Corp Suction apparatus, polishing device, semiconductor device and semiconductor device manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015183008A (en) * 2014-03-20 2015-10-22 リンテック株式会社 adhesive sheet

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