WO2008133270A1 - Radiation-sensitive resin composition - Google Patents

Radiation-sensitive resin composition Download PDF

Info

Publication number
WO2008133270A1
WO2008133270A1 PCT/JP2008/057839 JP2008057839W WO2008133270A1 WO 2008133270 A1 WO2008133270 A1 WO 2008133270A1 JP 2008057839 W JP2008057839 W JP 2008057839W WO 2008133270 A1 WO2008133270 A1 WO 2008133270A1
Authority
WO
WIPO (PCT)
Prior art keywords
radiation
resin composition
sensitive resin
excelling
sensitive
Prior art date
Application number
PCT/JP2008/057839
Other languages
French (fr)
Japanese (ja)
Inventor
Makoto Shimizu
Takehiko Naruoka
Yoshifumi Ooizumi
Takanori Kawakami
Nobuji Matsumura
Noboru Ootsuka
Original Assignee
Jsr Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corporation filed Critical Jsr Corporation
Priority to JP2009511884A priority Critical patent/JPWO2008133270A1/en
Publication of WO2008133270A1 publication Critical patent/WO2008133270A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Abstract

A radiation-sensitive resin composition comprising radiation-sensitive acid generating agent (B) and resin (A) having repeating units of the general formulae (1), (2) and (3) provided that the ratio of those of the general formula (1) is 20 mol% or higher. This radiation-sensitive resin composition is useful as a chemical amplification type resist excelling in fundamental properties as resist and excelling in isolated line performance and defect performance. (1) (2) (3)
PCT/JP2008/057839 2007-04-25 2008-04-23 Radiation-sensitive resin composition WO2008133270A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009511884A JPWO2008133270A1 (en) 2007-04-25 2008-04-23 Radiation sensitive resin composition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-115935 2007-04-25
JP2007115935 2007-04-25
JP2007230412 2007-09-05
JP2007-230412 2007-09-05

Publications (1)

Publication Number Publication Date
WO2008133270A1 true WO2008133270A1 (en) 2008-11-06

Family

ID=39925719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057839 WO2008133270A1 (en) 2007-04-25 2008-04-23 Radiation-sensitive resin composition

Country Status (2)

Country Link
JP (1) JPWO2008133270A1 (en)
WO (1) WO2008133270A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010536977A (en) * 2007-08-24 2010-12-02 エイゼット・エレクトロニック・マテリアルズ・ユーエスエイ・コーポレイション Polymers for use in photoresist compositions
JP2015179163A (en) * 2014-03-19 2015-10-08 信越化学工業株式会社 Positive resist composition and patterning process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005108444A1 (en) * 2004-05-06 2005-11-17 Jsr Corporation Lactone copolymer and radiation-sensitive resin composition
JP2006330325A (en) * 2005-05-26 2006-12-07 Jsr Corp Radiation sensitive resin composition
JP2007052182A (en) * 2005-08-17 2007-03-01 Jsr Corp Radiation sensitive resin composition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4506484B2 (en) * 2004-01-21 2010-07-21 住友化学株式会社 Chemically amplified positive resist composition
JP4622579B2 (en) * 2004-04-23 2011-02-02 住友化学株式会社 Chemically amplified positive resist composition, (meth) acrylic acid derivative and process for producing the same
JP4622735B2 (en) * 2005-08-12 2011-02-02 Ｊｓｒ株式会社 Positive radiation sensitive resin composition
JP5060986B2 (en) * 2007-02-27 2012-10-31 富士フイルム株式会社 Positive resist composition and pattern forming method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005108444A1 (en) * 2004-05-06 2005-11-17 Jsr Corporation Lactone copolymer and radiation-sensitive resin composition
JP2006330325A (en) * 2005-05-26 2006-12-07 Jsr Corp Radiation sensitive resin composition
JP2007052182A (en) * 2005-08-17 2007-03-01 Jsr Corp Radiation sensitive resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010536977A (en) * 2007-08-24 2010-12-02 エイゼット・エレクトロニック・マテリアルズ・ユーエスエイ・コーポレイション Polymers for use in photoresist compositions
JP2015179163A (en) * 2014-03-19 2015-10-08 信越化学工業株式会社 Positive resist composition and patterning process

Also Published As

Publication number Publication date
JPWO2008133270A1 (en) 2010-07-29

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