WO2008129617A1 - Substrate processing system - Google Patents

Substrate processing system Download PDF

Info

Publication number
WO2008129617A1
WO2008129617A1 PCT/JP2007/057835 JP2007057835W WO2008129617A1 WO 2008129617 A1 WO2008129617 A1 WO 2008129617A1 JP 2007057835 W JP2007057835 W JP 2007057835W WO 2008129617 A1 WO2008129617 A1 WO 2008129617A1
Authority
WO
WIPO (PCT)
Prior art keywords
cassette
opening
container
processing system
mounting part
Prior art date
Application number
PCT/JP2007/057835
Other languages
French (fr)
Japanese (ja)
Inventor
Hirofumi Nakamura
Original Assignee
Hirata Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corporation filed Critical Hirata Corporation
Priority to PCT/JP2007/057835 priority Critical patent/WO2008129617A1/en
Priority to JP2009510655A priority patent/JP5001354B2/en
Publication of WO2008129617A1 publication Critical patent/WO2008129617A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate processing system for treating substrates within a container which is provided with an openable and closable cover part and houses a cassette supporting the substrates. The substrate processing system is characterized in that it is equipped with opening and closing devices which open and close the cover part of the container and which are arrayed in a direction, a processing device which has a mounting part where the cassette is mounted and which processes the substrates supported by the cassette mounted at the mounting part, and a transferring device which is arranged between the opening and closing devices and the processing device to transfer the cassette from the container opened by the opening and closing devices to the mounting part, and that the transferring device is provided with a moving unit which reciprocates in a direction parallel to the array direction of the opening and closing devices and a transferring unit which is provided at the moving unit to transfer the cassette from the container to the mounting part.
PCT/JP2007/057835 2007-04-09 2007-04-09 Substrate processing system WO2008129617A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/057835 WO2008129617A1 (en) 2007-04-09 2007-04-09 Substrate processing system
JP2009510655A JP5001354B2 (en) 2007-04-09 2007-04-09 Substrate processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/057835 WO2008129617A1 (en) 2007-04-09 2007-04-09 Substrate processing system

Publications (1)

Publication Number Publication Date
WO2008129617A1 true WO2008129617A1 (en) 2008-10-30

Family

ID=39875166

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/057835 WO2008129617A1 (en) 2007-04-09 2007-04-09 Substrate processing system

Country Status (2)

Country Link
JP (1) JP5001354B2 (en)
WO (1) WO2008129617A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133218A1 (en) * 2011-03-26 2012-10-04 東京エレクトロン株式会社 Substrate processing device
WO2014088414A1 (en) * 2012-12-03 2014-06-12 Asm Ip Holding B.V. Modular vertical furnace processing system
JP2015093696A (en) * 2013-11-12 2015-05-18 ヒューグルエレクトロニクス株式会社 Substrate-case separation/union apparatus and substrate-case cleaning apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09216180A (en) * 1996-02-08 1997-08-19 Hitachi Ltd Semiconductor wafer cassette conveyance system
JPH1167866A (en) * 1997-08-20 1999-03-09 Kokusai Electric Co Ltd Semiconductor manufacturing apparatus
JP2001068522A (en) * 1999-08-27 2001-03-16 Hitachi Kokusai Electric Inc Substrate processor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358194A (en) * 2000-06-14 2001-12-26 Shinko Electric Co Ltd Wafer-conveying device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09216180A (en) * 1996-02-08 1997-08-19 Hitachi Ltd Semiconductor wafer cassette conveyance system
JPH1167866A (en) * 1997-08-20 1999-03-09 Kokusai Electric Co Ltd Semiconductor manufacturing apparatus
JP2001068522A (en) * 1999-08-27 2001-03-16 Hitachi Kokusai Electric Inc Substrate processor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133218A1 (en) * 2011-03-26 2012-10-04 東京エレクトロン株式会社 Substrate processing device
JP2012204698A (en) * 2011-03-26 2012-10-22 Tokyo Electron Ltd Substrate processing apparatus
US9147591B2 (en) 2011-03-26 2015-09-29 Tokyo Electron Limited Substrate processing apparatus
WO2014088414A1 (en) * 2012-12-03 2014-06-12 Asm Ip Holding B.V. Modular vertical furnace processing system
US9991139B2 (en) 2012-12-03 2018-06-05 Asm Ip Holding B.V. Modular vertical furnace processing system
JP2015093696A (en) * 2013-11-12 2015-05-18 ヒューグルエレクトロニクス株式会社 Substrate-case separation/union apparatus and substrate-case cleaning apparatus

Also Published As

Publication number Publication date
JP5001354B2 (en) 2012-08-15
JPWO2008129617A1 (en) 2010-07-22

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