WO2008142794A1 - Coating composition, products of curing, coatings for electrical insulation, coatings for heat release, and flexible printed wiring boards - Google Patents

Coating composition, products of curing, coatings for electrical insulation, coatings for heat release, and flexible printed wiring boards Download PDF

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Publication number
WO2008142794A1
WO2008142794A1 PCT/JP2007/060609 JP2007060609W WO2008142794A1 WO 2008142794 A1 WO2008142794 A1 WO 2008142794A1 JP 2007060609 W JP2007060609 W JP 2007060609W WO 2008142794 A1 WO2008142794 A1 WO 2008142794A1
Authority
WO
WIPO (PCT)
Prior art keywords
coatings
coating composition
curing
products
printed wiring
Prior art date
Application number
PCT/JP2007/060609
Other languages
French (fr)
Japanese (ja)
Inventor
Masakazu Takemoto
Takashi Naito
Takahiro Watanabe
Original Assignee
Ceramission Hanbai Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramission Hanbai Co., Ltd. filed Critical Ceramission Hanbai Co., Ltd.
Priority to PCT/JP2007/060609 priority Critical patent/WO2008142794A1/en
Priority to JP2009515061A priority patent/JPWO2008142794A1/en
Publication of WO2008142794A1 publication Critical patent/WO2008142794A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D101/00—Coating compositions based on cellulose, modified cellulose, or cellulose derivatives
    • C09D101/08—Cellulose derivatives
    • C09D101/26—Cellulose ethers
    • C09D101/28—Alkyl ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D185/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Coating compositions based on derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

[PROBLEMS] To provide a coating composition which has such high heat resistance and flame retardance as to withstand high-temperature mounting with lead-free solder and such flexibility as to withstand bending and cutting. [MEANS FOR SOLVING PROBLEMS] A two-package coating composition which is composed of the first fluid containing a product of partial hydrolysis of an alkoxysilane and an organic solvent and the second fluid containing an alkoxytitanium and an organic solvent and can be cured by mixing the first fluid with the second fluid, wherein at least one of the first and second fluids contains ethylcellulose.
PCT/JP2007/060609 2007-05-24 2007-05-24 Coating composition, products of curing, coatings for electrical insulation, coatings for heat release, and flexible printed wiring boards WO2008142794A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/060609 WO2008142794A1 (en) 2007-05-24 2007-05-24 Coating composition, products of curing, coatings for electrical insulation, coatings for heat release, and flexible printed wiring boards
JP2009515061A JPWO2008142794A1 (en) 2007-05-24 2007-05-24 Coating composition, cured product, coating film for electrical insulation, coating film for heat dissipation, and flexible printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/060609 WO2008142794A1 (en) 2007-05-24 2007-05-24 Coating composition, products of curing, coatings for electrical insulation, coatings for heat release, and flexible printed wiring boards

Publications (1)

Publication Number Publication Date
WO2008142794A1 true WO2008142794A1 (en) 2008-11-27

Family

ID=40031520

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/060609 WO2008142794A1 (en) 2007-05-24 2007-05-24 Coating composition, products of curing, coatings for electrical insulation, coatings for heat release, and flexible printed wiring boards

Country Status (2)

Country Link
JP (1) JPWO2008142794A1 (en)
WO (1) WO2008142794A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020141142A (en) * 2020-04-28 2020-09-03 星和電機株式会社 Flame-retardant heat dissipation sheet

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2466434A (en) * 1949-04-05 Heat-besistant insulating materials
JPS58213046A (en) * 1982-05-21 1983-12-10 ワツカ−−ヒエミ−・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング Aqueous composition containing organic silicon compound
JPH06192454A (en) * 1992-12-24 1994-07-12 Toppan Printing Co Ltd Gas-barrier material
JP2006095709A (en) * 2004-09-28 2006-04-13 Nisshin Steel Co Ltd Coated steel panel excellent in conductivity/heat absorbing and releasing properties
WO2006038262A1 (en) * 2004-09-30 2006-04-13 Ceramission Co., Ltd. Solder resist coating, cured product therefrom and printed wiring board having coating film therefrom
JP2007012967A (en) * 2005-07-01 2007-01-18 Ceramission Kk Heat radiation film for solar cell module and solar cell module provided with heat radiation film

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000277770A (en) * 1999-03-25 2000-10-06 Dainippon Printing Co Ltd Surface protecting sheet for solar battery module and solar battery module containing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2466434A (en) * 1949-04-05 Heat-besistant insulating materials
JPS58213046A (en) * 1982-05-21 1983-12-10 ワツカ−−ヒエミ−・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング Aqueous composition containing organic silicon compound
JPH06192454A (en) * 1992-12-24 1994-07-12 Toppan Printing Co Ltd Gas-barrier material
JP2006095709A (en) * 2004-09-28 2006-04-13 Nisshin Steel Co Ltd Coated steel panel excellent in conductivity/heat absorbing and releasing properties
WO2006038262A1 (en) * 2004-09-30 2006-04-13 Ceramission Co., Ltd. Solder resist coating, cured product therefrom and printed wiring board having coating film therefrom
JP2007012967A (en) * 2005-07-01 2007-01-18 Ceramission Kk Heat radiation film for solar cell module and solar cell module provided with heat radiation film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020141142A (en) * 2020-04-28 2020-09-03 星和電機株式会社 Flame-retardant heat dissipation sheet
JP7080920B2 (en) 2020-04-28 2022-06-06 星和電機株式会社 Flame-retardant heat dissipation sheet

Also Published As

Publication number Publication date
JPWO2008142794A1 (en) 2010-08-05

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