WO2008146759A1 - Curable composition and cured product thereof - Google Patents

Curable composition and cured product thereof Download PDF

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Publication number
WO2008146759A1
WO2008146759A1 PCT/JP2008/059591 JP2008059591W WO2008146759A1 WO 2008146759 A1 WO2008146759 A1 WO 2008146759A1 JP 2008059591 W JP2008059591 W JP 2008059591W WO 2008146759 A1 WO2008146759 A1 WO 2008146759A1
Authority
WO
WIPO (PCT)
Prior art keywords
curable composition
cured product
heat resistance
vinyl polymer
disclosed
Prior art date
Application number
PCT/JP2008/059591
Other languages
French (fr)
Japanese (ja)
Inventor
Jun Kotani
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to JP2009516308A priority Critical patent/JP5368302B2/en
Publication of WO2008146759A1 publication Critical patent/WO2008146759A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)

Abstract

Disclosed is a curable composition containing a vinyl polymer which generally provides a cured product exhibiting good mechanical characteristics, oil resistance, heat resistance and the like. This curable composition can be cured by hydrosilylation, and enables to obtain a cured product which is excellent in heat resistance after immersion in a lubricant. Also disclosed is a cured product which is excellent in heat resistance after immersion in a lubricant. Specifically disclosed is a first curable composition containing (A) a vinyl polymer (I) having at least one hydrosilylatable alkenyl group in a molecule, (B) a hydrosilyl group-containing compound (II), (C) a hydrosilylation catalyst and (D) a p-phenylenediamine antioxidant. Also specifically disclosed is a second curable composition containing (A) a vinyl polymer (I) having at least one hydrosilylatable alkenyl group in a molecule, (B) a hydrosilyl group-containing compound (II), (C) a hydrosilylation catalyst, (E) an amine antioxidant and (F) an anatase titanium oxide.
PCT/JP2008/059591 2007-05-25 2008-05-23 Curable composition and cured product thereof WO2008146759A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009516308A JP5368302B2 (en) 2007-05-25 2008-05-23 Curable composition and cured product thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-139091 2007-05-25
JP2007139091 2007-05-25

Publications (1)

Publication Number Publication Date
WO2008146759A1 true WO2008146759A1 (en) 2008-12-04

Family

ID=40075005

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059591 WO2008146759A1 (en) 2007-05-25 2008-05-23 Curable composition and cured product thereof

Country Status (2)

Country Link
JP (1) JP5368302B2 (en)
WO (1) WO2008146759A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011105869A (en) * 2009-11-18 2011-06-02 Kaneka Corp White curable composition and reflective coating material

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649370A (en) * 1992-07-29 1994-02-22 Kanegafuchi Chem Ind Co Ltd Curable composition for masking tape for printed circuit board
WO1999024509A1 (en) * 1997-11-06 1999-05-20 Kaneka Corporation Hardener, curable composition and foamable resin composition both containing the hardener, and foam made from the foamable resin composition and process for producing the same
JP2000154255A (en) * 1998-09-18 2000-06-06 Kanegafuchi Chem Ind Co Ltd Curable composition for molding and molded item obtained by curing same
JP2001131414A (en) * 1999-11-02 2001-05-15 Kanegafuchi Chem Ind Co Ltd Process for hydrosilylation
JP2003261770A (en) * 2002-03-08 2003-09-19 Kanegafuchi Chem Ind Co Ltd Sealant, method of sealing for semiconductor device or the like, method of production for semiconductor device, and semiconductor device
WO2004076585A1 (en) * 2003-02-25 2004-09-10 Kaneka Corporation Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
JP2005307064A (en) * 2004-04-23 2005-11-04 Kaneka Corp Method for producing curable composition
WO2005116134A1 (en) * 2004-05-28 2005-12-08 Kaneka Corporation Curable composition and cured product thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4190653B2 (en) * 1998-09-17 2008-12-03 住友ベークライト株式会社 High heat resistance low dielectric constant thermosetting resin

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649370A (en) * 1992-07-29 1994-02-22 Kanegafuchi Chem Ind Co Ltd Curable composition for masking tape for printed circuit board
WO1999024509A1 (en) * 1997-11-06 1999-05-20 Kaneka Corporation Hardener, curable composition and foamable resin composition both containing the hardener, and foam made from the foamable resin composition and process for producing the same
JP2000154255A (en) * 1998-09-18 2000-06-06 Kanegafuchi Chem Ind Co Ltd Curable composition for molding and molded item obtained by curing same
JP2001131414A (en) * 1999-11-02 2001-05-15 Kanegafuchi Chem Ind Co Ltd Process for hydrosilylation
JP2003261770A (en) * 2002-03-08 2003-09-19 Kanegafuchi Chem Ind Co Ltd Sealant, method of sealing for semiconductor device or the like, method of production for semiconductor device, and semiconductor device
WO2004076585A1 (en) * 2003-02-25 2004-09-10 Kaneka Corporation Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
JP2005307064A (en) * 2004-04-23 2005-11-04 Kaneka Corp Method for producing curable composition
WO2005116134A1 (en) * 2004-05-28 2005-12-08 Kaneka Corporation Curable composition and cured product thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011105869A (en) * 2009-11-18 2011-06-02 Kaneka Corp White curable composition and reflective coating material

Also Published As

Publication number Publication date
JP5368302B2 (en) 2013-12-18
JPWO2008146759A1 (en) 2010-08-19

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