WO2008146815A1 - 加熱炉 - Google Patents

加熱炉 Download PDF

Info

Publication number
WO2008146815A1
WO2008146815A1 PCT/JP2008/059733 JP2008059733W WO2008146815A1 WO 2008146815 A1 WO2008146815 A1 WO 2008146815A1 JP 2008059733 W JP2008059733 W JP 2008059733W WO 2008146815 A1 WO2008146815 A1 WO 2008146815A1
Authority
WO
WIPO (PCT)
Prior art keywords
hot air
board
holes
air blowoff
blowoff
Prior art date
Application number
PCT/JP2008/059733
Other languages
English (en)
French (fr)
Inventor
Hideki Nakamura
Original Assignee
Senju Metal Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co., Ltd. filed Critical Senju Metal Industry Co., Ltd.
Priority to JP2009516327A priority Critical patent/JP4957797B2/ja
Priority to CN2008800176459A priority patent/CN101683002B/zh
Publication of WO2008146815A1 publication Critical patent/WO2008146815A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

【課題】従来の熱風吹き出し口が複数の穴となっている熱風吹き出しヒーターは、加熱状態をコントロールするために、プリント基板の加熱に適した大きい穴と小さい穴が穿設された熱風吹き出し板を適宜変えて用いたり、或いは熱風吹き出し板の穴が同一の大きさのものでは、大量の熱を必要としない部分に対応する熱風吹き出し板の穴を塞いだりしていた。しかしながら熱風吹き出し板を変えたり、熱風吹き出し板の穴を塞いだりする作業に多大な手間がかかっていた。 【解決手段】本発明の加熱炉の熱風吹き出しヒーターは、熱風吹き出し板の穴と同一位置に同一形状の穴が穿設された熱風調整板を熱風吹き出し板に重ね合わせ、熱風調整板を少しずらすことにより、熱風吹き出し板の穴の開口を調整する。
PCT/JP2008/059733 2007-05-28 2008-05-27 加熱炉 WO2008146815A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009516327A JP4957797B2 (ja) 2007-05-28 2008-05-27 加熱炉
CN2008800176459A CN101683002B (zh) 2007-05-28 2008-05-27 加热炉

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-140236 2007-05-28
JP2007140236 2007-05-28

Publications (1)

Publication Number Publication Date
WO2008146815A1 true WO2008146815A1 (ja) 2008-12-04

Family

ID=40075055

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059733 WO2008146815A1 (ja) 2007-05-28 2008-05-27 加熱炉

Country Status (3)

Country Link
JP (1) JP4957797B2 (ja)
CN (1) CN101683002B (ja)
WO (1) WO2008146815A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013160431A (ja) * 2012-02-03 2013-08-19 Denso Corp 急速加熱装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103357982B (zh) * 2013-07-23 2016-01-27 深圳市劲拓自动化设备股份有限公司 一种印制电路板的预热装置及预热方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03198980A (ja) * 1989-12-27 1991-08-30 Tamura Seisakusho Co Ltd 熱風リフロー装置
JPH09186448A (ja) * 1995-12-28 1997-07-15 Nihon Dennetsu Kk リフローはんだ付け方法およびリフローはんだ付け装置
JPH09206927A (ja) * 1996-01-30 1997-08-12 Nihon Dennetsu Kk リフローはんだ付け方法およびその装置
WO2006013895A1 (ja) * 2004-08-04 2006-02-09 Senju Metal Industry Co., Ltd. リフロー炉
JP2007093168A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 熱処理炉

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03198980A (ja) * 1989-12-27 1991-08-30 Tamura Seisakusho Co Ltd 熱風リフロー装置
JPH09186448A (ja) * 1995-12-28 1997-07-15 Nihon Dennetsu Kk リフローはんだ付け方法およびリフローはんだ付け装置
JPH09206927A (ja) * 1996-01-30 1997-08-12 Nihon Dennetsu Kk リフローはんだ付け方法およびその装置
WO2006013895A1 (ja) * 2004-08-04 2006-02-09 Senju Metal Industry Co., Ltd. リフロー炉
JP2007093168A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 熱処理炉

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013160431A (ja) * 2012-02-03 2013-08-19 Denso Corp 急速加熱装置

Also Published As

Publication number Publication date
JPWO2008146815A1 (ja) 2010-08-19
CN101683002B (zh) 2012-06-13
JP4957797B2 (ja) 2012-06-20
CN101683002A (zh) 2010-03-24

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