WO2008149506A1 - ウエハ支持ガラス - Google Patents

ウエハ支持ガラス Download PDF

Info

Publication number
WO2008149506A1
WO2008149506A1 PCT/JP2008/001313 JP2008001313W WO2008149506A1 WO 2008149506 A1 WO2008149506 A1 WO 2008149506A1 JP 2008001313 W JP2008001313 W JP 2008001313W WO 2008149506 A1 WO2008149506 A1 WO 2008149506A1
Authority
WO
WIPO (PCT)
Prior art keywords
supporting glass
wafer
wafer supporting
glass
semiconductor wafer
Prior art date
Application number
PCT/JP2008/001313
Other languages
English (en)
French (fr)
Inventor
Yoshikazu Nishii
Original Assignee
Hoya Candeo Optronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007191826A external-priority patent/JP2009016771A/ja
Application filed by Hoya Candeo Optronics Corporation filed Critical Hoya Candeo Optronics Corporation
Priority to KR1020097021316A priority Critical patent/KR101227426B1/ko
Priority to CN2008800193242A priority patent/CN101681868B/zh
Publication of WO2008149506A1 publication Critical patent/WO2008149506A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

【課題】 　半導体ウエハ（ＳＷ）を接着して支持するとともに半導体ウエハから剥離できるように可撓性を備えたガラスプレート（ＧＰ）からなるウエハ支持ガラスを提供する。 【解決手段】 　ガラスプレート（ＧＰ）は、半導体ウエハ（ＳＷ）に接着してこの半導体ウエハを支持するウエハ支持ガラスである。そして、半導体ウエハ（ＳＷ）に接着されたウエハ支持ガラスを剥離するため、ウエハ支持ガラスは所定角度以上曲がる。ウエハ支持ガラスは３０度以上曲がると半導体ウエハに大きな力を与えないで剥離することができる。
PCT/JP2008/001313 2007-06-08 2008-05-27 ウエハ支持ガラス WO2008149506A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097021316A KR101227426B1 (ko) 2007-06-08 2008-05-27 웨이퍼 지지 유리
CN2008800193242A CN101681868B (zh) 2007-06-08 2008-05-27 晶片支承玻璃

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-152550 2007-06-08
JP2007152550 2007-06-08
JP2007-191826 2007-07-24
JP2007191826A JP2009016771A (ja) 2007-06-08 2007-07-24 ウエハ支持ガラス

Publications (1)

Publication Number Publication Date
WO2008149506A1 true WO2008149506A1 (ja) 2008-12-11

Family

ID=40093338

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001313 WO2008149506A1 (ja) 2007-06-08 2008-05-27 ウエハ支持ガラス

Country Status (1)

Country Link
WO (1) WO2008149506A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013039869A1 (en) * 2011-09-12 2013-03-21 3M Innovative Properties Company Peeling method and peeling device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10198942A (ja) * 1996-12-29 1998-07-31 Hoya Corp 記録媒体用ガラス基板、及び該基板を用いた記録媒体
JP2000349047A (ja) * 1999-06-01 2000-12-15 Lintec Corp 粘着材の貼付装置及び貼付方法
JP2001026500A (ja) * 1999-07-14 2001-01-30 Canon Inc 薄膜単結晶デバイスの製造法
JP2005183444A (ja) * 2003-12-16 2005-07-07 Daisho Denshi:Kk 基板保持キャリア及び基板の保持搬送方法
JP2006032488A (ja) * 2004-07-13 2006-02-02 Shin Etsu Polymer Co Ltd 電子部品保持具及びその使用方法
WO2006129458A1 (ja) * 2005-05-30 2006-12-07 Jsr Corporation 固定剤付きウエハ及び固定剤付きウエハの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10198942A (ja) * 1996-12-29 1998-07-31 Hoya Corp 記録媒体用ガラス基板、及び該基板を用いた記録媒体
JP2000349047A (ja) * 1999-06-01 2000-12-15 Lintec Corp 粘着材の貼付装置及び貼付方法
JP2001026500A (ja) * 1999-07-14 2001-01-30 Canon Inc 薄膜単結晶デバイスの製造法
JP2005183444A (ja) * 2003-12-16 2005-07-07 Daisho Denshi:Kk 基板保持キャリア及び基板の保持搬送方法
JP2006032488A (ja) * 2004-07-13 2006-02-02 Shin Etsu Polymer Co Ltd 電子部品保持具及びその使用方法
WO2006129458A1 (ja) * 2005-05-30 2006-12-07 Jsr Corporation 固定剤付きウエハ及び固定剤付きウエハの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013039869A1 (en) * 2011-09-12 2013-03-21 3M Innovative Properties Company Peeling method and peeling device

Similar Documents

Publication Publication Date Title
WO2012021196A3 (en) Method for manufacturing electronic devices and electronic devices thereof
EP1724319A4 (en) HOT REMOVABLE ADHESIVE ADHESIVE FOIL AND METHOD FOR PROCESSING LIABILITY WITH THE HOT REMOVABLE ADHESIVE ADHESIVE FOIL
TW200624975A (en) Apparatus and method for reducing slippage between structures in an interferometric modulator
SG115785A1 (en) Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device
EP2267090B8 (en) Pressure-sensitive adhesive film and back-grinding method using the same
WO2010129459A3 (en) Carrier for glass substrates
WO2005091790A3 (en) Labels and labeling process
SG124417A1 (en) Method and structure for fabricating III-V nitridelayers on silicon substrates
DE60316890D1 (de) Reaktive Heissschmelzkleberzusammensetzungen die verbesserte Hafteigenschaften auf schwierigen Substraten zeigen
GB2451151B8 (en) Array substrate for liquid crystal display device and method of fabricating the same.
WO2012000114A8 (en) Electronic devices with yielding substrates
WO2005123387A3 (en) Electro-active adhesive systems
EP1865550A4 (en) FLIPCHIP APPLICATION METHOD AND METHOD FOR CONNECTING SUBSTRATES
WO2009072226A1 (ja) 可撓性を有する表示装置
EP1887061A3 (en) Pressure-sensitive adhesive sheets for wafer grinding
EP2682456A3 (en) Bioactive surface
WO2006065410A3 (en) Adhesive composition
EP1829831A4 (en) GLASS COMPOSITION AND METHOD FOR MANUFACTURING SAME, AND GLASS SUBSTRATE FOR INFORMATION DISPLAY DEVICE IN INFORMATION DISPLAY DEVICE USING
TW200638095A (en) Liquid crystal display panel and fabricating method thereof
EP2574973A3 (en) Optical deflector apparatus including optical deflector chip sandwiched by two substrates
WO2009008106A1 (ja) 受光装置および受光装置の製造方法
WO2011156292A3 (en) Devices for methodologies for debonding and handling semiconductor wafers
WO2010029656A3 (en) Mems device and method for manufacturing the same
WO2007107885A3 (en) Device for contact by adhesion to a glass or semiconductor plate (wafer) surface of the like, and system for gripping such a plate comprising such a device
WO2010138931A3 (en) Mechanical isolation for mems electrical contacts

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880019324.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08763913

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20097021316

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08763913

Country of ref document: EP

Kind code of ref document: A1