WO2008128807A3 - Connexion à la masse pour des appareils électroniques - Google Patents

Connexion à la masse pour des appareils électroniques Download PDF

Info

Publication number
WO2008128807A3
WO2008128807A3 PCT/EP2008/052112 EP2008052112W WO2008128807A3 WO 2008128807 A3 WO2008128807 A3 WO 2008128807A3 EP 2008052112 W EP2008052112 W EP 2008052112W WO 2008128807 A3 WO2008128807 A3 WO 2008128807A3
Authority
WO
WIPO (PCT)
Prior art keywords
ground connection
frame
electronic devices
casing cover
electrically conducting
Prior art date
Application number
PCT/EP2008/052112
Other languages
German (de)
English (en)
Other versions
WO2008128807A2 (fr
Inventor
Josef Loibl
Karl Smirra
Original Assignee
Continental Automotive Gmbh
Josef Loibl
Karl Smirra
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh, Josef Loibl, Karl Smirra filed Critical Continental Automotive Gmbh
Publication of WO2008128807A2 publication Critical patent/WO2008128807A2/fr
Publication of WO2008128807A3 publication Critical patent/WO2008128807A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/6485—Electrostatic discharge protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/533—Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un système de connexion à la masse (1) destiné à connecter des appareils électroniques soumis à des vibrations à un support de masse. Le système de connexion comporte une plaque de base (2), au moins une plaque conductrice (4) et un couvercle de boîtier (3). Un ou plusieurs éléments de connexion électroconducteurs (5) sont disposés sur le couvercle de boîtier (3) de telle manière qu'ils peuvent s'encastrer de façon électrique dans au moins une cavité (6) de la plaque de base (3) et établir une connexion électroconductrice entre le couvercle de boîtier (3) et la plaque de base (2).
PCT/EP2008/052112 2007-04-23 2008-02-21 Connexion à la masse pour des appareils électroniques WO2008128807A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007019097.4A DE102007019097B4 (de) 2007-04-23 2007-04-23 Masseanschluss für elektronische Geräte
DE102007019097.4 2007-04-23

Publications (2)

Publication Number Publication Date
WO2008128807A2 WO2008128807A2 (fr) 2008-10-30
WO2008128807A3 true WO2008128807A3 (fr) 2008-12-24

Family

ID=39567930

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/052112 WO2008128807A2 (fr) 2007-04-23 2008-02-21 Connexion à la masse pour des appareils électroniques

Country Status (2)

Country Link
DE (1) DE102007019097B4 (fr)
WO (1) WO2008128807A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011056743A1 (de) * 2011-12-21 2013-06-27 Conti Temic Microelectronic Gmbh Masseverbindung einer Leiterplatte in einem Steuergerät

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508889A (en) * 1994-06-29 1996-04-16 Molex Incorporated Shield cover and shielding method using the same
US6320762B1 (en) * 1999-04-09 2001-11-20 Shiaw-Jong S. Chen Fixed conductive pin for printed wiring substrate electronics case and method of manufacture therefor
DE10032369A1 (de) * 2000-07-04 2002-02-07 Infineon Technologies Ag Abdeckvorrichtung für Keramikmodule
US20040201972A1 (en) * 2003-04-11 2004-10-14 Walesa Phillip John Multi-axis motor control with high voltage backplane
US20050237727A1 (en) * 2004-04-26 2005-10-27 Adc Broadband Access Systems, Inc. Radio frequency shield covers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4000286A1 (de) * 1990-01-08 1991-07-11 Bosch Gmbh Robert Abschirmbehaeltnis fuer einen bereich einer leiterplatte
JP2501638Y2 (ja) * 1991-11-25 1996-06-19 船井電機株式会社 プリント基板装着用シ―ルド板
DE19841258C1 (de) * 1998-09-09 2000-03-16 Siemens Ag Steuergerät
DE19900647C2 (de) 1999-01-11 2001-02-22 Siemens Ag Verbundbauteil, insbesondere Gehäuse
US6239359B1 (en) * 1999-05-11 2001-05-29 Lucent Technologies, Inc. Circuit board RF shielding
DE19951265C2 (de) 1999-10-25 2002-07-11 Isad Electronic Sys Gmbh & Co Schwingdämpfungselement
DE10136361A1 (de) 2001-07-26 2003-03-13 Leoni Bordnetz Sys Gmbh & Co Anschlussvorrichtung zur elektrischen Kontaktierung einer Masseleitung mit Massepotenzial
US6872880B2 (en) * 2003-06-17 2005-03-29 Delphi Technologies, Inc. Two-piece solderless EMC/EMI shield
DE102004041169B3 (de) 2004-08-25 2006-06-14 Siemens Ag Anordnung und Verfahren zur Masseanbindung eines elektrischen Schaltungsträgers
DE102005048416B3 (de) * 2005-10-10 2007-01-18 Siemens Ag Elektrische Vorrichtung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508889A (en) * 1994-06-29 1996-04-16 Molex Incorporated Shield cover and shielding method using the same
US6320762B1 (en) * 1999-04-09 2001-11-20 Shiaw-Jong S. Chen Fixed conductive pin for printed wiring substrate electronics case and method of manufacture therefor
DE10032369A1 (de) * 2000-07-04 2002-02-07 Infineon Technologies Ag Abdeckvorrichtung für Keramikmodule
US20040201972A1 (en) * 2003-04-11 2004-10-14 Walesa Phillip John Multi-axis motor control with high voltage backplane
US20050237727A1 (en) * 2004-04-26 2005-10-27 Adc Broadband Access Systems, Inc. Radio frequency shield covers

Also Published As

Publication number Publication date
DE102007019097B4 (de) 2023-07-13
DE102007019097A1 (de) 2008-10-30
WO2008128807A2 (fr) 2008-10-30

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