WO2008142248A3 - Module d'identification radiofréquence, et document de sécurité l'incorporant, notamment passeport électronique - Google Patents

Module d'identification radiofréquence, et document de sécurité l'incorporant, notamment passeport électronique Download PDF

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Publication number
WO2008142248A3
WO2008142248A3 PCT/FR2008/000438 FR2008000438W WO2008142248A3 WO 2008142248 A3 WO2008142248 A3 WO 2008142248A3 FR 2008000438 W FR2008000438 W FR 2008000438W WO 2008142248 A3 WO2008142248 A3 WO 2008142248A3
Authority
WO
WIPO (PCT)
Prior art keywords
identification module
substrate
security document
particular electronic
incorporating same
Prior art date
Application number
PCT/FR2008/000438
Other languages
English (en)
Other versions
WO2008142248A2 (fr
WO2008142248A9 (fr
Inventor
Phillipe Patrice
Henri Boccia
Original Assignee
Smart Packaking Solutions Sps
Phillipe Patrice
Henri Boccia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaking Solutions Sps, Phillipe Patrice, Henri Boccia filed Critical Smart Packaking Solutions Sps
Publication of WO2008142248A2 publication Critical patent/WO2008142248A2/fr
Publication of WO2008142248A3 publication Critical patent/WO2008142248A3/fr
Publication of WO2008142248A9 publication Critical patent/WO2008142248A9/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un module électronique (40) d'identification radiofréquence, comportant : un substrat (21) portant une puce microélectronique (24) ayant des plots d'entrée/sortie (25); une antenne (47) réalisée sur le substrat (21) et dont les bornes (26) sont reliées aux plots d'entrée/ sortie (25) correspondants de la puce microélectronique (24) par des moyens d'interconnexion (28); au moins une feuille d'entretoise (42) plane, disposée contre le substrat (21) et étant perforée de façon à former une cavité (43) dans laquelle sont logés la puce (24), les moyens d'interconnexion (28) et un matériau de remplissage de la cavité (43); Le module (42) est caractérisé en ce que la feuille d'entretoise (42) comporte en outre au moins une échancrure (45) au voisinage de sa périphérie, chaque échancrure (45) délimitant une zone (46) du substrat (21) non recouverte par la feuille d'entretoise (42).
PCT/FR2008/000438 2007-04-10 2008-03-31 Module d'identification radiofréquence, et document de sécurité l'incorporant, notamment passeport électronique WO2008142248A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0702585 2007-04-10
FR0702585A FR2915009B1 (fr) 2007-04-10 2007-04-10 Module d'identification radiofrequence, et document de securite l'incorporant, notamment passeport electronique

Publications (3)

Publication Number Publication Date
WO2008142248A2 WO2008142248A2 (fr) 2008-11-27
WO2008142248A3 true WO2008142248A3 (fr) 2009-01-22
WO2008142248A9 WO2008142248A9 (fr) 2009-03-05

Family

ID=38673186

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2008/000438 WO2008142248A2 (fr) 2007-04-10 2008-03-31 Module d'identification radiofréquence, et document de sécurité l'incorporant, notamment passeport électronique

Country Status (2)

Country Link
FR (1) FR2915009B1 (fr)
WO (1) WO2008142248A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2261054A1 (fr) * 2009-06-12 2010-12-15 Gemalto Oy Procédé de fabrication d'une page de sécurité

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3131216A1 (de) * 1981-04-14 1982-11-04 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "ausweiskarte mit ic-baustein"
WO2005034031A1 (fr) * 2003-10-01 2005-04-14 Axalto Sa Document d'identification

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3131216A1 (de) * 1981-04-14 1982-11-04 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "ausweiskarte mit ic-baustein"
WO2005034031A1 (fr) * 2003-10-01 2005-04-14 Axalto Sa Document d'identification

Also Published As

Publication number Publication date
FR2915009B1 (fr) 2009-06-05
FR2915009A1 (fr) 2008-10-17
WO2008142248A2 (fr) 2008-11-27
WO2008142248A9 (fr) 2009-03-05

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