WO2008126640A1 - プリント配線板及び電子機器 - Google Patents

プリント配線板及び電子機器 Download PDF

Info

Publication number
WO2008126640A1
WO2008126640A1 PCT/JP2008/054870 JP2008054870W WO2008126640A1 WO 2008126640 A1 WO2008126640 A1 WO 2008126640A1 JP 2008054870 W JP2008054870 W JP 2008054870W WO 2008126640 A1 WO2008126640 A1 WO 2008126640A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
electronic device
fiber
base material
Prior art date
Application number
PCT/JP2008/054870
Other languages
English (en)
French (fr)
Inventor
Kazumasa Takeuchi
Masaki Yamaguchi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008024305A external-priority patent/JP5200565B2/ja
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Publication of WO2008126640A1 publication Critical patent/WO2008126640A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　所定の折り曲げ方向Bに折り曲げられるプリント配線板１００であって、第１の方向Aに配列した第１の繊維６及び第１の方向Aと交差する第２の方向Cに配列した第２の繊維８を含有する繊維基材を有する繊維基材２と、繊維基材２上に形成された導体層４と、繊維基材２上に形成された導体層４と、を備え、第１の繊維６は、前記第１の方向と前記折り曲げ方向とのなす角度θ１が３０～６０度となるように配列しているプリント配線板１００である。
PCT/JP2008/054870 2007-04-09 2008-03-17 プリント配線板及び電子機器 WO2008126640A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-101657 2007-04-09
JP2007101657 2007-04-09
JP2008-024305 2008-02-04
JP2008024305A JP5200565B2 (ja) 2007-04-09 2008-02-04 プリント配線板及び電子機器

Publications (1)

Publication Number Publication Date
WO2008126640A1 true WO2008126640A1 (ja) 2008-10-23

Family

ID=39863764

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054870 WO2008126640A1 (ja) 2007-04-09 2008-03-17 プリント配線板及び電子機器

Country Status (1)

Country Link
WO (1) WO2008126640A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0515462U (ja) * 1991-08-05 1993-02-26 株式会社長谷川電機製作所 プリント配線基板
JP2002501676A (ja) * 1997-05-30 2002-01-15 テレダイン インダストリーズ、インコーポレーテッド 角度を持たせたプリプレグを用いた剛性／可撓性回路基盤
JP2004179171A (ja) * 2002-10-01 2004-06-24 Kyocera Corp 配線基板
JP2005325326A (ja) * 2004-04-12 2005-11-24 Hitachi Chem Co Ltd プリプレグ並びにこれを用いた金属張積層板及び印刷回路板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0515462U (ja) * 1991-08-05 1993-02-26 株式会社長谷川電機製作所 プリント配線基板
JP2002501676A (ja) * 1997-05-30 2002-01-15 テレダイン インダストリーズ、インコーポレーテッド 角度を持たせたプリプレグを用いた剛性／可撓性回路基盤
JP2004179171A (ja) * 2002-10-01 2004-06-24 Kyocera Corp 配線基板
JP2005325326A (ja) * 2004-04-12 2005-11-24 Hitachi Chem Co Ltd プリプレグ並びにこれを用いた金属張積層板及び印刷回路板

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